JP7397595B2

JP7397595B2 - Wiring base and electronic equipment

Info

Publication number: JP7397595B2
Application number: JP2019139888A
Authority: JP
Inventors: 郁也早野
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2023-12-13
Anticipated expiration: 2039-07-30
Also published as: JP2021022699A

Description

本発明は、電子部品が基体の側面に実装される配線基体および電子装置に関する。 The present invention relates to a wiring substrate and an electronic device in which electronic components are mounted on the side surface of the substrate.

例えば加速度センサ等の電子部品（センサ部品）が一つの配線基板に対し複数搭載されてなる電子装置が知られている。これらのセンサ部品は、自動車または撮像装置等の機器における前後左右上下等の多方向における加速度等の物理量を検知する。そして、検知した物理量は機器の制御等に利用される。 For example, an electronic device is known in which a plurality of electronic components (sensor components) such as an acceleration sensor are mounted on one wiring board. These sensor components detect physical quantities such as acceleration in multiple directions such as front, back, left, right, top and bottom of a vehicle or a device such as an imaging device. Then, the detected physical quantity is used for controlling equipment, etc.

複数のセンサ部品は、それぞれ一方向の検知方向を有している。これらのセンサ部品は、それぞれの検知方向が互いに異なる方向になるように実装されている（引用文献１）。 Each of the plurality of sensor components has one detection direction. These sensor components are mounted so that their detection directions are different from each other (cited document 1).

特開２００４－１５３５０３号公報Japanese Patent Application Publication No. 2004-153503

従来、複数の電子部品が搭載される配線基板および電子装置では、配線基板の側面に電子部品が実装される。このとき、電子部品との電気的な接続に用いる導体は、配線基板の主面（上面）に設けられたものに比較して側面に設けられたものは接合強度が小さく、剥がれ易い場合があり、配線基板や電子装置の接続信頼性が低下する可能性があった。 Conventionally, in wiring boards and electronic devices on which a plurality of electronic components are mounted, the electronic components are mounted on the side surface of the wiring board. At this time, conductors used for electrical connections with electronic components may have a lower bonding strength and may peel off more easily if they are provided on the side surfaces of the wiring board than those provided on the main surface (top surface). , there was a possibility that the connection reliability of wiring boards and electronic devices would deteriorate.

本発明の一実施形態に係る配線基体は、第１方向に沿う第１面と、前記第１方向に直交する第２面と、を含む基体を備え、前記第１面は電子部品が実装される面であり、前記第２面は外部基板に接続する面であり、前記第１面は、第１凹部と、該第１凹部の内側面を覆う第１導体と、を有し、前記基体は、前記第１方向に沿うとともに前記第１面に直交する第３面を有し、前記基体は、前記第１面と前記第２面との間に、前記第１方向に直交する方向に突出した第１凸部と、該第１凸部に位置する電極パッドと、前記第３面と前記第２面との間に、前記第１方向に直交する方向に突出した第２凸部と、を有し、前記第１面の正面視において、前記第１凸部の幅が、前記第１面の端から前記第２凸部の突出する方向の第２凸部の突出長さを含んでいる。 A wiring base according to an embodiment of the present invention includes a base including a first surface along a first direction and a second surface perpendicular to the first direction, and the first surface has electronic components mounted thereon. the second surface is a surface connected to an external board; the first surface has a first recess; and a first conductor covering an inner surface of the first recess; has a third surface extending in the first direction and perpendicular to the first surface, and the base body has a third surface extending in the direction perpendicular to the first direction between the first surface and the second surface. a protruding first protrusion, an electrode pad located on the first protrusion, and a second protrusion protruding in a direction perpendicular to the first direction between the third surface and the second surface. , when the first surface is viewed from the front, the width of the first convex portion includes a protrusion length of the second convex portion in a direction in which the second convex portion protrudes from an end of the first surface. I'm here.

本発明の一実施形態に係る配線基体は、上述した構成であることによって、配線基体の側面に位置する導体は、平坦な側面上に設けられたものと比較して側面における面積が同じであっても接合面積が大きくなるので接合強度が増し、剥がれにくくなる。その結果、配線基体に実装される電子部品の接続信頼性を高めることができる。 The wiring base according to an embodiment of the present invention has the above-described configuration, so that the conductor located on the side surface of the wiring base has the same area on the side surface as that of the conductor provided on the flat side surface. However, since the bonding area becomes larger, the bonding strength increases and peeling becomes difficult. As a result, connection reliability of electronic components mounted on the wiring base can be improved.

本発明の一実施形態に係る配線基体の斜視図である。FIG. 1 is a perspective view of a wiring base according to an embodiment of the present invention. 本発明の一実施形態に係る配線基体の斜視図である。FIG. 1 is a perspective view of a wiring base according to an embodiment of the present invention. （ａ）は図１および図２に示す配線基体における第１凹部および第２凹部を示す断面図であり、（ｂ）および（ｃ）は第１凹部および第２凹部の他の例を示す断面図である。(a) is a cross-sectional view showing a first recess and a second recess in the wiring substrate shown in FIGS. 1 and 2, and (b) and (c) are cross-sectional views showing other examples of the first recess and the second recess. It is a diagram. （ａ）は図１に示す配線基体における第１導体および第２導体を示す断面図であり、（ｂ）および（ｃ）は第１導体および第２導体の他の例を示す断面図である。(a) is a cross-sectional view showing the first conductor and the second conductor in the wiring base shown in FIG. 1, and (b) and (c) are cross-sectional views showing other examples of the first conductor and the second conductor. . （ａ）は図２に示す配線基体における第１導体および第２導体を示す断面図であり、（ｂ）および（ｃ）は第１導体および第２導体の他の例を示す断面図である。(a) is a cross-sectional view showing the first conductor and the second conductor in the wiring base shown in FIG. 2, and (b) and (c) are cross-sectional views showing other examples of the first conductor and the second conductor. . 本発明の一実施形態に係る電子装置の斜視図である。1 is a perspective view of an electronic device according to an embodiment of the present invention. 図６の第１面の正面図である。FIG. 7 is a front view of the first side of FIG. 6; 図６のＶＩＩＩ－ＶＩＩＩ線における断面図である。7 is a cross-sectional view taken along line VIII-VIII in FIG. 6. FIG. 図７のＩＸ－ＩＸ線における断面図である。8 is a sectional view taken along line IX-IX in FIG. 7. FIG. 図７のＸ－Ｘ線における断面図である。8 is a sectional view taken along line XX in FIG. 7. FIG. 本発明の他の実施形態に係る配線基体の斜視図である。FIG. 7 is a perspective view of a wiring base according to another embodiment of the present invention. 本発明の他の実施形態に係る電子装置の斜視図である。FIG. 3 is a perspective view of an electronic device according to another embodiment of the present invention. 図１２に示す電子装置の第１面の正面図である。13 is a front view of the first side of the electronic device shown in FIG. 12. FIG. 本発明の他の実施形態に係る配線基体の斜視図である。FIG. 7 is a perspective view of a wiring base according to another embodiment of the present invention. 本発明の他の実施形態に係る電子装置の斜視図である。FIG. 3 is a perspective view of an electronic device according to another embodiment of the present invention. 本発明の他の実施形態に係る配線基体の斜視図である。FIG. 7 is a perspective view of a wiring base according to another embodiment of the present invention. 図１６に示す配線基体の第１面の正面図である。17 is a front view of the first surface of the wiring base shown in FIG. 16. FIG. 本発明の他の実施形態に係る電子装置の斜視図である。FIG. 3 is a perspective view of an electronic device according to another embodiment of the present invention. 図１８の第１面の正面図である。19 is a front view of the first side of FIG. 18. FIG. 図６に示す電子装置と外部基板とが接続した斜視図である。FIG. 7 is a perspective view of the electronic device shown in FIG. 6 connected to an external board.

以下、各実施形態の配線基体１について、図面を用いて詳細に説明する。各図面には、説明の便宜上、第１方向をｚ方向とするｘｙｚ直交座標を付している。以下、第１方向をｚ方向として説明する場合がある。また、z方向の正方向を上方向として上下方向の説明をする場合がある。 Hereinafter, the wiring base 1 of each embodiment will be described in detail using the drawings. For convenience of explanation, xyz orthogonal coordinates with the first direction as the z direction are attached to each drawing. Hereinafter, the first direction may be described as the z direction. Further, the vertical direction may be explained with the positive direction of the z direction as the upward direction.

＜配線基体１の構成＞
図１は、本発明の一実施形態に係る配線基体１の斜視図である。図２は、本発明の一実施形態に係る配線基体１の斜視図である。図３（ａ）は、図１および図２に示す配線基体１における第１凹部３１および第２凹部５１を示す断面図であり、（ｂ）および（ｃ）は第１凹部３１および第２凹部５１の他の例を示す断面図である。図４（ａ）は、図１に示す配線基体１における第１導体３２および第２導体５２を示す断面図であり、（ｂ）および（ｃ）は第１導体３２および第２導体５２の他の例を示す断面図である。図５（ａ）は、図２に示す配線基体１における第１導体３２および第２導体５２を示す断面図であり、（ｂ）および（ｃ）は第１導体３２および第２導体５２の他の例を示す断面図である。図３～図５は、第１方向（ｚ方向）に直交する断面図である。 <Configuration of wiring base 1>
FIG. 1 is a perspective view of a wiring base 1 according to an embodiment of the present invention. FIG. 2 is a perspective view of the wiring base 1 according to one embodiment of the present invention. 3(a) is a sectional view showing the first recess 31 and the second recess 51 in the wiring base 1 shown in FIGS. 1 and 2, and FIG. 51 is a cross-sectional view showing another example. 4(a) is a sectional view showing the first conductor 32 and the second conductor 52 in the wiring base 1 shown in FIG. It is a sectional view showing an example. 5(a) is a cross-sectional view showing the first conductor 32 and the second conductor 52 in the wiring base 1 shown in FIG. It is a sectional view showing an example. 3 to 5 are cross-sectional views perpendicular to the first direction (z direction).

図６は、本発明の一実施形態に係る電子装置１０の斜視図である。なお、図６は図２に示す例の配線基体１を用いた電子装置１０の例を示している。図７は、図６の第１面３の正面図である。なお、図６（ａ）は第４面６側からの斜視図であり、図６（ｂ）は第２面４側からの斜視図である。図８は、図６のＶＩＩＩ－ＶＩＩＩ線における断面図である。図９は、図７のＩＸ－ＩＸ線における断面図である。図１０は、図７のＸ－Ｘ線における断面図である。 FIG. 6 is a perspective view of the electronic device 10 according to an embodiment of the invention. Note that FIG. 6 shows an example of an electronic device 10 using the wiring substrate 1 shown in FIG. FIG. 7 is a front view of the first surface 3 of FIG. 6. Note that FIG. 6(a) is a perspective view from the fourth surface 6 side, and FIG. 6(b) is a perspective view from the second surface 4 side. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 6. 9 is a sectional view taken along line IX-IX in FIG. 7. FIG. 10 is a cross-sectional view taken along line XX in FIG. 7.

