WO2019150740A1 - Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid - Google Patents

Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid Download PDF

Info

Publication number
WO2019150740A1
WO2019150740A1 PCT/JP2018/044069 JP2018044069W WO2019150740A1 WO 2019150740 A1 WO2019150740 A1 WO 2019150740A1 JP 2018044069 W JP2018044069 W JP 2018044069W WO 2019150740 A1 WO2019150740 A1 WO 2019150740A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit pattern
antenna
base material
adhesive
metal foil
Prior art date
Application number
PCT/JP2018/044069
Other languages
English (en)
Japanese (ja)
Inventor
禎光 前田
Original Assignee
サトーホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サトーホールディングス株式会社 filed Critical サトーホールディングス株式会社
Priority to JP2019568893A priority Critical patent/JP7353985B2/ja
Publication of WO2019150740A1 publication Critical patent/WO2019150740A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the present invention relates to a circuit pattern of an antenna part in an RFID inlay.
  • tags that are printed on the product with information on the product visibly printed, and labels that are printed on the product with information on the product visibly visible and affixed to the product etc. are used. Yes.
  • RFID Radio Frequency Identification
  • RFID includes an electromagnetic induction system using a 135 kHz band, a 13.56 MHz band, and a radio wave system using a UHF band.
  • the electromagnetic induction method is frequently used.
  • an induced electromotive force is obtained by electromagnetic induction using a coil antenna in which a start end and a termination end are connected to form a closed circuit.
  • an example of a method for manufacturing a coil antenna for HF band RFID is as follows. First, a base film such as PET having a metal foil bonded on one side is prepared. Next, a coiled antenna pattern is formed by etching. Subsequently, the inner peripheral end and the outer peripheral end of the coil antenna are electrically connected by a jumper wire.
  • the penetrating portion may become a damaged portion of the base material. It was.
  • an object of the present invention is to broaden the choices of base materials for RFID inlays and form a circuit pattern without damaging the base materials for RFID inlays.
  • a base circuit a coiled antenna portion formed on the base material, and one end of the antenna portion connected to the other end of the antenna portion to form a closed circuit
  • a circuit pattern manufacturing method having a bridge portion as a jumper wire of the antenna portion, the inner side of the outer peripheral line of the antenna portion disposed on the continuous body of the base material while transporting the continuous body of the base material
  • a pressure-sensitive adhesive coating process for coating a pressure-sensitive adhesive, and a metal foil arrangement process for arranging a continuous metal foil for forming the circuit pattern on the surface of the base material on which the pressure-sensitive adhesive is coated
  • a cutting step for forming a cut of the circuit pattern in the continuum of the metal foil, a removal step of removing a portion of the continuum of the metal foil that does not constitute the circuit pattern, and the bridge in the antenna unit Part
  • a bridge formation preparation step in which an insulating layer is formed in a region to be twisted and a conductive adhesive layer is provided on the other end of the antenna portion to which the bridge portion
  • the circuit pattern can be formed without damaging the RFID inlay base material while expanding the options of the base material for the RFID inlay.
  • FIG. 1 is an external view for explaining an RFID inlay having a circuit pattern manufactured by using a circuit pattern manufacturing method according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a circuit pattern manufacturing apparatus that executes a circuit pattern manufacturing method according to an embodiment of the present invention.
  • FIG. 3 is a plan view for explaining a coil antenna arranged in a continuous body.
  • FIG. 4 is a plan view for explaining a part of the continuous body obtained through the bridge formation preparation step in the circuit pattern manufacturing apparatus shown in FIG.
  • FIG. 5 is a cross-sectional view taken along the line VV for explaining the continuum shown in FIG.
  • FIG. 6 is a plan view for explaining a part of a continuous body obtained through the bending step in the circuit pattern manufacturing apparatus shown in FIG.
  • FIG. 1 is an external view for explaining an RFID inlay having a circuit pattern manufactured by using a circuit pattern manufacturing method according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a circuit pattern manufacturing apparatus that executes
  • FIG. 7 is a sectional view taken along line VII-VII for explaining the continuum shown in FIG.
