JP2006013426A - Light emitting device and lighting apparatus - Google Patents

Light emitting device and lighting apparatus Download PDF

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JP2006013426A
JP2006013426A JP2005016054A JP2005016054A JP2006013426A JP 2006013426 A JP2006013426 A JP 2006013426A JP 2005016054 A JP2005016054 A JP 2005016054A JP 2005016054 A JP2005016054 A JP 2005016054A JP 2006013426 A JP2006013426 A JP 2006013426A
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light
light emitting
emitting device
emitting element
phosphor layer
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JP2005016054A
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JP3898721B2 (en
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Tomoya Tabuchi
智也 田淵
Toru Miyake
徹 三宅
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Kyocera Corp
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Kyocera Corp
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Priority to JP2005016054A priority Critical patent/JP3898721B2/en
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to PCT/JP2005/013749 priority patent/WO2006067885A1/en
Priority to US11/721,807 priority patent/US8106584B2/en
Priority to CN2005800484314A priority patent/CN101124683B/en
Priority to KR1020077014202A priority patent/KR101114305B1/en
Priority to EP05767041A priority patent/EP1840977A4/en
Priority to TW094125398A priority patent/TWI433344B/en
Priority to CN2008101797631A priority patent/CN101447543B/en
Publication of JP2006013426A publication Critical patent/JP2006013426A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which radiation intensity, axial luminous intensity and luminance are made to be high by improving light extraction efficiency. <P>SOLUTION: A light emitting device 1 comprises: a base body 2 having a mounting portion 2a of a light emitting element 4 on the upper surface; a frame body 3 bonded to a periphery of the upper surface of the base body 2 so that it can fix the mounting portion 2a firmly; a wiring conductor in which one end is formed on the upper surface of the base body 2 and connected with an electrode of the light emitting element 4, and the other end is introduced to an exterior of the base body 2; the light emitting element 4 which is mounted on the mounting portion 2a and electrically connected with the wiring conductor; a first translucent component 5, arranged inside the frame body 3 so that it can cover the light emitting element 4; and a phosphor layer 7 containing the phosphor, which is arranged inside the frame body 3 so that it can coat the first translucency component 5 by preparing a clearance between the first translucency component 5, and converts the wavelength of the light emitted by the light emitting element 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光素子から発光される光を蛍光体で波長変換し外部に放射する発光装置およびそれを用いた照明装置に関する。   The present invention relates to a light-emitting device that converts the wavelength of light emitted from a light-emitting element with a phosphor and emits the light to the outside, and an illumination device using the light-emitting device.

従来の発光ダイオード(LED)等の発光素子14を収容するための発光装置11を図4に示す。図4に示すように、発光装置は、上面の中央部に発光素子14を載置するための搭載部12aを有し、搭載部12aおよびその周辺から発光装置の内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体(図示せず)が形成された絶縁体から成る基体12と、基体12の上面に接着固定され、中央部に発光素子14を収納するための貫通孔が形成された、金属、樹脂またはセラミックス等から成る枠体13とから主に構成される。   A light-emitting device 11 for housing a light-emitting element 14 such as a conventional light-emitting diode (LED) is shown in FIG. As shown in FIG. 4, the light emitting device has a mounting portion 12a for mounting the light emitting element 14 at the center of the upper surface, and electrically connects the inside and outside of the light emitting device from the mounting portion 12a and its periphery. A base 12 made of an insulator on which a wiring conductor (not shown) made of a lead terminal, metallized wiring or the like is formed, and a through hole for adhering and fixing to the upper surface of the base 12 and accommodating the light emitting element 14 in the center portion It is mainly composed of the formed frame body 13 made of metal, resin, ceramics or the like.

基体12は酸化アルミニウム質焼結体(アルミナセラミックス)や窒化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体12がセラミックスから成る場合、その上面にメタライズ配線層がタングステン(W)、モリブデン(Mo)−マンガン(Mn)等から成る金属ペーストを高温で焼成して形成される。また、基体12が樹脂から成る場合、基体12をモールド成型する際に、銅(Cu)や鉄(Fe)−ニッケル(Ni)合金等から成るリード端子が基体12の内部に一端部が突出するように固定される。   The substrate 12 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, the metallized wiring layer is formed on the upper surface by baking a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 12 is made of resin, when the base 12 is molded, a lead terminal made of copper (Cu), iron (Fe) -nickel (Ni) alloy or the like protrudes at one end into the base 12. To be fixed.

また、枠体13は、アルミニウム(Al)やFe−Ni−コバルト(Co)合金等の金属、アルミナ質焼結体等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型、押し出し成型等により形成される。さらに、枠体13の中央部には上方に向かうに伴って外側に広がる貫通孔が形成されており、貫通孔の内周面の光の反射率を向上させる場合、この内周面にAl等の金属が蒸着法やメッキ法により被着される。そして、枠体13は、半田、銀ロウ等のロウ材または樹脂接着剤により、基体12の上面に接合される。   The frame 13 is made of a metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, a ceramic such as an alumina sintered body, or a resin such as an epoxy resin. It is formed by molding or the like. Furthermore, a through hole is formed in the central portion of the frame 13 so as to spread outward as it goes upward. To improve the light reflectance of the inner peripheral surface of the through hole, Al or the like is provided on the inner peripheral surface. The metal is deposited by vapor deposition or plating. The frame 13 is bonded to the upper surface of the base 12 by a brazing material such as solder, silver brazing, or a resin adhesive.

そして、基体12表面に形成した配線導体(図示せず)と発光素子14の電極とをボンディングワイヤ(図示せず)を介して電気的に接続し、しかる後、発光素子14の表面に蛍光体層17を形成した後に、枠体13の内側に透明樹脂15を充填し熱硬化させることで、発光素子14からの光を蛍光体層17により波長変換し所望の波長スペクトルを有する光を取り出せる発光装置と成すことができる。また、発光素子14として発光波長が300〜400nmの紫外領域を含むものを選び、蛍光体層17に含まれる赤、青、緑の3原色の蛍光体粒子の混合比率を調整することで色調を自由に設計することができる。   Then, a wiring conductor (not shown) formed on the surface of the substrate 12 and the electrode of the light emitting element 14 are electrically connected via a bonding wire (not shown), and then the phosphor is applied to the surface of the light emitting element 14. After the layer 17 is formed, the inside of the frame 13 is filled with a transparent resin 15 and thermally cured, whereby the light emitted from the light-emitting element 14 is converted by the phosphor layer 17 so that light having a desired wavelength spectrum can be extracted. Can be made with equipment. Further, the light emitting element 14 is selected to include an ultraviolet region having an emission wavelength of 300 to 400 nm, and the color tone is adjusted by adjusting the mixing ratio of phosphor particles of the three primary colors red, blue and green contained in the phosphor layer 17. Can be designed freely.

