JP7149563B2 - light emitting device - Google Patents

Description

TECHNICAL FIELD The present invention relates generally to light emitting devices, and more particularly to light emitting devices comprising light emitting elements that emit ultraviolet light.

Conventionally, a light emitting device has been proposed that includes a mounting substrate, an ultraviolet light emitting element, a spacer, and a cover (Patent Document 1). The ultraviolet light emitting element is mounted on the mounting substrate. The spacer is arranged on the mounting board. The spacer is formed with a through hole that exposes the ultraviolet light emitting element. The cover is arranged on the spacer so as to block the through hole of the spacer.

In the light emitting device, the mounting board, the spacer, and the cover form a package that houses the ultraviolet light emitting element.

JP 2016-127249 A

2. Description of the Related Art In a light emitting device having an ultraviolet light emitting element, it is sometimes desired to control the light distribution of ultraviolet light emitted from the ultraviolet light emitting element by an optical member such as a lens arranged outside the package. However, in a light-emitting device equipped with an ultraviolet light-emitting element, when the lens is fixed to another member with an adhesive, the adhesive portion that adheres the lens and the other member may be damaged by the ultraviolet rays emitted from the ultraviolet light-emitting element. There is a concern that it will deteriorate with time and the reliability will decrease.

SUMMARY OF THE INVENTION An object of the present invention is to provide a light-emitting device having an optical member and capable of improving reliability.

A light-emitting device according to one aspect of the present invention includes a mounting substrate, a light-emitting element, a spacer, a cover, an optical member, and a joint. The light emitting element is arranged on the mounting substrate and emits ultraviolet rays. The spacer has a frame shape, is arranged on the mounting substrate, and surrounds the light emitting element. The cover is arranged on the spacer to cover the light emitting element. The cover transmits ultraviolet rays emitted from the light emitting element. The optical member is arranged on the cover. The optical member has an optically functional portion and a protruding portion. The optically functional portion overlaps the light emitting element in the thickness direction of the mounting substrate and transmits ultraviolet rays emitted from the light emitting element. The protruding portion protrudes outward from the optical function portion in plan view in the thickness direction, and at least partially overlaps the spacer in the thickness direction. The joint portion is interposed between the projecting portion and the cover in the thickness direction, and joins the projecting portion and the cover. The joint portion is interposed between an adhesive layer, the adhesive layer, and the cover, and includes a first light shielding layer that shields ultraviolet rays emitted from the light emitting element, and the adhesive layer and the projecting portion. and a second light shielding layer interposed therebetween for shielding ultraviolet rays emitted from the light emitting element.
A light-emitting device according to another aspect of the present invention includes a mounting substrate, a light-emitting element, a spacer, a cover, an optical member, and a joint. The light emitting element is arranged on the mounting substrate and emits ultraviolet rays. The spacer has a frame shape, is arranged on the mounting substrate, and surrounds the light emitting element. The cover is arranged on the spacer to cover the light emitting element. The cover transmits ultraviolet rays emitted from the light emitting element. The optical member is arranged on the cover. The optical member has an optically functional portion and a protruding portion. The optically functional portion overlaps the light emitting element in the thickness direction of the mounting substrate and transmits ultraviolet rays emitted from the light emitting element. The protruding portion protrudes outward from the optical function portion in plan view in the thickness direction, and at least partially overlaps the spacer in the thickness direction. The joint portion is interposed between the projecting portion and the cover in the thickness direction, and joins the projecting portion and the cover. The joint portion is made of low-melting-point glass or solder.
A light-emitting device according to another aspect of the present invention includes a mounting substrate, a light-emitting element, a spacer, a cover, an optical member, and a joint. The light emitting element is arranged on the mounting substrate and emits ultraviolet rays. The spacer has a frame shape, is arranged on the mounting substrate, and surrounds the light emitting element. The cover is arranged on the spacer to cover the light emitting element. The cover transmits ultraviolet rays emitted from the light emitting element. The optical member is arranged on the cover. The optical member has an optically functional portion and a protruding portion. The optically functional portion overlaps the light emitting element in the thickness direction of the mounting substrate and transmits ultraviolet rays emitted from the light emitting element. The protruding portion protrudes outward from the optical function portion in plan view in the thickness direction, and at least a portion of the protruding portion overlaps the spacer in the thickness direction. The joint portion is interposed between the projecting portion and the cover in the thickness direction, and joins the projecting portion and the cover. The joint portion is composed of a plurality of metal layers that overlap and are joined to each other in the thickness direction of the mounting substrate.

In the light emitting device of the present invention, it is possible to provide an optical member and improve reliability.

FIG. 1 is a plan view of a light emitting device according to one embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line XX of FIG. 1, showing the same light emitting device. FIG. 3 is a cross-sectional view of a light-emitting element in the same light-emitting device. 4A to 4D are process cross-sectional views for explaining a method for manufacturing the above light emitting device. FIG. 5 is a cross-sectional view of a light-emitting device according to Modification 1 of one embodiment of the present invention. FIG. 6 is a cross-sectional view of a light-emitting device according to Modification 2 of one embodiment of the present invention. FIG. 7 is a cross-sectional view of a light-emitting device according to Modification 3 of one embodiment of the present invention. FIG. 8 is a cross-sectional view of a light-emitting device according to Modification 4 of one embodiment of the present invention. FIG. 9 is a cross-sectional view of a light-emitting device according to Modification 5 of one embodiment of the present invention.

Each drawing described in the following embodiments and the like is a schematic drawing, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio.

(embodiment)
(1) Overall Configuration of Light Emitting Device Hereinafter, a light emitting device 1 according to an embodiment will be described with reference to the drawings.

A light-emitting device 1 according to the embodiment includes a mounting substrate 2, a light-emitting element 3, a spacer 4, a cover 5, an optical member 9, and a joint portion 10, as shown in FIGS. The light emitting element 3 is arranged on the mounting board 2 . The spacer 4 has a frame shape and is arranged on the mounting board 2 to surround the light emitting element 3 . A cover 5 is arranged on the spacer 4 so as to cover the light emitting element 3 . The cover 5 transmits ultraviolet rays emitted from the light emitting element 3 . The optical member 9 is arranged on the cover 5 .

In the light emitting device 1 , the spacer 4 and the cover 5 constitute a package cover member 6 . In the package cover member 6, the spacer 4 and the cover 5 are joined together. The light emitting device 1 includes a package 7 including a mounting substrate 2 and a package cover member 6 . In the light-emitting device 1, a space 8 surrounded by the mounting substrate 2, the spacer 4, and the cover 5 has an inert gas atmosphere. The inert gas atmosphere is, for example, N ₂ gas atmosphere. In the light emitting device 1 , the optical member 9 and the cover 5 are joined together by the joining portion 10 .