  • FIG. 8 is a plan view showing a part of the RFID label according to the embodiment of the present invention.
  • FIG. 9 is a cross-sectional view taken along line IX-IX for explaining the RFID label shown in FIG.
  • FIG. 10 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention.
  • FIG. 12 is a cross-sectional view illustrating an RFID medium according to an embodiment of the present invention.
  • FIG. 1 is an external view for explaining an RFID inlay 10 including a circuit pattern 1 manufactured by using a circuit pattern manufacturing method according to an embodiment of the present invention.
  • the RFID inlay 10 shown in FIG. 1 is referred to as a circuit pattern 1 before the IC chip 20 is mounted.
  • the circuit pattern 1 has a base material 11 and a coil antenna 12.
  • the coil antenna 12 is a jumper wire for connecting an antenna portion 13 in which a metal foil is formed in a coil shape on a base 11 and one end on the outer peripheral side and the other end on the inner peripheral side of the antenna portion 13 to form a closed circuit.
  • the bridge portion 14 is connected to the antenna portion 13 and formed on the same plane as the antenna portion 13.
  • electrical_connection part 17 is formed in the end of the inner peripheral side of the antenna part 13.
  • the bridge part 14 consists of the base part 14a and the folding
  • a bridge portion side conductive portion 16 is formed at the end of the folded piece 14b.
  • the circuit pattern 1 has an insulating layer 15 applied to a predetermined region of the antenna unit 13.
  • the bridge portion 14 is folded on the insulating layer 15 so that the bridge portion-side conductive portion 16 and the antenna portion-side conductive portion 17 are overlapped, and a conductive adhesive layer (hereinafter referred to as a conductive layer 18). ).
  • the RFID inlay 10 includes an IC chip 20 with RFID (Radio Frequency Identification) specifications connected to the antenna unit 13 of the circuit pattern 1.
  • RFID media such as a tag, a label, and a wristband, can be produced by performing predetermined processing on the RFID inlay 10. Details of the RFID label and the RFID medium will be described later.
  • FIG. 2 is a schematic diagram of a circuit pattern manufacturing apparatus 100 that executes the method of manufacturing the circuit pattern 1 according to the embodiment of the present invention.
  • the manufacturing method of the circuit pattern 1 which concerns on this embodiment is the adhesive coating process P1 which applies the adhesive A to the continuous body C, conveying the continuous body C of the base material 11, and
  • the metal foil arrangement process P2 in which the metal foil continuum M is arranged on the surface of the continuum C coated with the adhesive A, and the cuts of the antenna portion 13 and the bridge portion 14 are formed in the metal foil continuum M.
  • the manufacturing method of the circuit pattern 1 has the pressurization process P7 which pressurizes the antenna part 13 left in the continuous body C.
  • An arrow F in FIG. 2 indicates the conveyance direction of the continuous body C.
  • the adhesive coating unit 110 receives a pressure-sensitive adhesive tank 111 that stores pressure-sensitive adhesive, a feeding roller 112 that feeds pressure-sensitive adhesive A from the pressure-sensitive adhesive tank 111, and receives the pressure-sensitive adhesive A from the feeding roller 112 and transfers it to a continuous body C.
  • a plate roller 113 and an impression cylinder 114 are provided.
  • the adhesive coating unit 110 includes a UV lamp 115 that irradiates the adhesive A with ultraviolet light.
  • the plate roller 113 is obtained by winding a plate on which a convex pattern 113a corresponding to the shape of the adhesive A applied to the continuous body C of the base material 11 is wound around the plate cylinder.
  • a plurality of convex patterns 113 a are formed on the plate roller 113.
  • the plurality of convex patterns 113a are impositioned side by side in the feed direction and the width direction of the plate roller 113. Thereby, the adhesive for several antenna parts can be simultaneously transferred to the continuous body C, and can be applied.
  • Each convex pattern 113 a has a shape that fits inside the outer peripheral line of the antenna unit 13 disposed on the base material 11.
  • the thickness of the pressure-sensitive adhesive A applied to the continuous body C is preferably 3 ⁇ m or more and 25 ⁇ m or less. If it is 3 ⁇ m or more, a sufficient adhesive force for adhering the antenna unit 13 is obtained, and if it is 25 ⁇ m or less, it does not protrude outside the outer peripheral line of the antenna unit 13 due to pressurization. From this viewpoint, the thickness of the adhesive A is more preferably 3 ⁇ m or more and 10 ⁇ m or less.
  • FIG. 3 is a plan view for explaining the coil antenna 12 formed on the continuous body C.
