JP7402385B1 - 半導体洗浄液および半導体洗浄液の製造方法 - Google Patents

半導体洗浄液および半導体洗浄液の製造方法 Download PDF

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JP7402385B1
JP7402385B1 JP2023535854A JP2023535854A JP7402385B1 JP 7402385 B1 JP7402385 B1 JP 7402385B1 JP 2023535854 A JP2023535854 A JP 2023535854A JP 2023535854 A JP2023535854 A JP 2023535854A JP 7402385 B1 JP7402385 B1 JP 7402385B1
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distillation column
isopropyl alcohol
distillation
stage
semiconductor cleaning
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JPWO2023176192A1 (https=
JPWO2023176192A5 (https=
Inventor
俊輔 保坂
貴史 徳永
義晶 山下
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Tokuyama Corp
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Tokuyama Corp
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
    • C07C29/03—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by addition of hydroxy groups to unsaturated carbon-to-carbon bonds, e.g. with the aid of H2O2
    • C07C29/04—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring by addition of hydroxy groups to unsaturated carbon-to-carbon bonds, e.g. with the aid of H2O2 by hydration of carbon-to-carbon double bonds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
    • C07C29/74—Separation; Purification; Use of additives, e.g. for stabilisation
    • C07C29/76—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment
    • C07C29/80—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment by distillation
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C29/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom not belonging to a six-membered aromatic ring
    • C07C29/74—Separation; Purification; Use of additives, e.g. for stabilisation
    • C07C29/76—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment
    • C07C29/80—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment by distillation
    • C07C29/82—Separation; Purification; Use of additives, e.g. for stabilisation by physical treatment by distillation by azeotropic distillation
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C31/00—Saturated compounds having hydroxy or O-metal groups bound to acyclic carbon atoms
    • C07C31/02—Monohydroxylic acyclic alcohols
    • C07C31/10—Monohydroxylic acyclic alcohols containing three carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
JP2023535854A 2022-03-16 2023-02-07 半導体洗浄液および半導体洗浄液の製造方法 Active JP7402385B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022041318 2022-03-16
JP2022041318 2022-03-16
PCT/JP2023/003901 WO2023176192A1 (ja) 2022-03-16 2023-02-07 半導体洗浄液および半導体洗浄液の製造方法

Publications (3)

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JPWO2023176192A1 JPWO2023176192A1 (https=) 2023-09-21
JP7402385B1 true JP7402385B1 (ja) 2023-12-20
JPWO2023176192A5 JPWO2023176192A5 (https=) 2024-02-22

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JP2023535854A Active JP7402385B1 (ja) 2022-03-16 2023-02-07 半導体洗浄液および半導体洗浄液の製造方法

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Country Link
US (1) US20250171718A1 (https=)
JP (1) JP7402385B1 (https=)
KR (1) KR20240163660A (https=)
CN (1) CN118742996A (https=)
DE (1) DE112023001404T5 (https=)
TW (1) TW202344677A (https=)
WO (1) WO2023176192A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260021637A (ko) * 2023-06-13 2026-02-13 가부시키가이샤 도쿠야마 반도체 약액 및 반도체 약액의 제조방법
CN121752541A (zh) * 2023-09-07 2026-03-27 株式会社德山 纯化异丙醇水溶液的制造方法
JP2026505851A (ja) * 2023-11-15 2026-02-18 エルジー・ケム・リミテッド イソプロピルアルコールの精製方法
WO2025105774A1 (ko) * 2023-11-15 2025-05-22 주식회사 엘지화학 이소프로필 알코올의 제조방법
JP7651784B1 (ja) * 2023-11-28 2025-03-26 株式会社トクヤマ 精製イソプロピルアルコールの製造方法
WO2025115528A1 (ja) * 2023-11-28 2025-06-05 株式会社トクヤマ 精製イソプロピルアルコールの製造方法
JP7695493B1 (ja) * 2023-12-01 2025-06-18 株式会社トクヤマ 精製イソプロピルアルコールの製造方法および製造装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121160A (ja) * 2000-10-16 2002-04-23 Mitsui Chemicals Inc イソプロピルアルコールの製造方法
WO2009037953A1 (ja) * 2007-09-19 2009-03-26 Mitsui Chemicals, Inc. アルコールの製造方法および酸処理ラネー触媒
WO2017217279A1 (ja) * 2016-06-17 2017-12-21 株式会社トクヤマ イソプロピルアルコールの製造方法及び不純物が低減されたイソプロピルアルコール
WO2018135408A1 (ja) * 2017-01-23 2018-07-26 株式会社トクヤマ イソプロピルアルコール組成物及びイソプロピルアルコールの製造方法
WO2020071307A1 (ja) * 2018-10-03 2020-04-09 株式会社トクヤマ 高純度イソプロピルアルコール及びその製造方法
WO2021200936A1 (ja) * 2020-04-02 2021-10-07 株式会社トクヤマ 半導体処理液及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002121160A (ja) * 2000-10-16 2002-04-23 Mitsui Chemicals Inc イソプロピルアルコールの製造方法
WO2009037953A1 (ja) * 2007-09-19 2009-03-26 Mitsui Chemicals, Inc. アルコールの製造方法および酸処理ラネー触媒
WO2017217279A1 (ja) * 2016-06-17 2017-12-21 株式会社トクヤマ イソプロピルアルコールの製造方法及び不純物が低減されたイソプロピルアルコール
WO2018135408A1 (ja) * 2017-01-23 2018-07-26 株式会社トクヤマ イソプロピルアルコール組成物及びイソプロピルアルコールの製造方法
WO2020071307A1 (ja) * 2018-10-03 2020-04-09 株式会社トクヤマ 高純度イソプロピルアルコール及びその製造方法
WO2021200936A1 (ja) * 2020-04-02 2021-10-07 株式会社トクヤマ 半導体処理液及びその製造方法

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Publication number Publication date
CN118742996A (zh) 2024-10-01
DE112023001404T5 (de) 2024-12-24
JPWO2023176192A1 (https=) 2023-09-21
KR20240163660A (ko) 2024-11-19
TW202344677A (zh) 2023-11-16
US20250171718A1 (en) 2025-05-29
WO2023176192A1 (ja) 2023-09-21

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