また一般的に蛍光体粒子は粉体であり、蛍光体単独では蛍光体層17の形成が困難なため、樹脂もしくはガラスなどの透明部材中に蛍光体粒子を混入して発光素子14の表面に塗布し蛍光体層17とするのが一般的である。
特許第3065263号公報
In general, the phosphor particles are powder, and it is difficult to form the phosphor layer 17 with the phosphor alone. Therefore, the phosphor particles are mixed in a transparent member such as a resin or glass to form the surface of the light emitting element 14. In general, the phosphor layer 17 is applied.
Japanese Patent No. 3052663

しかし、従来の発光装置11の場合、蛍光体層17で波長変換された後に蛍光体層17の下側に発光される光や、発光素子から発光された後に蛍光体層17の上面で下側に反射される光は、枠体13内側で反射が繰り返されて減衰したり、基体12や発光素子14によって吸収され、その結果、光損失が著しく増加するという問題点を有していた。   However, in the case of the conventional light emitting device 11, the light emitted to the lower side of the phosphor layer 17 after wavelength conversion by the phosphor layer 17 or the lower side on the upper surface of the phosphor layer 17 after being emitted from the light emitting element The light reflected by the light is repeatedly reflected inside the frame 13 and attenuated, or is absorbed by the base 12 and the light emitting element 14, resulting in a problem that the light loss is remarkably increased.

また、発光素子14から斜め上方向に発光された光は、枠体13で反射されることなく発光装置11の外側に大きな放射角度で放射されるため、放射角度が大きくなって軸上光度が低いという問題点も有していた。   Further, the light emitted obliquely upward from the light emitting element 14 is radiated at a large radiation angle outside the light emitting device 11 without being reflected by the frame 13, so the radiation angle is increased and the axial luminous intensity is increased. It had the problem of being low.

したがって、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、光取り出し効率を向上させ、放射光強度、軸上光度および輝度が高い発光装置および照明装置を提供することである。   Therefore, the present invention has been completed in view of the above-described conventional problems, and an object thereof is to provide a light emitting device and an illuminating device that improve light extraction efficiency and have high radiated light intensity, high on-axis luminous intensity, and luminance. That is.

本発明の発光装置は、上面に発光素子の搭載部を有する基体と、該基体の上面の外周部に前記搭載部を固繞するように接合された枠体と、一端が前記基体の上面に形成されて前記発光素子の電極に電気的に接続されるとともに他端が前記基体の外面に導出された配線導体と、前記搭載部に搭載されるとともに前記配線導体に電気的に接続された前記発光素子と、前記発光素子を被覆する第1の透光性部材と、前記枠体の内周面または上面に、前記第1の透光性部材との間に隙間をあけて前記第1の透光性部材を覆うように設けられた、前記発光素子が発光する光を波長変換する蛍光体を透光性材料に含有させて成る蛍光体層とを具備していることを特徴とする。   The light-emitting device of the present invention includes a base body having a light-emitting element mounting portion on the upper surface, a frame body joined to the outer peripheral portion of the upper surface of the base body so as to fix the mounting portion, and one end on the upper surface of the base body The wiring conductor formed and electrically connected to the electrode of the light emitting element and having the other end led to the outer surface of the base, and the wiring conductor mounted on the mounting portion and electrically connected to the wiring conductor The first light-transmitting member that covers the light-emitting element, the first light-transmitting member that covers the light-emitting element, and the first light-transmitting member on the inner peripheral surface or the upper surface of the frame body are spaced apart from each other. And a phosphor layer which is provided so as to cover the translucent member and which includes a translucent material containing a phosphor which converts the wavelength of light emitted from the light emitting element.

本発明の発光装置において、好ましくは、前記蛍光体層の下面に第2の透光性部材が形成されていることを特徴とする。   In the light emitting device of the present invention, preferably, a second light transmissive member is formed on the lower surface of the phosphor layer.

本発明の発光装置において、好ましくは、前記第1の透光性部材は半球状であることを特徴とする。   In the light emitting device of the present invention, preferably, the first light transmitting member is hemispherical.

本発明の発光装置において、好ましくは、前記第1の透光性部材の透光性部材は、シリコーン樹脂から成ることを特徴とする。   In the light emitting device of the present invention, preferably, the light transmissive member of the first light transmissive member is made of a silicone resin.

本発明の発光装置において、好ましくは、前記第2の透光性部材の透光性部材は、シリコーン樹脂から成ることを特徴とする。   In the light emitting device of the present invention, preferably, the light transmissive member of the second light transmissive member is made of a silicone resin.

本発明の照明装置は、上記本発明の発光装置を光源として用いたことを特徴とする。   The illuminating device of the present invention is characterized by using the light emitting device of the present invention as a light source.

本発明の発光装置は、発光素子を被覆する第1の透光性部材と、枠体の内周面または上面に、第1の透光性部材との間に隙間をあけて第1の透光性部材を覆うように設けられた、発光素子が発光する光を波長変換する蛍光体を透光性材料に含有させて成る蛍光体層とを具備していることから、発光素子から発光された光が第1の透光性部材の上面から出射する際、第1の透光性部材の上面は屈折率のより低い空気層であるため、第1の透光性部材の上面での光の屈折を大きくして光を上側の広範囲に広げることができ、蛍光体層に光を満遍なく均一に照射させることができる。よって、蛍光体層の一部だけに光が集中することなく、蛍光体層全体で波長変換させることができ、波長変換効率を向上させることができる。   The light-emitting device of the present invention has a first light-transmitting member covering the light-emitting element and a first light-transmitting member with a gap between the inner peripheral surface or the upper surface of the frame and the first light-transmitting member. A light-emitting element is provided so as to cover the light-sensitive member, and a phosphor layer containing a light-transmitting material containing a phosphor that converts the wavelength of light emitted from the light-emitting element. When the emitted light is emitted from the upper surface of the first translucent member, the upper surface of the first translucent member is an air layer having a lower refractive index. Thus, the light can be spread over a wide range on the upper side, and the phosphor layer can be uniformly and uniformly irradiated with light. Therefore, the wavelength conversion can be performed in the entire phosphor layer without concentrating light on only a part of the phosphor layer, and the wavelength conversion efficiency can be improved.

また、蛍光体層の下面はより屈折率の低い空気層と接しているので、第1の透光性部材の上面から広範囲に出射した光を第2の透光性部材の下面に入射する際、屈折によって基体に対して直角な上側方向に進行させることができる。よって、蛍光体層中を透過する光路長を蛍光体層全体において近似させて波長変換効率の差によって色むらが生じるのを有効に防止することができるとともに、発光装置の軸上へ指向性よく光を放射させて放射光強度、軸上光度および輝度を高めることができる。   Further, since the lower surface of the phosphor layer is in contact with the air layer having a lower refractive index, when light emitted in a wide range from the upper surface of the first light transmissive member is incident on the lower surface of the second light transmissive member. By refraction, it can be advanced in the upper direction perpendicular to the substrate. Therefore, the optical path length transmitted through the phosphor layer can be approximated in the entire phosphor layer to effectively prevent color unevenness due to the difference in wavelength conversion efficiency, and with good directivity on the axis of the light emitting device. Light can be emitted to increase emitted light intensity, on-axis brightness and brightness.

さらに、蛍光体層の下面はより屈折率の低い空気層と接しているので、蛍光体層中の蛍光体から下側方向に発せられる光や、蛍光体層の上面で下側方向に反射された光の多くを蛍光体層の下面で全反射させることができ、光が枠体の内側で反射を繰り返して減衰したり、基体や発光素子に吸収されるのを有効に防止して、光取り出し効率が低下するのを有効に抑制することができる。   Furthermore, since the lower surface of the phosphor layer is in contact with an air layer having a lower refractive index, light emitted downward from the phosphor in the phosphor layer or reflected downward from the upper surface of the phosphor layer. Most of the reflected light can be totally reflected by the lower surface of the phosphor layer, effectively preventing the light from being repeatedly reflected inside the frame and attenuated or absorbed by the substrate or light emitting element. It is possible to effectively suppress a decrease in the extraction efficiency.

本発明の発光装置は、蛍光体層の下面に第2の透光性部材が形成されていることから、蛍光体層の下面に蛍光体が露出していたとしても、その露出した蛍光体を第2の透光性部材で覆うことにより、蛍光体から発せられた光を第2の透光性部材の下面で良好に全反射させて上側に光を進行させることができる。よって、蛍光体から直接隙間に光が発せされて光が基体や発光素子に吸収されるのを有効に防止し、より光取り出し効率を向上することが可能な発光装置とすることができる。   In the light emitting device of the present invention, since the second light transmissive member is formed on the lower surface of the phosphor layer, even if the phosphor is exposed on the lower surface of the phosphor layer, the exposed phosphor is By covering with the second translucent member, the light emitted from the phosphor can be totally reflected well on the lower surface of the second translucent member, and the light can be advanced upward. Therefore, it is possible to effectively prevent light from being directly emitted from the phosphor into the gap and absorbed by the substrate or the light emitting element, and to obtain a light emitting device capable of further improving light extraction efficiency.

本発明の発光装置は、第1の透光性部材が半球状であることから、発光素子から発せられる光の進行方向は、第1の透光性部材の上面との間の角度を直交にすることができるため、第1の透光性部材の上面で全反射することなく光を効率よく取り出すことができ、放射光強度の高い発光装置とすることができる。   In the light emitting device of the present invention, since the first translucent member is hemispherical, the traveling direction of light emitted from the light emitting element is orthogonal to the upper surface of the first translucent member. Therefore, light can be efficiently extracted without being totally reflected on the upper surface of the first light-transmissive member, and a light-emitting device with high radiated light intensity can be obtained.

本発明の発光装置は、第1の透光性部材または第2の透光性部材がシリコーン樹脂から成ることから、シリコーン樹脂は発光素子から発せられる紫外光などの光に対して劣化しにくいため、封止の信頼性の高い発光装置を提供することができる。   In the light emitting device of the present invention, since the first light transmissive member or the second light transmissive member is made of a silicone resin, the silicone resin hardly deteriorates against light such as ultraviolet light emitted from the light emitting element. A light-emitting device with high sealing reliability can be provided.

本発明の照明装置は、上記本発明の発光装置を光源として用いたことから、光取り出し効率を向上させ、放射光強度、軸上光度および輝度が高い照明装置を提供することができる。   Since the illuminating device of the present invention uses the light emitting device of the present invention as a light source, the light extraction efficiency can be improved, and an illuminating device having high radiated light intensity, high on-axis luminous intensity and luminance can be provided.

本発明の発光装置1について以下に詳細に説明する。図1および図5はそれぞれ本発明の発光装置1の実施の形態の各種例を示す断面図である。図1,5において、2は基体、3は枠体、4は発光素子、5は第1の透光性部材、6は第2の透光性部材、7は蛍光体層であり、主としてこれらで発光装置1が構成される。   The light emitting device 1 of the present invention will be described in detail below. FIG. 1 and FIG. 5 are sectional views showing various examples of the embodiment of the light emitting device 1 of the present invention. In FIGS. 1 and 5, 2 is a base, 3 is a frame, 4 is a light emitting element, 5 is a first light transmissive member, 6 is a second light transmissive member, and 7 is a phosphor layer. Thus, the light emitting device 1 is configured.

本発明における基体2は、アルミナセラミックス,窒化アルミニウム質焼結体,ムライト質焼結体,ガラスセラミックス等のセラミックス、エポキシ樹脂等の樹脂、または金属から成り、発光素子4を支持する支持部材として機能する。また、その上面に発光素子4を搭載するための搭載部2aを有している。   The substrate 2 in the present invention is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, resin such as epoxy resin, or metal, and functions as a support member that supports the light emitting element 4. To do. Moreover, it has the mounting part 2a for mounting the light emitting element 4 on the upper surface.

基体2がセラミックスの場合、発光素子4が電気的に接続されるための配線導体(図示せず)が搭載部2aやその周辺に形成されている。この配線導体が基体2の外表面に導出されて外部電気回路基板に接続されることにより、発光素子4と外部電気回路基板とが電気的に接続されることとなる。   When the base 2 is ceramic, a wiring conductor (not shown) for electrically connecting the light emitting element 4 is formed on the mounting portion 2a and its periphery. The wiring conductor is led out to the outer surface of the base 2 and connected to the external electric circuit board, whereby the light emitting element 4 and the external electric circuit board are electrically connected.