The mounting board 2 is a mounting board on which the light emitting element 3 is mounted, and has a first conductor portion 21 and a second conductor portion 22 . The mounting substrate 2 also has a first bonding metal layer 23 for bonding to the package cover member 6 . The light emitting element 3 has a first electrode 31 electrically connected to the first conductor portion 21 and a second electrode 32 electrically connected to the second conductor portion 22 . The light emitting element 3 is flip-chip mounted on the mounting substrate 2 .

In the light emitting device 1, the first electrode 31 and the first conductor 21 are joined by the first joint 61, and the second electrode 32 and the second conductor 22 are joined by the second joint 62. . Further, in the light emitting device 1 , the second bonding metal layer 46 provided on the spacer 4 and the first bonding metal layer 23 of the mounting substrate 2 are bonded by the third bonding portion 63 . In the light emitting device 1 , the spacer 4 is joined to the mounting substrate 2 via the third joint portion 63 over the entire circumference. In the light emitting device 1, each of the first joint portion 61, the second joint portion 62, and the third joint portion 63 is made of AuSn.

The light-emitting device 1 can be used by being mounted on a wiring substrate, for example. A wiring board is a mother board. The wiring board can be formed of, for example, a metal-based printed wiring board.

(2) Each Component of Light Emitting Device Next, each component of the light emitting device 1 will be described with reference to the drawings.

(2.1) Mounting substrate The mounting substrate 2 is a substrate on which the light emitting element 3 is mounted. In the light-emitting device 1 , one light-emitting element 3 is mounted on the mounting substrate 2 . The mounting board 2 is larger than the light emitting element 3 in plan view.

The mounting substrate 2 includes a support 20 , and a first conductor portion 21 , a second conductor portion 22 , and a first bonding metal layer 23 supported by the support 20 .

The support 20 is flat and has a front surface 201 and a back surface 202 that are opposite to each other in the thickness direction. The outer peripheral shape of the support 20 is, for example, square. The mounting substrate 2 is a ceramic substrate, and the support 20 is made of AlN ceramic. The support 20 has a function of supporting the first conductor portion 21 , the second conductor portion 22 and the first bonding metal layer 23 .

The first conductor portion 21 , the second conductor portion 22 and the first bonding metal layer 23 are formed on the surface 201 of the support 20 .

The first conductor portion 21 is a conductive layer electrically connected to the first electrode 31 of the light emitting element 3 . The second conductor portion 22 is a conductive layer electrically connected to the second electrode 32 of the light emitting element 3 .

The first bonding metal layer 23 surrounds the first conductor portion 21 and the second conductor portion 22 in plan view. The first bonding metal layer 23 is formed along the outer periphery of the support 20 . The planar view shape of the first bonding metal layer 23 is a rectangular frame shape.

Each of the first conductor portion 21, the second conductor portion 22, and the first bonding metal layer 23 includes, for example, a Ti film on the surface 201 of the support 20, a Pt film on the Ti film, and a Pt film on the Pt film. and a laminated film of .

The mounting substrate 2 further includes a first external connection electrode 24 and a second external connection electrode 25, and a first through wire 26 and a second through wire 27 formed through the support 20 in the thickness direction. I'm in. The first external connection electrode 24 and the second external connection electrode 25 are formed on the back surface 202 of the support 20 . The first external connection electrode 24 is electrically connected to the first conductor portion 21 via the first through wire 26 . The second external connection electrode 25 is electrically connected to the second conductor portion 22 via the second through wire 27 . Each of the first external connection electrode 24 and the second external connection electrode 25 is composed of, for example, a Ti film on the rear surface 202 of the support 20, a Pt film on the Ti film, and an Au film on the Pt film. It can be composed of a laminated film. Each material of the first through wire 26 and the second through wire 27 is, for example, W, Cu, or the like.

(2.2) Light-Emitting Element The light-emitting element 3 is an ultraviolet LED chip that emits ultraviolet light in the UV-C wavelength range. The emission peak wavelength of an ultraviolet LED chip is, for example, 275 nm. The chip size of the ultraviolet LED chip is, for example, 1 mm square (1 mm×1 mm). The thickness of the UV LED chip is, for example, 100 μm.

The light emitting element 3 includes a substrate 30, a semiconductor multilayer film 39, a first electrode 31, and a second electrode 32, as shown in FIG.

The substrate 30 has a first surface 301 and a second surface 302 opposite to each other in the thickness direction. The outer peripheral shape of the substrate 30 is square. The substrate 30 supports a semiconductor multilayer film 39 .

A semiconductor multilayer film 39 is formed on the first surface 301 of the substrate 30 . The semiconductor multilayer film 39 includes a first conductivity type semiconductor layer 33 , a light emitting layer 34 and a second conductivity type semiconductor layer 35 . In the semiconductor multilayer film 39, the first conductivity type semiconductor layer 33, the light emitting layer 34, and the second conductivity type semiconductor layer 35 are arranged in this order from the substrate 30 side. The peripheral shape of the first conductivity type semiconductor layer 33 has the same size as the peripheral shape of the substrate 30 . The perimeters of the light emitting layer 34 and the second conductivity type semiconductor layer 35 are each smaller than the perimeter of the first conductivity type semiconductor layer 33 .

In the light emitting element 3 , the first electrode 31 is electrically connected to the first conductivity type semiconductor layer 33 and the second electrode 32 is electrically connected to the second conductivity type semiconductor layer 35 . The first electrode 31 includes a first ohmic electrode layer 31A and a first pad electrode layer 31B.

The first ohmic electrode layer 31A is formed on the surface 331 of the first conductivity type semiconductor layer 33 in order to obtain ohmic contact with the first conductivity type semiconductor layer 33 . The first pad electrode layer 31B is formed so as to cover the first ohmic electrode layer 31A so as to be bonded to the mounting substrate 2 via the first bonding portion 61 made of AuSn, for example.

The second electrode 32 includes a second ohmic electrode layer 32A and a second pad electrode layer 32B. The second ohmic electrode layer 32A is formed on the surface 351 of the second conductivity type semiconductor layer 35 in order to obtain ohmic contact with the second conductivity type semiconductor layer 35 . The second pad electrode layer 32B is formed to cover the second ohmic electrode layer 32A so as to be bonded to the mounting board 2 via the second bonding portion 62 made of AuSn, for example.

