JP7353985B2 - 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体 - Google Patents

回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体 Download PDF

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JP7353985B2
JP7353985B2 JP2019568893A JP2019568893A JP7353985B2 JP 7353985 B2 JP7353985 B2 JP 7353985B2 JP 2019568893 A JP2019568893 A JP 2019568893A JP 2019568893 A JP2019568893 A JP 2019568893A JP 7353985 B2 JP7353985 B2 JP 7353985B2
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antenna
base material
base
bridge
circuit pattern
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JP2019568893A
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Japanese (ja)
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JPWO2019150740A1 (ja
Inventor
禎光 前田
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Sato Holdings Corp
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Sato Holdings Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
JP2019568893A 2018-02-01 2018-11-29 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体 Active JP7353985B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018016234 2018-02-01
JP2018016234 2018-02-01
PCT/JP2018/044069 WO2019150740A1 (fr) 2018-02-01 2018-11-29 Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid

Publications (2)

Publication Number Publication Date
JPWO2019150740A1 JPWO2019150740A1 (ja) 2021-01-14
JP7353985B2 true JP7353985B2 (ja) 2023-10-02

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JP2019568893A Active JP7353985B2 (ja) 2018-02-01 2018-11-29 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体

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JP (1) JP7353985B2 (fr)
WO (1) WO2019150740A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10211443B2 (en) 2014-09-10 2019-02-19 Cellink Corporation Battery interconnects
EP3653027A4 (fr) 2017-07-13 2021-04-28 CelLink Corporation Procédés et dispositifs de circuits d'interconnexion
US11516921B2 (en) 2019-09-20 2022-11-29 Manaflex, Llc Reel-to-reel lamination methods and devices in FPC fabrication
WO2022072886A1 (fr) 2020-10-02 2022-04-07 Cellink Corporation Formation de connexions à des circuits d'interconnexion flexibles
WO2022072338A1 (fr) 2020-10-02 2022-04-07 Cellink Corporation Procédés et systèmes pour connecter un circuit d'interconnexion flexible
US20220311103A1 (en) 2021-03-24 2022-09-29 Cellink Corporation Multilayered flexible battery interconnects and methods of fabricating thereof
WO2023164486A1 (fr) 2022-02-22 2023-08-31 Cellink Corporation Circuits d'interconnexion flexibles et leurs procédés de fabrication
WO2023201030A2 (fr) 2022-04-15 2023-10-19 Cellink Corporation Circuits d'interconnexion flexibles pour blocs-batteries

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057289A (ja) 1998-08-11 2000-02-25 Sony Corp 非接触ｉｃカード
WO2003017191A3 (fr) 2001-08-15 2003-09-25 Moore North America Inc Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci
JP2008181474A (ja) 2006-06-12 2008-08-07 Brother Ind Ltd タグテープロール
JP2009169899A (ja) 2008-01-21 2009-07-30 Toppan Printing Co Ltd 偽造防止用ｉｃタグ
JP2011518429A (ja) 2008-03-26 2011-06-23 テクノマル・オサケユキテュア 積層回路基板の製造方法
JP2014503100A (ja) 2011-05-19 2014-02-06 テクノマル・オサケユキテュア リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法
WO2017159222A1 (fr) 2016-03-18 2017-09-21 サトーホールディングス株式会社 Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057289A (ja) 1998-08-11 2000-02-25 Sony Corp 非接触ｉｃカード
WO2003017191A3 (fr) 2001-08-15 2003-09-25 Moore North America Inc Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci
JP2008181474A (ja) 2006-06-12 2008-08-07 Brother Ind Ltd タグテープロール
JP2009169899A (ja) 2008-01-21 2009-07-30 Toppan Printing Co Ltd 偽造防止用ｉｃタグ
JP2011518429A (ja) 2008-03-26 2011-06-23 テクノマル・オサケユキテュア 積層回路基板の製造方法
JP2014503100A (ja) 2011-05-19 2014-02-06 テクノマル・オサケユキテュア リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法
WO2017159222A1 (fr) 2016-03-18 2017-09-21 サトーホールディングス株式会社 Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid

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JPWO2019150740A1 (ja) 2021-01-14
WO2019150740A1 (fr) 2019-08-08

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