図１１は、本発明の他の実施形態に係る配線基体１の斜視図である。図１１（ａ）は第４面６側からの斜視図であり、図１１（ｂ）は第２面４側からの斜視図である。図１２は、本発明の他の実施形態に係る電子装置１０の斜視図である。なお、図１２は図１１に示す例の配線基体１を用いた電子装置１０の例を示している。図１３は、図１２に示す電子装置１０の第１面３の正面図である。図１４は、本発明の他の実施形態に係る配線基体１の斜視図である。図１４（ａ）は第４面６側からの斜視図であり、図１４（ｂ）は第２面４側からの斜視図である。図１５は、本発明の他の実施形態に係る電子装置１０の斜視図である。なお、図１５は図１４に示す例の配線基体１を用いた電子装置１０の例を示している。また、図１５（ａ）は第４面６側からの斜視図であり、図１５（ｂ）は第２面４側からの斜視図である。 FIG. 11 is a perspective view of a wiring base 1 according to another embodiment of the present invention. 11(a) is a perspective view from the fourth surface 6 side, and FIG. 11(b) is a perspective view from the second surface 4 side. FIG. 12 is a perspective view of an electronic device 10 according to another embodiment of the invention. Note that FIG. 12 shows an example of an electronic device 10 using the wiring base 1 shown in FIG. 11. FIG. 13 is a front view of the first surface 3 of the electronic device 10 shown in FIG. 12. FIG. 14 is a perspective view of a wiring base 1 according to another embodiment of the present invention. 14(a) is a perspective view from the fourth surface 6 side, and FIG. 14(b) is a perspective view from the second surface 4 side. FIG. 15 is a perspective view of an electronic device 10 according to another embodiment of the invention. Note that FIG. 15 shows an example of an electronic device 10 using the wiring base 1 shown in FIG. 14. Further, FIG. 15(a) is a perspective view from the fourth surface 6 side, and FIG. 15(b) is a perspective view from the second surface 4 side.

図１６は、本発明の他の実施形態に係る配線基体１の斜視図である。図１７は、図１６に示す配線基体１の第１面３の正面図である。図１８は、本発明の他の実施形態に係る電子装置１０の斜視図である。なお、図１８は図１６に示す例の配線基体１を用いた電子装置１０の例を示している。図１９は、図１８の第１面３の正面図である。図２０は、図６に示す電子装置１０と外部基板７とが接続した斜視図である。 FIG. 16 is a perspective view of a wiring base 1 according to another embodiment of the present invention. FIG. 17 is a front view of the first surface 3 of the wiring base 1 shown in FIG. 16. FIG. 18 is a perspective view of an electronic device 10 according to another embodiment of the invention. Note that FIG. 18 shows an example of an electronic device 10 using the wiring base 1 shown in FIG. 16. FIG. 19 is a front view of the first surface 3 of FIG. 18. FIG. 20 is a perspective view in which the electronic device 10 shown in FIG. 6 and the external board 7 are connected.

本発明の各実施形態に係る配線基体１は、第１方向に沿う第１面３と、第１方向に直交する第２面４と、を含む基体２を備えている。第１面３は第１電子部品３０が実装される面であり、第１凹部３１と、第１凹部３１の内側面を覆う第１導体３２と、を有する。第２面４は外部基板７に接続する面である。なお、本明細書において配線基体１は、基体２の第１面３に対し、第１凹部３１、第１導体３２が備わったものを配線基体１と呼ぶ。 The wiring base 1 according to each embodiment of the present invention includes a base 2 including a first surface 3 extending in a first direction and a second surface 4 perpendicular to the first direction. The first surface 3 is a surface on which the first electronic component 30 is mounted, and has a first recess 31 and a first conductor 32 that covers the inner surface of the first recess 31 . The second surface 4 is a surface connected to the external board 7. Note that, in this specification, the wiring base 1 having the first recess 31 and the first conductor 32 on the first surface 3 of the base 2 is referred to as the wiring base 1 .

また、配線基体１は第１方向に沿うとともに第１面３に直交する第３面５と、第１方向に直交する第４面６とをさらに備えていてもよい。第３面５は第２電子部品５０が実装される面であり、第２凹部５１と、第２凹部５１の内側面を覆う第２導体５２と、を有する。第４面６は第３電子部品６０が実装される面であり、第４面６上に第３導体６１を有する。以降、配線基体１が備える各構成について述べていく。 Further, the wiring base 1 may further include a third surface 5 extending along the first direction and perpendicular to the first surface 3, and a fourth surface 6 perpendicular to the first direction. The third surface 5 is a surface on which the second electronic component 50 is mounted, and has a second recess 51 and a second conductor 52 that covers the inner surface of the second recess 51. The fourth surface 6 is a surface on which the third electronic component 60 is mounted, and has a third conductor 61 on the fourth surface 6. Hereinafter, each configuration of the wiring base 1 will be described.

配線基体１を構成する基体２は、図１や図２の斜視図のように直方体形状であってもよい。直方体形状である場合、より具体的には、立方体形状であってもよい。直方体形状や立方体形状であることにより、例えば複数の電子部品を一つの配線基体に実装することができるので、一つの配線基板に対し一つの電子部品を実装する場合に比べ、必要な配線基体１の数を少なくすることができ、外部基板７に実装する際に省スペース化しやすくなる。加えて第１面３、第３面５、および第４面６のそれぞれに実装される第１電子部品３０、第２電子部品５０、第３電子部品６０として例えば一方向における物理量の検知機能を有するセンサ部品を実装した際に、３方向の物理量の精確な検出が容易となる。 The base 2 constituting the wiring base 1 may have a rectangular parallelepiped shape as shown in the perspective views of FIGS. 1 and 2. When the shape is a rectangular parallelepiped, more specifically, the shape may be a cube. Due to the rectangular parallelepiped or cubic shape, for example, multiple electronic components can be mounted on one wiring substrate, so compared to the case where one electronic component is mounted on one wiring substrate, the number of wiring substrates required is smaller. This makes it easier to save space when mounting on the external board 7. In addition, the first electronic component 30, the second electronic component 50, and the third electronic component 60 mounted on the first surface 3, the third surface 5, and the fourth surface 6 each have a function of detecting a physical quantity in one direction, for example. When a sensor component having the above structure is mounted, accurate detection of physical quantities in three directions becomes easy.

基体２の形状は、例えば図１６の斜視図ように３枚の板がそれぞれ直交して配置されて一体となった形状であってもよい。言い換えれば、図１や図２のような直方体形状の基体２を第１面３、第３面５および第４面６に亘って切り欠いた形状であってもよい。この形状であることによって、後述するように第１面３、第３面５、および第４面６のそれぞれに電子部品３０，５０，６０を実装する際に、電子部品３０，５０，６０を基体２で囲まれた空間内に実装することができ、電子部品３０，５０，６０が基体２の外側へ突出しないので、配線基体１を一層小型化でき、ひいては電子装置１０をより一層小型化しやすくなる。基体２の他の形状としては、２枚の板が直交して配置され一体となったＬ字形状であってもよい。このときの第１面３は第４面６と直交する面であり、第３面５は第１面３の裏面であり基体２の外側に位置することになる。あるいは、第１面３と第３面５は同じ面とすることもできる。いずれの場合であっても、少なくとも２つの電子部品３０，６０を基体２で囲まれた内側の空間に実装することができるので、電子装置１０をより一層小型化しやすくなる。 The shape of the base body 2 may be, for example, a shape in which three plates are arranged orthogonally to each other and integrated, as shown in the perspective view of FIG. 16. In other words, the rectangular parallelepiped-shaped base 2 as shown in FIGS. 1 and 2 may be cut out across the first surface 3, third surface 5, and fourth surface 6. This shape allows the electronic components 30, 50, 60 to be mounted on the first surface 3, third surface 5, and fourth surface 6, respectively, as described later. Since it can be mounted in the space surrounded by the base 2 and the electronic components 30, 50, and 60 do not protrude outside the base 2, the wiring base 1 can be further downsized, and the electronic device 10 can be further downsized. It becomes easier. Another shape of the base body 2 may be an L-shape in which two plates are arranged perpendicularly and integrated. The first surface 3 at this time is a surface perpendicular to the fourth surface 6, and the third surface 5 is the back surface of the first surface 3 and is located on the outside of the base body 2. Alternatively, the first surface 3 and the third surface 5 may be the same surface. In either case, at least two electronic components 30 and 60 can be mounted in the inner space surrounded by the base 2, making it easier to downsize the electronic device 10.

基体２の大きさは、例えば幅が３ｍｍ～１５ｍｍ、奥行きが３ｍｍ～１５ｍｍ、高さが３ｍｍ～１５ｍｍで構成される仮想直方体の内部に収まる大きさであってもよい。なお、本明細書において基体２の内側とは、この仮想直方体の中心に近い側のことであり、基体２の外部とは仮想直方体の中心から遠い側を意味する。 The size of the base body 2 may be such that it fits inside a virtual rectangular parallelepiped having a width of 3 mm to 15 mm, a depth of 3 mm to 15 mm, and a height of 3 mm to 15 mm. Note that in this specification, the inside of the base 2 means the side near the center of this virtual rectangular parallelepiped, and the outside of the base 2 means the side far from the center of the virtual rectangular parallelepiped.

基体２は絶縁体材料を含んでいてもよく、複数の絶縁層が第１方向に積層されて基体２が作られていてもよい。例えば、図８に示す例では１３層の絶縁層が積層されて基体２が構成されている。絶縁体材料は、たとえば酸化アルミニウム質焼結体、ムライト質焼結体、炭化珪素質焼結体、窒化アルミニウム質焼結体または窒化珪素質焼結体のようなセラミック材料、またはガラスセラミック材料等を用いることができる。 The base body 2 may include an insulating material, and the base body 2 may be formed by laminating a plurality of insulating layers in the first direction. For example, in the example shown in FIG. 8, the base body 2 is configured by laminating 13 insulating layers. Examples of the insulating material include ceramic materials such as aluminum oxide sintered bodies, mullite sintered bodies, silicon carbide sintered bodies, aluminum nitride sintered bodies, and silicon nitride sintered bodies, or glass ceramic materials. can be used.

