JP7379091B2 - インプリント装置、インプリント方法、及び物品の製造方法 - Google Patents

インプリント装置、インプリント方法、及び物品の製造方法 Download PDF

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Publication number
JP7379091B2
JP7379091B2 JP2019197773A JP2019197773A JP7379091B2 JP 7379091 B2 JP7379091 B2 JP 7379091B2 JP 2019197773 A JP2019197773 A JP 2019197773A JP 2019197773 A JP2019197773 A JP 2019197773A JP 7379091 B2 JP7379091 B2 JP 7379091B2
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JP
Japan
Prior art keywords
light
optical system
imprint
mold
imprint material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019197773A
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English (en)
Japanese (ja)
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JP2021072354A5 (enExample
JP2021072354A (ja
Inventor
達也 林
健一郎 篠田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019197773A priority Critical patent/JP7379091B2/ja
Priority to KR1020200139936A priority patent/KR20210052293A/ko
Priority to US17/083,150 priority patent/US11480872B2/en
Publication of JP2021072354A publication Critical patent/JP2021072354A/ja
Publication of JP2021072354A5 publication Critical patent/JP2021072354A5/ja
Application granted granted Critical
Publication of JP7379091B2 publication Critical patent/JP7379091B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B29C2033/426—Stampers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/001—Flat articles, e.g. films or sheets having irregular or rough surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2019197773A 2019-10-30 2019-10-30 インプリント装置、インプリント方法、及び物品の製造方法 Active JP7379091B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019197773A JP7379091B2 (ja) 2019-10-30 2019-10-30 インプリント装置、インプリント方法、及び物品の製造方法
KR1020200139936A KR20210052293A (ko) 2019-10-30 2020-10-27 임프린트 장치, 임프린트 방법 및 물품 제조 방법
US17/083,150 US11480872B2 (en) 2019-10-30 2020-10-28 Imprint apparatus, imprint method, and method for manufacturing article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019197773A JP7379091B2 (ja) 2019-10-30 2019-10-30 インプリント装置、インプリント方法、及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2021072354A JP2021072354A (ja) 2021-05-06
JP2021072354A5 JP2021072354A5 (enExample) 2022-10-17
JP7379091B2 true JP7379091B2 (ja) 2023-11-14

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JP2019197773A Active JP7379091B2 (ja) 2019-10-30 2019-10-30 インプリント装置、インプリント方法、及び物品の製造方法

Country Status (3)

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US (1) US11480872B2 (enExample)
JP (1) JP7379091B2 (enExample)
KR (1) KR20210052293A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4398040A3 (en) * 2018-11-08 2025-07-02 Canon Kabushiki Kaisha Imprint apparatus and product manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019067918A (ja) 2017-09-29 2019-04-25 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2019106536A (ja) 2017-12-11 2019-06-27 キヤノン株式会社 空間的に不均一な照明を用いたインプリントシステム及びインプリンティングプロセス
JP2019125656A (ja) 2018-01-15 2019-07-25 東芝メモリ株式会社 インプリント装置、インプリント方法、及び半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8361371B2 (en) 2008-02-08 2013-01-29 Molecular Imprints, Inc. Extrusion reduction in imprint lithography
SG156564A1 (en) * 2008-04-09 2009-11-26 Asml Holding Nv Lithographic apparatus and device manufacturing method
JP5686779B2 (ja) * 2011-10-14 2015-03-18 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6827785B2 (ja) * 2016-11-30 2021-02-10 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019067918A (ja) 2017-09-29 2019-04-25 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2019106536A (ja) 2017-12-11 2019-06-27 キヤノン株式会社 空間的に不均一な照明を用いたインプリントシステム及びインプリンティングプロセス
JP2019125656A (ja) 2018-01-15 2019-07-25 東芝メモリ株式会社 インプリント装置、インプリント方法、及び半導体装置の製造方法

Also Published As

Publication number Publication date
US20210132492A1 (en) 2021-05-06
KR20210052293A (ko) 2021-05-10
JP2021072354A (ja) 2021-05-06
US11480872B2 (en) 2022-10-25

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