DE102019102511B4 - Lasersystem - Google Patents

Lasersystem Download PDF

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Publication number
DE102019102511B4
DE102019102511B4 DE102019102511.7A DE102019102511A DE102019102511B4 DE 102019102511 B4 DE102019102511 B4 DE 102019102511B4 DE 102019102511 A DE102019102511 A DE 102019102511A DE 102019102511 B4 DE102019102511 B4 DE 102019102511B4
Authority
DE
Germany
Prior art keywords
laser
optics
optical
laser beams
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102019102511.7A
Other languages
German (de)
English (en)
Other versions
DE102019102511A1 (de
Inventor
Andreas Heimes
Christian Lingel
Felix Marschall
Silke Thierfelder
Christoph Tillkorn
Torsten Beck
Julian Hellstern
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TRUMPF LASER- UND SYSTEMTECHNIK SE, DE
Original Assignee
Trumpf Laser und Systemtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Laser und Systemtechnik GmbH filed Critical Trumpf Laser und Systemtechnik GmbH
Priority to DE102019102511.7A priority Critical patent/DE102019102511B4/de
Priority to TW109101094A priority patent/TWI722760B/zh
Priority to PCT/EP2020/050985 priority patent/WO2020156821A1/de
Priority to JP2021541537A priority patent/JP7377273B2/ja
Priority to CN202080011371.3A priority patent/CN113366375B/zh
Priority to KR1020217027056A priority patent/KR20210120045A/ko
Publication of DE102019102511A1 publication Critical patent/DE102019102511A1/de
Application granted granted Critical
Publication of DE102019102511B4 publication Critical patent/DE102019102511B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0911—Anamorphotic systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0916—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
DE102019102511.7A 2019-01-31 2019-01-31 Lasersystem Active DE102019102511B4 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102019102511.7A DE102019102511B4 (de) 2019-01-31 2019-01-31 Lasersystem
TW109101094A TWI722760B (zh) 2019-01-31 2020-01-13 雷射系統
PCT/EP2020/050985 WO2020156821A1 (de) 2019-01-31 2020-01-16 Lasersytem
JP2021541537A JP7377273B2 (ja) 2019-01-31 2020-01-16 レーザシステム
CN202080011371.3A CN113366375B (zh) 2019-01-31 2020-01-16 激光系统
KR1020217027056A KR20210120045A (ko) 2019-01-31 2020-01-16 레이저 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102019102511.7A DE102019102511B4 (de) 2019-01-31 2019-01-31 Lasersystem

Publications (2)

Publication Number Publication Date
DE102019102511A1 DE102019102511A1 (de) 2020-08-06
DE102019102511B4 true DE102019102511B4 (de) 2020-08-20

Family

ID=69192030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102019102511.7A Active DE102019102511B4 (de) 2019-01-31 2019-01-31 Lasersystem

Country Status (6)

Country Link
JP (1) JP7377273B2 (zh)
KR (1) KR20210120045A (zh)
CN (1) CN113366375B (zh)
DE (1) DE102019102511B4 (zh)
TW (1) TWI722760B (zh)
WO (1) WO2020156821A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230036934A (ko) 2021-09-08 2023-03-15 주식회사 엘지에너지솔루션 파우치형 이차전지의 실링방법, 파우치형 이차전지의 제조방법, 파우치형 이차전지의 실링장치 및 이를 이용하여 제조되는 파우치형 이차전지.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356577B1 (en) * 1999-07-15 2002-03-12 Silicon Light Machines Method and apparatus for combining light output from multiple laser diode bars
US20130182435A1 (en) * 2010-09-09 2013-07-18 Limo Patentverwaltung Gmbh & Co. Kg Laser apparatus for generating a line-shaped intensity distribution in a working plane
DE102008027229B4 (de) * 2008-06-06 2016-06-30 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Strahlformung

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472249B2 (ja) * 2000-08-25 2003-12-02 キヤノン株式会社 複数の光源を使用する照明装置、照明制御装置及び方法、並びに、露光装置
TWI289896B (en) * 2001-11-09 2007-11-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
US7040780B2 (en) * 2004-02-20 2006-05-09 General Dynamics Armament And Technical Products Laser dazzler matrix
KR20070090246A (ko) * 2004-12-22 2007-09-05 칼 짜이스 레이저 옵틱스 게엠베하 선형 빔을 형성하기 위한 광 조명 시스템
US7408714B2 (en) * 2005-02-11 2008-08-05 Coherent, Inc. Method and apparatus for coupling laser beams
US7674999B2 (en) * 2006-08-23 2010-03-09 Applied Materials, Inc. Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system
DE102007044298B3 (de) * 2007-09-17 2009-02-26 Coherent Gmbh Verfahren und Anordnung zum Erzeugen eines Laserstrahls mit einem linienhaften Strahlquerschnitt
US7916769B2 (en) * 2008-04-30 2011-03-29 Corning Incorporated Optical package having deformable mirrors for focus compensation
DE102010063924A1 (de) * 2010-12-22 2012-06-28 Hilti Aktiengesellschaft Optisches System zur Strahlformung eines Laserstrahls sowie Lasersystem mit einem solchen optischen System
DE102013102863A1 (de) * 2013-03-20 2014-09-25 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Homogenisierung eines Laserstrahls
EP3142823B1 (de) * 2014-05-13 2020-07-29 Trumpf Laser- und Systemtechnik GmbH Einrichtung zur überwachung der ausrichtung eines laserstrahls und euv-strahlungserzeugungsvorrichtung damit
WO2016006099A1 (ja) * 2014-07-11 2016-01-14 ギガフォトン株式会社 レーザシステム
KR102192096B1 (ko) * 2014-06-20 2020-12-16 기가포톤 가부시키가이샤 레이저 시스템
DE102014116957A1 (de) * 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
US10247952B2 (en) * 2015-03-04 2019-04-02 Coherent Lasersystems Gmbh & Co. Kg Polarization-controlled laser line-projector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356577B1 (en) * 1999-07-15 2002-03-12 Silicon Light Machines Method and apparatus for combining light output from multiple laser diode bars
DE102008027229B4 (de) * 2008-06-06 2016-06-30 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Strahlformung
US20130182435A1 (en) * 2010-09-09 2013-07-18 Limo Patentverwaltung Gmbh & Co. Kg Laser apparatus for generating a line-shaped intensity distribution in a working plane

Also Published As

Publication number Publication date
TWI722760B (zh) 2021-03-21
CN113366375B (zh) 2024-08-13
JP7377273B2 (ja) 2023-11-09
DE102019102511A1 (de) 2020-08-06
KR20210120045A (ko) 2021-10-06
CN113366375A (zh) 2021-09-07
JP2022520002A (ja) 2022-03-28
TW202036094A (zh) 2020-10-01
WO2020156821A1 (de) 2020-08-06

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Owner name: TRUMPF LASER- UND SYSTEMTECHNIK SE, DE

Free format text: FORMER OWNERS: TRUMPF LASER GMBH, 78713 SCHRAMBERG, DE; TRUMPF LASER- UND SYSTEMTECHNIK GMBH, 71254 DITZINGEN, DE

Owner name: TRUMPF LASER- UND SYSTEMTECHNIK GMBH, DE

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Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE

R018 Grant decision by examination section/examining division
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R081 Change of applicant/patentee

Owner name: TRUMPF LASER- UND SYSTEMTECHNIK SE, DE

Free format text: FORMER OWNER: TRUMPF LASER- UND SYSTEMTECHNIK GMBH, 71254 DITZINGEN, DE

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Representative=s name: SPREE, CORNELIUS, DE