基体２は、図１、図２の配線基体１の斜視図で示すように、第１方向に沿う第１面３に、第１凹部３１と、第１凹部３１の内側面を覆う第１導体３２とを有している。第１凹部３１の内側面とは、第１凹部３１の内面のうち、第１方向（ｚ方向）に直交する面（上面、下面）は含まず、第１方向に沿う面であり、上面と下面の間の面である。言い換えれば、第１凹部３１の内面のうち、第１面３の正面視で見える部分である。第１凹部３１の開口部の幅が内部の幅よりも小さい場合は正面視で見える部分と、正面透視で見える、第１面３と対向する部分である。これによって第１面３に対し、第１面３の正面視において面積が等しい導体が第１面３上にある場合と比べ、第１凹部３１の分だけ基体２と第１導体３２との接合面積を増やすことができるので、第１導体３２の接合強度を高めることができる。その結果、第１導体３２と接続される第１電子部品３０の電気的な接続信頼性を向上することができる。なお、図１や図２のように基体２が直方体形状である場合、第１面３は基体２の外側の面を指す。また、基体２が図１６や図１７のように３枚の板がそれぞれ直交して配置されて一体となった形状であったり、Ｌ字形状であったりする場合、基体２の外側の面だけでなく内側の面を第１面３としてもよい。 As shown in the perspective views of the wiring base 1 in FIGS. 1 and 2, the base 2 has a first recess 31 and a first conductor covering the inner surface of the first recess 31 on the first surface 3 along the first direction. 32. The inner surface of the first recess 31 is a surface along the first direction, excluding the surfaces (upper surface, lower surface) orthogonal to the first direction (z direction) of the inner surface of the first recess 31, and is the surface along the first direction. It is the surface between the lower surfaces. In other words, it is a portion of the inner surface of the first recess 31 that is visible when the first surface 3 is viewed from the front. When the width of the opening of the first recess 31 is smaller than the inside width, there are a portion visible in front view and a portion facing the first surface 3 visible in front view. As a result, the connection between the base body 2 and the first conductor 32 is increased by the amount of the first recess 31 compared to the case where there are conductors on the first surface 3 that have the same area when viewed from the front of the first surface 3. Since the area can be increased, the bonding strength of the first conductor 32 can be increased. As a result, the electrical connection reliability of the first electronic component 30 connected to the first conductor 32 can be improved. Note that when the base body 2 has a rectangular parallelepiped shape as shown in FIGS. 1 and 2, the first surface 3 refers to the outer surface of the base body 2. In addition, when the base 2 has a shape in which three plates are arranged perpendicularly to each other and integrated as shown in FIGS. 16 and 17, or an L-shape, only the outer surface of the base 2 Alternatively, the inner surface may be the first surface 3.

第１凹部３１の第１方向に直交する断面の形状は図３～図５に示すように多角形状もしくは弓形状であってもよい。このとき、多角形状とは、例えば正方形状、長方形状あるいは台形状であってもよい。多角形には方形や台形のような単純多角形以外の多角形、例えば図３（ｃ）の第１凹部３１の凸型のような凸多角形も含まれる。弓形状とは、例えば図３（ａ）および図３（ｂ）に示す例のような半円形、半長円形であってもよい。図３（ｂ）に示す例の第１凹部３１の形状は半円であり、図３（ａ）に示す例の第１凹部３１の形状は半円の弧の部分を伸ばして弦の部分（開口部分）を短くした形状（半円形）であり、いずれも弓形状である。弓形状であるとき、その弧の曲率半径は例えば０．１ｍｍ～０．２５ｍｍであってもよい。弓形状であることによって、第１凹部３１におけるクラックの発生を低減できるので、第１導体３２が剥がれてしまうことを低減できる。また、弓形状であるときに、弧の一部が直線形状になっていてもよい。 The cross section of the first recess 31 perpendicular to the first direction may have a polygonal shape or an arcuate shape, as shown in FIGS. 3 to 5. At this time, the polygonal shape may be, for example, square, rectangular, or trapezoidal. Polygons include polygons other than simple polygons such as squares and trapezoids, for example, convex polygons such as the convex shape of the first recess 31 in FIG. 3(c). The arch shape may be, for example, a semicircle or a semiellipse as shown in FIGS. 3(a) and 3(b). The shape of the first recess 31 in the example shown in FIG. 3(b) is a semicircle, and the shape of the first recess 31 in the example shown in FIG. The opening part) is shortened (semicircular), and both are arch-shaped. When it is arch-shaped, the radius of curvature of the arc may be, for example, 0.1 mm to 0.25 mm. The bow shape can reduce the occurrence of cracks in the first recess 31, thereby reducing the possibility that the first conductor 32 will peel off. Furthermore, when the arc is in the shape of a bow, a part of the arc may be in the shape of a straight line.

第１凹部３１は、図３～図５の（ａ）および（ｃ）に示す例のように、第１面３の正面視における第１凹部３１の中心を含む第１方向に直交する断面において、第１面３に位置する開口部分より基体２の内部に幅の大きい部分を有していてもよい。ここでいう幅は、第１方向（ｚ方向）に直交し第１面３に平行な方向（ｘ方向）の長さであり、図３～図５においては開口部分の幅をＷｏ、基体２の内部における最大幅をＷｍａｘで示している。これによって、第１凹部３１は開口付近に幅が狭い部分が位置することとなる。第１導体３２を引き剥がすような、第１凹部３１内から外側方向への力が加わっても、第１導体３２がこの幅の狭い部分に引っ掛かり、押さえられることとなる。そのため、第１導体３２が基体２の第１凹部３１から剥がれ難くなるので、電気的な接続信頼性が向上する。 The first recess 31 is formed in a cross section perpendicular to the first direction including the center of the first recess 31 when viewed from the front of the first surface 3, as shown in the examples shown in FIGS. 3 to 5 (a) and (c). , the inside of the base body 2 may have a wider portion than the opening portion located on the first surface 3. The width here is the length in the direction (x direction) that is perpendicular to the first direction (z direction) and parallel to the first surface 3. In FIGS. The maximum width inside is indicated by Wmax. As a result, a narrow portion of the first recess 31 is located near the opening. Even if a force is applied from inside the first recess 31 toward the outside, which would cause the first conductor 32 to be peeled off, the first conductor 32 will be caught and held down by this narrow portion. Therefore, the first conductor 32 becomes difficult to peel off from the first recess 31 of the base 2, so that the electrical connection reliability is improved.

第１凹部３１の大きさは、例えば幅が０．１ｍｍ～０．５ｍｍ、奥行き（第１面３からの深さ）が０．１ｍｍ～０．３ｍｍ、高さ（第１方向の長さ）が０．２ｍｍ～１．０ｍｍで構成される直方体の内部に収まる大きさであってもよい。このとき第１凹部３１の開口部分の幅Ｗｏは０．１ｍｍ～０．５ｍｍの範囲の大きさであってもよく、第１凹部３１の最大幅Ｗｍａｘは０．２ｍｍ～０．８ｍｍの大きさであってもよい。また、図１や図２のような直方体形状のとき、第１面３の正面視において、第１凹部３１は第２面４側に位置する端を除く場所に位置していてもよい。言い換えれば、第１凹部３１は第１面３に開口し、第２面４には開口していないものとすることができる。これによって、第１導体３２と外部基板７上の導体が短絡することを低減できる。また、第１凹部３１は第４面６には開口せず、第１面３のみに開口するものとすることができる。これにより第１導体３２は、第１方向の両端が基体２で挟まれたものとなるので、接合強度が高いものとなる。 The first recess 31 has, for example, a width of 0.1 mm to 0.5 mm, a depth (depth from the first surface 3) of 0.1 mm to 0.3 mm, and a height (length in the first direction). The size may be such that it fits inside a rectangular parallelepiped having a size of 0.2 mm to 1.0 mm. At this time, the width Wo of the opening portion of the first recess 31 may be in the range of 0.1 mm to 0.5 mm, and the maximum width Wmax of the first recess 31 may be in the range of 0.2 mm to 0.8 mm. It may be. Further, in the case of a rectangular parallelepiped shape as shown in FIGS. 1 and 2, the first recess 31 may be located at a location other than the end located on the second surface 4 side when the first surface 3 is viewed from the front. In other words, the first recess 31 may be open to the first surface 3 and not open to the second surface 4. This can reduce short circuits between the first conductor 32 and the conductor on the external substrate 7. Further, the first recess 31 may not open to the fourth surface 6 but only to the first surface 3. As a result, both ends of the first conductor 32 in the first direction are sandwiched between the base body 2, so that the bonding strength is high.

第１面３には第１凹部３１が複数位置していてもよい。第１凹部３１が複数位置している場合、複数の第１凹部３１のそれぞれに第１導体３２が位置していてもよい。第１凹部３１および第１導体３２の数は、第１導体３２と接続される第１電子部品３０の電極の数に応じて設定することができる。このとき、基体２が絶縁層の積層体である場合、積層方向に直交する方向または積層方向に平行な方向に沿って第１凹部３１が一直線上に複数位置していてもよい。また、第１面３に実装される第１電子部品３０を中心として、第１凹部３１が対称になるように複数配置されていてもよい。これによって、例えば第１電子部品３０を実装し、ワイヤボンディング等で接続する際に、ボンディング作業が容易となる。 A plurality of first recesses 31 may be located on the first surface 3. When a plurality of first recesses 31 are located, the first conductor 32 may be located in each of the plurality of first recesses 31. The number of first recesses 31 and first conductors 32 can be set according to the number of electrodes of first electronic component 30 connected to first conductor 32. At this time, when the base body 2 is a laminate of insulating layers, a plurality of first recesses 31 may be located in a straight line along a direction perpendicular to the stacking direction or a direction parallel to the stacking direction. Furthermore, a plurality of first recesses 31 may be arranged symmetrically with respect to the first electronic component 30 mounted on the first surface 3 . This facilitates bonding work, for example, when mounting the first electronic component 30 and connecting it by wire bonding or the like.

第１導体３２は第１凹部３１の内側面を覆うものであるので、第１導体３２の形状は、図４に示す例のように第１凹部３１の内側面に沿った形状であり、第１凹部３１内において第１導体３２の表面と第１面３（開口）との間に空間（開口部に面する空間）ができる形状であってもよい。これに対して、第１導体３２の形状は、図５に示す例のように、第１凹部３１の形状と同じ形状、言い換えれば第１凹部３１に導体が充填された形状であってもよい。このような形状の場合も第１導体３２は第１凹部３１の内側面を覆うものであり、図４に示す例の第１導体３２の厚みが大きくなって開口まで達したものということができる。 Since the first conductor 32 covers the inner surface of the first recess 31, the shape of the first conductor 32 is a shape along the inner surface of the first recess 31 as in the example shown in FIG. The shape may be such that a space (a space facing the opening) is created between the surface of the first conductor 32 and the first surface 3 (opening) within the first recess 31 . On the other hand, the shape of the first conductor 32 may be the same as the shape of the first recess 31, as in the example shown in FIG. 5, in other words, the first recess 31 may be filled with a conductor. . Even in the case of such a shape, the first conductor 32 covers the inner surface of the first recess 31, and it can be said that the thickness of the first conductor 32 in the example shown in FIG. 4 is increased and reaches the opening. .