  • the coating position of the adhesive A is positioned so that the margin on the upstream side in the transport direction of the adhesive A located below the antenna unit 13 is wider than the margin on the downstream side in the transport direction. Is done.
  • the margin on the upstream side in the conveyance direction is preferably 50 ⁇ m or more and 300 ⁇ m or less, and the margin on the downstream side in the conveyance direction is preferably 30 ⁇ m or more and 100 ⁇ m or less (however, the margin on the upstream side in the conveyance direction> conveyance) Fill the margin on the downstream side).
  • the adhesive A is not applied to the position corresponding to the folded piece 14b of the bridge portion 14.
  • step P ⁇ b> positioning when applying the adhesive to the continuum C and cutting when forming the antenna portion cut.
  • a step of printing a reference mark that can be used as a reference for positioning the position is performed.
  • examples of materials applicable as the base material 11 include paper such as fine paper and coated paper, polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, polyethylene naphthalate, and the like. And a multilayer film called synthetic paper formed by laminating a plurality of these resin films.
  • the thickness of the substrate 11 is preferably 25 ⁇ m or more and 300 ⁇ m or less.
  • it can be set to 50 ⁇ m or more and 260 ⁇ m or less in the above range, and is usually preferably 70 ⁇ m or more and 110 ⁇ m or less.
  • a resin film when using a resin film as a base material, it can be 25 micrometers or more and 200 micrometers or less within the said range. From these, it can select suitably according to a use.
  • Examples of the pressure-sensitive adhesive A applicable in the pressure-sensitive adhesive coating process P1 include an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive.
  • a screen printing method is also applicable.
  • the adhesive strength of the adhesive A is preferably 500 gf / 25 mm or more, more preferably 800 gf / 25 mm or more, and further preferably 1000 gf / 25 mm or more in a 180 ° peel test (JIS Z 0237). .
  • the upper limit value of the adhesive strength is preferably 2000 gf / 25 mm.
  • the metal foil arrangement step P2 is executed by the metal foil arrangement unit 120.
  • the metal foil arrangement unit 120 includes a pressing roller 121 and a support roller 122.
  • the metal foil continuum M transported by a transport path different from the transport path of the continuum C is superposed on the surface of the continuum C coated with the adhesive A, and the pressure roller It is inserted and bonded between 121 and the support roller 122. Since there is no adhesive at a position corresponding to the outer side of the outer peripheral line of the antenna unit 13 and the lower side of the bridge unit 14, the metal foil continuum M is a continuum except for the region where the antenna unit 13 is formed. Not attached to C.
  • the metal constituting the metal foil any conductive metal usually used for forming the antenna portion can be used.
  • copper and aluminum can be cited.
  • the thickness of the metal foil is preferably 3 ⁇ m or more and 25 ⁇ m or less.
  • an aluminum foil having a thickness of 20 ⁇ m is used.
  • the continuous body C to which the continuous body M of metal foil is stuck is guided by the roller 123 and sent to the cutting process P3.
  • the cutting process P3 is executed by the cutting unit 130.
  • the cutting unit 130 includes a die roll 131 that forms a cut in the antenna portion 13 and the bridge portion 14 in a continuous body M of metal foil disposed in the continuous body C, and an anvil roller 132 that backs up the die roll 131.
  • a convex blade portion 131a having the shape of the outer peripheral line of the antenna portion 13 is formed.
  • the convex blade 131a can be a flexible die. In addition to this, it can be constituted by an engraving blade, an implanted blade or the like.
  • the cutting unit 130 divides the antenna portion 13 by biting the convex blade 131a into the metal foil continuum M while sandwiching and continuously transporting the workpiece formed of the continuum C and the continuum M. Thereby, a notch can be formed in the continuous body M of metal foil.
  • the removal step P4 is executed by the removal unit 140.
  • the removal unit 140 includes peel rollers 141 and 142.
  • the unnecessary direction Mb of the metal foil is moved along a part of the peel roller 141 to change the conveying direction, and the workpiece is moved along a part of the peel roller 142 to be conveyed in a direction different from the conveying direction of the unnecessary part Mb.
  • the unnecessary portion Mb of the metal foil is pulled away from the workpiece composed of the continuum C and the continuum M.
