JP2022501819A5 - - Google Patents

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Publication number
JP2022501819A5
JP2022501819A5 JP2021515183A JP2021515183A JP2022501819A5 JP 2022501819 A5 JP2022501819 A5 JP 2022501819A5 JP 2021515183 A JP2021515183 A JP 2021515183A JP 2021515183 A JP2021515183 A JP 2021515183A JP 2022501819 A5 JP2022501819 A5 JP 2022501819A5
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JP
Japan
Prior art keywords
layer
conductive
conductive layer
openings
nonconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021515183A
Other languages
English (en)
Japanese (ja)
Other versions
JP7382396B2 (ja
JP2022501819A (ja
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Publication date
Priority claimed from GB1815292.6A external-priority patent/GB2577286B/en
Application filed filed Critical
Publication of JP2022501819A publication Critical patent/JP2022501819A/ja
Publication of JP2022501819A5 publication Critical patent/JP2022501819A5/ja
Application granted granted Critical
Publication of JP7382396B2 publication Critical patent/JP7382396B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021515183A 2018-09-19 2019-09-13 電装部品を含む転送部材 Active JP7382396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1815292.6 2018-09-19
GB1815292.6A GB2577286B (en) 2018-09-19 2018-09-19 Transfer including an electrical component
PCT/GB2019/000137 WO2020058660A1 (en) 2018-09-19 2019-09-13 Transfer including an electrical component

Publications (3)

Publication Number Publication Date
JP2022501819A JP2022501819A (ja) 2022-01-06
JP2022501819A5 true JP2022501819A5 (enExample) 2022-09-20
JP7382396B2 JP7382396B2 (ja) 2023-11-16

Family

ID=68084859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021515183A Active JP7382396B2 (ja) 2018-09-19 2019-09-13 電装部品を含む転送部材

Country Status (6)

Country Link
US (1) US11406012B2 (enExample)
EP (1) EP3854185B1 (enExample)
JP (1) JP7382396B2 (enExample)
CN (1) CN113424664B (enExample)
GB (1) GB2577286B (enExample)
WO (1) WO2020058660A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2602800B (en) 2021-01-13 2023-05-10 Mygo4Ward Ltd Improvements relating to functional electrical stimulation garments
CN119731663A (zh) * 2022-06-24 2025-03-28 瑞尔博有限公司 用于跟踪物品的低功率电子带的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02223438A (ja) * 1989-02-27 1990-09-05 Yoshida Kogyo Kk <Ykk> 表裏面加飾成形品及びその成形品の製造方法並びに加飾用シート
US7759167B2 (en) 2005-11-23 2010-07-20 Imec Method for embedding dies
JP5600458B2 (ja) * 2010-03-30 2014-10-01 株式会社トッパンＴｄｋレーベル 焼成用転写型フィルム及び焼成体を備えるガラス板の製造方法
US8472207B2 (en) * 2011-01-14 2013-06-25 Harris Corporation Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
US8948839B1 (en) * 2013-08-06 2015-02-03 L.I.F.E. Corporation S.A. Compression garments having stretchable and conductive ink
JP6083233B2 (ja) * 2012-12-19 2017-02-22 Jnc株式会社 インモールド成形用転写フィルム、インモールド成形体の製造方法および成形体
RU2664719C2 (ru) 2013-11-01 2018-08-23 Ппг Индастриз Огайо, Инк. Способы переноса электропроводящих материалов
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
US9724869B2 (en) * 2014-12-29 2017-08-08 Tacto Tek Oy Multilayer structure for accommodating electronics and related method of manufacture
CN107709007B (zh) 2015-05-19 2021-01-05 塔科图特科有限责任公司 用于电子器件的热成型塑料覆盖部及相关的制造方法
EP3364728A4 (en) 2015-10-16 2019-06-12 Japan Science and Technology Agency WELDING FOIL, DEVICE TRANSFER BOW AND TEXTILE DEVICE
US20170164461A1 (en) * 2015-12-08 2017-06-08 Intel Corporation Conductive flexible and stretchable encapsulation method and apparatus
GB2550535B (en) * 2015-12-31 2019-07-31 Wearable Tech Limited Constructing a jacket
JP6982959B2 (ja) * 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
JP6823472B2 (ja) * 2016-02-22 2021-02-03 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
GB2555592B (en) * 2016-11-02 2019-02-27 Conductive Transfers Ltd Transfer for application to a surface
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics

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