第１導体３２が図５に示す例のように第１凹部３１の形状に合うように充填された形状であるとき、第１導体３２は、第１面３側の表面が第１面３と同一面上に位置していてもよい。言い換えれば、第１面３と面一であってもよい。これによって、第１電子部品３０をフリップチップ実装する際に、第１電子部品３０の傾きを抑えやすくなる。そのため、第１電子部品３０として例えばセンサ部品を第１面３に実装する場合、物理量の検出精度を向上させることができる。また、図６に示す例のように第１電子部品３０の電極と第１導体３２とをワイヤボンディングで接続する際に、第１導体３２の表面が平坦であるのでボンディングワイヤの接続性がよくなる。そのため、第１電子部品３０の実装信頼性の高い電子装置１０を得ることができる。なお、本明細書において第１導体３２と第１面３とが同一面上であることは第１面３上から第１導体３２の第１面３側の表面が１０μｍの範囲で基体２の内部側、あるいは基体２の外部側に位置していることも含む。 When the first conductor 32 is filled to fit the shape of the first recess 31 as in the example shown in FIG. They may be located on the same plane. In other words, it may be flush with the first surface 3. This makes it easier to suppress the inclination of the first electronic component 30 when the first electronic component 30 is flip-chip mounted. Therefore, when mounting, for example, a sensor component on the first surface 3 as the first electronic component 30, the detection accuracy of the physical quantity can be improved. Further, when the electrode of the first electronic component 30 and the first conductor 32 are connected by wire bonding as in the example shown in FIG. 6, since the surface of the first conductor 32 is flat, the connectivity of the bonding wire is improved. . Therefore, it is possible to obtain the electronic device 10 in which the first electronic component 30 is mounted with high reliability. In addition, in this specification, the first conductor 32 and the first surface 3 are on the same surface when the surface of the first conductor 32 on the first surface 3 side is within a range of 10 μm from the top of the first surface 3 of the base body 2. It also includes being located on the inside or outside of the base 2.

また、第１導体３２が、図４に示す例のように、第１凹部３１の開口部に面する空間を有する形状であるときには、例えば第１電子部品３０をフリップチップ実装する際に第１凹部３１の空間に導電性の接着剤等を充填することができるため、第１電子部品３０と配線基体１との実装強度を向上させることができる。このとき、第１導体３２は第１凹部３１の内側面と連続する上面および下面にまで位置していてもよい。これによって、第１凹部３１と第１導体３２との接合強度を一層高めることができる。 Further, when the first conductor 32 has a shape that has a space facing the opening of the first recess 31, as in the example shown in FIG. Since the space of the recess 31 can be filled with a conductive adhesive or the like, the mounting strength between the first electronic component 30 and the wiring base 1 can be improved. At this time, the first conductor 32 may be located on the upper and lower surfaces continuous with the inner surface of the first recess 31. Thereby, the bonding strength between the first recess 31 and the first conductor 32 can be further increased.

第１導体３２の材料は、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 The first conductor 32 is made of, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or an alloy material containing these metal materials.

配線基体１は、図８のように第１導体３２に繋がり基体２の内部に向かって延びる第１導線３３を備えていてもよい。第１導線３３は、基体２の内部を通り第２面４にかけて延びていてもよく、その際、後述する第２面４の第１電極パッド４１と電気的に接続していてもよい。これにより、第１導体３２と第１電子部品３０の電極とが接続され、第１電極パッド４１と外部基板７の電極とが接続されることで、第１電子部品３０が外部回路に接続される。 The wiring base 1 may include a first conducting wire 33 connected to the first conductor 32 and extending toward the inside of the base 2, as shown in FIG. The first conducting wire 33 may extend through the inside of the base 2 to the second surface 4, and in this case may be electrically connected to a first electrode pad 41 on the second surface 4, which will be described later. As a result, the first conductor 32 and the electrode of the first electronic component 30 are connected, and the first electrode pad 41 and the electrode of the external board 7 are connected, so that the first electronic component 30 is connected to the external circuit. Ru.

第１導線３３は、例えば積層された絶縁層の層間に設けられ、第２面４に平行な方向（ｘｙ面方向）に延びる第１導体層、第１方向（ｚ方向）に延びて絶縁層を貫通し、絶縁層を挟んで位置する複数の第１導体層を接続する第１貫通導体を含む。図８～図１０に示す例では、第１導線３３の第１導体層が第１導体３２の第１方向（ｚ方向）の端部（上端、下端）に接続されているが、これに限られるものではない。 The first conductive wire 33 is provided, for example, between stacked insulating layers, including a first conductor layer extending in a direction parallel to the second surface 4 (xy plane direction) and an insulating layer extending in the first direction (z direction). The conductor includes a first through conductor that penetrates through the conductor and connects the plurality of first conductor layers located with an insulating layer in between. In the examples shown in FIGS. 8 to 10, the first conductor layer of the first conductor 33 is connected to the ends (upper end, lower end) of the first conductor 32 in the first direction (z direction), but this is not limitative. It's not something you can do.

第１導線３３の材料も第１導体３２の材料と同様に、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 Like the material of the first conductor 32, the material of the first conducting wire 33 is also a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or an alloy material containing these metal materials. It is formed by etc.

第１導線３３は第１導体３２と複数個所で接続していてもよい。第１導線３３が基体２の内部で分岐して、第１導体３２に複数個所で接続されていれば、第１導線３３と第１導体３２との接続信頼性が向上する。これによって第１導線３３を介して接続される外部基板７と第１電子部品３０との接続信頼性を向上させることができる。第１導線３３と第１導体３２との接続箇所は、図８に示す例のように、例えば第１導体３２の上端および下端と接続されていてもよいし、第１導体３２の中央と端部に接続されていてもよい。 The first conducting wire 33 may be connected to the first conductor 32 at multiple locations. If the first conducting wire 33 is branched inside the base 2 and connected to the first conductor 32 at a plurality of locations, the reliability of the connection between the first conducting wire 33 and the first conductor 32 is improved. Thereby, the connection reliability between the external board 7 and the first electronic component 30 connected via the first conducting wire 33 can be improved. The connection points between the first conductor 33 and the first conductor 32 may be connected to the upper and lower ends of the first conductor 32, for example, as in the example shown in FIG. It may be connected to the section.

第２面４は、例えば図２０に示す例のように、外部基板７と接続する面であってもよい。第２面４が外部基板７と接続するとは、第２面４が外部基板７と機械的に接続して固定される場合と、機械的な接続に加えて電気的に接続される場合とがある。外部基板７と電気的に接続する場合は、第２面４は第１電極パッド４１を有しており、第１電極パッド４１と外部基板７の電極とが電気的に接続する。 The second surface 4 may be a surface connected to the external board 7, as in the example shown in FIG. 20, for example. When the second surface 4 is connected to the external board 7, there are two cases: the second surface 4 is mechanically connected and fixed to the external board 7, and the second surface 4 is electrically connected in addition to the mechanical connection. be. When electrically connected to the external substrate 7, the second surface 4 has a first electrode pad 41, and the first electrode pad 41 and the electrode of the external substrate 7 are electrically connected.

第１電極パッド４１の形状は例えば円形状や矩形状であってもよく、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 The first electrode pad 41 may have a circular or rectangular shape, for example, and may be made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or a metal material such as these metal materials. It is made of alloy materials, etc.

基体２は、第１方向に沿うとともに第１面３に直交する第３面５を有していてもよい。言い換えれば、第３面５は、第１面３および第２面４と直交していてもよい。これによって、例えば第１電子部品３０、第２電子部品５０、第３電子部品６０がそれぞれセンサ部品である場合、ｘｙｚの３方向の物理量を検知が可能なセンサ装置を容易に提供することができる。 The base body 2 may have a third surface 5 that extends along the first direction and is perpendicular to the first surface 3 . In other words, the third surface 5 may be orthogonal to the first surface 3 and the second surface 4. With this, for example, when the first electronic component 30, the second electronic component 50, and the third electronic component 60 are each sensor components, it is possible to easily provide a sensor device that can detect physical quantities in the three directions of x, y, and z. .

第３面５は、第２電子部品５０が実装される面であり、図１、図２の配線基体１の斜視図で示すように、第２凹部５１と、第２凹部５１の内側面を覆う第２導体５２と、を有していてもよい。第２凹部５１の内側面とは、第１凹部３１と同様に、第２凹部５１の内面のうち第１方向（ｚ方向）に直交する面（上面、下面）は含まず、第１方向に（ｚ方向）に沿う面であり、上面と下面の面である。言い換えれば、第２凹部５１の内面のうち、第３面５の正面視で見える部分である。第２凹部５１の開口部の幅が内部の幅よりも小さい場合は正面視で見える部分と、正面透視で見える、第３面５と対向する部分である。これによって、第３面５に対し、第３面５の正面視において面積が等しい導体が第３面５上にある場合と比べ、第２凹部５１の分だけ基体２と第２導体５２との接合面積を増やすことができるので、第２導体５２の接合強度を高めることができる。その結果、第２導体５２と接続される第２電子部品５０の電気的な接続信頼性を向上することができる。基体２が図１６や図１７のように３枚の板がそれぞれ直交して配置されて一体となった形状であったり、Ｌ字形状であったりする場合、基体２の外側の面だけでなく内側の面を第３面５としてもよい。 The third surface 5 is a surface on which the second electronic component 50 is mounted, and includes the second recess 51 and the inner surface of the second recess 51, as shown in the perspective view of the wiring base 1 in FIGS. It may also have a second conductor 52 that covers it. Similar to the first recess 31, the inner surface of the second recess 51 does not include the surfaces (upper surface, lower surface) perpendicular to the first direction (z direction) of the inner surface of the second recess 51, but It is a surface along the (z direction), and is a top surface and a bottom surface. In other words, it is a portion of the inner surface of the second recess 51 that is visible when the third surface 5 is viewed from the front. When the width of the opening of the second recess 51 is smaller than the inner width, there are a portion visible in front view and a portion facing the third surface 5 visible in front view. As a result, compared to the case where there are conductors having the same area on the third surface 5 in a front view of the third surface 5, the distance between the base 2 and the second conductor 52 is increased by the second recess 51. Since the bonding area can be increased, the bonding strength of the second conductor 52 can be increased. As a result, the electrical connection reliability of the second electronic component 50 connected to the second conductor 52 can be improved. When the base 2 has an integrated shape of three plates arranged perpendicularly to each other as shown in FIGS. 16 and 17, or an L-shape, not only the outer surface of the base 2 but also the outer surface of the base 2 The inner surface may be the third surface 5.

