JP7382396B2 - 電装部品を含む転送部材 - Google Patents

電装部品を含む転送部材 Download PDF

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Publication number
JP7382396B2
JP7382396B2 JP2021515183A JP2021515183A JP7382396B2 JP 7382396 B2 JP7382396 B2 JP 7382396B2 JP 2021515183 A JP2021515183 A JP 2021515183A JP 2021515183 A JP2021515183 A JP 2021515183A JP 7382396 B2 JP7382396 B2 JP 7382396B2
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JP
Japan
Prior art keywords
conductive layer
conductive
transfer member
electrical component
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021515183A
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English (en)
Japanese (ja)
Other versions
JP2022501819A (ja
JP2022501819A5 (enExample
Inventor
ポール ティモシー ブルック，
レイモンド バンゲイ，
マーク ジョン キャッチポール，
メルヴィン レビット，
スチーブン ポール サトクリフ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conductive Transfers Ltd
Original Assignee
Conductive Transfers Ltd
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Filing date
Publication date
Application filed by Conductive Transfers Ltd filed Critical Conductive Transfers Ltd
Publication of JP2022501819A publication Critical patent/JP2022501819A/ja
Publication of JP2022501819A5 publication Critical patent/JP2022501819A5/ja
Application granted granted Critical
Publication of JP7382396B2 publication Critical patent/JP7382396B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1733—Decalcomanias applied under pressure only, e.g. provided with a pressure sensitive adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/12—Transfer pictures or the like, e.g. decalcomanias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00—Garments
    • A41D1/002—Garments adapted to accommodate electronic equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2021515183A 2018-09-19 2019-09-13 電装部品を含む転送部材 Active JP7382396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1815292.6 2018-09-19
GB1815292.6A GB2577286B (en) 2018-09-19 2018-09-19 Transfer including an electrical component
PCT/GB2019/000137 WO2020058660A1 (en) 2018-09-19 2019-09-13 Transfer including an electrical component

Publications (3)

Publication Number Publication Date
JP2022501819A JP2022501819A (ja) 2022-01-06
JP2022501819A5 JP2022501819A5 (enExample) 2022-09-20
JP7382396B2 true JP7382396B2 (ja) 2023-11-16

Family

ID=68084859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515183A Active JP7382396B2 (ja) 2018-09-19 2019-09-13 電装部品を含む転送部材

Country Status (6)

Country Link
US (1) US11406012B2 (enExample)
EP (1) EP3854185B1 (enExample)
JP (1) JP7382396B2 (enExample)
CN (1) CN113424664B (enExample)
GB (1) GB2577286B (enExample)
WO (1) WO2020058660A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2602800B (en) 2021-01-13 2023-05-10 Mygo4Ward Ltd Improvements relating to functional electrical stimulation garments
CN119731663A (zh) * 2022-06-24 2025-03-28 瑞尔博有限公司 用于跟踪物品的低功率电子带的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014502792A (ja) 2011-01-14 2014-02-03 ハリス コーポレイション 液晶高分子はんだマスクとアウタシール層とを有する電子デバイス及びその関連方法
JP2017143257A (ja) 2016-02-05 2017-08-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP2017152687A (ja) 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
US20180117895A1 (en) 2016-11-02 2018-05-03 Global Print Solutions Limited Transfer for Application to a Surface

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JPH02223438A (ja) * 1989-02-27 1990-09-05 Yoshida Kogyo Kk <Ykk> 表裏面加飾成形品及びその成形品の製造方法並びに加飾用シート
US7759167B2 (en) 2005-11-23 2010-07-20 Imec Method for embedding dies
JP5600458B2 (ja) * 2010-03-30 2014-10-01 株式会社トッパンＴｄｋレーベル 焼成用転写型フィルム及び焼成体を備えるガラス板の製造方法
US8948839B1 (en) * 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
JP6083233B2 (ja) * 2012-12-19 2017-02-22 Jnc株式会社 インモールド成形用転写フィルム、インモールド成形体の製造方法および成形体
RU2664719C2 (ru) 2013-11-01 2018-08-23 Ппг Индастриз Огайо, Инк. Способы переноса электропроводящих материалов
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
US9724869B2 (en) * 2014-12-29 2017-08-08 Tacto Tek Oy Multilayer structure for accommodating electronics and related method of manufacture
CN107709007B (zh) 2015-05-19 2021-01-05 塔科图特科有限责任公司 用于电子器件的热成型塑料覆盖部及相关的制造方法
EP3364728A4 (en) 2015-10-16 2019-06-12 Japan Science and Technology Agency WELDING FOIL, DEVICE TRANSFER BOW AND TEXTILE DEVICE
US20170164461A1 (en) * 2015-12-08 2017-06-08 Intel Corporation Conductive flexible and stretchable encapsulation method and apparatus
GB2550535B (en) * 2015-12-31 2019-07-31 Wearable Tech Limited Constructing a jacket
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014502792A (ja) 2011-01-14 2014-02-03 ハリス コーポレイション 液晶高分子はんだマスクとアウタシール層とを有する電子デバイス及びその関連方法
JP2017143257A (ja) 2016-02-05 2017-08-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP2017152687A (ja) 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
US20180117895A1 (en) 2016-11-02 2018-05-03 Global Print Solutions Limited Transfer for Application to a Surface

Also Published As

Publication number Publication date
US20210360784A1 (en) 2021-11-18
WO2020058660A1 (en) 2020-03-26
GB2577286B (en) 2022-12-14
EP3854185B1 (en) 2025-02-12
JP2022501819A (ja) 2022-01-06
CN113424664B (zh) 2024-09-06
EP3854185A1 (en) 2021-07-28
GB2577286A (en) 2020-03-25
US11406012B2 (en) 2022-08-02
CN113424664A (zh) 2021-09-21

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