JP7353985B2 - 回路パターン、rfidインレイ、rfidラベル及びrfid媒体 - Google Patents
回路パターン、rfidインレイ、rfidラベル及びrfid媒体 Download PDFInfo
- Publication number
- JP7353985B2 JP7353985B2 JP2019568893A JP2019568893A JP7353985B2 JP 7353985 B2 JP7353985 B2 JP 7353985B2 JP 2019568893 A JP2019568893 A JP 2019568893A JP 2019568893 A JP2019568893 A JP 2019568893A JP 7353985 B2 JP7353985 B2 JP 7353985B2
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- Prior art keywords
- antenna
- base material
- base
- bridge
- circuit pattern
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018016234 | 2018-02-01 | ||
JP2018016234 | 2018-02-01 | ||
PCT/JP2018/044069 WO2019150740A1 (fr) | 2018-02-01 | 2018-11-29 | Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019150740A1 JPWO2019150740A1 (ja) | 2021-01-14 |
JP7353985B2 true JP7353985B2 (ja) | 2023-10-02 |
Family
ID=67478047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019568893A Active JP7353985B2 (ja) | 2018-02-01 | 2018-11-29 | 回路パターン、rfidインレイ、rfidラベル及びrfid媒体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7353985B2 (fr) |
WO (1) | WO2019150740A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10211443B2 (en) | 2014-09-10 | 2019-02-19 | Cellink Corporation | Battery interconnects |
EP3653027A4 (fr) | 2017-07-13 | 2021-04-28 | CelLink Corporation | Procédés et dispositifs de circuits d'interconnexion |
US10842025B1 (en) | 2019-09-20 | 2020-11-17 | Manaflex Llc | Reel-to-reel slug removal methods and devices in FPC fabrication |
US11876312B2 (en) | 2020-10-02 | 2024-01-16 | Cellink Corporation | Methods and systems for terminal-free circuit connectors and flexible multilayered interconnect circuits |
WO2022072886A1 (fr) | 2020-10-02 | 2022-04-07 | Cellink Corporation | Formation de connexions à des circuits d'interconnexion flexibles |
JP2024512188A (ja) | 2021-03-24 | 2024-03-19 | セルリンク コーポレーション | 多層フレキシブルバッテリー相互接続及びその製造方法 |
US11751328B1 (en) | 2022-02-22 | 2023-09-05 | Cellink Corporation | Flexible interconnect circuits and methods of fabrication thereof |
US11950377B1 (en) | 2022-04-15 | 2024-04-02 | Cellink Corporation | Flexible interconnect circuits for battery packs |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000057289A (ja) | 1998-08-11 | 2000-02-25 | Sony Corp | 非接触icカード |
WO2003017191A3 (fr) | 2001-08-15 | 2003-09-25 | Moore North America Inc | Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci |
JP2008181474A (ja) | 2006-06-12 | 2008-08-07 | Brother Ind Ltd | タグテープロール |
JP2009169899A (ja) | 2008-01-21 | 2009-07-30 | Toppan Printing Co Ltd | 偽造防止用icタグ |
JP2011518429A (ja) | 2008-03-26 | 2011-06-23 | テクノマル・オサケユキテュア | 積層回路基板の製造方法 |
JP2014503100A (ja) | 2011-05-19 | 2014-02-06 | テクノマル・オサケユキテュア | リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法 |
WO2017159222A1 (fr) | 2016-03-18 | 2017-09-21 | サトーホールディングス株式会社 | Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6407669B1 (en) * | 2001-02-02 | 2002-06-18 | 3M Innovative Properties Company | RFID tag device and method of manufacturing |
-
2018
- 2018-11-29 WO PCT/JP2018/044069 patent/WO2019150740A1/fr active Application Filing
- 2018-11-29 JP JP2019568893A patent/JP7353985B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000057289A (ja) | 1998-08-11 | 2000-02-25 | Sony Corp | 非接触icカード |
WO2003017191A3 (fr) | 2001-08-15 | 2003-09-25 | Moore North America Inc | Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci |
JP2008181474A (ja) | 2006-06-12 | 2008-08-07 | Brother Ind Ltd | タグテープロール |
JP2009169899A (ja) | 2008-01-21 | 2009-07-30 | Toppan Printing Co Ltd | 偽造防止用icタグ |
JP2011518429A (ja) | 2008-03-26 | 2011-06-23 | テクノマル・オサケユキテュア | 積層回路基板の製造方法 |
JP2014503100A (ja) | 2011-05-19 | 2014-02-06 | テクノマル・オサケユキテュア | リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法 |
WO2017159222A1 (fr) | 2016-03-18 | 2017-09-21 | サトーホールディングス株式会社 | Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid |
Also Published As
Publication number | Publication date |
---|---|
WO2019150740A1 (fr) | 2019-08-08 |
JPWO2019150740A1 (ja) | 2021-01-14 |
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