  • the unnecessary portion Mb is recovered and then subjected to a reprocessing process, and is used again as a metal foil continuum M.
  • the bridge formation preparation process P5 is formed by the bridge formation unit 150.
  • the bridge forming unit 150 includes an insulating layer coating unit 151 and a conductive layer coating unit 152.
  • the insulating layer coating unit 151 includes a collar 151a for storing the insulating material B, a feeding roller 151b for feeding the insulating material B from the collar 151a, and a plate roller for receiving the insulating material B from the feeding roller 151b and coating the continuous body C. 151c and an impression cylinder 151d, and a UV lamp 151e that irradiates the insulating material B with ultraviolet light.
  • the insulating layer 15 is formed in a region where the bridge portion 14 is folded and overlapped with the antenna portion 13.
  • the plate roller 151c is obtained by winding a plate on which a convex pattern 151f corresponding to the shape of the insulating material B applied to the continuous body C of the base material 11 is wound.
  • the insulating material B for example, general-purpose ultraviolet curable ink, medium, or varnish can be used.
  • the thickness of the insulating layer is preferably 2 ⁇ m or more and 50 ⁇ m or less. If it is less than 2 ⁇ m, the antenna unit 13 cannot be completely covered, and insulation may be incomplete. If it exceeds 50 ⁇ m, it becomes too thick as an RFID inlay, and when a label is produced using this, high-quality printing cannot be performed with a general-purpose label printer or the like.
  • the conductive layer coating unit 152 includes a tub 152a for storing the conductive adhesive D, a feeding roller 152b for feeding the conductive adhesive D from the tub 152a, and the conductive adhesive D from the feeding roller 152b to receive the continuous body C.
  • the conductive layer 18 made of the conductive adhesive D is formed on the antenna portion side conductive portion 17.
  • the plate roller 152c is obtained by winding a plate on which a convex pattern 152f corresponding to the shape of the conductive adhesive D applied to the continuous body C of the substrate 11 is wound.
  • the conductive layer coating unit 152 is not limited to the above-described method, and may be a method of discharging a fixed amount from a nozzle.
  • any conductive adhesive can be used.
  • Cemedine Co., Ltd., low temperature curable flexible conductive adhesive, SX-ECA48 can be mentioned.
  • a conductive adhesive double-sided tape can also be used.
  • the conductive material may be printed by inkjet.
  • FIG. 4 is a plan view for explaining a part of the continuum obtained through the bridge formation preparation step P5 in the circuit pattern manufacturing apparatus 100 shown in FIG.
  • FIG. 5 is a cross-sectional view taken along line VV for explaining the continuum shown in FIG.
  • an insulating layer 15 is formed in a region where the folded piece 14 b of the bridge portion 14 is overlapped, and a conductive layer 18 is formed in the antenna portion side conductive portion 17.
  • the insulating layer 15 is applied so as to cover the surface of the antenna portion 13 and a part of the base portion 14a.
  • the folded piece 14b side of the bridge part 14 is not stuck to the continuous body C, but is in a slightly raised state.
  • the bending process P6 is executed by the bending unit 160.
  • the bending unit 160 includes a roller 161 that changes the conveying direction of the continuous body C, and a bending portion 162 for rolling up the bridge portion 14. Further, the bending unit 160 includes a roller 163 that changes the conveyance direction of the continuous body C.
  • the front end of the bent portion 162 is arranged so as to enter between the bridge portion 14 that has been lifted by the roller 161 being turned in the conveying direction of the continuous body C and the continuous body C, and the continuous body C is transported. Then, the progress of the bridge portion 14 in the transport direction is prevented. Thus, when the continuous body C is transported, the bridge portion 14 is pushed back toward the upstream side in the transport direction and is bent and bent.
  • the bent portion 162 is formed of a spatula member having elasticity.
  • the bent portion 162 may be a brush.
  • a mechanism for blowing high-pressure air toward the folded piece 14b may be used.
  • FIG. 6 is a plan view for explaining a part of the continuum obtained through the bending step P6 in the circuit pattern manufacturing apparatus 100 shown in FIG.
  • FIG. 7 is a cross-sectional view taken along line VII-VII for explaining the continuum shown in FIG.
  • the bridge portion 14 is bent on the insulating layer 15. Thereby, as shown in FIG. 7, the bridge part 14 can electrically connect the bridge part side conduction
  • FIG. 7 the bridge part 14 can electrically connect the bridge part side conduction
