CN111742400B - 移动衬底传送室 - Google Patents
移动衬底传送室 Download PDFInfo
- Publication number
- CN111742400B CN111742400B CN201980013736.3A CN201980013736A CN111742400B CN 111742400 B CN111742400 B CN 111742400B CN 201980013736 A CN201980013736 A CN 201980013736A CN 111742400 B CN111742400 B CN 111742400B
- Authority
- CN
- China
- Prior art keywords
- vtm
- substrate processing
- processing tool
- modules
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862631057P | 2018-02-15 | 2018-02-15 | |
| US62/631,057 | 2018-02-15 | ||
| PCT/US2019/018174 WO2019161169A1 (en) | 2018-02-15 | 2019-02-15 | Moving substrate transfer chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111742400A CN111742400A (zh) | 2020-10-02 |
| CN111742400B true CN111742400B (zh) | 2025-04-29 |
Family
ID=67619589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980013736.3A Active CN111742400B (zh) | 2018-02-15 | 2019-02-15 | 移动衬底传送室 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11282737B2 (https=) |
| JP (1) | JP7344887B2 (https=) |
| KR (1) | KR102706036B1 (https=) |
| CN (1) | CN111742400B (https=) |
| WO (1) | WO2019161169A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6985531B1 (ja) | 2020-02-05 | 2021-12-22 | 株式会社安川電機 | 搬送システム、搬送方法および搬送装置 |
| JP7156332B2 (ja) * | 2020-05-21 | 2022-10-19 | 株式会社安川電機 | 搬送装置、搬送方法および搬送システム |
| WO2023205361A1 (en) * | 2022-04-22 | 2023-10-26 | Lam Research Corporation | Shallow-depth equipment front end module with robot |
| KR102620088B1 (ko) * | 2023-05-12 | 2024-01-02 | 에이피티씨 주식회사 | 기판 이송 장치 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5202716A (en) * | 1988-02-12 | 1993-04-13 | Tokyo Electron Limited | Resist process system |
| JPH10144765A (ja) * | 1996-11-11 | 1998-05-29 | Canon Sales Co Inc | 基板処理システム |
| US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
| AU2003259203A1 (en) * | 2002-07-22 | 2004-02-09 | Brooks Automation, Inc. | Substrate processing apparatus |
| US7959395B2 (en) * | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| JP4493955B2 (ja) * | 2003-09-01 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理装置及び搬送ケース |
| KR20070029032A (ko) * | 2005-09-08 | 2007-03-13 | 주성엔지니어링(주) | 이동식 이송챔버와 이를 포함하는 기판처리장치 |
| US20070051314A1 (en) | 2005-09-08 | 2007-03-08 | Jusung Engineering Co., Ltd. | Movable transfer chamber and substrate-treating apparatus including the same |
| JP2009147236A (ja) | 2007-12-17 | 2009-07-02 | Mitsubishi Heavy Ind Ltd | 真空処理装置 |
| JP5139253B2 (ja) * | 2008-12-18 | 2013-02-06 | 東京エレクトロン株式会社 | 真空処理装置及び真空搬送装置 |
| JP5526988B2 (ja) | 2010-04-28 | 2014-06-18 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理システム |
| JP5551625B2 (ja) | 2011-01-13 | 2014-07-16 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| KR20250119665A (ko) | 2011-09-16 | 2025-08-07 | 퍼시몬 테크놀로지스 코포레이션 | 운송 장치 및 이를 포함하는 처리 장치 |
| TWI629743B (zh) | 2012-02-10 | 2018-07-11 | 布魯克斯自動機械公司 | 基材處理設備 |
| US9558978B2 (en) * | 2012-05-04 | 2017-01-31 | Kla-Tencor Corporation | Material handling with dedicated automated material handling system |
| US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
| US9558975B2 (en) | 2013-09-20 | 2017-01-31 | Varian Semiconductor Equipment Associates, Inc. | System and method for transferring articles between vacuum and non-vacuum environments |
| US9818633B2 (en) * | 2014-10-17 | 2017-11-14 | Lam Research Corporation | Equipment front end module for transferring wafers and method of transferring wafers |
| JP6837274B2 (ja) | 2015-06-30 | 2021-03-03 | 東京エレクトロン株式会社 | 半導体製造装置及び基板搬送方法 |
| US20170115657A1 (en) * | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
-
2019
- 2019-02-15 WO PCT/US2019/018174 patent/WO2019161169A1/en not_active Ceased
- 2019-02-15 JP JP2020543528A patent/JP7344887B2/ja active Active
- 2019-02-15 KR KR1020207026097A patent/KR102706036B1/ko active Active
- 2019-02-15 CN CN201980013736.3A patent/CN111742400B/zh active Active
- 2019-02-15 US US16/969,857 patent/US11282737B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019161169A1 (en) | 2019-08-22 |
| KR102706036B1 (ko) | 2024-09-11 |
| US20200381285A1 (en) | 2020-12-03 |
| CN111742400A (zh) | 2020-10-02 |
| US11282737B2 (en) | 2022-03-22 |
| JP2021514541A (ja) | 2021-06-10 |
| JP7344887B2 (ja) | 2023-09-14 |
| KR20200110813A (ko) | 2020-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |