JP7412413B2 - 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 - Google Patents

樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 Download PDF

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JP7412413B2
JP7412413B2 JP2021508203A JP2021508203A JP7412413B2 JP 7412413 B2 JP7412413 B2 JP 7412413B2 JP 2021508203 A JP2021508203 A JP 2021508203A JP 2021508203 A JP2021508203 A JP 2021508203A JP 7412413 B2 JP7412413 B2 JP 7412413B2
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resin
weight
resin composition
parts
dielectric layer
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JPWO2020195236A1 (enExample
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俊宏 細井
堅志郎 福田
祥浩 米田
友宏 石野
哲朗 佐藤
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Mitsui Kinzoku Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
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    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C—CHEMISTRY; METALLURGY
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    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
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    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
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    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
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    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
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    • B32B2307/70—Other properties
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
JP2021508203A 2019-03-27 2020-02-07 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板 Active JP7412413B2 (ja)

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JP2019059816 2019-03-27
JP2019059816 2019-03-27
PCT/JP2020/004882 WO2020195236A1 (ja) 2019-03-27 2020-02-07 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板

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KR20220079327A (ko) * 2020-12-04 2022-06-13 코닝 인코포레이티드 광추출 기판 및 이를 구비하는 유기발광장치

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JP2002064111A (ja) 2000-08-21 2002-02-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2006123232A (ja) 2004-10-27 2006-05-18 Mitsui Mining & Smelting Co Ltd 誘電体フィラー含有樹脂層付銅箔及びその誘電体フィラー含有樹脂層付銅箔を用いて得られたプリント配線板
JP2011219674A (ja) 2010-04-13 2011-11-04 Sumitomo Bakelite Co Ltd 回路基板用熱硬化樹脂性組成物
JP2014012751A (ja) 2012-07-03 2014-01-23 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板
JP2017193655A (ja) 2016-04-21 2017-10-26 Dic株式会社 フッ素樹脂粒子分散体、樹脂組成物、金属張積層板、プリプレグ及び金属張積層板の製造方法
WO2018003590A1 (ja) 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置

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JPH05208469A (ja) 1991-09-03 1993-08-20 Matsushita Electric Works Ltd 電気用積層板
JPH09291473A (ja) 1996-04-23 1997-11-11 Asahi Shiyueebell Kk ガラスクロス
ES2367838T3 (es) * 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6657849B1 (en) 2000-08-24 2003-12-02 Oak-Mitsui, Inc. Formation of an embedded capacitor plane using a thin dielectric
JP2002309200A (ja) 2001-04-17 2002-10-23 Ajinomoto Co Inc 接着フィルム
JP2005208469A (ja) 2004-01-26 2005-08-04 Konica Minolta Business Technologies Inc 画像形成装置
CA2558594A1 (en) * 2004-03-29 2005-10-06 Nippon Chemical Industrial Co., Ltd. Inorganic dielectric powder for composite dielectric material and composite dielectric material
JP5189901B2 (ja) 2008-06-06 2013-04-24 花王株式会社 吸収性物品
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Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2002064111A (ja) 2000-08-21 2002-02-28 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及びそれを用いた半導体装置
JP2006123232A (ja) 2004-10-27 2006-05-18 Mitsui Mining & Smelting Co Ltd 誘電体フィラー含有樹脂層付銅箔及びその誘電体フィラー含有樹脂層付銅箔を用いて得られたプリント配線板
JP2011219674A (ja) 2010-04-13 2011-11-04 Sumitomo Bakelite Co Ltd 回路基板用熱硬化樹脂性組成物
JP2014012751A (ja) 2012-07-03 2014-01-23 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板
JP2017193655A (ja) 2016-04-21 2017-10-26 Dic株式会社 フッ素樹脂粒子分散体、樹脂組成物、金属張積層板、プリプレグ及び金属張積層板の製造方法
WO2018003590A1 (ja) 2016-06-28 2018-01-04 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置

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