JP7377273B2 - レーザシステム - Google Patents

レーザシステム Download PDF

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Publication number
JP7377273B2
JP7377273B2 JP2021541537A JP2021541537A JP7377273B2 JP 7377273 B2 JP7377273 B2 JP 7377273B2 JP 2021541537 A JP2021541537 A JP 2021541537A JP 2021541537 A JP2021541537 A JP 2021541537A JP 7377273 B2 JP7377273 B2 JP 7377273B2
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Japan
Prior art keywords
laser
optical
output
channel
optics
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JP2021541537A
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Japanese (ja)
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JP2022520002A (ja
Inventor
ティアフェルダー、ジルケ
ティルコルン、クリストフ
ベック、トシュテン
ヘルシュテルン、ユリアン
ハイメス、アンドレアス
リンゲル、クリスティアン
マルシャル、フェリクス
Original Assignee
トゥルンプフ レイザー－ ウント システムテクニック ゲーエムベーハー
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0911—Anamorphotic systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0916—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
JP2021541537A 2019-01-31 2020-01-16 レーザシステム Active JP7377273B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019102511.7A DE102019102511B4 (de) 2019-01-31 2019-01-31 Lasersystem
DE102019102511.7 2019-01-31
PCT/EP2020/050985 WO2020156821A1 (de) 2019-01-31 2020-01-16 Lasersytem

Publications (2)

Publication Number Publication Date
JP2022520002A JP2022520002A (ja) 2022-03-28
JP7377273B2 true JP7377273B2 (ja) 2023-11-09

Family

ID=69192030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021541537A Active JP7377273B2 (ja) 2019-01-31 2020-01-16 レーザシステム

Country Status (6)

Country Link
JP (1) JP7377273B2 (zh)
KR (1) KR20210120045A (zh)
CN (1) CN113366375A (zh)
DE (1) DE102019102511B4 (zh)
TW (1) TWI722760B (zh)
WO (1) WO2020156821A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230036934A (ko) 2021-09-08 2023-03-15 주식회사 엘지에너지솔루션 파우치형 이차전지의 실링방법, 파우치형 이차전지의 제조방법, 파우치형 이차전지의 실링장치 및 이를 이용하여 제조되는 파우치형 이차전지.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003516553A (ja) 1999-07-15 2003-05-13 シリコン・ライト・マシーンズ 多数のレーザダイオードバーから出力される光を合成するための方法及び装置
US20080210671A1 (en) 2006-08-23 2008-09-04 Applied Maerials, Inc. Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
JP2013541419A (ja) 2010-09-09 2013-11-14 リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー．カーゲー 作業面において線形強度分布を発生させるためのレーザ装置
WO2015194056A1 (ja) 2014-06-20 2015-12-23 ギガフォトン株式会社 レーザシステム
JP2018514940A (ja) 2015-03-04 2018-06-07 コヒーレント レーザーシステムズ ゲーエムベーハー ウント コンパニー カーゲー 偏光制御レーザーライン投射器

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JP3472249B2 (ja) * 2000-08-25 2003-12-02 キヤノン株式会社 複数の光源を使用する照明装置、照明制御装置及び方法、並びに、露光装置
TWI289896B (en) * 2001-11-09 2007-11-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
US7040780B2 (en) * 2004-02-20 2006-05-09 General Dynamics Armament And Technical Products Laser dazzler matrix
TWI361123B (en) * 2004-12-22 2012-04-01 Zeiss Carl Laser Optics Gmbh Optical illumination system for creating a line beam
US7408714B2 (en) * 2005-02-11 2008-08-05 Coherent, Inc. Method and apparatus for coupling laser beams
DE102007044298B3 (de) * 2007-09-17 2009-02-26 Coherent Gmbh Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt
US7916769B2 (en) * 2008-04-30 2011-03-29 Corning Incorporated Optical package having deformable mirrors for focus compensation
DE102008027229B4 (de) 2008-06-06 2016-06-30 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Strahlformung
DE102010063924A1 (de) * 2010-12-22 2012-06-28 Hilti Aktiengesellschaft Optisches System zur Strahlformung eines Laserstrahls sowie Lasersystem mit einem solchen optischen System
DE102013102863A1 (de) * 2013-03-20 2014-09-25 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Homogenisierung eines Laserstrahls
EP3142823B1 (de) * 2014-05-13 2020-07-29 Trumpf Laser- und Systemtechnik GmbH Einrichtung zur überwachung der ausrichtung eines laserstrahls und euv-strahlungserzeugungsvorrichtung damit
KR102245053B1 (ko) * 2014-07-11 2021-04-26 기가포톤 가부시키가이샤 레이저 시스템
DE102014116957A1 (de) * 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003516553A (ja) 1999-07-15 2003-05-13 シリコン・ライト・マシーンズ 多数のレーザダイオードバーから出力される光を合成するための方法及び装置
US20080210671A1 (en) 2006-08-23 2008-09-04 Applied Maerials, Inc. Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
JP2013541419A (ja) 2010-09-09 2013-11-14 リモ パテントフェルヴァルトゥング ゲーエムベーハー ウント コー．カーゲー 作業面において線形強度分布を発生させるためのレーザ装置
WO2015194056A1 (ja) 2014-06-20 2015-12-23 ギガフォトン株式会社 レーザシステム
JP2018514940A (ja) 2015-03-04 2018-06-07 コヒーレント レーザーシステムズ ゲーエムベーハー ウント コンパニー カーゲー 偏光制御レーザーライン投射器

Also Published As

Publication number Publication date
DE102019102511B4 (de) 2020-08-20
CN113366375A (zh) 2021-09-07
TWI722760B (zh) 2021-03-21
DE102019102511A1 (de) 2020-08-06
JP2022520002A (ja) 2022-03-28
KR20210120045A (ko) 2021-10-06
WO2020156821A1 (de) 2020-08-06
TW202036094A (zh) 2020-10-01

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