In the light emitting device 3, the substrate 30 is, for example, a sapphire substrate. The first conductivity type semiconductor layer 33 is, for example, an n-type Al _0.60 Ga _0.40 N layer. The light-emitting layer 34 has, for example, a multiple quantum well structure in which a plurality (eg, four) of barrier layers and a plurality (eg, four) of well layers are alternately arranged in the thickness direction of the substrate 30 . Each of the multiple well layers is, for example, an Al _0.45 Ga _0.55 N layer. Each of the multiple barrier layers is, for example, an Al _0.60 Ga _0.40 N layer. The second conductivity type semiconductor layer 35 includes, for example, a p-type Al _0.80 Ga _0.20 N layer and a p-type GaN layer. The semiconductor multilayer film 39 includes a buffer layer (for example, an AlN layer) interposed between the substrate 30 and the first conductivity type semiconductor layer 33 . A light extraction surface of the light emitting element 3 includes the second surface 302 of the substrate 30 .

(2.3) Package Cover Member The package cover member 6 includes the spacer 4 and the cover 5 as described above.

Spacer 4 includes a first surface 41 facing cover 5 and a second surface 42 opposite cover 5 . In the light emitting device 1 , the spacer 4 is a member interposed between the mounting board 2 and the cover 5 . Therefore, the second surface 42 of the spacer 4 faces the mounting board 2 . In the light emitting device 1 , the light emitting element 3 is arranged inside the spacer 4 . The thickness (height) of the spacer 4 in the thickness direction D<b>1 of the mounting substrate 2 is greater than the thickness of the light emitting element 3 .

The spacer 4 is frame-shaped. The outer peripheral shape of the spacer 4 in plan view (the outer peripheral shape of the spacer 4 seen from the thickness direction of the mounting substrate 2) is square. The spacer 4 is smaller than the mounting substrate 2 in plan view. More specifically, the peripheral shape of the spacer 4 in plan view is smaller than the peripheral shape of the mounting substrate 2 in plan view. In other words, the outer peripheral line of the spacer 4 in plan view is inside the outer peripheral line of the mounting board 2 in plan view.

The spacer 4 has a first surface 41 , a second surface 42 , an inner peripheral surface 43 and an outer peripheral surface 44 . The first surface 41 faces the cover 5 in the thickness direction D1. The second surface 42 faces the mounting board 2 in the thickness direction D1. The inner peripheral surface 43 connects the inner periphery of the first surface 41 and the inner periphery of the second surface 42 . The outer peripheral surface 44 connects the outer periphery of the first surface 41 and the outer periphery of the second surface 42 . The inner peripheral surface 43 includes an inclined surface 430 forming an acute internal angle with the second surface 42 . The inner peripheral surface 43 includes four inclined surfaces 430 . The four inclined surfaces 430 are arranged along the inner circumference of the second surface 42 of the spacer 4 . Thus, the spacer 4 has an opening area that gradually increases as it moves away from the second surface 42 and approaches the first surface 41 in the thickness direction D<b>1 of the mounting substrate 2 . The spacer 4 has an opening area that gradually increases with increasing distance from the mounting board 2 in the thickness direction D1 of the mounting board 2 . In the light emitting device 1 , the spacer 4 is made of silicon, and the inner peripheral surface 43 of the spacer 4 functions as a reflecting surface that reflects ultraviolet rays emitted from the light emitting element 3 toward the cover 5 side. In other words, in the light-emitting device 1, the spacer 4 also serves as a reflector that reflects the ultraviolet rays emitted from the light-emitting element 3 toward the cover 5 side.

The four inclined surfaces 430 of the spacer 4 are formed by anisotropic etching of the silicon substrate using the crystal plane orientation dependence of the etching rate of the silicon substrate. The first surface 41 of the spacer 4 is the (100) plane, and the four inclined planes 430 are the {111} planes. An etchant used for anisotropic etching here is, for example, a TMAH solution heated to a predetermined temperature (eg, 85° C.). The etchant is not limited to the TMAH solution, and other alkaline solutions (eg, KOH solution, etc.) may be used.

The light emitting device 1 includes a silicon oxide film 45 interposed between the second surface 42 of the spacer 4 and the second bonding metal layer 46 . The second bonding metal layer 46 is composed of, for example, a laminated film of an Al film 461 and an Au film 462 .

The cover 5 is flat. The cover 5 has a first main surface 51 on the side of the spacer 4 and a second main surface 52 on the side opposite to the spacer 4 . The outer peripheral shape of the cover 5 in plan view (the outer peripheral shape of the cover 5 viewed from the thickness direction of the cover 5) is, for example, a square shape. The cover 5 is smaller than the mounting substrate 2 in plan view. More specifically, the peripheral shape of the cover 5 in plan view is smaller than the peripheral shape of the mounting board 2 in plan view. In other words, the outer peripheral line of the cover 5 in plan view is inside the outer peripheral line of the mounting substrate 2 in plan view.

The cover 5 is made of glass. More specifically, the cover 5 is made of glass that transmits ultraviolet rays emitted from the ultraviolet LED chip, which is the light emitting element 3 .

The glass forming the cover 5 contains an alkaline component. Alkaline components are, for example, Na, K, Na ₂ O, K ₂ O and the like. Here, the glass forming the cover 5 is borosilicate glass.

In the package cover member 6, the spacer 4 and the cover 5 are directly joined. “Directly bonded” means bonded without using a bonding material or the like. The spacer 4 and the cover 5 are directly bonded by anodic bonding. The fact that the spacer 4 and the cover 5 are directly bonded by anodic bonding can be confirmed by, for example, observation results of a cross-sectional TEM image (Cross-Sectional Transmission Electron Microscope Image) and composition analysis by an EDX method (Energy Dispersive X-ray Spectroscopy). As a result, it can be confirmed by the depth profile of elements measured by SIMS (Secondary Ion Mass Spectroscopy).

(2.4) Optical Member The optical member 9 is arranged on the cover 5 . In other words, the optical member 9 is arranged on the second main surface 52 side of the cover 5 (the side opposite to the spacer 4 side). In short, the optical member 9 is arranged outside the package 7 . The optical member 9 has translucency to ultraviolet rays emitted from the light emitting element 3 . Here, the term "having translucency" means having a transmittance of 50% or more, preferably 70% or more, and more preferably 90% or more with respect to ultraviolet rays emitted from the light emitting element 3 . The material of the optical member 9 is an inorganic material. More specifically, the optical member 9 is made of synthetic quartz, for example.