発光素子4を配線導体に接続する方法としては、ワイヤボンディング(図示せず)を介して接続する方法、または、発光素子4の下面で半田バンプ(図示せず)により接続するフリップチップボンディング方式を用いた方法等が用いられる。好ましくは、フリップチップボンディング方式により接続するのがよい。これにより、配線導体を発光素子4の直下に設けることができるため、発光素子4の周辺の基体2の上面に配線導体を設けるためのスペースを設ける必要がなくなる。よって、発光素子4から発光された光がこの基体2の配線導体用のスペースで吸収されて放射光強度が低下するのを有効に抑制することができるとともに発光装置1を小型にすることができる。   As a method of connecting the light emitting element 4 to the wiring conductor, a method of connecting via wire bonding (not shown) or a flip chip bonding method in which the lower surface of the light emitting element 4 is connected by solder bumps (not shown). The method used is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the wiring conductor can be provided directly under the light emitting element 4, it is not necessary to provide a space for providing the wiring conductor on the upper surface of the base 2 around the light emitting element 4. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 4 from being absorbed in the space for the wiring conductor of the base body 2 to reduce the intensity of the emitted light, and to reduce the size of the light emitting device 1. .

この配線導体は、基体2がセラミックスから成る場合、例えば、W,Mo,Cu,銀(Ag)等の金属粉末のメタライズ層により形成される。または、配線導体が形成された絶縁体から成る入出力端子を基体2に設けた貫通孔に嵌着接合させることによって設けられる。また、基体2が樹脂から成る場合、例えば、Fe−Ni−Co合金等のリード端子を埋設することによって形成される。   This wiring conductor is formed by a metallized layer of metal powder such as W, Mo, Cu, silver (Ag), for example, when the substrate 2 is made of ceramics. Alternatively, an input / output terminal made of an insulator on which a wiring conductor is formed is provided by being fitted into a through hole provided in the base 2. Moreover, when the base | substrate 2 consists of resin, it forms, for example by embedding lead terminals, such as a Fe-Ni-Co alloy.

なお、配線導体の露出する表面には、Niや金(Au)等の耐食性に優れる金属を1〜20μm程度の厚さで被着させておくのが良く、配線導体の酸化腐食を有効に防止し得るともに、発光素子4と配線導体との接続を強固にし得る。したがって、配線導体の露出表面には、例えば、厚さ1〜10μm程度のNiメッキ層と厚さ0.1〜3μm程度のAuメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのがより好ましい。   In addition, it is better to deposit a metal with excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm on the exposed surface of the wiring conductor, effectively preventing oxidative corrosion of the wiring conductor. In addition, the connection between the light emitting element 4 and the wiring conductor can be strengthened. Therefore, for example, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor by an electrolytic plating method or an electroless plating method. Is more preferable.

また、本発明における枠体3はAlやFe−Ni−Co合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工、金型成型、押し出し成型等により形成される。   The frame 3 in the present invention is made of metal such as Al or Fe-Ni-Co alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is formed by cutting, die molding, extrusion molding, or the like.

また、枠体3の内周面の表面は、その表面の算術平均粗さRaが、0.1μm以下であるのが良く、これにより発光素子4の光を良好に発光装置1の上側に反射することができる。Raが0.1μmを超える場合、発光素子4の枠体3の内周面で光を上側に反射し難くなるとともに発光装置1の内部で乱反射し易くなる。その結果、発光装置1の内部における光の伝搬損失が大きく成り易いとともに、所望の放射角度で光を発光装置1の外部に出射することが困難になる。   Further, the surface of the inner peripheral surface of the frame 3 should have an arithmetic average roughness Ra of the surface of 0.1 μm or less, whereby the light of the light emitting element 4 is favorably reflected to the upper side of the light emitting device 1. be able to. When Ra exceeds 0.1 μm, it becomes difficult to reflect light upward on the inner peripheral surface of the frame 3 of the light-emitting element 4 and diffusely reflect inside the light-emitting device 1. As a result, the propagation loss of light inside the light emitting device 1 tends to increase, and it becomes difficult to emit light outside the light emitting device 1 at a desired radiation angle.

また、本発明における蛍光体層7は、エポキシ樹脂、シリコーン樹脂、アクリル樹脂、または、ガラス等の透光性部材中に、例えば、赤、青、緑の3原色の蛍光体を混入して、第2の透光性部材の上面に塗布または載置することで形成される。蛍光体としては様々な材料が用いられており、例えば、赤はLaS:Eu(EuドープLaS)の蛍光体、緑はZnS:Cu,Alの蛍光体、青は(BaMgAl)1012:Euの蛍光体等の粒子状のものを用いる。さらに、このような蛍光体は1種類に限らず、複数のものを任意の割合で配合することにより、所望の発光スペクトルと色を有する光を出力することができる。 In addition, the phosphor layer 7 in the present invention is mixed with, for example, phosphors of three primary colors of red, blue, and green in a translucent member such as an epoxy resin, a silicone resin, an acrylic resin, or glass. It forms by apply | coating or mounting on the upper surface of a 2nd translucent member. Various materials are used as the phosphor. For example, red is a phosphor of La 2 O 2 S: Eu (Eu-doped La 2 O 2 S), green is a phosphor of ZnS: Cu, Al, and blue is a phosphor. A particulate material such as a phosphor of (BaMgAl) 10 O 12 : Eu is used. Furthermore, the phosphor is not limited to one type, and a light having a desired emission spectrum and color can be output by blending a plurality of phosphors at an arbitrary ratio.

また、蛍光体層7の厚みは0.1〜1mmであるのがよい。これにより、発光素子4から発光された光を効率よく波長変換させることができる。蛍光体層7の厚みが0.1mm未満であると、発光素子4から発せられた光のうち、蛍光体層7で波長変換されずに蛍光体層7を透過する割合が高くなり、波長変換効率が低下しやすくなる。また、1mmを超えると、蛍光体層7で波長変換された光が蛍光体層7で吸収されやすくなり、放射光強度が低下しやすくなる。   The thickness of the phosphor layer 7 is preferably 0.1 to 1 mm. Thereby, the wavelength of the light emitted from the light emitting element 4 can be efficiently converted. When the thickness of the phosphor layer 7 is less than 0.1 mm, the ratio of the light emitted from the light emitting element 4 that is transmitted through the phosphor layer 7 without being wavelength-converted by the phosphor layer 7 is increased. Tends to decrease. On the other hand, if the thickness exceeds 1 mm, the light whose wavelength has been converted by the phosphor layer 7 is easily absorbed by the phosphor layer 7 and the intensity of radiated light tends to decrease.

