JP7392580B2 - 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス - Google Patents

感光性樹脂組成物、電子デバイスの製造方法および電子デバイス Download PDF

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JP7392580B2
JP7392580B2 JP2020099148A JP2020099148A JP7392580B2 JP 7392580 B2 JP7392580 B2 JP 7392580B2 JP 2020099148 A JP2020099148 A JP 2020099148A JP 2020099148 A JP2020099148 A JP 2020099148A JP 7392580 B2 JP7392580 B2 JP 7392580B2
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photosensitive resin
resin composition
film
electronic device
cured film
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JP2021193411A (ja
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卓士 川浪
裕馬 田中
律也 川崎
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2020099148A 2020-06-08 2020-06-08 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス Active JP7392580B2 (ja)

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JP2020099148A JP7392580B2 (ja) 2020-06-08 2020-06-08 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2023127695A JP7647809B2 (ja) 2020-06-08 2023-08-04 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2025035405A JP2025083394A (ja) 2020-06-08 2025-03-06 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

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JP2020099148A JP7392580B2 (ja) 2020-06-08 2020-06-08 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

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JP2021193411A JP2021193411A (ja) 2021-12-23
JP7392580B2 true JP7392580B2 (ja) 2023-12-06

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JP2020099148A Active JP7392580B2 (ja) 2020-06-08 2020-06-08 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2023127695A Active JP7647809B2 (ja) 2020-06-08 2023-08-04 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
JP2025035405A Pending JP2025083394A (ja) 2020-06-08 2025-03-06 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

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JP2025035405A Pending JP2025083394A (ja) 2020-06-08 2025-03-06 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

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WO2024053564A1 (ja) * 2022-09-08 2024-03-14 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜、および電子装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016148767A (ja) 2015-02-12 2016-08-18 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、及び半導体装置
WO2018159384A1 (ja) 2017-03-03 2018-09-07 東レ株式会社 樹脂組成物、樹脂シート、硬化パターンおよび半導体電子部品または半導体装置
JP2019053220A (ja) 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
WO2008123583A1 (ja) 2007-04-04 2008-10-16 Asahi Kasei Emd Corporation 感光性ポリアミド酸エステル組成物
WO2018080870A1 (en) 2016-10-25 2018-05-03 Fujifilm Electronic Materials U.S.A., Inc. Polyimides

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016148767A (ja) 2015-02-12 2016-08-18 日立化成株式会社 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、及び半導体装置
WO2018159384A1 (ja) 2017-03-03 2018-09-07 東レ株式会社 樹脂組成物、樹脂シート、硬化パターンおよび半導体電子部品または半導体装置
JP2019053220A (ja) 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

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JP2025083394A (ja) 2025-05-30
JP2021193411A (ja) 2021-12-23
JP2023155261A (ja) 2023-10-20
JP7647809B2 (ja) 2025-03-18

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