The optical member 9 controls the light distribution of ultraviolet rays emitted from the light emitting element 3 . The optical member 9 has an optically functional portion 90 and a projecting portion 93 . The optically functional portion 90 and the projecting portion 93 are made of the same material and are integrated. The optically functional portion 90 overlaps the light emitting element 3 in the thickness direction D1 of the mounting substrate 2 and transmits ultraviolet rays emitted from the light emitting element 3 . The protruding portion 93 protrudes outward from the optical function portion 90 in plan view in the thickness direction D1 and overlaps the spacer 4 in the thickness direction D1. The joint portion 10 is interposed between the projecting portion 93 and the cover 5 in the thickness direction D<b>1 of the mounting substrate 2 and joins the projecting portion 93 and the cover 5 .

The optically functional portion 90 is a portion that functions as a lens. In plan view from the thickness direction D1 of the mounting substrate 2, the outer peripheral shape of the optically functional portion 90 is substantially circular. The optically functional portion 90 is larger than the light emitting element 3 in plan view from the thickness direction D1 of the mounting substrate 2 . In addition, the optically functional portion 90 is larger than the inner peripheral shape of the second surface 42 of the spacer 4 in plan view from the thickness direction D1 of the mounting substrate 2 . The optically functional portion 90 has a first surface 91 on the cover 5 side and a second surface 92 on the side opposite to the cover 5 . The lens is a condensing lens. More specifically, the lens is a plano-convex aspherical lens. Therefore, in the optically functional portion 90, the first surface 91 is a flat surface and the second surface 92 is a convex curved surface (aspherical surface).

The projecting portion 93 is a portion that is used, for example, to join the optical member 9 and the cover 5 together. The protruding portion 93 protrudes from the entire outer periphery of the optical function portion 90 . The thickness of the protruding portion 93 in the thickness direction D1 of the mounting substrate 2 is thinner than the maximum thickness of the optical function portion 90 in the thickness direction D1 of the mounting substrate 2 . The projecting portion 93 has a first surface 931 on the cover 5 side and a second surface 932 on the side opposite to the cover 5 . In the projecting portion 93, each of the first surface 931 and the second surface 932 is a plane. In the optical member 9, the first surface 931 of the protruding portion 93 and the first surface 91 of the optical function portion 90 are connected, and the first surface 931 and the first surface 91 are positioned on the same plane ( flush). In the optical member 9, the second surface 932 of the protruding portion 93 and the second surface 92 of the optical function portion 90 are connected, and the boundary between the second surface 932 and the second surface 92 is the optical function portion. It is determined by the outer peripheral shape of the second surface 92 of 90 .

In plan view from the thickness direction D1 of the mounting substrate 2, the outer peripheral shape of the projecting portion 93 is, for example, a square shape. The outer peripheral shape of the projecting portion 93 is the same as the outer peripheral shape of the cover 5 . Therefore, the outer peripheral shape of the optical member 9 is the same as the outer peripheral shape of the cover 5 when viewed from the thickness direction D<b>1 of the mounting substrate 2 .

(2.5) Joining Portion The joining portion 10 is interposed between the projecting portion 93 of the optical member 9 and the cover 5 in the thickness direction D1 of the mounting substrate 2, and joins the projecting portion 93 and the cover 5. . The light emitting device 1 includes a plurality (four) of joints 10 . The plurality of joint portions 10 are arranged apart from each other in the direction along the outer periphery of the cover 5 on the second main surface 52 of the cover 5 . More specifically, the joints 10 are arranged in one-to-one correspondence with the four corners of the second main surface 52 of the cover 5 . Thus, in the light-emitting device 1, the optically functional portion 90 of the optical member 9 faces the cover 5 in the thickness direction D1 of the mounting substrate 2 with only the space S1 interposed therebetween.

In plan view from the thickness direction D1 of the mounting substrate 2, the outer peripheral shape of each of the plurality of joint portions 10 is, for example, a circular shape. The plurality of joints 10 have the same size in plan view from the thickness direction D1, but may have different sizes.

The joint 10 includes an adhesive layer 13 . The adhesive layer 13 contains resin. Here, the adhesive layer 13 is formed using a resin-based adhesive. The resin-based adhesive is, for example, an epoxy resin-based adhesive.

The junction 10 includes a first light shielding layer 11 and a second light shielding layer 12 . The first light shielding layer 11 is interposed between the adhesive layer 13 and the cover 5 and shields ultraviolet rays emitted from the light emitting element 3 . The second light shielding layer 12 is interposed between the adhesive layer 13 and the projecting portion 93 and shields ultraviolet rays emitted from the light emitting element 3 . The function of shielding ultraviolet rays is realized by at least one phenomenon of reflection, absorption, scattering, and the like of ultraviolet rays, for example.

Each of the first light shielding layer 11 and the second light shielding layer 12 is metal. It is preferable that the first light shielding layer 11 be made of a metal having good adhesion to the cover 5 and the adhesive layer 13 respectively. It is preferable that the second light shielding layer 12 be made of a metal having good adhesion to the protruding portion 93 of the optical member 9 and the adhesive layer 13 . Each metal of the first light shielding layer 11 and the second light shielding layer 12 is, for example, Cr. The reflectance of Cr with respect to ultraviolet rays emitted from the light emitting element 3 is less than 50%. At the junction 10, the thickness of the first light shielding layer 11 and the thickness of the second light shielding layer 12 are the same.

Regarding the bonding portion 10 , the adhesive layer 13 is contained within the first light shielding layer 11 and the second light shielding layer 12 when viewed from the thickness direction D<b>1 of the mounting substrate 2 . In this case, "contained in the first light shielding layer 11 and the second light shielding layer 12" means that when the adhesive layer 13 and the first light shielding layer 11 have the same shape, the adhesive layer 13 and the second light shielding layer 12 have the same shape. In the light-emitting device 1 according to the embodiment, the area of the adhesive layer 13 and the area of the first light-shielding layer 11 are the same in plan view from the thickness direction D1 of the mounting substrate 2 . Further, in the light emitting device 1, the area of the adhesive layer 13 and the area of the second light shielding layer 12 are the same when viewed from the thickness direction D1 of the mounting substrate 2 in a plan view.