  • the pressurizing process P7 is executed by the pressurizing unit 170.
  • the pressure unit 170 includes a pressing roller 171 and a support roller 172.
  • the pressure-sensitive adhesive A is spread over the entire surface of the antenna unit 13 disposed in the continuous body C by sandwiching and pressing the work between the pressing roller 171 and the support roller 172.
  • the pressure is preferably 2 kg / cm or more and 6 kg / cm or less.
  • the work in which the coil antenna 12 is arranged on the continuous body C of the base material 11 is wound around the winding roller 102.
  • the continuous body C of the base material 11 fed from the feeding roller 101 is separated from the plate roller 113 and the impression cylinder in the adhesive coating process P1.
  • the adhesive A is applied to a region where the antenna unit 13 is to be arranged and a region on the inner side of the outer peripheral line of the antenna unit 13.
  • the metal foil continuum M is superimposed on the continuum C coated with the adhesive A.
  • the notch of the antenna part 13 and the bridge part 14 is formed.
  • the unnecessary portion Mb that does not constitute the antenna portion 13 and the bridge portion 14 is removed from the metal foil continuum M.
  • the insulating layer 15 is formed in a region where the bridge portion 14 is overlapped with the antenna portion 13, and the conductive layer 18 is formed in the antenna portion side conductive portion 17.
  • the bridge portion 14 is bent on the insulating layer 15 and the conductive layer 18 in the bending step P6.
  • the coil antenna 12 disposed in the continuous body C is pressurized in the pressurizing step P7.
  • the coil antenna 12 having the bridge portion 14 can be formed on the continuous body C of the base material 11.
  • the metal foil is attached to the base material 11 with the adhesive A. Therefore, the metal foil is attached to both surfaces of a conventional base material for RFID inlay such as PET. In comparison with a method of processing a metal foil into a coiled antenna by etching or the like, an inexpensive material such as paper can be used as a substrate.
  • the bridge portion can be formed by bending the metal foil, so that the circuit pattern 1 can be obtained without damaging the substrate as compared with the case where a caulking jig or the like is used. Can be manufactured. Furthermore, it is not necessary to prepare a separate jumper wire.
  • the manufacturing method of the RFID inlay 10 according to the present embodiment includes an IC chip mounting step of mounting the IC chip 20 on the workpiece manufactured by the above-described manufacturing method of the circuit pattern 1.
  • the IC chip 20 is fixed to a specific position of the antenna unit 13 using a conductive material.
  • a conductive material As an example of the bonding method of the IC chip 20, baking bonding using an anisotropic conductive paste or a conductive film can be used.
  • FIG. 8 is a plan view showing a part of the RFID label 200 according to the embodiment of the present invention.
  • FIG. 9 is a cross-sectional view taken along line IX-IX for explaining the RFID label 200 shown in FIG.
  • the RFID label 200 is configured using an RFID inlay 10 having a circuit pattern 1.
  • the circuit pattern 1 includes a base material 11 and a coil antenna 12.
  • the coil antenna 12 is formed on the base member 11 in a coil shape with a metal foil and is connected to the antenna unit 13 and formed on the same plane as the antenna unit 13, and the antenna unit 13 is closed circuit. And a bridge part 14 for the purpose.
  • the RFID inlay 10 is obtained by mounting the IC chip 20 on the circuit pattern 1 described above using the anisotropic conductive adhesive E.
  • a separator 202 is temporarily attached to the surface of the substrate 11 on which the circuit pattern 1 is formed via an adhesive 201 for adherend.
  • the surface of the substrate 11 on which the coil antenna 12 or the like is not provided is not processed.
  • the RFID label according to the present embodiment can be directly printed on a substrate using a general-purpose label printer, and can be attached to an adherend.
  • the manufacturing method of the RFID label 200 according to the present invention the coil antenna 12 of the RFID inlay 10 on which the circuit pattern 1 is formed is formed following the manufacturing method of the circuit pattern 1 and the manufacturing method of the RFID inlay 10 described above. There is a step of temporarily attaching the separator 202 to the surface via the adherend adhesive 201.
  • FIG. 10 is a cross-sectional view illustrating an RFID label 300 according to an embodiment of the present invention.
  • the RFID label 300 is configured using an RFID inlay 10 having a circuit pattern 1.
  • a separator 302 is temporarily attached to a surface of a substrate 11 on which a circuit pattern 1 is formed with an adherent adhesive 301 interposed therebetween.