第２凹部５１の第１方向に直交する断面の形状は、第１凹部３１と同様に、多角形状もしくは弓形状であってもよい。弓形状であることによって、第２凹部５１におけるクラックの発生を低減できるので、第２導体５２が剥がれてしまうことを低減できる。図１～図５に示す例において、第１凹部３１は第１方向（ｚ方向）に直交し第１面３に沿った方向（ｘ方向）に長い形状である。これに対して、第２凹部５１は第１方向（ｚ方向）に沿った方向に長い形状である。そのため、第２凹部５１の幅は第１凹部３１の幅よりも小さくすることができる。幅が小さくても内側面の面積は第１凹部３１と同等であるので、第２導体５２の接合強度も同等である。ここでいう第２凹部５１の幅は、第１方向（ｚ方向）に直交し第２面５に平行な方向（ｙ方向）の長さである。 Similar to the first recess 31, the cross section of the second recess 51 perpendicular to the first direction may have a polygonal shape or an arcuate shape. The bow shape can reduce the occurrence of cracks in the second recess 51, thereby reducing the possibility that the second conductor 52 will peel off. In the examples shown in FIGS. 1 to 5, the first recess 31 has a shape that is perpendicular to the first direction (z direction) and long in the direction along the first surface 3 (x direction). On the other hand, the second recess 51 has a long shape in the first direction (z direction). Therefore, the width of the second recess 51 can be made smaller than the width of the first recess 31. Even if the width is small, the area of the inner surface is the same as that of the first recess 31, so the bonding strength of the second conductor 52 is also the same. The width of the second recess 51 here is the length in the direction (y direction) that is perpendicular to the first direction (z direction) and parallel to the second surface 5.

第２凹部５１は、図３～図５の（ａ）および（ｃ）に示す例のように、第３面５の正面視における第２凹部５１の中心を含む第１方向に直交する断面において、第３面５に位置する開口部分（図３～図５のＷｏ）より基体２の内部に幅の値の大きい部分（図３～図５のＷｍａｘ）を有していてもよい。ここでいう幅は、第１方向（ｚ方向）に直交し第３面５に平行な方向（ｙ方向）の長さであり、図３～図５においては開口部分の幅をＷｏ、基体２の内部における最大幅をＷｍａｘで示している。これによって、第２凹部５１は開口付近に幅が狭い部分が位置することとなる。第２導体５２を引き剥がすような、第２凹部５１内から外側方向への力が加わっても、第２導体５２がこの幅の狭い部分に引っ掛かり、押さえられることとなる。そのため、第２導体５２が基体２の第２凹部５１から剥がれ難くなるので、電気的な接続信頼性が向上する。 The second recess 51 is formed in a cross section perpendicular to the first direction including the center of the second recess 51 when viewed from the front of the third surface 5, as shown in FIGS. 3 to 5 (a) and (c). , the inside of the base body 2 may have a portion (Wmax in FIGS. 3 to 5) having a larger width value than the opening portion located on the third surface 5 (Wo in FIGS. 3 to 5). The width here is the length in the direction (y direction) perpendicular to the first direction (z direction) and parallel to the third surface 5. In FIGS. The maximum width inside is indicated by Wmax. As a result, the second recess 51 has a narrow portion located near the opening. Even if a force is applied from inside the second recess 51 toward the outside to peel off the second conductor 52, the second conductor 52 will be caught in this narrow portion and will be held down. Therefore, the second conductor 52 becomes difficult to peel off from the second recess 51 of the base 2, so that the electrical connection reliability is improved.

第２凹部５１の大きさは、第１凹部３１と同様に、例えば幅が０．１ｍｍ～０．５ｍｍ、奥行き（第３面５からの深さ）が０．１ｍｍ～０．３ｍｍ、高さ（第１方向の長さ）が０．２ｍｍ～１．０で構成される直方体の内部に収まる大きさであってもよい。このとき、例えば第２凹部５１の開口部分の幅Ｗｏは０．１ｍｍ～０．５ｍｍの範囲の大きさであってもよく、第２凹部５１の最大幅Ｗｍａｘは０．２ｍｍ～０．８ｍｍの大きさであってもよい。また、図１、図２のような直方体形状のとき、第３面５の正面視において、外部基板７に実装される第２面４側に位置する端を除く場所に位置していてもよい。言い換えれば、第２凹部５１は第３面５に開口し、第２面４には開口していないものとすることができる。これによって、第２導体５２と外部基板７上の導体が短絡することを低減できる。また、第２凹部５１は第４面６にも開口せず、第３面５のみに開口するものとすることができ、接合強度が高いものとなる。 The second recess 51 has the same dimensions as the first recess 31, for example, a width of 0.1 mm to 0.5 mm, a depth (depth from the third surface 5) of 0.1 mm to 0.3 mm, and a height of 0.1 mm to 0.5 mm. (Length in the first direction) may be a size that fits inside a rectangular parallelepiped having a length of 0.2 mm to 1.0. At this time, for example, the width Wo of the opening portion of the second recess 51 may range from 0.1 mm to 0.5 mm, and the maximum width Wmax of the second recess 51 may range from 0.2 mm to 0.8 mm. It may be the size. In addition, when the shape is a rectangular parallelepiped as shown in FIGS. 1 and 2, when viewed from the front of the third surface 5, it may be located at a location other than the end located on the second surface 4 side that is mounted on the external board 7. . In other words, the second recess 51 may be open to the third surface 5 and not open to the second surface 4. This can reduce short circuits between the second conductor 52 and the conductor on the external substrate 7. Further, the second recess 51 can be configured to open only on the third surface 5 without opening on the fourth surface 6, resulting in high bonding strength.

第３面５には第２凹部５１が複数位置していてもよい。第２凹部５１が複数位置している場合、複数の第２凹部５１のそれぞれに第２導体５２が位置していてもよい。第２凹部５１および第２導体５２の数は、第２導体５２と接続される第２電子部品５０の電極の数に応じて設定することができる。このとき、基体２が積層されて作られる場合、積層方向に直交する方向または積層方向に平行な方向に沿って、第２凹部５１が一直線上に複数位置していてもよい。また、第３面５に実装される第２電子部品５０を中心として、第２凹部５１が対称になるように複数配置されていてもよい。これによって、例えば第２電子部品５０を実装し、ワイヤボンディング等で接続する際にボンディング作業が容易となる。 A plurality of second recesses 51 may be located on the third surface 5. When a plurality of second recesses 51 are located, the second conductor 52 may be located in each of the plurality of second recesses 51. The number of second recesses 51 and second conductors 52 can be set according to the number of electrodes of second electronic component 50 connected to second conductor 52. At this time, when the base body 2 is made by stacking, a plurality of second recesses 51 may be located in a straight line along a direction perpendicular to the stacking direction or a direction parallel to the stacking direction. Further, a plurality of second recesses 51 may be arranged symmetrically with respect to the second electronic component 50 mounted on the third surface 5 . This facilitates bonding work when, for example, mounting the second electronic component 50 and connecting it by wire bonding or the like.

第１導体３２と同様に、第２導体５２は第２凹部５１の内側面を覆うものであるので、第２導体５２の形状は、図４に示す例のように第２凹部５１の内側面に沿った形状であり、第２凹部５１の開口部に面する空間を有する形状であってもよい。また、第２導体５２の形状は、図５に示す例のように、第２凹部５１の形状と同じ形状、言い換えれば第２凹部５１に導体が充填された形状であってもよい。 Like the first conductor 32, the second conductor 52 covers the inner surface of the second recess 51, so the shape of the second conductor 52 covers the inner surface of the second recess 51 as in the example shown in FIG. It is also possible to have a shape along with a space facing the opening of the second recess 51. Furthermore, the shape of the second conductor 52 may be the same as the shape of the second recess 51, as in the example shown in FIG. 5, or in other words, the second recess 51 may be filled with a conductor.

第２導体５２が図５に示す例のように第２凹部５１の形状に合うように充填された形状であるとき、第２導体５２は、第３面５側の表面が第３面５と同一面上に位置していてもよい。言い換えれば、第３面５と面一であってもよい。これによって、第２電子部品５０をフリップチップ実装する際に第２電子部品５０の傾きを抑えやすくなる。そのため、第２電子部品５０として例えばセンサ部品を第３面５に実装する場合、物理量の検出精度を向上させることができる。また、図６に示す例のように第２電子部品５０の電極と第２導体５２とをワイヤボンディングで接続する際に、第２導体５２の表面が平坦であるのでボンディングワイヤの接続性がよくなる。そのため、第２電子部品５０の実装信頼性の高い電子装置１０を得ることができる。なお、本明細書において第２導体５２と第３面５とが同一面上にあることは第３面５上から第２導体５２の第３面５側の表面が１０μｍの範囲で基体２の内部側、あるいは基体２の外部側に位置していることも含む。 When the second conductor 52 has a shape filled to match the shape of the second recess 51 as in the example shown in FIG. They may be located on the same plane. In other words, it may be flush with the third surface 5. This makes it easier to suppress the inclination of the second electronic component 50 when the second electronic component 50 is flip-chip mounted. Therefore, when mounting, for example, a sensor component on the third surface 5 as the second electronic component 50, the detection accuracy of the physical quantity can be improved. Further, when the electrode of the second electronic component 50 and the second conductor 52 are connected by wire bonding as in the example shown in FIG. 6, since the surface of the second conductor 52 is flat, the connectivity of the bonding wire is improved. . Therefore, it is possible to obtain the electronic device 10 in which the second electronic component 50 is mounted with high reliability. In this specification, the second conductor 52 and the third surface 5 being on the same plane means that the surface of the second conductor 52 on the third surface 5 side is within a range of 10 μm from the top of the third surface 5 of the base 2. It also includes being located on the inside or outside of the base 2.

また、第２導体５２が、図４に示す例のように、第２凹部５１の開口部に面する空間を有する形状であるときには、例えば第２電子部品５０をフリップチップ実装する際に第２凹部５１の空間に導電性の接着剤等を充填することができるため、第２電子部品５０と配線基体１との実装強度を向上させることができる。このとき、第２導体５２は、第２凹部５１の内側面と連続する上面および下面にまで位置していてもよい。これによって、第２凹部５１と第２導体５２との接合強度を一層高めることができる。 Further, when the second conductor 52 has a shape that has a space facing the opening of the second recess 51, as in the example shown in FIG. Since the space of the recess 51 can be filled with a conductive adhesive or the like, the mounting strength between the second electronic component 50 and the wiring base 1 can be improved. At this time, the second conductor 52 may be located on the upper and lower surfaces continuous with the inner surface of the second recess 51. Thereby, the bonding strength between the second recess 51 and the second conductor 52 can be further increased.