The adhesive layer 13 is contained within the protruding portion 93 in plan view from the thickness direction D<b>1 of the mounting substrate 2 . Accordingly, the adhesive layer 13 does not overlap the optically functional portion 90 when viewed from the thickness direction D<b>1 of the mounting substrate 2 , and is located outside the inner circumference of the first surface 41 of the spacer 4 .

(3) Method for Manufacturing Light-Emitting Device A method for manufacturing the light-emitting device 1 will be briefly described below with reference to FIG.

In the method for manufacturing the light emitting device 1 , a plurality (four) of first light shielding layers 11 are formed on the second main surface 52 of the cover 5 . After that, the spacer 4 and the cover 5 are joined to form the package cover member 6 . Before bonding the package cover member 6 and the mounting board 2, as shown in FIG. Laminated structure is provided. On the other hand, on the first conductor portion 21, the second conductor portion 22, and the first metal layer 23 for bonding of the mounting substrate 2, at the base of each of the first joint portion 61, the second joint portion 62, and the third joint portion 63, A first AuSn layer 71, a second AuSn layer 72 and a third AuSn layer 73 are provided. Here, the first barrier layer 81, the second A barrier layer 82 and a third barrier layer 83 are provided. The material of the first barrier layer 81, the second barrier layer 82 and the third barrier layer 83 is Pt, for example. A first Au layer 121, a second Au layer 122 and a third Au layer 123 are provided on the first AuSn layer 71, the second AuSn layer 72 and the third AuSn layer 73, respectively. The first Au layer 121 , the second Au layer 122 and the third Au layer 123 are layers provided to suppress oxidation of Sn in the first AuSn layer 71 , the second AuSn layer 72 and the third AuSn layer 73 . The thicknesses of the first Au layer 121, the second Au layer 122 and the third Au layer 123 are such that when the first AuSn layer 71, the second AuSn layer 72 and the third AuSn layer 73 melt, the first AuSn layer 71, the second AuSn layer 72 and the third AuSn layer 73 melt. Au is thermally diffused into the 3AuSn layer 73, and the first conductor portion 21, the second conductor portion 22 and the first bonding metal layer 23 are bonded to the first electrode 31, the second electrode 32 and the second bonding metal layer 46. is determined to take place. Hereinafter, the laminated film of the first barrier layer 81, the first AuSn layer 71, and the first Au layer 121 is referred to as a first bonding layer 131, and the laminated film of the second barrier layer 82, the second AuSn layer 72, and the second Au layer 122. The membrane is referred to as second bonding layer 132 . Moreover, the laminated film of the third barrier layer 83 , the third AuSn layer 73 and the third Au layer 123 is hereinafter referred to as a third bonding layer 133 . The first bonding layer 131 only needs to include at least the first AuSn layer 71, and is not limited to a laminated film, and may be a single layer film. The second bonding layer 132 only needs to include at least the second AuSn layer 72, and is not limited to a laminated film, and may be a single layer film. The third bonding layer 133 only needs to include at least the third AuSn layer 73, and is not limited to a laminated film, and may be a single layer film.

Further, in the method for manufacturing the light emitting device 1, the light emitting element 3 is mounted on the mounting board 2 before the package cover member 6 and the mounting board 2 are joined together, and then the package cover member 6 and the mounting board 2 are joined together. do.

When mounting the light emitting element 3 on the mounting substrate 2, the first electrode 31 and the second electrode 32 of the light emitting element 3 are in contact with the first bonding layer 131 and the second bonding layer 132 on the mounting substrate 2. , the first AuSn layer 71 and the second AuSn layer 72 are melted while being appropriately heated and pressurized, and then cooled and solidified to form the first joint 61 and the second joint 62. do. Here, when the first AuSn layer 71 melts, Au diffuses from the first Au layer 121 into the melted AuSn, and the composition ratio of Au in the melted AuSn increases. Further, when the second AuSn layer 72 melts, Au diffuses from the second Au layer 122 into the melted AuSn, increasing the composition ratio of Au in the melted AuSn.

When the package cover member 6 and the mounting board 2 are joined together, the second joining metal layer 46 provided on the package cover member 6 and the third joining layer 133 on the mounting board 2 are brought into contact with each other. The third joint portion 63 is formed by melting the third AuSn layer 73 while applying appropriate heat and pressure in a superimposed state, and then cooling and solidifying the layers. When the third AuSn layer 73 melts, Au diffuses from the third Au layer 123 into the melted AuSn, increasing the composition ratio of Au in the melted AuSn.

After bonding the package cover member 6 and the mounting board 2 as described above, the adhesive that forms the adhesive layer 13 is applied onto each of the plurality of first light shielding layers 11 of the cover 5, and the plurality of first light shielding layers 11 are coated. 2 The optical member 9 having the light shielding layer 12 formed on the first surface 931 of the projecting portion 93 is joined to the cover 5 .

(4) Effect The light-emitting device 1 according to the embodiment includes a mounting substrate 2, a light-emitting element 3, a spacer 4, a cover 5, an optical member 9, and a joint portion . The light emitting element 3 is arranged on the mounting substrate 2 and emits ultraviolet rays. The spacer 4 has a frame shape and is arranged on the mounting board 2 to surround the light emitting element 3 . A cover 5 is arranged on the spacer 4 so as to cover the light emitting element 3 . The cover 5 transmits ultraviolet rays emitted from the light emitting element 3 . The optical member 9 is arranged on the cover 5 . The optical member 9 has an optically functional portion 90 and a projecting portion 93 . The optically functional portion 90 overlaps the light emitting element 3 in the thickness direction D1 of the mounting substrate 2 and transmits ultraviolet rays emitted from the light emitting element 3 . The protruding portion 93 protrudes outward from the optically functional portion 90 in plan view in the thickness direction D1, and at least a portion of the protruding portion 93 overlaps the spacer 4 in the thickness direction D1. The joint portion 10 is interposed between the projecting portion 93 and the cover 5 in the thickness direction D<b>1 and joins the projecting portion 93 and the cover 5 .

In the light emitting device 1 according to the embodiment, it is possible to provide the optical member 9 and improve reliability. Here, the light-emitting device 1 can control the light distribution of ultraviolet light emitted from the light-emitting element 3 by means of the optical function section 90 of the optical member 9 . In the light emitting device 1, the space surrounded by the mounting substrate 2, the spacer 4 and the cover 5 does not have a portion that deteriorates with time due to the ultraviolet rays emitted from the light emitting element 3, such as an adhesive agent. Thereby, the reliability of the light-emitting device 1 can be improved.