また、本発明の第1の透光性部材5は、発光素子4を覆うように形成されている。第1の透光性部材5は、発光素子4との屈折率差が小さく、紫外線領域から可視光領域の光に対して透過率の高いものから成るのがよく、例えば、第1の透光性部材5は、シリコーン樹脂,エポキシ樹脂,ユリア樹脂等の透明樹脂や、低融点ガラス、ゾル−ゲルガラス等から成る。これにより、発光素子4と第1の透光性部材5との屈折率差により光の反射損失が発生するのを有効に抑制することができる。   The first light transmissive member 5 of the present invention is formed so as to cover the light emitting element 4. The first translucent member 5 is preferably made of a material having a small refractive index difference from the light emitting element 4 and having a high transmissivity with respect to light from the ultraviolet region to the visible light region. The conductive member 5 is made of transparent resin such as silicone resin, epoxy resin, urea resin, low melting point glass, sol-gel glass, or the like. Thereby, it is possible to effectively suppress the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 4 and the first light transmissive member 5.

好ましくは、第1の透光性部材がシリコーン樹脂から成るのがよい。シリコーン樹脂は発光素子4から発せられる紫外光などの光に対して劣化しにくいため、封止の信頼性の高い発光装置を提供することができる。   Preferably, the first translucent member is made of a silicone resin. Since the silicone resin does not easily deteriorate with respect to light such as ultraviolet light emitted from the light-emitting element 4, a light-emitting device with high sealing reliability can be provided.

また、図2に示すように、第1の透光性部材5が半球状であるのがよい。これにより、発光素子4から発せられる光の進行方向は、第1の透光性部材5の上面との間の角度を直交にすることができるため、第1の透光性部材5の上面で全反射することなく光を効率よく取り出すことができ、放射光強度の高い発光装置1とすることができる。   Moreover, as shown in FIG. 2, the 1st translucent member 5 is good to be hemispherical. Thereby, since the traveling direction of the light emitted from the light emitting element 4 can be orthogonal to the upper surface of the first light transmissive member 5, the light is emitted from the upper surface of the first light transmissive member 5. Light can be efficiently extracted without being totally reflected, and the light emitting device 1 having high radiation light intensity can be obtained.

また、本発明の発光装置1は、好ましくは、蛍光体層7の下面に第2の透光性部材6が形成されているのがよい。これにより、蛍光体層7の下面に蛍光体が露出していたとしても、その露出した蛍光体を第2の透光性部材6で覆うことにより、蛍光体から発せられた光を第2の透光性部材6の下面で良好に全反射させて上側に光を進行させることができる。よって、蛍光体から直接隙間に光が発せされて光が基体2や発光素子4に吸収されるのを有効に防止し、より光取り出し効率を向上することが可能な発光装置1とすることができる。   In the light emitting device 1 of the present invention, it is preferable that the second light transmissive member 6 is formed on the lower surface of the phosphor layer 7. Thereby, even if the phosphor is exposed on the lower surface of the phosphor layer 7, the emitted phosphor is covered with the second translucent member 6, so that the light emitted from the phosphor is second Light can be fully reflected on the lower surface of the translucent member 6 to allow light to travel upward. Therefore, it is possible to effectively prevent the light from being directly emitted from the phosphor into the gap and absorbed by the substrate 2 or the light emitting element 4, and the light emitting device 1 capable of further improving the light extraction efficiency. it can.

このような第2の透光性部材6は、第1の透光性部材5との間に隙間をあけて第1の透光性部材5を覆うように設けられ、紫外線領域から可視光領域の光に対して透過率が高いものから成るのがよい。このように、第2の透光性部材6が第1の透光性部材との間に隙間をあけて第1の透光性部材を覆うように設けられているので、第1の透光性部材5の上面から広範囲に出射した光を第2の透光性部材6の下面に入射する際に基体2に対して直角な上側方向に進行させることができる。よって、蛍光体層7中を透過する光路長を蛍光体層7全体において近似させて波長変換効率の差によって色むらが生じるのを有効に防止することができるとともに、発光装置1の軸上へ指向性よく光を放射させて放射光強度、軸上光度および輝度を高めることができる。   Such a second translucent member 6 is provided so as to cover the first translucent member 5 with a gap between the second translucent member 5 and the ultraviolet light region to the visible light region. It is good to consist of a thing with the high transmittance | permeability with respect to the light of this. Thus, since the 2nd translucent member 6 is provided so that a clearance gap may be provided between the 1st translucent member and the 1st translucent member may be covered, the 1st translucent member is provided. The light emitted in a wide range from the upper surface of the conductive member 5 can be advanced in the upper direction perpendicular to the base 2 when entering the lower surface of the second light transmissive member 6. Therefore, the optical path length transmitted through the phosphor layer 7 can be approximated in the entire phosphor layer 7 to effectively prevent color unevenness due to the difference in wavelength conversion efficiency, and to the axis of the light emitting device 1. Light can be emitted with high directivity to increase the intensity of emitted light, the on-axis luminous intensity, and the luminance.

さらに、第2の透光性部材6の下面はより屈折率の低い空気層と接しているので、蛍光体層7中の蛍光体から下側方向に発せられる光や、蛍光体層7の上面で下側方向に反射された光の多くを第2の透光性部材6の下面で全反射させることができ、光が枠体3の内側で反射を繰り返して減衰したり、基体2や発光素子4に吸収されるのを有効に防止して、光取り出し効率が低下するのを有効に抑制することができる。   Furthermore, since the lower surface of the second translucent member 6 is in contact with the air layer having a lower refractive index, light emitted from the phosphor in the phosphor layer 7 in the lower direction, or the upper surface of the phosphor layer 7 Most of the light reflected in the lower direction can be totally reflected by the lower surface of the second translucent member 6, and the light is repeatedly reflected inside the frame body 3 to be attenuated, or the base 2 and the light emission. It is possible to effectively prevent the element 4 from being absorbed, and to effectively suppress a decrease in light extraction efficiency.

なお、第1の透光性部材5と蛍光体層7との間の隙間、または第1の透光性部材5と第2の透光性部材6との間の隙間は、第1の透光性部材5や第2の透光性部材6、蛍光体層を構成する透光性部材の屈折率よりも小さくなっていればよく、必ずしも空気層である必要はない。例えば、他の気体の層であってもよく、低屈折率の透光性部材の層であってもよい。   Note that the gap between the first translucent member 5 and the phosphor layer 7 or the gap between the first translucent member 5 and the second translucent member 6 is the first translucent member. It is sufficient that the refractive index of the light-transmitting member 5, the second light-transmitting member 6, and the light-transmitting member constituting the phosphor layer is smaller, and the air layer is not necessarily required. For example, it may be a layer of other gas or a layer of a light-transmissive member having a low refractive index.