第２導体５２の材料は、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 The material of the second conductor 52 is, for example, a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or an alloy material containing these metal materials.

配線基体１は、図８に示す例のように第２導体５２に繋がり基体２の内部に向かって延びる第２導線５３を備えていてもよい。第２導線５３は、基体２の内部を通り、第２面４にかけて延びていてもよく、その際、第２面４の第１電極パッド４１と電気的に接続していてもよい。これにより、第２導体５２と第２電子部品５０の電極とが接続され、第１電極パッド４１と外部基板７の電極とが接続されることで、第２電子部品５０が外部回路に接続される。 The wiring base 1 may include a second conducting wire 53 connected to the second conductor 52 and extending toward the inside of the base 2, as in the example shown in FIG. The second conducting wire 53 may pass through the inside of the base body 2 and extend to the second surface 4, and in this case may be electrically connected to the first electrode pad 41 on the second surface 4. As a result, the second conductor 52 and the electrode of the second electronic component 50 are connected, and the first electrode pad 41 and the electrode of the external board 7 are connected, so that the second electronic component 50 is connected to the external circuit. Ru.

第２導線５３の形状は、第１導線３３の形状と同様に、例えば積層された絶縁層の層間に設けられ、第２面４に平行な方向（ｘｙ面方向）に延びる第２導体層、第１方向（ｚ方向）に延びて絶縁層を貫通し、絶縁層を挟んで位置する複数の第２導体層を接続する第２貫通導体を含む。 The shape of the second conductive wire 53 is similar to the shape of the first conductive wire 33, for example, a second conductor layer provided between laminated insulating layers and extending in a direction parallel to the second surface 4 (xy plane direction); It includes a second through conductor that extends in the first direction (z direction), penetrates the insulating layer, and connects the plurality of second conductor layers located on both sides of the insulating layer.

第２導線５３の材料も第２導体５２の材料と同様に、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 Similarly to the material of the second conductor 52, the material of the second conducting wire 53 is also a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or an alloy material containing these metal materials. It is formed by etc.

第１導線３３と同様に、第２導線５３も第２導体５２と複数個所で接続していてもよい。第２導線５３が基体２の内部で分岐して、第２導体５２に複数個所で接続されていれば、第２導線５３と第２導体５２との接続信頼性が向上する。これによって第２導線５３を介して接続される外部基板７と第２電子部品５０との接続信頼性を向上させることができる。第２導線５３と第２導体５２との接続箇所は、第１導線３３と第１導体３２との接続箇所と同様に、例えば第２導体５２の上端、下端および中央部のどこに接続されていてもよい。 Like the first conducting wire 33, the second conducting wire 53 may also be connected to the second conductor 52 at a plurality of locations. If the second conducting wire 53 is branched inside the base 2 and connected to the second conductor 52 at a plurality of locations, the reliability of the connection between the second conducting wire 53 and the second conductor 52 is improved. Thereby, the connection reliability between the external board 7 and the second electronic component 50, which are connected via the second conductive wire 53, can be improved. The connection point between the second conductor 53 and the second conductor 52 is the same as the connection point between the first conductor 33 and the first conductor 32, for example, where the second conductor 53 is connected to the upper end, the lower end, or the center. Good too.

基体２は第１方向に直交する第４面６を更に有していてもよい。第４面６は第２面４と対向していてもよい。第４面６は第３電子部品６０が実装される面であり、図１、図２、図１６の斜視図で示すように、第４面６は第３導体６１を有していてもよい。 The base body 2 may further have a fourth surface 6 orthogonal to the first direction. The fourth surface 6 may face the second surface 4. The fourth surface 6 is a surface on which the third electronic component 60 is mounted, and as shown in the perspective views of FIGS. 1, 2, and 16, the fourth surface 6 may have a third conductor 61. .

第３導体６１は、第３導体６１と接続する第３導線６２を介して基体２の内部を通り、第２面４の第１電極パッド４１と接続してもよい。また、第３導線６２は、後述する第１凸部３４あるいは第２凸部５４の面上にまで延び、第１凸部３４上の第２電極パッド３４１あるいは第２凸部５４上の第３電極パッド５４１と接続してもよい。これによって、第３導体と接続する第３電子部品６０と外部基板７とを電気的に接続することができる。なお、第３導体６１は、後述するように製造段階においてセラミックグリーンシートに埋め込み、焼成することによって基体２との接合強度を向上することができる。 The third conductor 61 may pass through the inside of the base 2 via a third conducting wire 62 connected to the third conductor 61 and may be connected to the first electrode pad 41 on the second surface 4 . Further, the third conductive wire 62 extends onto the surface of the first convex portion 34 or the second convex portion 54, which will be described later, and the second electrode pad 341 on the first convex portion 34 or the third conductive wire 62 on the second convex portion 54. It may also be connected to the electrode pad 541. Thereby, the third electronic component 60 connected to the third conductor and the external board 7 can be electrically connected. Note that the third conductor 61 can improve the bonding strength with the base body 2 by embedding it in a ceramic green sheet and firing it in the manufacturing stage, as will be described later.

基体２は、図１１～図１５に示す例のように、第１面３と第２面４との間において、第１方向に直交する方向に突出した第１凸部３４を更に有していてもよい。また、第３面５と第２面４との間において、第１方向に直交する方向に突出した第２凸部５４を更に有していてもよい。 As shown in the examples shown in FIGS. 11 to 15, the base body 2 further includes a first convex portion 34 projecting in a direction perpendicular to the first direction between the first surface 3 and the second surface 4. It's okay. Moreover, between the third surface 5 and the second surface 4, a second convex portion 54 may be further provided that protrudes in a direction perpendicular to the first direction.

第１凸部３４によって、第１面３に第１電子部品３０を実装する場合、図１２および図１３に示す例のように、第１凸部３４が第１電子部品３０を支えることができる。これによって、第１面３に第１電子部品３０を実装する際、第１面３を重力方向に対し垂直になるように基体２を回転させた後、第１電子部品３０を実装させる必要がなくなり、ひいては、配線基体１に複数の電子部品を実装することが容易となる。 When the first electronic component 30 is mounted on the first surface 3 by the first convex portion 34, the first convex portion 34 can support the first electronic component 30, as in the example shown in FIGS. 12 and 13. . As a result, when mounting the first electronic component 30 on the first surface 3, it is necessary to rotate the base 2 so that the first surface 3 is perpendicular to the direction of gravity, and then mount the first electronic component 30. This makes it easier to mount a plurality of electronic components on the wiring base 1.

また、第１凸部３４を有する場合、図１４に示す例のように第２電極パッド３４１が第１凸部３４上に位置していてもよい。このとき、第１導線３３、第２導線５３、あるいは第３導線６２が第１凸部３４の第２電極パッド３４１にまで延び、接続していてもよい。これによって、第２電極パッド３４１を介して電子部品３０，５０，６０と外部基板７とをワイヤボンディング等で電気的に接続することができる。つまり、第２面４を介さずに電子装置１０と外部基板７とを接続することができるので、設計の自由度が向上する。また、第２面４と外部基板７とは機械的な接続だけであり、第２面４の全面で外部基板７に接合されるので接合信頼性が高くなる。第２面４を研磨等でより平坦にすることができ、外部基板７との間は厚みが均一な接合材で接合することができるので、外部基板７に対して傾くことなく固定することができる。 Further, when the first convex portion 34 is provided, the second electrode pad 341 may be located on the first convex portion 34 as in the example shown in FIG. 14 . At this time, the first conducting wire 33, the second conducting wire 53, or the third conducting wire 62 may extend to and connect to the second electrode pad 341 of the first convex portion 34. Thereby, the electronic components 30, 50, 60 and the external substrate 7 can be electrically connected via the second electrode pad 341 by wire bonding or the like. In other words, since the electronic device 10 and the external board 7 can be connected without using the second surface 4, the degree of freedom in design is improved. Further, the second surface 4 and the external substrate 7 are only mechanically connected, and the entire second surface 4 is bonded to the external substrate 7, so that the bonding reliability is increased. The second surface 4 can be made flatter by polishing or the like, and it can be bonded to the external substrate 7 with a bonding material of uniform thickness, so it can be fixed to the external substrate 7 without tilting. can.

第２電極パッド３４１の形状は例えば円形状や矩形状であってもよく、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 The shape of the second electrode pad 341 may be, for example, circular or rectangular, and may be made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or a metal material such as these metal materials. It is made of alloy materials, etc.

第１凸部３４は、例えば図１１および図１２に示す例においては、その幅（ｘ方向の長さ）は第１面３の幅と同じか、第１面３の幅に第２凸部５４の突出長さを加えた長さである。上述したように第１電子部品３０を支持するのに必要な幅であればよく、複数の第１凸部３４を第１面３の幅方向に配置することもできる。第１凸部３４の上面の位置は、第１電子部品３０を支持することのできる位置であり、第１電子部品３０の大きさおよび実装位置に応じて設定することができる。第１凸部３４の下面の位置は、図１１および図１２に示す例では第２面４と同じ位置であるが、これに限られない。第１凸部３４の下面の位置が第２面４と同じ位置であると、第１凸部３４の厚み（ｚ方向の長さ）が最大になり、基体の剛性が向上して第１電子部品３０、第２電子部品５０、第３電子部品６０として例えば一方向における物理量の検知機能を有するセンサ部品を実装した際に、３方向の物理量の検出がより精確なものとなる。第１凸部３４上に第２電極パッド３４１を設ける場合は、第１凸部３４の第１面３から突出する部分の平面視の大きさ（ｘｙ方向の大きさ）は、所定の大きさ及び数の第２電極パッド３４１を配置することができる大きさにすることができる。第１凸部３４の材料は、後述するように、基体２と同様の製造過程で作られる場合、基体２と同様の材質あってもよい。また、基体２に対し第１凸部３４を接着して形成されてもよい。なお、本明細書および図面においてｙ方向はｚ方向と直交する方向であって、第１面３に対し垂直な方向を指す。 For example, in the examples shown in FIGS. 11 and 12, the first convex portion 34 has a width (length in the x direction) that is the same as the width of the first surface 3 , or the width of the second convex portion is equal to the width of the first surface 3 . The length is the sum of the protrusion length of 54. As described above, the width may be sufficient as long as it is necessary to support the first electronic component 30, and a plurality of first convex portions 34 may be arranged in the width direction of the first surface 3. The position of the upper surface of the first convex portion 34 is a position that can support the first electronic component 30, and can be set according to the size and mounting position of the first electronic component 30. Although the position of the lower surface of the first convex portion 34 is the same position as the second surface 4 in the example shown in FIGS. 11 and 12, it is not limited thereto. When the position of the lower surface of the first convex part 34 is the same as the second surface 4, the thickness (length in the z direction) of the first convex part 34 is maximized, the rigidity of the base is improved, and the first electron For example, when a sensor component having a function of detecting a physical quantity in one direction is mounted as the component 30, the second electronic component 50, and the third electronic component 60, the detection of the physical quantity in three directions becomes more accurate. When the second electrode pad 341 is provided on the first convex portion 34, the size of the portion of the first convex portion 34 protruding from the first surface 3 in plan view (size in the xy direction) is a predetermined size. The size can be set such that a number of second electrode pads 341 can be arranged thereon. The first convex portion 34 may be made of the same material as the base 2 if it is made in the same manufacturing process as the base 2, as will be described later. Alternatively, the first convex portion 34 may be bonded to the base body 2 and formed. Note that in this specification and the drawings, the y direction is a direction perpendicular to the z direction, and refers to a direction perpendicular to the first surface 3.