  • an outer substrate 304 having a printing surface is laminated on the surface of the substrate 11 opposite to the surface on which the circuit pattern 1 is formed via an outer substrate adhesive or an outer substrate adhesive 303.
  • the RFID label according to this embodiment can be printed on the outer base material 304 and can be attached to the adherend.
  • the adherend for adhesion is applied to the surface of the substrate 11 on which the circuit pattern 1 is formed, following the manufacturing method of the circuit pattern 1 and the manufacturing method of the RFID inlay 10 described above.
  • FIG. 11 is a cross-sectional view illustrating an RFID label 400 according to an embodiment of the present invention.
  • the RFID label 400 is configured using the RFID inlay 10 having the circuit pattern 1.
  • an outer substrate 402 is laminated on the surface of the substrate 11 on which the circuit pattern 1 is formed via an adherent adhesive or adherend adhesive 401. Yes.
  • a separator 404 is temporarily attached on the outer substrate 402 via an adhesive 403.
  • the manufacturing method of the RFID label 400 according to the present embodiment is the adherend for adherend on the surface of the substrate 11 on which the circuit pattern 1 is formed, following the manufacturing method of the circuit pattern 1 and the manufacturing method of the RFID inlay 10 described above.
  • FIG. 12 is a cross-sectional view illustrating an RFID medium 500 according to an embodiment of the present invention.
  • the RFID medium 500 is configured using an RFID inlay 10 having a circuit pattern 1.
  • An RFID medium 500 includes a first outer group laminated on the surface of the substrate 11 on which the circuit pattern 1 is formed via an adhesive for outer substrate or an adhesive 501 for outer substrate.
  • the manufacturing method of the RFID medium 500 according to the present embodiment is the same as the manufacturing method of the circuit pattern 1 and the manufacturing method of the RFID inlay 10 described above, and the adhesive for the outer base material on the surface of the base material 11 on which the circuit pattern 1 is formed.
  • the step of laminating the first outer substrate 502 via the adhesive or the outer substrate adhesive 501, and the outer substrate pressure-sensitive adhesive or outer surface on the opposite side of the surface of the substrate 11 on which the circuit pattern 1 is formed Laminating the second outer substrate 504 with the substrate adhesive 503 interposed therebetween.
  • the first outer base material 502 and the second outer base material 504 protect the antenna unit 13 and the IC chip 20 arranged on the base material 11 and also a tag (particularly an apparel tag), It determines the form of labels, wristbands, tickets and the like.
  • the thickness and material can be selected according to the desired application.
  • an emulsion adhesive, a solvent adhesive, and a hot melt adhesive are used as adhesives for bonding the first and second outer base materials to the RFID inlay 10.
  • An adhesive can also be used.
  • acrylic adhesives, urethane adhesives, silicone adhesives, rubber adhesives, and the like can be applied.
  • adhesives such as an acrylic adhesive, a urethane adhesive, a silicone adhesive, and a rubber adhesive, are applicable.
  • the insulating layer 15 is applied so as to cover a part of the antenna part 13 and a part of the base part 14 a.
  • the insulating layer 15 may be applied to the folded piece 14 b of the bridge portion 14.
  • the order of the step of forming the insulating layer 15 and the step of forming the conductive layer 18 may be reversed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication de motif de circuit dans lequel : lorsqu'un corps continu d'un matériau de base est transporté, un adhésif est appliqué plus à l'intérieur que le fil périphérique externe d'une section d'antenne disposée sur le corps continu d'un matériau de base ; un corps continu d'une feuille métallique est disposé sur la surface sur laquelle l'adhésif a été appliqué ; une encoche de motif de circuit est formée dans le corps continu de la feuille métallique ; la partie du corps continu de la feuille métallique ne formant pas le motif de circuit est retirée ; une couche d'isolation est formée sur une partie de la section d'antenne ; et une section de pont est pliée sur la couche d'isolation, connectant ainsi électriquement une partie de la section d'antenne et une partie de la section de pont courbée.
PCT/JP2018/044069 2018-02-01 2018-11-29 Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid WO2019150740A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019568893A JP7353985B2 (ja) 2018-02-01 2018-11-29 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018016234 2018-02-01
JP2018-016234 2018-02-01