第2の透光性部材6は、蛍光体層7を構成する透光性部材との屈折率差が小さく、紫外線領域から可視光領域の光に対して透過率の高いものから成るのがよく、例えば、第2の透光性部材5は、シリコーン樹脂,エポキシ樹脂,ユリア樹脂等の透明樹脂や、低融点ガラス、ゾル−ゲルガラス等から成る。好ましくは、蛍光体層7を構成する透光性部材と同じ材料であるのがよい。これにより、蛍光体層7と第2の透光性部材との界面で光を良好に透過させて光損失を小さくすることができるとともに蛍光体層7と第2の透光性部材5との熱膨張係数差による応力でこれらが剥離するのを有効に防止できる。   The second light transmissive member 6 is preferably made of a material having a small refractive index difference from the light transmissive member constituting the phosphor layer 7 and having a high transmittance with respect to light from the ultraviolet region to the visible light region. For example, the 2nd translucent member 5 consists of transparent resins, such as a silicone resin, an epoxy resin, and a urea resin, low melting glass, sol-gel glass, etc. Preferably, the same material as the translucent member constituting the phosphor layer 7 may be used. Thereby, light can be transmitted through the interface between the phosphor layer 7 and the second translucent member to reduce light loss, and the phosphor layer 7 and the second translucent member 5 can be reduced. These can be effectively prevented from being peeled off by stress due to a difference in thermal expansion coefficient.

また、好ましくは、第2の透光性部材5をシリコーン樹脂とするのがよい。シリコーン樹脂は発光素子4から発せられる紫外光などの光に対して劣化しにくいため、封止の信頼性の高い発光装置を提供することができる。   Preferably, the second light transmissive member 5 is made of silicone resin. Since the silicone resin does not easily deteriorate with respect to light such as ultraviolet light emitted from the light-emitting element 4, a light-emitting device with high sealing reliability can be provided.

また、第1の透光性部材5の厚みや、第1の透光性部材5と蛍光体層7との間隔(隙間の幅)、第1の透光性部材5と第2の透光性部材6との間隔(隙間の幅)、第2の透光性部材6の厚みは、第1の透光性部材5と蛍光体層7の界面や第1の透光性部材5と第2の透光性部材6の界面における反射効率を考慮して適切に選択すれば良い。   Further, the thickness of the first translucent member 5, the distance (gap width) between the first translucent member 5 and the phosphor layer 7, the first translucent member 5 and the second translucent light. The distance (gap width) from the light transmitting member 6 and the thickness of the second light transmitting member 6 are the same as the interface between the first light transmitting member 5 and the phosphor layer 7 and the first light transmitting member 5 and the first light transmitting member 5. The reflection efficiency at the interface between the two translucent members 6 may be selected appropriately.

好ましくは、図5に示すように、第1の透光性部材5の上面と蛍光体層7との間隔(隙間の幅)、または第1の透光性部材5の上面と第2の透光性部材6との間隔(隙間の幅)を第1の透光性部材5の厚みよりも小さくするのがよい。これにより、隙間の熱膨張を小さくするとともに隙間の熱膨張による応力を第1の透光性部材5で十分吸収して発光素子4に応力が生じて発光素子4の発光特性が変化するのを良好に防止できる。   Preferably, as shown in FIG. 5, the distance (gap width) between the upper surface of the first light-transmissive member 5 and the phosphor layer 7, or the upper surface of the first light-transmissive member 5 and the second light-transmissive member. It is preferable to make the distance (gap width) from the light transmissive member 6 smaller than the thickness of the first light transmissive member 5. As a result, the thermal expansion of the light-emitting element 4 is changed by reducing the thermal expansion of the gap and sufficiently absorbing the stress due to the thermal expansion of the gap by the first translucent member 5 to generate stress in the light-emitting element 4. It can prevent well.

一方、光損失を低減するという観点からは、第1の透光性部材5と第2の透光性部材6の厚みの合計(第2の透光性部材6がない場合は、第1の透光性部材5の厚み)が、隙間の幅(第1の透光性部材5と第2の透光性部材6との間隔、または第1の透光性部材5と蛍光体層7との間隔)よりも、小さくなっているのがよい。これにより、発光素子4から発光された光が外部に放出されるまでに通過する経路において、屈折率の小さな隙間の割合を大きくすることができ、発光装置内で閉じ込められたり、乱反射を繰り返すことによって生じる光の伝搬損失を抑制することができる
また、図3に示すように、枠体3の上面に、ガラス、サファイア、石英、またはエポキシ樹脂,シリコーン樹脂,アクリル樹脂等の樹脂(プラスチック)などの透明部材から成る蓋体8を載置固定しても良い。この場合、枠体3の内側に設置された、発光素子4、配線導体、ボンディングワイヤ、第1の透光性部材5、第2の透光性部材6を保護するとともに、発光装置1内部を気密に封止し、発光素子4を長期に安定した動作をさせることができる。また、蓋体8をレンズ状に形成して光学レンズの機能を付加することによって、光を集光または分散させて所望の放射角度、強度分布で光を発光装置1の外部に取りだすことができる。
On the other hand, from the viewpoint of reducing light loss, the total thickness of the first light transmissive member 5 and the second light transmissive member 6 (if there is no second light transmissive member 6, the first The thickness of the translucent member 5 is the width of the gap (the distance between the first translucent member 5 and the second translucent member 6 or the first translucent member 5 and the phosphor layer 7. It is better that it is smaller than the interval. Thereby, in the path through which the light emitted from the light emitting element 4 passes until it is emitted to the outside, the ratio of the gap with a small refractive index can be increased, and it is confined in the light emitting device or repeatedly diffusely reflected. In addition, as shown in FIG. 3, glass, sapphire, quartz, or a resin (plastic) such as epoxy resin, silicone resin, acrylic resin, etc. on the upper surface of the frame 3 The lid body 8 made of the transparent member may be placed and fixed. In this case, while protecting the light emitting element 4, the wiring conductor, the bonding wire, the first light transmissive member 5, and the second light transmissive member 6 installed inside the frame 3, the inside of the light emitting device 1 is protected. The light emitting element 4 can be hermetically sealed, and the light emitting element 4 can be operated stably for a long time. Further, by forming the lid 8 in the shape of a lens and adding the function of an optical lens, it is possible to collect or disperse the light and extract the light outside the light emitting device 1 with a desired radiation angle and intensity distribution. .