第２凸部５４によって、第３面５に第２電子部品５０を実装する場合、後述する図１２、図１３に示すように、第２凸部５４が第２電子部品５０を支えることができる。これによって、第３面５に第２電子部品５０を実装する際、第３面５を重力方向に対し垂直になるように基体２を回転させて実装させる必要がなくなり、ひいては、配線基体１に複数の電子部品を実装することが容易となる。 When the second electronic component 50 is mounted on the third surface 5 by the second convex portion 54, the second convex portion 54 can support the second electronic component 50, as shown in FIGS. 12 and 13, which will be described later. . As a result, when mounting the second electronic component 50 on the third surface 5, there is no need to rotate the base 2 so that the third surface 5 is perpendicular to the direction of gravity. It becomes easy to mount multiple electronic components.

また、第２凸部５４を有する場合、図１４に示す例のように第２凸部５４上に第３電極パッド５４１が位置していてもよい。このとき、第１導線３３、第２導線５３、あるいは第３導線６２が第２凸部５４の第３電極パッド５４１にまで延びて接続していてもよい。これによって、第３電極パッド５４１を介して電子部品３０，５０，６０と外部基板７とを電気的に接続することができる。つまり、第２面４を介さずに電子装置１０と外部基板７とを接続することができるので、設計の自由度が向上する。 Furthermore, when the second convex portion 54 is provided, the third electrode pad 541 may be located on the second convex portion 54 as in the example shown in FIG. 14 . At this time, the first conducting wire 33, the second conducting wire 53, or the third conducting wire 62 may extend and connect to the third electrode pad 541 of the second convex portion 54. Thereby, the electronic components 30, 50, 60 and the external substrate 7 can be electrically connected via the third electrode pad 541. In other words, since the electronic device 10 and the external board 7 can be connected without using the second surface 4, the degree of freedom in design is improved.

第３電極パッド５４１の形状は例えば円形状や矩形状であってもよく、例えばタングステン、モリブデン、マンガン、銅、銀、パラジウム、金、白金、ニッケルもしくはコバルト等の金属材料またはこれらの金属材料を含む合金材料等によって形成されている。 The shape of the third electrode pad 541 may be, for example, circular or rectangular, and may be made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt, or any of these metal materials. It is made of alloy materials, etc.

第２凸部５４は、例えば図１１のｘ方向においては、第３面５の端から一方端にまでかけて位置していてもよい。ｚ方向においては、第３面５から第２面４にかけて位置していてもよい。また、第１凸部３４と一体となっていてもよい。第２凸部５４の材料は、後述するように、基体２と同様の製造過程で作られる場合、基体２と同様の材質あってもよい。また、基体２に対し第２凸部５４を接着して形成してもよい。なお、本明細書および図面においてｘ方向はｚ方向と直交する方向であって、第１面３に対し平行でｙ方向、ｚ方向のそれぞれと垂直な方向を指す。 The second convex portion 54 may be located from one end to one end of the third surface 5, for example in the x direction of FIG. In the z direction, it may be located from the third surface 5 to the second surface 4. Further, it may be integrated with the first convex portion 34. The second convex portion 54 may be made of the same material as the base 2 if it is made in the same manufacturing process as the base 2, as will be described later. Alternatively, the second convex portion 54 may be formed by adhering it to the base body 2. Note that in this specification and the drawings, the x direction is a direction perpendicular to the z direction, parallel to the first surface 3, and perpendicular to each of the y direction and the z direction.

第１凸部３４と第２凸部５４とが基体２と同様の製造過程で作られる場合、第１凸部３４と第２凸部５４とが一体になっていてもよく、これによって、第１凸部３４および第２凸部５４と接続する基体２の強度を増すことができる。 When the first convex portion 34 and the second convex portion 54 are made in the same manufacturing process as the base 2, the first convex portion 34 and the second convex portion 54 may be integrated. The strength of the base body 2 connected to the first convex portion 34 and the second convex portion 54 can be increased.

＜配線基体１の製造方法＞
基体２は、例えば複数の絶縁層が酸化アルミニウム質焼結体からなる場合、次のようにして作製される。まず、酸化アルミニウムおよび酸化ケイ素等の原料粉末に適当な有機バインダおよび溶剤等を添加混合してスラリーを作製する。次に、スラリーをドクターブレード法等の成形法でシート状に成形することにより複数枚のセラミックグリーンシートを作製する。その後、上記のセラミックグリーンシートを積層して、圧着する。最後にこの積層されたセラミックグリーンシートを還元雰囲気中において約１６００℃の温度で焼成するとともに、切断加工や打ち抜き加工により適当な形状とすることによって所望の形状からなる基体２を作製することができる。 <Method for manufacturing wiring base 1>
For example, when the plurality of insulating layers are made of an aluminum oxide sintered body, the base body 2 is manufactured as follows. First, a slurry is prepared by adding and mixing a suitable organic binder, solvent, etc. to raw material powders such as aluminum oxide and silicon oxide. Next, a plurality of ceramic green sheets are produced by forming the slurry into a sheet shape using a forming method such as a doctor blade method. Thereafter, the above ceramic green sheets are laminated and pressure bonded. Finally, the laminated ceramic green sheets are fired at a temperature of about 1600° C. in a reducing atmosphere, and the substrate 2 having a desired shape can be produced by cutting or punching them into an appropriate shape. .

第１導体３２および第２導体５２は、まず、セラミックグリーンシートに貫通孔を設け、貫通孔内に金属ペーストを充填もしくは印刷する。そして、それぞれのセラミックグリーンシートを積層するとともに圧着し、貫通孔と重なる位置で積層方向に沿って切断し、金属ペーストとセラミックグリーンシートとを同時焼成することによって設けることができる。なお、貫通孔を切断した際の凹部が第１凹部３１または第２凹部５１となる。貫通孔は、例えば金属ピンを用いた機械的な打ち抜き加工、またはレーザ光を用いた加工等の孔あけ加工によって設けることができる。金属ペーストの貫通孔への充填の際には、真空吸引等の手段を併用して金属ペーストの充填を容易なものとする。第３導体６１については、まず、セラミックグリーンシートに金属ペーストを印刷する。そして、セラミックグリーンシートを積層するとともに圧着し、同時焼成することによって設けることができる。印刷時にプレスしてセラミックグリーンシート（基体２）に埋め込まれた形状にすることによって基体２と第３導体６１との接合強度を向上することができる。 For the first conductor 32 and the second conductor 52, first, through holes are provided in a ceramic green sheet, and metal paste is filled or printed in the through holes. Then, each ceramic green sheet is laminated and pressed together, cut along the lamination direction at a position overlapping with the through hole, and the metal paste and the ceramic green sheet are simultaneously fired. Note that the recessed portion when the through hole is cut becomes the first recessed portion 31 or the second recessed portion 51. The through-hole can be provided, for example, by mechanical punching using a metal pin or drilling using a laser beam. When filling the through holes with the metal paste, means such as vacuum suction are used in combination to facilitate the filling of the metal paste. Regarding the third conductor 61, first, a metal paste is printed on a ceramic green sheet. Then, it can be provided by laminating and pressing ceramic green sheets and simultaneously firing them. The bonding strength between the base 2 and the third conductor 61 can be improved by pressing it during printing to form a shape embedded in the ceramic green sheet (substrate 2).

第１導線３３、第２導線５３および第３導線６２は、例えばタングステンやモリブデン、マンガン等の高融点の金属からなるメタライズ層からなる場合、次のようにして形成することができる。まず高融点の金属の粉末を有機溶剤およびバインダとともによく混ざるように練って作製した金属ペーストを、絶縁層の上面や下面となるセラミックグリーンシートの所定部位にスクリーン印刷等の方法で印刷する。その後、これらの金属ペーストが印刷されたセラミックグリーンシートを積層するとともに圧着し、同時焼成する。以上の工程によって、基体２にメタライズ層が第１導線３３、第２導線５３、第３導線６２として被着される。 When the first conductive wire 33, the second conductive wire 53, and the third conductive wire 62 are made of a metallized layer made of a metal with a high melting point such as tungsten, molybdenum, or manganese, they can be formed as follows. First, a metal paste made by kneading high melting point metal powder with an organic solvent and a binder so that it is well mixed is printed on predetermined parts of the ceramic green sheet that will become the upper and lower surfaces of the insulating layer by a method such as screen printing. Thereafter, ceramic green sheets printed with these metal pastes are laminated and pressed together, and simultaneously fired. Through the above steps, the metallized layer is deposited on the base 2 as the first conductive wire 33, the second conductive wire 53, and the third conductive wire 62.

第１電極パッド４１、第２電極パッド３４１および第３電極パッド５４１は、第１導線３３等と同様の材料および方法で設けることができる。 The first electrode pad 41, the second electrode pad 341, and the third electrode pad 541 can be provided using the same material and method as the first conductive wire 33 and the like.

第１導体３２、第２導体５２、第３導体６１、第１電極パッド４１、第２電極パッド３４１および第３電極パッド５４１の露出する表面には、これらの耐腐食性向上のため、および電子部品３０等との電気的接続のための接合材（例えば、ボンディングワイヤ）の接続性のために、例えばニッケル／金（Ｎｉ／Ａｕ）めっき皮膜等を設けることができる。 The exposed surfaces of the first conductor 32, the second conductor 52, the third conductor 61, the first electrode pad 41, the second electrode pad 341, and the third electrode pad 541 are coated with anti-corrosion materials and electronic For example, a nickel/gold (Ni/Au) plating film or the like may be provided for connectivity of a bonding material (eg, bonding wire) for electrical connection with the component 30 and the like.

＜電子装置１０の構成＞
本発明の各実施形態に係る電子装置１０は、配線基体１と、第１面３に実装される第１電子部品３０と、第３面５に実装される第２電子部品５０と、第４面６に実装される第３電子部品６０と、を備えている。以降、電子装置１０が備える各構成について述べていく。 <Configuration of electronic device 10>
The electronic device 10 according to each embodiment of the present invention includes a wiring base 1, a first electronic component 30 mounted on the first surface 3, a second electronic component 50 mounted on the third surface 5, and a fourth electronic component 30 mounted on the third surface 5. A third electronic component 60 is mounted on the surface 6. Hereinafter, each configuration included in the electronic device 10 will be described.

