JP7344887B2 - 移動式基板搬送チャンバ - Google Patents

移動式基板搬送チャンバ Download PDF

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Publication number
JP7344887B2
JP7344887B2 JP2020543528A JP2020543528A JP7344887B2 JP 7344887 B2 JP7344887 B2 JP 7344887B2 JP 2020543528 A JP2020543528 A JP 2020543528A JP 2020543528 A JP2020543528 A JP 2020543528A JP 7344887 B2 JP7344887 B2 JP 7344887B2
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JP
Japan
Prior art keywords
vtm
substrate processing
processing tool
process modules
tool according
Prior art date
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JP2020543528A
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English (en)
Japanese (ja)
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JP2021514541A5 (https=
JP2021514541A (ja
Inventor
ブラウン・ダニエル・アーサー
シャープレス・レオナード・ジョン
ロンネ・アラン・ケント
バークハート・クリストファー・ウィリアム
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Lam Research Corp
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Lam Research Corp
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Publication date
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Publication of JP2021514541A5 publication Critical patent/JP2021514541A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2020543528A 2018-02-15 2019-02-15 移動式基板搬送チャンバ Active JP7344887B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862631057P 2018-02-15 2018-02-15
US62/631,057 2018-02-15
PCT/US2019/018174 WO2019161169A1 (en) 2018-02-15 2019-02-15 Moving substrate transfer chamber

Publications (3)

Publication Number Publication Date
JP2021514541A JP2021514541A (ja) 2021-06-10
JP2021514541A5 JP2021514541A5 (https=) 2022-03-24
JP7344887B2 true JP7344887B2 (ja) 2023-09-14

Family

ID=67619589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020543528A Active JP7344887B2 (ja) 2018-02-15 2019-02-15 移動式基板搬送チャンバ

Country Status (5)

Country Link
US (1) US11282737B2 (https=)
JP (1) JP7344887B2 (https=)
KR (1) KR102706036B1 (https=)
CN (1) CN111742400B (https=)
WO (1) WO2019161169A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985531B1 (ja) 2020-02-05 2021-12-22 株式会社安川電機 搬送システム、搬送方法および搬送装置
JP7156332B2 (ja) * 2020-05-21 2022-10-19 株式会社安川電機 搬送装置、搬送方法および搬送システム
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot
KR102620088B1 (ko) * 2023-05-12 2024-01-02 에이피티씨 주식회사 기판 이송 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079409A (ja) 2003-09-01 2005-03-24 Tokyo Electron Ltd 基板処理装置
US20070051314A1 (en) 2005-09-08 2007-03-08 Jusung Engineering Co., Ltd. Movable transfer chamber and substrate-treating apparatus including the same
JP2009147236A (ja) 2007-12-17 2009-07-02 Mitsubishi Heavy Ind Ltd 真空処理装置
JP2012146855A (ja) 2011-01-13 2012-08-02 Tokyo Electron Ltd 基板処理装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
JPH10144765A (ja) * 1996-11-11 1998-05-29 Canon Sales Co Inc 基板処理システム
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
AU2003259203A1 (en) * 2002-07-22 2004-02-09 Brooks Automation, Inc. Substrate processing apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
JP5139253B2 (ja) * 2008-12-18 2013-02-06 東京エレクトロン株式会社 真空処理装置及び真空搬送装置
JP5526988B2 (ja) 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
KR20250119665A (ko) 2011-09-16 2025-08-07 퍼시몬 테크놀로지스 코포레이션 운송 장치 및 이를 포함하는 처리 장치
TWI629743B (zh) 2012-02-10 2018-07-11 布魯克斯自動機械公司 基材處理設備
US9558978B2 (en) * 2012-05-04 2017-01-31 Kla-Tencor Corporation Material handling with dedicated automated material handling system
US10424498B2 (en) 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
US9558975B2 (en) 2013-09-20 2017-01-31 Varian Semiconductor Equipment Associates, Inc. System and method for transferring articles between vacuum and non-vacuum environments
US9818633B2 (en) * 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
JP6837274B2 (ja) 2015-06-30 2021-03-03 東京エレクトロン株式会社 半導体製造装置及び基板搬送方法
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079409A (ja) 2003-09-01 2005-03-24 Tokyo Electron Ltd 基板処理装置
US20070051314A1 (en) 2005-09-08 2007-03-08 Jusung Engineering Co., Ltd. Movable transfer chamber and substrate-treating apparatus including the same
JP2009147236A (ja) 2007-12-17 2009-07-02 Mitsubishi Heavy Ind Ltd 真空処理装置
JP2012146855A (ja) 2011-01-13 2012-08-02 Tokyo Electron Ltd 基板処理装置

Also Published As

Publication number Publication date
WO2019161169A1 (en) 2019-08-22
KR102706036B1 (ko) 2024-09-11
US20200381285A1 (en) 2020-12-03
CN111742400A (zh) 2020-10-02
US11282737B2 (en) 2022-03-22
JP2021514541A (ja) 2021-06-10
CN111742400B (zh) 2025-04-29
KR20200110813A (ko) 2020-09-25

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