JP7345663B2 - めっき装置およびめっき方法 - Google Patents
めっき装置およびめっき方法 Download PDFInfo
- Publication number
- JP7345663B2 JP7345663B2 JP2022536229A JP2022536229A JP7345663B2 JP 7345663 B2 JP7345663 B2 JP 7345663B2 JP 2022536229 A JP2022536229 A JP 2022536229A JP 2022536229 A JP2022536229 A JP 2022536229A JP 7345663 B2 JP7345663 B2 JP 7345663B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- nozzle
- electrode
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 title claims description 770
- 238000000034 method Methods 0.000 title claims description 55
- 239000000463 material Substances 0.000 claims description 52
- 230000007246 mechanism Effects 0.000 claims description 40
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 24
- 230000035515 penetration Effects 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 16
- 230000009471 action Effects 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- KIWQCVMQMWPCJB-UHFFFAOYSA-N [Ti].[Ir]=O Chemical compound [Ti].[Ir]=O KIWQCVMQMWPCJB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 36
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 19
- 239000004332 silver Substances 0.000 description 19
- 230000004048 modification Effects 0.000 description 18
- 238000012986 modification Methods 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000010936 titanium Substances 0.000 description 8
- 239000013527 degreasing agent Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005237 degreasing agent Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 239000012459 cleaning agent Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- 230000003472 neutralizing effect Effects 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020120768 | 2020-07-14 | ||
| JP2020120768 | 2020-07-14 | ||
| PCT/JP2021/024554 WO2022014316A1 (ja) | 2020-07-14 | 2021-06-29 | めっき電極、めっき装置およびめっき方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022014316A1 JPWO2022014316A1 (enrdf_load_stackoverflow) | 2022-01-20 |
| JPWO2022014316A5 JPWO2022014316A5 (ja) | 2022-11-16 |
| JP7345663B2 true JP7345663B2 (ja) | 2023-09-15 |
Family
ID=79555413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022536229A Active JP7345663B2 (ja) | 2020-07-14 | 2021-06-29 | めっき装置およびめっき方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7345663B2 (enrdf_load_stackoverflow) |
| WO (1) | WO2022014316A1 (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108315773A (zh) | 2018-01-25 | 2018-07-24 | 郑州大学 | 一种精密3d打印金属微模具的方法及装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4921220B1 (enrdf_load_stackoverflow) * | 1970-12-23 | 1974-05-30 | ||
| JPS506419B1 (enrdf_load_stackoverflow) * | 1970-12-25 | 1975-03-13 | ||
| JPS5224022U (enrdf_load_stackoverflow) * | 1975-08-07 | 1977-02-19 | ||
| JPS5628210Y2 (enrdf_load_stackoverflow) * | 1977-04-14 | 1981-07-04 | ||
| JPS57171689A (en) * | 1981-04-13 | 1982-10-22 | Tokio Osaki | Plating device |
| DE3312905C2 (de) * | 1983-04-11 | 1986-03-27 | Battelle-Institut E.V., 6000 Frankfurt | Vorrichtung zur galvanischen Innenbeschichtung von Hohlteilen |
| JPS61103475U (enrdf_load_stackoverflow) * | 1984-12-14 | 1986-07-01 | ||
| JPH0635680B2 (ja) * | 1988-11-04 | 1994-05-11 | 川崎製鉄株式会社 | 金属材表面の局部電解処理装置 |
| JP3291103B2 (ja) * | 1993-12-22 | 2002-06-10 | 住友特殊金属株式会社 | 連続表面処理装置 |
| CN104775141B (zh) * | 2015-04-29 | 2017-04-12 | 江苏理工学院 | 零件内孔修复用电刷镀装置及方法 |
-
2021
- 2021-06-29 WO PCT/JP2021/024554 patent/WO2022014316A1/ja active Application Filing
- 2021-06-29 JP JP2022536229A patent/JP7345663B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108315773A (zh) | 2018-01-25 | 2018-07-24 | 郑州大学 | 一种精密3d打印金属微模具的方法及装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022014316A1 (ja) | 2022-01-20 |
| JPWO2022014316A1 (enrdf_load_stackoverflow) | 2022-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kui et al. | Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films | |
| US11492717B2 (en) | Manufacturing apparatus of electrolytic copper foil | |
| US5087333A (en) | Method and apparatus for electroplating | |
| JP7345663B2 (ja) | めっき装置およびめっき方法 | |
| US20040235219A1 (en) | Plating apparatus, plating method, and method for manufacturing semiconductor device | |
| US9574283B2 (en) | Rinsing and drying for electrochemical processing | |
| US6962649B2 (en) | Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces | |
| CN117071015A (zh) | 一种正逆向脉冲电解银合金溶液、配制方法、电镀方法和银合金镀层 | |
| US20050045474A1 (en) | Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof | |
| US11629427B2 (en) | Plating apparatus and plating method | |
| KR100695372B1 (ko) | 도금 방법 | |
| KR102204664B1 (ko) | 릴투릴 금속판재 및 가공품의 나노부동태 처리방법 및 그에 따라서 제조된 금속판재 및 가공품 | |
| EP0114216B1 (en) | Method for selective electroplating | |
| JP2019085606A (ja) | めっき装置及びめっき方法 | |
| TWI640652B (zh) | 由第一金屬製成且具有由第二金屬製成之外鞘層之線的製造方法 | |
| CN1318651C (zh) | 镀敷装置、镀敷方法及半导体装置的制造方法 | |
| KR20210035897A (ko) | 금속의 전기 도금 또는 전착용 전극 | |
| KR100727270B1 (ko) | 인쇄 회로 기판 제작을 위한 도금 전극 구조 및 이를 구비한 전해 도금 장치 | |
| JP2019044233A (ja) | めっき処理装置、めっき処理方法、及びめっき対象物の保持具 | |
| JP2014218708A (ja) | 金属材料の水洗装置及び水洗方法 | |
| JP2002266098A (ja) | めっき装置、及び半導体装置の製造方法 | |
| JP2021113342A (ja) | 表面処理装置及びＮｉめっきステンレススクリーン印刷用メッシュ | |
| JP5978439B2 (ja) | 導電部材 | |
| JP2001140093A (ja) | 金属フープ材のめっき後処理方法 | |
| CN117265607A (zh) | 盲孔金属件及其电镀方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220913 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220913 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230404 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20230529 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230703 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230808 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230905 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7345663 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |