JP7350215B1 - 冷却板及び半導体製造装置用部材 - Google Patents
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- 238000001816 cooling Methods 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title claims description 58
- 239000004065 semiconductor Substances 0.000 title claims description 47
- 239000000758 substrate Substances 0.000 claims description 85
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 28
- 229910008484 TiSi Inorganic materials 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 4
- 229910008479 TiSi2 Inorganic materials 0.000 abstract 2
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 description 38
- 239000003507 refrigerant Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 30
- 229910010271 silicon carbide Inorganic materials 0.000 description 16
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 15
- 239000002826 coolant Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 239000002131 composite material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 238000013001 point bending Methods 0.000 description 6
- 229910018134 Al-Mg Inorganic materials 0.000 description 5
- 229910018467 Al—Mg Inorganic materials 0.000 description 5
- 229910018566 Al—Si—Mg Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000011002 quantification Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000002447 crystallographic data Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910021341 titanium silicide Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 239000012856 weighed raw material Substances 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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Abstract
Description
TiSi2を42~65質量%、TiCを4~16質量%含有すると共に、SiCをTiSi2の質量%よりも少量含有する、
ものである。
以下に、第1実施形態の半導体製造装置用部材10について説明する。図1は半導体製造装置用部材10の平面図、図2は図1のA-A断面図である。
以下に、第2実施形態の半導体製造装置用部材110について説明する。図6は半導体製造装置用部材110の断面図である。
以下に、第3実施形態の半導体製造装置用部材210について説明する。図9は半導体製造装置用部材210の断面図、図10は半導体製造装置用部材210の裏面図(P視図)である。
・調合
原料成分を、表1に示す質量%となるように秤量し、イソプロピルアルコールを溶媒とし、ナイロン製のポット、直径10mmの鉄芯入りナイロンボールを用いて4時間湿式混合した。混合後スラリーを取り出し、窒素気流中110℃で乾燥した。その後、30メッシュの篩に通し、調合粉末とした。尚、秤量した原料約500gを高速流動混合機(粉体投入部の容量1.8L)に投入し、攪拌羽根の回転数1500rpmで混合した場合にも湿式混合と同様の材料特性が得られることを確認した。
・成形
調合粉末を、200kgf/cm2の圧力で一軸加圧成形し、円盤状成形体を作製し、焼成用黒鉛モールドに収納した。
・焼成
円盤状成形体をホットプレス焼成することにより緻密質の冷却板を得た。ホットプレス焼成では、プレス圧力を200kgf/cm2とし、表1に示す焼成温度(最高温度)で焼成し、焼成終了まで真空雰囲気とした。焼成温度での保持時間は4時間とした。得られた冷却板の直径は400mm、厚さは25mmであった。
表1には、a:各実験例の出発原料組成(質量%)、b:ホットプレス焼成温度、c:XRD測定結果から求めた冷却板の構成相とその含有率(質量%)、d:冷却板における2つの質量比(SiC/TiSi2とSiC/TiC)、e:冷却板の材料特性(開気孔率、嵩密度、4点曲げ強度、線熱膨張係数、熱伝導率)、f:冷却板の製品特性(ピットの数)を示した。なお、実験例1~24のうち、実験例1~16が本発明の実施例に相当し、残りは比較例に相当する。
冷却板を乳鉢で粉砕し、X線回折装置により結晶相を同定した。測定条件はCuKα,40kV,40mA,2θ=5~70°とし、封入管式X線回折装置(ブルカー・エイエックスエス製 D8 ADVANCE)を使用した。また、構成相の簡易定量を行った。この簡易定量は、冷却板に含まれる結晶相の含有量をX線回折のピークに基づいて求めた。ここでは、SiC、TiSi2、TSC(Ti3SiC2)、TiCおよびSiO2に分けて簡易定量を行い含有量を求めた。簡易定量には、ブルカー・エイエックスエス社の粉末回折データ解析用ソフトウェア「EVA」の簡易プロファイルフィッティング機能(FPM Eval.)を利用した。本機能は定性した結晶相のICDD PDFカードのI/Icor(コランダムの回折強度に 対する強度比)を用いて構成相の量比を算出するものである。各結晶相のPDFカード番号は、SiC:00-049-1428、TiSi2:01-071-0187、TSC: 01-070-6397、TiC:01-070-9258(TiC0.62)、SiO2:00-039-1425を用いた。