Further, in the light-emitting device 1 according to Embodiment 1, since the bonding portion 10 includes the adhesive layer 13 , the projecting portion 93 and the cover 5 can be bonded by the adhesive layer 13 .

Further, in the light emitting device 1 according to Embodiment 1, the joint portion 10 further includes the first light shielding layer 11 and the second light shielding layer 12 . As a result, in the light-emitting device 1 , ultraviolet rays emitted from the light-emitting element 3 and reflected by other members (the mounting substrate 2 , the spacer 4 , the cover 5 , the optical member 9 , etc.) are less likely to enter the adhesive layer 13 . Therefore, the light-emitting device 1 according to Embodiment 1 can further suppress the deterioration of the adhesive layer 13 due to ultraviolet rays, compared with the case where the first light-shielding layer 11 and the second light-shielding layer 12 are not provided, and the reliability is improved. can be further improved.

(Modification)
The embodiment described above is but one of the various embodiments of the present invention. The above-described embodiment can be modified in various ways according to design and the like, as long as the object of the present invention can be achieved.

(Modification 1)
A light-emitting device 1a according to Modification 1 of the embodiment will be described below with reference to FIG.

The basic configuration of the light emitting device 1a according to Modification 1 is the same as that of the light emitting device 1 according to the embodiment. Concerning the light emitting device 1a according to Modification 1, the same components as those of the light emitting device 1 according to the embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the light-emitting device 1a according to Modification 1, the area of the adhesive layer 13 is smaller than the area of the first light-shielding layer 11 and the area of the second light-shielding layer 12 in plan view from the thickness direction D1 of the mounting substrate 2 .

Further, in the light-emitting device 1a according to Modification 1, in a plan view from the thickness direction D1 of the mounting substrate 2, the distance L3 between the adhesive layer 13 and the center of the optical function portion 90 is the same as that of the first light shielding layer 11 and the optical function portion 90. longer than the distance L1 from the center of the functional part 90. Accordingly, in the light-emitting device 1a according to Modification 1, ultraviolet light emitted from the light-emitting element 3 is less likely to enter the adhesive layer 13 than in the light-emitting device 1 according to the embodiment.

(Modification 2)
A light-emitting device 1b according to Modification 2 of the embodiment will be described below with reference to FIG.

The basic configuration of the light emitting device 1b according to Modification 2 is the same as that of the light emitting device 1a according to Modification 1 of the embodiment. Regarding the light-emitting device 1b according to Modification 2, the same components as those of the light-emitting device 1a according to Modification 1 of the embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the light-emitting device 1b according to Modification 2, in plan view from the thickness direction D1 of the mounting substrate 2, the distance (shortest distance) L13 between the adhesive layer 13 and (the outer periphery of) the optical function portion 90 is the first light shielding distance. It is longer than the distance (shortest distance) L11 between the layer 11 and (the outer circumference of) the optically functional portion 90 . Accordingly, in the light-emitting device 1b according to Modification 2, ultraviolet rays emitted from the light-emitting element 3 are less likely to enter the adhesive layer 13 than in the light-emitting device 1 according to the embodiment.

(Modification 3)
A light-emitting device 1c according to Modification 3 of the embodiment will be described below with reference to FIG.

The basic configuration of the light emitting device 1c according to Modification 3 is the same as that of the light emitting device 1b according to Modification 2 of the first embodiment. Regarding the light-emitting device 1c according to Modification 3, the same components as those of the light-emitting device 1b according to Modification 2 of the embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the light-emitting device 1c according to Modification 3, the area of the first light shielding layer 11 is larger than the area of the second light shielding layer 12 in plan view from the thickness direction D1 of the mounting substrate 2 . Accordingly, in the light-emitting device 1c according to Modification 3, ultraviolet rays emitted from the light-emitting element 3 are less likely to enter the adhesive layer 13 than in the light-emitting device 1a according to Modification 1 of the embodiment.

(Modification 4)
A light-emitting device 1d according to Modification 4 of the embodiment will be described below with reference to FIG.

The basic configuration of the light emitting device 1d according to Modification 4 is the same as that of the light emitting device 1a according to Modification 1 of the first embodiment. Regarding the light-emitting device 1d according to Modification 4, the same components as those of the light-emitting device 1a according to Modification 1 of the embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the light emitting device 1 d according to Modification 4, the thickness of the first light shielding layer 11 is thicker than the thickness of the second light shielding layer 12 . Accordingly, in the light-emitting device 1d according to Modification 4, ultraviolet rays emitted from the light-emitting element 3 are less likely to enter the adhesive layer 13 than in the light-emitting device 1a according to Modification 1 of the embodiment.

(Modification 5)
A light-emitting device 1e according to Modification 5 of the embodiment will be described below with reference to FIG.

The basic configuration of the light-emitting device 1e according to Modification 5 is the same as that of the light-emitting device 1 according to the first embodiment. Regarding the light-emitting device 1e according to Modification 5, the same components as those of the light-emitting device 1 according to the embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the light-emitting device 1e according to Modification 5, when viewed from the thickness direction D1 of the mounting substrate 2, a part of the adhesive layer 13 extends from the first light shielding layer 11 and the second light shielding layer 12 to the optical function section 90 side. It sticks out on the opposite side. As a result, the light-emitting device 1e according to Modification 5 can be easily manufactured. Moreover, in the light-emitting device 1e according to Modification 5, it is possible to prevent the area of the adhesive layer 13 from becoming too small.

(Other modifications)
For example, in the package cover member 6, the cover 5 is not limited to glass containing an alkali component, and may be made of, for example, quartz glass. In this case, the spacer 4 and the cover 5 may be joined by a joining portion made of low-melting glass, for example. The low melting point glass is glass with a softening point of 600° C. or lower, preferably a glass with a softening point of 500° C. or lower, and more preferably a glass with a softening point of 400° C. or lower. Low-melting-point glass is, for example, glass containing lead oxide (PbO) and boric anhydride (B ₂ O ₃ ) as main components.

Further, the glass is not limited to borosilicate glass or quartz glass, and may be, for example, soda-lime glass, alkali-free glass, or the like.

Further, the light-emitting element 3 is not limited to an ultraviolet LED chip that emits ultraviolet rays in the UV-C wavelength region, and may be an ultraviolet LED chip that emits ultraviolet rays in the UV-B wavelength region, for example. Further, the light emitting element 3 may be, for example, an ultraviolet LED chip that emits ultraviolet rays in the UV-A wavelength range.