Publications (1)

Publication Number Publication Date
WO2019150740A1 true WO2019150740A1 (fr) 2019-08-08

Family

ID=67478047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/044069 WO2019150740A1 (fr) 2018-02-01 2018-11-29 Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid

Country Status (2)

Country Link
JP (1) JP7353985B2 (fr)
WO (1) WO2019150740A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10842025B1 (en) 2019-09-20 2020-11-17 Manaflex Llc Reel-to-reel slug removal methods and devices in FPC fabrication
US11751328B1 (en) 2022-02-22 2023-09-05 Cellink Corporation Flexible interconnect circuits and methods of fabrication thereof
US11791577B2 (en) 2020-10-02 2023-10-17 Cellink Corporation Forming connections to flexible interconnect circuits
US11876312B2 (en) 2020-10-02 2024-01-16 Cellink Corporation Methods and systems for terminal-free circuit connectors and flexible multilayered interconnect circuits
US11888180B2 (en) 2021-03-24 2024-01-30 Cellink Corporation Multilayered flexible battery interconnects and methods of fabricating thereof
US11894580B2 (en) 2014-09-10 2024-02-06 Cellink Corporation Battery interconnects
US11950377B1 (en) 2022-04-15 2024-04-02 Cellink Corporation Flexible interconnect circuits for battery packs
US11979976B2 (en) 2017-07-13 2024-05-07 Cellink Corporation Methods of forming interconnect circuits

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057289A (ja) * 1998-08-11 2000-02-25 Sony Corp 非接触ｉｃカード
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
WO2003017191A2 (fr) * 2001-08-15 2003-02-27 Moore North America, Inc. Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci
JP2008181474A (ja) * 2006-06-12 2008-08-07 Brother Ind Ltd タグテープロール
JP2009169899A (ja) * 2008-01-21 2009-07-30 Toppan Printing Co Ltd 偽造防止用ｉｃタグ
JP2011518429A (ja) * 2008-03-26 2011-06-23 テクノマル・オサケユキテュア 積層回路基板の製造方法
JP2014503100A (ja) * 2011-05-19 2014-02-06 テクノマル・オサケユキテュア リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法
WO2017159222A1 (fr) * 2016-03-18 2017-09-21 サトーホールディングス株式会社 Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057289A (ja) * 1998-08-11 2000-02-25 Sony Corp 非接触ｉｃカード
US6407669B1 (en) * 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
WO2003017191A2 (fr) * 2001-08-15 2003-02-27 Moore North America, Inc. Etiquette d'identification de frequence radio (rfid) possedant un montage electrique en pont integral et procede d'assemblage de celle-ci
JP2008181474A (ja) * 2006-06-12 2008-08-07 Brother Ind Ltd タグテープロール
JP2009169899A (ja) * 2008-01-21 2009-07-30 Toppan Printing Co Ltd 偽造防止用ｉｃタグ
JP2011518429A (ja) * 2008-03-26 2011-06-23 テクノマル・オサケユキテュア 積層回路基板の製造方法
JP2014503100A (ja) * 2011-05-19 2014-02-06 テクノマル・オサケユキテュア リール・トゥ・リールの大量生産に適した電気ブリッジの製造方法
WO2017159222A1 (fr) * 2016-03-18 2017-09-21 サトーホールディングス株式会社 Procédé de fabrication de diagramme d'antenne, procédé de fabrication d'entrée rfid, procédé de fabrication d'étiquette rfid, et procédé de fabrication de support rfid