(1)開気孔率及び嵩密度
純水を媒体としたアルキメデス法により測定した。
(2)4点曲げ強度
JIS-R1601に従って求めた。
(3)線熱膨張係数(40~570℃の平均線熱膨張係数)
ブルカー・エイエックスエス(株)製、TD5020S(横型示差膨張測定方式)を使用し、アルゴン雰囲気中、昇温速度20℃/分の条件で650℃まで2回昇温し、2回目の測定データから40~570℃の平均線熱膨張係数を算出した。標準試料には装置付属のアルミナ標準試料(純度99.7%、嵩密度3.9g/cm3、長さ20mm)を使用した。このアルミナ標準試料をもう1本用意し、同一条件で線熱膨張係数を測定した値は7.7ppm/Kであった。
(4)熱伝導率
レーザーフラッシュ法により測定した。
得られた直径400mmの冷却板の表面(30000mm2以上)に対して蛍光液を用いた浸透探傷試験を実施し、紫外線を当てて蛍光液が浸透した長径0.5mm以上の穴(ピット)の数を目視でカウントした。
(1)実験例1~16
実験例1~16では、原料としてSiC、TiSi2及びTiCを用い(実験例12,14では更にSiO2を用い)、焼成温度1330~1420℃でホットプレス焼成を行って冷却板を得た。得られた冷却板は、各構成相の含有率が適正だったため、優れた材料特性及び製品特性が得られた。そして、実験例1~16の冷却板は、材料特性が優れていたため、冷却対象物を冷却する能力が高いものといえる。特に、線熱膨張係数がアルミナと同等であるため、冷却板とアルミナとを金属接合した接合体を低温と高温との間で繰り返し使用したとしても両者が剥がれるのを抑制できる。また、製品特性であるピットの数がゼロ又は1だったため、ピットを起点とした破壊の発生を抑制でき、ピットの存在する場所での熱伝導の低下に伴う温度ムラの発生も抑制できる。なお、実験例14では、ピットの数はゼロであったが、構成相のSiO2の含有率が0.7質量%とやや高かったため、実験例1~13,15,16に比べて4点曲げ強度がやや低かった。
実験例17~24で得られた冷却板は、各構成相の含有率が適正でなかったため、実験例1~16に比べて材料特性が劣る傾向が見られた。また、これらの冷却板は、製品特性であるピットの数が5以上だったため、ピットを起点とした破壊が発生しやすく、ピットの存在する場所での熱伝導の低下に伴う温度ムラも発生しやすいものであった。ちなみに、実験例23,24では、開気孔率がゼロであったが、ピットの数が多く見られた。この結果から、開気孔率がゼロであるからといって必ずしもピットの数がゼロとはいえないことがわかった。
Claims (5)
- TiSi2を42~65質量%、TiCを4~16質量%含有すると共に、SiCをTiSi2の質量%よりも少量含有し、SiO 2 を0.1~0.5質量%含有する、冷却板。
- 30000mm2以上の表面を有し、前記表面に対して蛍光液を用いた浸透探傷試験を実施したあと前記表面を観察したときに前記蛍光液が浸透し且つ長径が0.5mm以上の穴が1個以下である、
請求項1に記載の冷却板。 - 質量比SiC/TiSi2が0.47~0.98、質量比SiC/TiCが2.7~8.8である、
請求項1又は2に記載の冷却板。 - アルミナ基板の冷却に用いられるものであり、アルミナとの40℃~570℃の平均線熱膨張係数の差が0.5ppm/K以下、又は、40℃~570℃の平均線熱膨張係数が7.2~9.0ppm/Kである、
請求項1又は2に記載の冷却板。 - 電極を内蔵したアルミナ基板と、
請求項4に記載の冷却板と、
前記アルミナ基板と前記冷却板とを接合する金属接合層と、
を備えた半導体製造装置用部材。
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JP2005056944A (ja) * | 2003-08-08 | 2005-03-03 | Hitachi Ltd | 電子回路装置 |
JP2005154832A (ja) * | 2003-11-25 | 2005-06-16 | Kyocera Corp | 複合材料とその製造方法及びウェハ保持部材 |
JP2021116218A (ja) * | 2020-01-29 | 2021-08-10 | 日本碍子株式会社 | 緻密質複合材料、その製法、接合体及び半導体製造装置用部材 |
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JP6182084B2 (ja) * | 2013-03-25 | 2017-08-16 | 日本碍子株式会社 | 緻密質複合材料、その製法、接合体及び半導体製造装置用部材 |
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- 2022-05-24 WO PCT/JP2022/021267 patent/WO2023228281A1/ja unknown
- 2022-05-24 JP JP2023512671A patent/JP7350215B1/ja active Active
- 2022-05-24 KR KR1020237007012A patent/KR20230164643A/ko not_active Application Discontinuation
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2023
- 2023-01-09 TW TW112100843A patent/TWI819949B/zh active
- 2023-02-23 US US18/173,208 patent/US20230386882A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005056944A (ja) * | 2003-08-08 | 2005-03-03 | Hitachi Ltd | 電子回路装置 |
JP2005154832A (ja) * | 2003-11-25 | 2005-06-16 | Kyocera Corp | 複合材料とその製造方法及びウェハ保持部材 |
JP2021116218A (ja) * | 2020-01-29 | 2021-08-10 | 日本碍子株式会社 | 緻密質複合材料、その製法、接合体及び半導体製造装置用部材 |
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TW202347671A (zh) | 2023-12-01 |
KR20230164643A (ko) | 2023-12-04 |
JPWO2023228281A1 (ja) | 2023-11-30 |
WO2023228281A1 (ja) | 2023-11-30 |
TWI819949B (zh) | 2023-10-21 |
US20230386882A1 (en) | 2023-11-30 |
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