Further, the number of light emitting elements 3 arranged inside the spacer 4 on the mounting substrate 2 is not limited to one, and may be plural. Further, when the light-emitting devices 1, 1a to 1e are provided with a plurality of light-emitting elements 3 arranged inside the spacer 4, the plurality of light-emitting elements 3 may be the same type of light-emitting elements, or the plurality of light-emitting elements 3 may be of the same type. At least one of the light emitting elements 3 may be of a different type from the rest of the light emitting elements 3 . For example, the light-emitting devices 1, 1a to 1e have four light-emitting elements 3, one first ultraviolet LED chip that emits ultraviolet rays in the UV-C wavelength region, and a first ultraviolet LED chip that emits ultraviolet rays in the UV-B wavelength region. and two second ultraviolet LED chips.

Further, regarding the light-emitting devices 1, 1a to 1e, the light-emitting element 3 may be bonded to the mounting substrate 2 by conductive bumps.

Moreover, the bonding method of the spacer 4 and the cover 5 is not limited to anodic bonding, and they may be directly bonded by, for example, a surface activation bonding method. Moreover, the spacer 4 and the cover 5 may be bonded by, for example, a eutectic bonding method.

Moreover, the material of the spacer 4 is not limited to silicon, and may be aluminum, an aluminum alloy, or the like.

Moreover, the spacer 4 is not limited to being smaller than the mounting board 2 when viewed from the thickness direction D1 of the mounting board 2. For example, the spacer 4 may have the same size as the mounting board 2 when viewed from the top. It may be larger than the mounting board 2 when viewed.

Further, the spacer 4 is not limited to the configuration in which the opening area gradually increases as the distance from the second surface 42 approaches the first surface 41 in the thickness direction D1 of the mounting substrate 2. For example, the opening area is gradually increased. may have increased. Further, the spacer 4 may have a substantially constant opening area regardless of the position in the thickness direction D1 of the mounting substrate 2, for example.

Moreover, the lens that constitutes the optically functional portion 90 of the optical member 9 is not limited to a plano-convex lens, and may be, for example, a Fresnel lens. Also, the lens is not limited to an aspherical lens, and may be, for example, a spherical lens. Further, the lens is not limited to a plano-convex lens, and may be, for example, a bi-convex lens, a plano-concave lens, or the like. Also, the optical function unit 90 is not limited to a lens, and may be a lens array, a prism, or the like.

Further, the optical member 9 is not limited to synthetic quartz, and may be quartz glass, borosilicate glass, or the like.

Moreover, the projecting portion 93 of the optical member 9 is not limited to the case where the entire projecting portion 93 overlaps the spacer 4 in the thickness direction D<b>1 of the mounting substrate 2 .

In the light-emitting device 1, the optically functional portion 90 of the optical member 9 and the joint portion 10 do not necessarily have to be separated from each other when viewed from the thickness direction D1 of the mounting substrate 2. The portion may overlap the optically functional portion 90 . Further, in the light emitting device 1, a part of the adhesive layer 13 protrudes from the first light shielding layer 11 and the second light shielding layer 12 toward the optical function section 90 in a plan view from the thickness direction D1 of the mounting substrate 2. good too.

Moreover, each metal of the first light shielding layer 11 and the second light shielding layer 12 is not limited to Cr, and may be Ti, Mo, or the like, for example. Also, the first light shielding layer 11 and the second light shielding layer 12 may be made of different metals. Also, each of the first light shielding layer 11 and the second light shielding layer 12 may be an alloy. Also, each of the first light shielding layer 11 and the second light shielding layer 12 may be glass that absorbs ultraviolet rays from the light emitting element 3 .

Also, the joining portion 10 may be made of low-melting glass. Also, the joint 10 may contain solder. Moreover, the joint portion 10 may be configured by a plurality of metal layers that overlap each other in the thickness direction D1 of the mounting substrate 2 and are joined to each other.

Moreover, the light-emitting devices 1, 1a to 1e may include Zener diodes connected in anti-parallel to the light-emitting element 3. FIG. As a result, the light emitting devices 1, 1a to 1e can be improved in resistance to static electricity. The Zener diode is preferably mounted on the mounting substrate 2 within the package 7, for example.

(summary)
The following aspects are disclosed from the embodiments and the like described above.

A light emitting device (1; 1a; 1b; 1c; 1d; 1e) according to a first aspect includes a mounting substrate (2), a light emitting element (3), a spacer (4), a cover (5), an optical It comprises a member (9) and a joint (10). The light emitting element (3) is arranged on the mounting substrate (2) and emits ultraviolet rays. The spacer (4) has a frame shape, is arranged on the mounting substrate (2), and surrounds the light emitting element (3). A cover (5) is placed on the spacer (4) to cover the light emitting element (3). The cover (5) transmits ultraviolet rays emitted from the light emitting element (3). The optical member (9) is arranged on the cover (5). The optical member (9) has an optically functional portion (90) and a protrusion (93). The optical function part (90) overlaps the light emitting element (3) in the thickness direction (D1) of the mounting substrate (2) and transmits ultraviolet rays emitted from the light emitting element (3). The protruding portion (93) protrudes outward from the optically functional portion (90) in plan view in the thickness direction (D1), and at least partially overlaps the spacer (4) in the thickness direction (D1). . The joint (10) is interposed between the projection (93) and the cover (5) in the thickness direction (D1) and joins the projection (93) and the cover (5).

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the first aspect, the optical member (9) is provided and reliability can be improved.

In the light emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the second aspect, in the first aspect, the junction (10) includes an adhesive layer (13).

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the second aspect, the protrusion (93) and the cover (5) can be joined by the adhesive layer (13).

In the light emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the third aspect, in the second aspect, the junction (10) comprises a first light shielding layer (11) and a second light shielding layer ( 12) and The first light shielding layer (11) is interposed between the adhesive layer (13) and the cover (5) and shields the ultraviolet rays emitted from the light emitting element (3). The second light shielding layer (12) is interposed between the adhesive layer (13) and the projecting portion (93) and shields ultraviolet rays emitted from the light emitting element (3).

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the third aspect, adhesion by ultraviolet light is more effective than in the case where the first light-shielding layer (11) and the second light-shielding layer (12) are not provided. Deterioration of the layer (13) can be further suppressed, and reliability can be further improved.

In the light emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the fourth aspect, in the third aspect, each of the first light shielding layer (11) and the second light shielding layer (12) is made of metal. be.

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the fourth aspect, deterioration of the first light-shielding layer (11) and the second light-shielding layer (12) due to ultraviolet light can be suppressed. .

