JP7382904B2 - マイクロリソグラフィ用マスクを測定するためのデバイス、および自動合焦方法 - Google Patents

マイクロリソグラフィ用マスクを測定するためのデバイス、および自動合焦方法 Download PDF

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JP7382904B2
JP7382904B2 JP2020110384A JP2020110384A JP7382904B2 JP 7382904 B2 JP7382904 B2 JP 7382904B2 JP 2020110384 A JP2020110384 A JP 2020110384A JP 2020110384 A JP2020110384 A JP 2020110384A JP 7382904 B2 JP7382904 B2 JP 7382904B2
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Prior art keywords
mask
caustic
imaging
focal
optical unit
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JP2021006903A5 (https=
JP2021006903A (ja
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レングル マリオ
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カール・ツァイス・エスエムティー・ゲーエムベーハー
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0052—Optical details of the image generation
    • G02B21/006—Optical details of the image generation focusing arrangements; selection of the plane to be imaged
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/241—Devices for focusing
    • G02B21/244—Devices for focusing using image analysis techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/241—Devices for focusing
    • G02B21/245—Devices for focusing using auxiliary sources, detectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/28—Systems for automatic generation of focusing signals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/28—Systems for automatic generation of focusing signals
    • G02B7/36—Systems for automatic generation of focusing signals using image sharpness techniques, e.g. image processing techniques for generating autofocus signals
    • G02B7/38—Systems for automatic generation of focusing signals using image sharpness techniques, e.g. image processing techniques for generating autofocus signals measured at different points on the optical axis, e.g. focussing on two or more planes and comparing image data
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Automatic Focus Adjustment (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Microscoopes, Condenser (AREA)
  • Focusing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Studio Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2020110384A 2019-06-27 2020-06-26 マイクロリソグラフィ用マスクを測定するためのデバイス、および自動合焦方法 Active JP7382904B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019117293.4A DE102019117293B3 (de) 2019-06-27 2019-06-27 Vorrichtung zur Vermessung von Masken für die Mikrolithographie und Autofokussierverfahren
DE102019117293.4 2019-06-27

Publications (3)

Publication Number Publication Date
JP2021006903A JP2021006903A (ja) 2021-01-21
JP2021006903A5 JP2021006903A5 (https=) 2022-04-26
JP7382904B2 true JP7382904B2 (ja) 2023-11-17

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JP2020110384A Active JP7382904B2 (ja) 2019-06-27 2020-06-26 マイクロリソグラフィ用マスクを測定するためのデバイス、および自動合焦方法

Country Status (6)

Country Link
US (1) US11647288B2 (https=)
JP (1) JP7382904B2 (https=)
KR (1) KR20210002345A (https=)
CN (1) CN112147858B (https=)
DE (1) DE102019117293B3 (https=)
TW (1) TWI794612B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021128222B4 (de) * 2021-10-29 2023-10-19 Carl Zeiss Smt Gmbh Verfahren zur Vermessung eines Substrates für die Halbleiterlithografie
DE102023119683B4 (de) * 2023-07-25 2025-12-18 Carl Zeiss Smt Gmbh Verfahren zur Bestimmung einer Lage einer Objektoberfläche

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318302A (ja) 2000-05-08 2001-11-16 Tokyo Seimitsu Co Ltd 焦点検出装置及び自動焦点顕微鏡
JP2009031169A (ja) 2007-07-28 2009-02-12 Nikon Corp 位置検出装置、露光装置、及びデバイスの製造方法
JP2013029579A (ja) 2011-07-27 2013-02-07 Mitsuboshi Diamond Industrial Co Ltd 合焦位置調整方法、合焦位置調整装置、およびレーザー加工装置
CN106772923A (zh) 2015-11-24 2017-05-31 睿励科学仪器（上海）有限公司 基于倾斜狭缝的自动对焦方法和系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6677565B1 (en) * 1998-08-18 2004-01-13 Veeco Tucson Inc. High speed autofocus and tilt for an optical imaging system
US6124924A (en) * 1998-12-24 2000-09-26 Applied Materials, Inc. Focus error correction method and apparatus
DE10153113A1 (de) * 2001-08-15 2003-03-13 Aglaia Ges Fuer Bildverarbeitu Verfahren und Vorrichtung zur Entfernungsbestimmung
US6688565B1 (en) 2002-10-01 2004-02-10 Kupo Co., Ltd. Multi-leg stand
US7142315B1 (en) * 2004-01-16 2006-11-28 Kla-Tencor Technologies Corporation Slit confocal autofocus system
US9229209B2 (en) * 2008-01-21 2016-01-05 Carl Zeiss Smt Gmbh Autofocus device and autofocusing method for an imaging device
WO2009093594A1 (ja) * 2008-01-24 2009-07-30 Nikon Corporation 面位置検出装置、露光装置、およびデバイス製造方法
JP5498044B2 (ja) 2009-03-26 2014-05-21 株式会社東芝 自動焦点調節機構及び光学画像取得装置
JP5757099B2 (ja) * 2010-02-15 2015-07-29 株式会社ニコン 焦点調節装置、及び焦点調節プログラム
DE102011082414A1 (de) 2011-09-09 2013-03-14 Carl Zeiss Sms Gmbh Autofokuseinrichtung und Autofokussierverfahren für eine Abbildungsvorrichtung
DE102012223128B4 (de) 2012-12-13 2022-09-01 Carl Zeiss Microscopy Gmbh Autofokusverfahren für Mikroskop und Mikroskop mit Autofokuseinrichtung
DE102014114864B4 (de) * 2014-10-14 2016-06-02 Carl Zeiss Sms Gmbh Verfahren und Vorrichtung zum Ermitteln eines lateralen Versatzes eines Musters auf einem Substrat relativ zu einer Sollposition
DE102016120730A1 (de) 2016-10-31 2018-02-08 Carl Zeiss Smt Gmbh Autofokussiereinrichtung für eine Abbildungsvorrichtung sowie Autofokussierverfahren
JP7079569B2 (ja) * 2017-04-21 2022-06-02 株式会社ニューフレアテクノロジー 検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001318302A (ja) 2000-05-08 2001-11-16 Tokyo Seimitsu Co Ltd 焦点検出装置及び自動焦点顕微鏡
JP2009031169A (ja) 2007-07-28 2009-02-12 Nikon Corp 位置検出装置、露光装置、及びデバイスの製造方法
JP2013029579A (ja) 2011-07-27 2013-02-07 Mitsuboshi Diamond Industrial Co Ltd 合焦位置調整方法、合焦位置調整装置、およびレーザー加工装置
CN106772923A (zh) 2015-11-24 2017-05-31 睿励科学仪器（上海）有限公司 基于倾斜狭缝的自动对焦方法和系统

Also Published As

Publication number Publication date
US20200412939A1 (en) 2020-12-31
CN112147858B (zh) 2023-11-10
CN112147858A (zh) 2020-12-29
KR20210002345A (ko) 2021-01-07
DE102019117293B3 (de) 2020-11-05
US11647288B2 (en) 2023-05-09
TW202107227A (zh) 2021-02-16
TWI794612B (zh) 2023-03-01
JP2021006903A (ja) 2021-01-21

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