また、本発明の発光装置1は、1個のものを所定の配置となるように設置して光源として用いたことにより、または複数個を、例えば、格子状や千鳥状,放射状,複数の発光装置から成る、円状や多角形状の発光装置群を同心状に複数群形成したもの等所定の配置となるように設置して光源として用いたことにより、本発明の照明装置とすることができる。これにより、光取り出し効率を向上させ、放射光強度、軸上光度および輝度が高い照明装置を提供することができる。   In addition, the light emitting device 1 of the present invention is a single light source set in a predetermined arrangement and used as a light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emission types. A lighting device according to the present invention can be obtained by installing a light emitting device group of a circular shape or a polygonal shape, which is composed of a plurality of devices, so as to have a predetermined arrangement, such as a concentric group of light emitting device groups. . Thereby, the light extraction efficiency can be improved, and an illuminating device with high radiated light intensity, axial luminous intensity and luminance can be provided.

また、半導体から成る発光素子4の電子の再結合による発光を利用しているため、従来の放電を用いた照明装置よりも低消費電力かつ長寿命とすることが可能であり、発熱の小さな小型の照明装置とすることができる。その結果、発光素子4から発生する光の中心波長の変動を抑制することができ、長期間にわたり安定した放射光強度かつ放射光角度(配光分布)で光を照射することができるとともに、照射面における色むらや照度分布の偏りが抑制された照明装置とすることができる。   In addition, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and a small size that generates less heat. It can be set as the illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be irradiated with a stable radiant light intensity and radiant light angle (light distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

また、本発明の発光装置1を光源として所定の配置に設置するとともに、これらの発光装置1の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射できる照明装置とすることができる。   In addition, the light emitting device 1 of the present invention is installed in a predetermined arrangement as a light source, and a reflection jig, an optical lens, a light diffusing plate, or the like optically designed in an arbitrary shape is installed around the light emitting device 1 It can be set as the illuminating device which can radiate | emit light of arbitrary light distribution.

例えば、図6,図7に示す平面図,断面図のように複数個の発光装置1が発光装置駆動回路基板10に複数列に配置され、発光装置1の周囲に任意の形状に光学設計した反射治具9が設置されて成る照明装置の場合、隣接する一列上に配置された複数個の発光装置1において、隣り合う発光装置1との間隔が最短に成らないような配置、いわゆる千鳥状とすることが好ましい。即ち、発光装置1が格子状に配置される際には、光源となる発光装置1が直線上に配列されることによりグレアが強くなり、このような照明装置が人の視覚に入ってくることにより、不快感や目の障害を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人間の目に対する不快感や目に及ぼす障害を低減することができる。さらに、隣り合う発光装置1間の距離が長くなることにより、隣接する発光装置1間の熱的な干渉が有効に抑制され、発光装置1が実装された発光装置駆動回路基板10内における熱のこもりが抑制され、発光装置1の外部に効率よく熱が放散される。その結果、人の目に対しても障害の小さい長期間にわたり光学特性の安定した長寿命の照明装置を作製することができる。   For example, a plurality of light emitting devices 1 are arranged in a plurality of rows on the light emitting device driving circuit board 10 as shown in the plan view and the cross-sectional view shown in FIGS. 6 and 7, and are optically designed in an arbitrary shape around the light emitting device 1. In the case of an illuminating device in which the reflecting jig 9 is installed, in a plurality of light emitting devices 1 arranged on one adjacent row, an arrangement in which the interval between adjacent light emitting devices 1 is not shortest, a so-called staggered pattern It is preferable that That is, when the light-emitting devices 1 are arranged in a grid, the light-emitting devices 1 serving as light sources are arranged on a straight line, so that glare is strong, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between the adjacent light emitting devices 1 is increased, thermal interference between the adjacent light emitting devices 1 is effectively suppressed, and heat in the light emitting device driving circuit board 10 on which the light emitting device 1 is mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 1. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

また、照明装置が、図8,図9に示す平面図,断面図のような発光装置駆動回路基板10上に複数の発光装置1から成る円状や多角形状の発光装置1群を、同心状に複数群形成した照明装置の場合、1つの円状や多角形状の発光装置1群における発光装置1の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置1同士の間隔を適度に保ちながら発光装置1をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置1の密度を低くして発光装置駆動回路基板10の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基板10内における温度分布が一様となり、照明装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置1の温度上昇を抑制することができる。その結果、発光装置1は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。   In addition, the lighting device is a concentric arrangement of a circular or polygonal light-emitting device group consisting of a plurality of light-emitting devices 1 on the light-emitting device drive circuit board 10 as shown in the plan view and the sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable to increase the number of the light emitting devices 1 arranged in one circular or polygonal light emitting device 1 group toward the outer peripheral side from the center side of the illuminating device. Thereby, more light-emitting devices 1 can be arranged while keeping the interval between the light-emitting devices 1 moderately, and the illuminance of the illumination device can be further improved. Moreover, the density of the light-emitting device 1 in the central portion of the lighting device can be lowered to suppress heat accumulation in the central portion of the light-emitting device driving circuit board 10. Therefore, the temperature distribution in the light emitting device driving circuit board 10 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 1 can be suppressed. As a result, the light emitting device 1 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装,展示用照明器具、街路用照明器具、誘導灯器具及び信号装置、舞台及びスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

なお、本発明は以上の実施の形態の例および実施例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。   It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

また、本発明の照明装置は、複数個の発光装置1を所定の配置となるように設置したものだけでなく、1個の発光装置1を所定の配置となるように設置したものでもよい。   Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 1 are installed in a predetermined arrangement, but may be one in which one light emitting device 1 is installed in a predetermined arrangement.

本発明の発光装置1について以下に実施例を示す。   Examples of the light emitting device 1 of the present invention will be described below.

まず、基体2となるアルミナセラミックス基板を準備した。基体2は、幅8mm×奥行き8mm×厚さ0.5mmの直方体とした。   First, an alumina ceramic substrate to be the base 2 was prepared. The base 2 was a rectangular parallelepiped having a width of 8 mm, a depth of 8 mm, and a thickness of 0.5 mm.

また、基体2の発光素子4が搭載される搭載部2aから基体2の外表面にかけて配線導体を形成した。搭載部2aの配線導体は、Mo−Mn粉末からなるメタライズ層により直径0.1mmの円形パッドに成形され、その表面には厚さ3μmのNiメッキ層が被着された。また、基体2内部の配線導体は、貫通導体からなる電気接続部、いわゆるスルーホールによって形成された。このスルーホールについても搭載部2aの配線導体と同様にMo−Mn粉末からなるメタライズ導体で成形された。   Further, a wiring conductor was formed from the mounting portion 2 a on which the light emitting element 4 of the base 2 is mounted to the outer surface of the base 2. The wiring conductor of the mounting portion 2a was formed into a circular pad having a diameter of 0.1 mm by a metallized layer made of Mo—Mn powder, and a Ni plating layer having a thickness of 3 μm was deposited on the surface thereof. Moreover, the wiring conductor inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed of a metallized conductor made of Mo-Mn powder, like the wiring conductor of the mounting portion 2a.