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the fifth aspect, in any one of the third or fourth aspect, the adhesive layer (13) contains a resin.

In the light emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the fifth aspect, the projecting portion (93) and the cover (5) can be joined by a resin joining method.

In the light-emitting device (1; 1a; 1b; 1c; 1d) according to the sixth aspect, in any one of the third to fifth aspects, the adhesive layer (13) is a plane from the thickness direction (D1) It is visually contained in the first light shielding layer (11) and in the second light shielding layer (12).

In the light-emitting device (1; 1a; 1b; 1c; 1d) according to the sixth aspect, ultraviolet light emitted from the light-emitting element (3) is less likely to enter the adhesive layer (13).

In the light-emitting device (1a; 1b; 1c; 1d) according to the seventh aspect, in the sixth aspect, in a plan view from the thickness direction (D1), the area of the adhesive layer (13) is the first light shielding layer ( It is smaller than the area of 11) and the area of the second light shielding layer (12).

In the light-emitting device (1a; 1b; 1c; 1d) according to the seventh aspect, ultraviolet light emitted from the light-emitting element (3) is less likely to enter the adhesive layer (13).

In the light-emitting device (1a; 1b; 1c; 1d; 1e) according to the eighth aspect, in any one of the third to seventh aspects, the adhesive layer (13 ) and the center of the optical function part (90) is longer than the distance (L11) between the first light shielding layer (11) and the center of the optical function part (90).

In the light-emitting device (1a; 1b; 1c; 1d; 1e) according to the eighth aspect, ultraviolet light emitted from the light-emitting element (3) is less likely to enter the adhesive layer (13).

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the ninth aspect, in any one of the second to eighth aspects, the adhesive layer (13) is is housed within the projecting portion (93) in plan view.

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the ninth aspect, for example, a part of the adhesive layer (13) is a protrusion (93) in a plan view from the thickness direction (D1). Ultraviolet rays emitted from the light emitting element (3) are less likely to enter the adhesive layer (13) than when the adhesive layer (13) protrudes from the adhesive layer (90).

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the tenth aspect, in any one of the first to ninth aspects, the light-emitting element (3) is UV-C or UV-B is an ultraviolet LED chip that emits ultraviolet light in the wavelength range of .

In the light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the tenth aspect, the light-emitting element (3) is provided with an ultraviolet LED chip that emits ultraviolet light in the UV-C or UV-B wavelength range. In the configuration, it becomes possible to control the light distribution of ultraviolet rays by the optical member (9) and to improve the reliability. The light-emitting device (1; 1a; 1b; 1c; 1d; 1e) according to the tenth aspect can be used, for example, in fields such as sterilization, medical treatment, and high-speed treatment of environmental pollutants.

REFERENCE SIGNS LIST 1 Light emitting device 2 Mounting substrate 3 Light emitting element 4 Spacer 5 Cover 9 Optical member 90 Optical function part 93 Protruding part 10 Joining part 11 First light shielding layer 12 Second light shielding layer 13 Adhesive layer L1 Distance L3 Distance L11 Distance L13 Distance

Claims (10)

a mounting board;
a light-emitting element arranged on the mounting substrate and emitting ultraviolet rays;
a frame-shaped spacer arranged on the mounting substrate and surrounding the light emitting element;
a cover disposed on the spacer so as to cover the light emitting element and transmitting ultraviolet rays emitted from the light emitting element;
an optically functional portion disposed on the cover, overlapping the light emitting element in the thickness direction of the mounting substrate and transmitting ultraviolet rays emitted from the light emitting element; an optical member having a protruding portion protruding outward from the functional portion and at least partially overlapping the spacer in the thickness direction;
a joint portion interposed between the protrusion and the cover in the thickness direction and joining the protrusion and the cover ;
The junction is
an adhesive layer;
a first light shielding layer interposed between the adhesive layer and the cover and shielding ultraviolet rays emitted from the light emitting element;
a second light shielding layer that is interposed between the adhesive layer and the protrusion and shields ultraviolet rays emitted from the light emitting element;
Luminescent device. Each of the first light shielding layer and the second light shielding layer is metal,
A light-emitting device according to claim 1 . The adhesive layer contains a resin,
The light-emitting device according to claim 1 or 2. The adhesive layer is contained within the first light shielding layer and the second light shielding layer in plan view from the thickness direction,
The light-emitting device according to any one of claims 1-3. In plan view from the thickness direction, the area of the adhesive layer is smaller than the area of the first light shielding layer and the area of the second light shielding layer.
The light emitting device according to claim 4. In plan view from the thickness direction, the distance between the adhesive layer and the center of the optical function part is longer than the distance between the first light shielding layer and the center of the optical function part,
The light-emitting device according to any one of claims 1-5. The adhesive layer is contained within the protrusion in plan view from the thickness direction,
The light-emitting device according to any one of claims 1-6. The light emitting element is an ultraviolet LED chip that emits ultraviolet light in the UV-C or UV-B wavelength range,
The light-emitting device according to any one of claims 1-7. a mounting board;
a light-emitting element arranged on the mounting substrate and emitting ultraviolet rays;
a frame-shaped spacer arranged on the mounting substrate and surrounding the light emitting element;
a cover disposed on the spacer so as to cover the light emitting element and transmitting ultraviolet rays emitted from the light emitting element;
an optically functional portion disposed on the cover, overlapping the light emitting element in the thickness direction of the mounting substrate and transmitting ultraviolet rays emitted from the light emitting element; an optical member having a protruding portion protruding outward from the functional portion and at least partially overlapping the spacer in the thickness direction;
a joint portion interposed between the protrusion and the cover in the thickness direction and joining the protrusion and the cover;
The joint is made of low-melting glass or solder,
Luminescent device. a mounting board;
a light-emitting element arranged on the mounting substrate and emitting ultraviolet rays;
a frame-shaped spacer arranged on the mounting substrate and surrounding the light emitting element;
a cover disposed on the spacer so as to cover the light emitting element and transmitting ultraviolet rays emitted from the light emitting element;
an optically functional portion disposed on the cover, overlapping the light emitting element in the thickness direction of the mounting substrate and transmitting ultraviolet rays emitted from the light emitting element; an optical member having a protruding portion protruding outward from the functional portion and at least partially overlapping the spacer in the thickness direction;
a joint portion interposed between the protrusion and the cover in the thickness direction and joining the protrusion and the cover;
The joint portion is composed of a plurality of metal layers that overlap and are joined to each other in the thickness direction of the mounting substrate,
Luminescent device.

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