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11894580B2 (en) 2014-09-10 2024-02-06 Cellink Corporation Battery interconnects
US11979976B2 (en) 2017-07-13 2024-05-07 Cellink Corporation Methods of forming interconnect circuits
US10993334B2 (en) 2019-09-20 2021-04-27 Manaflex, Llc Methods for laser welding layers of circuitry pattern in the reel-to-reel fabrication of flexible printed circuits
US11026332B2 (en) 2019-09-20 2021-06-01 Manaflex, Llc Reel-to-reel flexible printed circuit fabrication methods and devices
US11026333B2 (en) 2019-09-20 2021-06-01 Manaflex, Llc Reel-to-reel laser sintering methods and devices in FPC fabrication
US11490523B2 (en) 2019-09-20 2022-11-01 Manaflex, Llc Reel-to-reel laser ablation methods and devices in FPC fabrication
US11516921B2 (en) 2019-09-20 2022-11-29 Manaflex, Llc Reel-to-reel lamination methods and devices in FPC fabrication
US10842025B1 (en) 2019-09-20 2020-11-17 Manaflex Llc Reel-to-reel slug removal methods and devices in FPC fabrication
US11791577B2 (en) 2020-10-02 2023-10-17 Cellink Corporation Forming connections to flexible interconnect circuits
US11876312B2 (en) 2020-10-02 2024-01-16 Cellink Corporation Methods and systems for terminal-free circuit connectors and flexible multilayered interconnect circuits
US11888180B2 (en) 2021-03-24 2024-01-30 Cellink Corporation Multilayered flexible battery interconnects and methods of fabricating thereof
US11751328B1 (en) 2022-02-22 2023-09-05 Cellink Corporation Flexible interconnect circuits and methods of fabrication thereof
US11950377B1 (en) 2022-04-15 2024-04-02 Cellink Corporation Flexible interconnect circuits for battery packs

Also Published As

Publication number Publication date
JPWO2019150740A1 (ja) 2021-01-14
JP7353985B2 (ja) 2023-10-02

Similar Documents

Publication Publication Date Title
WO2019150740A1 (fr) Motif de circuit, incrustation rfid, étiquette rfid, support rfid, procédé de fabrication de motif de circuit, procédé de fabrication d'incrustation rfid, procédé de fabrication d'étiquette rfid et procédé de fabrication de support rfid
JP6853237B2 (ja) アンテナパターンの製造方法、ｒｆｉｄインレットの製造方法、ｒｆｉｄラベルの製造方法及びｒｆｉｄ媒体の製造方法
WO2019163472A1 (fr) Procédé de fabrication de motif d'antenne, procédé de fabrication d'incrustation d'identification par radiofréquence, procédé de fabrication d'étiquette d'identification par radiofréquence, et procédé de fabrication de support d'identification par radiofréquence
US8169323B2 (en) Noncontact IC tag label, airline baggage tag label, and manufacturing method for noncontact IC tag label
JP2009259258A (ja) 使い捨てチップ電子装置及び製造方法
US8368538B2 (en) Method of making an RFID label
JP2023171387A (ja) アンテナパターン、ｒｆｉｄインレイ及びｒｆｉｄラベル
WO2024070826A1 (fr) Procédé de fabrication de motif d'antenne et motif d'antenne
JP7402720B2 (ja) アンテナパターンの製造方法及びアンテナパターン
JP2024048361A (ja) アンテナパターンの製造方法及びアンテナパターン
WO2023047949A1 (fr) Récipient d'identification par radiofréquence (rfid) et procédé de production d'un récipient d'identification par radiofréquence (rfid)
JP7145617B2 (ja) 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル、及びｒｆｉｄ媒体
JP7475914B2 (ja) Ｒｆｉｄラベル及びｒｆｉｄラベルの製造方法
EP4287167A1 (fr) Étiquette rfid, support d'enregistrement rfid et procédé de fabrication d'étiquette rfid
JP2022052401A (ja) アンテナパターンの製造方法
JP2004317544A (ja) Ｉｃチップ実装体付きラベル
JP2017182717A (ja) Ｒｆｉｄ記録媒体シートの製造方法及びカード

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18903143

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019568893

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18903143

Country of ref document: EP

Kind code of ref document: A1