さらに、基体2と枠体3を接着剤で接合し、しかる後、屈折率が1.76のエポキシ系樹脂から成る第1の透光性部材5を、発光素子4を覆うように枠体3の内部に半径0.4mmの半球形状となるように載置し、さらに、その半球形状の天頂部より高さ方向へ1.1mmの隙間を設け、その上方に屈折率が1.41のシリコーン樹脂から成る、厚みが0.1mmの板状の第2の透光性部材6を、第1の透光性部材5を覆うように枠体3の内側に接着した。そして、第2の透光性部材6の上面に、赤はLaS:Eu、緑はZnS:Cu,Al、青は(BaMgAl)1012:Euから成る蛍光体をシリコーン樹脂から成る透光性部材に含有して成る蛍光体層7を被覆させることで本発明の発光装置1を構成した。 Further, the base 2 and the frame 3 are bonded with an adhesive, and then the first light-transmissive member 5 made of an epoxy resin having a refractive index of 1.76 is disposed inside the frame 3 so as to cover the light emitting element 4. Is placed in a hemispherical shape with a radius of 0.4 mm, and a gap of 1.1 mm is provided in the height direction from the hemispherical zenith, and the thickness thereof is made of a silicone resin with a refractive index of 1.41. A plate-shaped second light-transmissive member 6 having a thickness of 0.1 mm was adhered to the inside of the frame 3 so as to cover the first light-transmissive member 5. On the upper surface of the second translucent member 6, a phosphor made of La 2 O 2 S: Eu for red, ZnS: Cu, Al for green, and (BaMgAl) 10 O 12 : Eu for blue is made of silicone resin. The light emitting device 1 of the present invention was configured by coating the phosphor layer 7 contained in the translucent member.

一方、比較例として、枠体3の内部に、第1の透光性部材5を厚さ1.5mmで充填して構成したこと以外は、本発明の発光装置1と同一条件のものを構成した。   On the other hand, as a comparative example, the same structure as the light emitting device 1 of the present invention was configured except that the frame 3 was filled with the first translucent member 5 with a thickness of 1.5 mm. .

このようにして作製した本発明の発光装置1と比較例について、各全光束量を測定したところ、本発明の発光装置1の全光束量が、比較例に対し約10%程度多くなり、本発明の発光装置1の方が優れていることが分かった。   When the total luminous flux was measured for the light emitting device 1 of the present invention thus manufactured and the comparative example, the total luminous flux of the light emitting device 1 of the present invention was increased by about 10% compared to the comparative example. It has been found that the light emitting device 1 of the invention is superior.

なお、本発明は以上の実施の形態の例および実施例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。   Note that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 従来の発光装置の断面図である。It is sectional drawing of the conventional light-emitting device. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の照明装置の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図6の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図8の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG.

符号の説明Explanation of symbols

1:発光装置
2:基体
2a:搭載部
3:枠体
4:発光素子
5:第1の透光性部材
6:第2の透光性部材
7:蛍光体層
8:蓋体
1: Light-emitting device 2: Base 2a: Mounting portion 3: Frame body 4: Light-emitting element 5: First light-transmitting member 6: Second light-transmitting member 7: Phosphor layer 8: Lid

Claims (6)

上面に発光素子の搭載部を有する基体と、該基体の上面の外周部に前記搭載部を固繞するように接合された枠体と、一端が前記基体の上面に形成されて前記発光素子の電極に電気的に接続されるとともに他端が前記基体の外面に導出された配線導体と、前記搭載部に搭載されるとともに前記配線導体に電気的に接続された前記発光素子と、前記発光素子を被覆する第1の透光性部材と、前記枠体の内周面または上面に、前記第1の透光性部材との間に隙間をあけて前記第1の透光性部材を覆うように設けられた、前記発光素子が発光する光を波長変換する蛍光体を透光性材料に含有させて成る蛍光体層とを具備していることを特徴とする発光装置。 A base having a light emitting element mounting portion on the top surface, a frame joined to the outer peripheral portion of the top surface of the base so as to fix the mounting portion, and one end formed on the top surface of the base. A wiring conductor electrically connected to the electrode and having the other end led to the outer surface of the base; the light emitting element mounted on the mounting portion and electrically connected to the wiring conductor; and the light emitting element The first translucent member that covers the first translucent member and the inner peripheral surface or the upper surface of the frame so as to cover the first translucent member with a gap between the first translucent member and the first translucent member And a phosphor layer comprising a translucent material containing a phosphor that converts the wavelength of light emitted from the light emitting element. 前記蛍光体層の下面に第2の透光性部材が形成されていることを特徴とする請求項1記載の発光装置。 The light emitting device according to claim 1, wherein a second light transmissive member is formed on a lower surface of the phosphor layer. 前記第1の透光性部材は半球状であることを特徴とする請求項1または請求項2記載の発光装置。 The light emitting device according to claim 1, wherein the first light transmissive member is hemispherical. 前記第1の透光性部材は、シリコーン樹脂から成ることを特徴とする請求項1乃至請求項3のいずれかに記載の発光装置。 The light emitting device according to claim 1, wherein the first light transmissive member is made of a silicone resin. 前記第2の透光性部材は、シリコーン樹脂から成ることを特徴とする請求項1乃至請求項4のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 4, wherein the second translucent member is made of silicone resin. 請求項1乃至請求項5のいずれかに記載の発光装置を光源として用いたことを特徴とする照明装置。 6. A lighting device using the light emitting device according to claim 1 as a light source.
JP2005016054A 2004-01-28 2005-01-24 Light emitting device and lighting device Expired - Fee Related JP3898721B2 (en)

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US11/721,807 US8106584B2 (en) 2004-12-24 2005-07-27 Light emitting device and illumination apparatus
CN2005800484314A CN101124683B (en) 2004-12-24 2005-07-27 Light-emitting device and illuminating device
KR1020077014202A KR101114305B1 (en) 2004-12-24 2005-07-27 Light-emitting device and illuminating device
PCT/JP2005/013749 WO2006067885A1 (en) 2004-12-24 2005-07-27 Light-emitting device and illuminating device
EP05767041A EP1840977A4 (en) 2004-12-24 2005-07-27 Light-emitting device and illuminating device
TW094125398A TWI433344B (en) 2004-12-24 2005-07-27 Light emitting apparatus and illuminating apparatus
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JP2017183302A (en) * 2016-03-28 2017-10-05 シチズン時計株式会社 Light-emitting device
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