第１電子部品３０は、例えば加速度センサ、角度センサ、速度センサ、磁気センサなどのセンサ部品や、コンデンサ、インダクタ、抵抗であってもよい。また、第１面３に複数個の第１電子部品３０が実装されていてもよい。 The first electronic component 30 may be, for example, a sensor component such as an acceleration sensor, an angle sensor, a speed sensor, or a magnetic sensor, or a capacitor, an inductor, or a resistor. Further, a plurality of first electronic components 30 may be mounted on the first surface 3.

第１電子部品３０は第１面３に様々な手法で実装されうるが、具体的には、ワイヤボンディングによって第１導体３２と電気的に接続されていてもよい。また、フリップチップ実装によって第１導体３２と電気的に接続されていてもよい。ワイヤボンディングによって実装される場合、第１導体３２だけでなく、第３面５に位置する第２導体５２や第４面６に位置する第３導体６１にもボンディングし、電気的に接続されていてもよい。これによって、第１面３の面積が小さいときでも第１電子部品３０を実装することができる。 The first electronic component 30 can be mounted on the first surface 3 by various methods, but specifically, it may be electrically connected to the first conductor 32 by wire bonding. Further, it may be electrically connected to the first conductor 32 by flip-chip mounting. When mounted by wire bonding, it is bonded not only to the first conductor 32 but also to the second conductor 52 located on the third surface 5 and the third conductor 61 located on the fourth surface 6, so that they are electrically connected. It's okay. Thereby, the first electronic component 30 can be mounted even when the area of the first surface 3 is small.

第２電子部品５０も第１電子部品３０同様に、例えば加速度センサ、角度センサ、速度センサ、磁気センサなどのセンサ部品や、コンデンサ、インダクタ、抵抗であってもよい。また、第３面５に複数個の第２電子部品５０が実装されていてもよい。 Like the first electronic component 30, the second electronic component 50 may also be a sensor component such as an acceleration sensor, an angle sensor, a speed sensor, or a magnetic sensor, or a capacitor, an inductor, or a resistor. Further, a plurality of second electronic components 50 may be mounted on the third surface 5.

第２電子部品５０は第３面５に様々な手法で実装されうるが、具体的には、ワイヤボンディングによって第２導体５２と電気的に接続されていてもよい。また、フリップチップ実装によって第２導体５２と電気的に接続されていてもよい。ワイヤボンディングによって実装される場合、第２導体５２だけでなく、第１面３に位置する第１導体３２や第４面６に位置する第３導体６１にもボンディングし、電気的に接続されていてもよい。これによって、第３面５の面積が小さいときでも第２電子部品５０を実装することができる。 The second electronic component 50 can be mounted on the third surface 5 by various methods, but specifically, it may be electrically connected to the second conductor 52 by wire bonding. Further, it may be electrically connected to the second conductor 52 by flip-chip mounting. When mounted by wire bonding, it is bonded not only to the second conductor 52 but also to the first conductor 32 located on the first surface 3 and the third conductor 61 located on the fourth surface 6, so that they are electrically connected. It's okay. Thereby, the second electronic component 50 can be mounted even when the area of the third surface 5 is small.

第３電子部品６０も第１電子部品３０、第２電子部品５０同様に、例えば加速度センサ、角度センサ、速度センサ、磁気センサなどのセンサ部品や、コンデンサ、インダクタ、抵抗であってもよい。また、第４面６に複数個の第３電子部品６０が実装されていてもよい。 Like the first electronic component 30 and the second electronic component 50, the third electronic component 60 may also be a sensor component such as an acceleration sensor, an angle sensor, a speed sensor, or a magnetic sensor, or a capacitor, an inductor, or a resistor. Further, a plurality of third electronic components 60 may be mounted on the fourth surface 6.

第３電子部品６０は第４面６に様々な手法で実装されうるが、具体的には、ワイヤボンディングによって第３導体６１と電気的に接続されていてもよい。また、フリップチップ実装によって第３導体６１と電気的に接続されていてもよい。ワイヤボンディングによって実装される場合、第３導体６１だけでなく、第１面３に位置する第１導体３２や第３面５に位置する第２導体５２にもボンディングし、電気的に接続されていてもよい。これによって、第４面６の面積が小さいときでも第３電子部品６０を実装することができる。 The third electronic component 60 can be mounted on the fourth surface 6 by various methods, but specifically, it may be electrically connected to the third conductor 61 by wire bonding. Further, it may be electrically connected to the third conductor 61 by flip-chip mounting. When mounted by wire bonding, it is bonded not only to the third conductor 61 but also to the first conductor 32 located on the first surface 3 and the second conductor 52 located on the third surface 5, so that they are electrically connected. It's okay. Thereby, the third electronic component 60 can be mounted even when the area of the fourth surface 6 is small.

第１電子部品３０、第２電子部品５０、第３電子部品６０は、配線基体１にエポキシ樹脂等の接着剤を用いて接着されていてもよい。これによって、配線基体１との接続強度が増す。 The first electronic component 30, the second electronic component 50, and the third electronic component 60 may be bonded to the wiring base 1 using an adhesive such as an epoxy resin. This increases the connection strength with the wiring base 1.

配線基体１に対し第１電子部品３０のみだけでなく、第２電子部品５０または第３電子部品６０、あるいは第２電子部品５０および第３電子部品６０の両方が実装されていることによって、例えば、第１電子部品３０、第２電子部品５０、第３電子部品６０がそれぞれセンサ部品である場合、ｘｙｚの３方向の物理量を一つの配線基体１で計測することができる。 For example, by mounting not only the first electronic component 30 but also the second electronic component 50 or the third electronic component 60, or both the second electronic component 50 and the third electronic component 60 on the wiring base 1. , the first electronic component 30, the second electronic component 50, and the third electronic component 60 are each sensor components, physical quantities in three directions of x, y, and z can be measured with one wiring base 1.

以上、各実施形態の配線基体１および電子装置１０について説明してきたが、本発明は上述の実施形態に限定されるものではない。すなわち、本発明の要旨を逸脱しない範囲内であれば種々の変更および各実施形態の組み合わせを施すことは何等差し支えない。 Although the wiring substrate 1 and the electronic device 10 of each embodiment have been described above, the present invention is not limited to the above-mentioned embodiments. That is, various modifications and combinations of the embodiments may be made without departing from the gist of the present invention.

１：配線基体
２：基体
３：第１面
４：第２面
５：第３面
６：第４面
７：外部基板
１０：電子装置
３０：第１電子部品
３１：第１凹部
３２：第１導体
３３：第１導線
３４：第１凸部
３４１：第２電極パッド
４１：第１電極パッド
５０：第２電子部品
５１：第２凹部
５２：第２導体
５３：第２導線
５４：第２凸部
５４１：第３電極パッド
６０：第３電子部品
６１：第３導体
６２：第３導線 1: Wiring base 2: Base 3: First surface 4: Second surface 5: Third surface 6: Fourth surface 7: External substrate 10: Electronic device 30: First electronic component 31: First recess 32: First Conductor 33: First conducting wire 34: First protrusion 341: Second electrode pad 41: First electrode pad 50: Second electronic component 51: Second recess 52: Second conductor 53: Second conducting wire 54: Second protrusion Part 541: Third electrode pad 60: Third electronic component 61: Third conductor 62: Third conducting wire

Claims

A base body including a first surface along a first direction and a second surface perpendicular to the first direction,
The first surface is a surface on which electronic components are mounted, the second surface is a surface connected to an external board,
The first surface has a first recess and a first conductor that covers an inner surface of the first recess,
The base body has a third surface along the first direction and perpendicular to the first surface,
The base includes a first protrusion protruding in a direction perpendicular to the first direction between the first surface and the second surface, an electrode pad located on the first protrusion, and a third protrusion. a second convex portion protruding in a direction perpendicular to the first direction between the surface and the second surface ;
In a front view of the first surface, the width of the first convex portion includes a protrusion length of the second convex portion in a direction in which the second convex portion protrudes from an end of the first surface.

The wiring base according to claim 1, wherein the base has a rectangular parallelepiped shape.

3. The wiring base according to claim 1, wherein the first surface has a plurality of first recesses, and the first conductor is located on an inner surface of each of the plurality of first recesses.

The wiring base according to any one of claims 1 to 3, wherein the first recess has an arcuate cross-sectional shape perpendicular to the first direction.

The first recess has a width larger than an opening located on the first surface inside the base body in a cross section perpendicular to the first direction including the center of the first recess when viewed from the front of the first surface. The wiring base according to any one of claims 1 to 4, having a portion.

6. The wiring base according to claim 1, wherein a surface of the first conductor on the first surface side is located on the same plane as the first surface.

7. A first conductive wire connected to the first conductor and extending toward the inside of the base body, the first conductive wire being connected to the first conductor at a plurality of locations. Wiring base described in .

The third surface is a surface on which an electronic component is mounted, and the third surface has a second recess and a second conductor that covers an inner surface of the second recess. The wiring base according to any one of the above.

9. The wiring base according to claim 8, wherein the third surface has a plurality of the second recesses, and the second conductor is located on an inner surface of each of the plurality of second recesses.

10. The wiring base according to claim 8, wherein the second recess has an arcuate cross-sectional shape perpendicular to the first direction.

The second recess has a width larger than an opening located on the third surface inside the base body in a cross section perpendicular to the first direction that includes the center of the second recess when viewed from the front of the third surface. The wiring base according to any one of claims 8 to 10.

The wiring base according to any one of claims 8 to 11, wherein a surface of the second conductor on the third surface side is located on the same plane as the third surface.

The base further has a fourth surface perpendicular to the first direction,
The wiring substrate according to any one of claims 1 to 7, wherein the fourth surface is a surface on which electronic components are mounted.

The base further has a fourth surface perpendicular to the first direction,
The wiring substrate according to any one of claims 8 to 12, wherein the fourth surface is a surface on which electronic components are mounted.

The wiring base according to any one of claims 1 to 14,
an electronic device, comprising: a first electronic component located on the first surface and connected to the first conductor;

The wiring base according to claim 15,
a first electronic component located on the first surface and connected to the first conductor;
a second electronic component located on the third surface;
An electronic device comprising:

The wiring base according to claim 13,
a first electronic component located on the first surface and connected to the first conductor;
a third electronic component located on the fourth surface;
An electronic device comprising:

The wiring base according to claim 14,
a first electronic component located on the first surface and connected to the first conductor;
a third electronic component located on the fourth surface;
An electronic device comprising: