JP7333226B2 - 表示装置の製造方法及び表示装置 - Google Patents

表示装置の製造方法及び表示装置 Download PDF

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Publication number
JP7333226B2
JP7333226B2 JP2019156126A JP2019156126A JP7333226B2 JP 7333226 B2 JP7333226 B2 JP 7333226B2 JP 2019156126 A JP2019156126 A JP 2019156126A JP 2019156126 A JP2019156126 A JP 2019156126A JP 7333226 B2 JP7333226 B2 JP 7333226B2
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Japan
Prior art keywords
inorganic light
light emitting
emitting element
defective
inorganic
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JP2019156126A
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English (en)
Japanese (ja)
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JP2021033178A (ja
Inventor
康弘 金谷
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Japan Display Inc
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Japan Display Inc
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Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2019156126A priority Critical patent/JP7333226B2/ja
Priority to CN202010874375.6A priority patent/CN112447120B/zh
Priority to TW109129107A priority patent/TWI753549B/zh
Publication of JP2021033178A publication Critical patent/JP2021033178A/ja
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Publication of JP7333226B2 publication Critical patent/JP7333226B2/ja
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Led Device Packages (AREA)
JP2019156126A 2019-08-28 2019-08-28 表示装置の製造方法及び表示装置 Active JP7333226B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019156126A JP7333226B2 (ja) 2019-08-28 2019-08-28 表示装置の製造方法及び表示装置
CN202010874375.6A CN112447120B (zh) 2019-08-28 2020-08-26 显示装置的制造方法及显示装置
TW109129107A TWI753549B (zh) 2019-08-28 2020-08-26 顯示裝置之製造方法及顯示裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019156126A JP7333226B2 (ja) 2019-08-28 2019-08-28 表示装置の製造方法及び表示装置

Publications (2)

Publication Number Publication Date
JP2021033178A JP2021033178A (ja) 2021-03-01
JP7333226B2 true JP7333226B2 (ja) 2023-08-24

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Family Applications (1)

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JP2019156126A Active JP7333226B2 (ja) 2019-08-28 2019-08-28 表示装置の製造方法及び表示装置

Country Status (3)

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JP (1) JP7333226B2 (zh)
CN (1) CN112447120B (zh)
TW (1) TWI753549B (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006065011A (ja) 2004-08-27 2006-03-09 Sony Corp 素子接続配線、画像表示装置及び配線切断方法
JP2011517090A (ja) 2008-03-31 2011-05-26 クリー インコーポレイテッド 発光調整方法及びその方法を用いて製造されたデバイス
JP2016523450A (ja) 2013-06-18 2016-08-08 ルクスビュー テクノロジー コーポレイション 波長変換層を有するｌｅｄディスプレイ
US20180190712A1 (en) 2016-12-30 2018-07-05 Fang Xu Semiconductor LED Display Devices
JP2018523848A (ja) 2015-07-23 2018-08-23 ソウル セミコンダクター カンパニー リミテッド ディスプレイ装置及びその製造方法
US20190080970A1 (en) 2017-09-11 2019-03-14 Vuereal Inc. Repair techniques for micro-led devices and arrays
US20190181122A1 (en) 2017-12-13 2019-06-13 Innolux Corporation Electronic device and method of manufacturing the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5459142B2 (ja) * 2010-08-11 2014-04-02 セイコーエプソン株式会社 有機ｅｌ装置、有機ｅｌ装置の製造方法、及び電子機器
KR101954973B1 (ko) * 2012-09-19 2019-03-08 삼성디스플레이 주식회사 유기 발광 표시 장치
TWI498791B (zh) * 2012-12-27 2015-09-01 Toppan Printing Co Ltd 液晶顯示裝置、彩色濾光片基板及彩色濾光片基板之製造方法
KR102294163B1 (ko) * 2014-12-05 2021-08-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 모듈
WO2017217703A1 (en) * 2016-06-13 2017-12-21 Seoul Semiconductor Co., Ltd Display apparatus and manufacturing method thereof
CN106098720A (zh) * 2016-06-20 2016-11-09 深圳市华星光电技术有限公司 微发光二极管显示器
KR102605472B1 (ko) * 2016-09-09 2023-11-23 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
KR101947643B1 (ko) * 2016-12-02 2019-02-13 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
CN114759060A (zh) * 2017-12-13 2022-07-15 群创光电股份有限公司 电子装置及其制造方法
CN108877653B (zh) * 2018-06-29 2021-11-02 京东方科技集团股份有限公司 像素电路、显示装置及其制造方法
TWI679756B (zh) * 2019-02-20 2019-12-11 友達光電股份有限公司 發光二極體面板及其製作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006065011A (ja) 2004-08-27 2006-03-09 Sony Corp 素子接続配線、画像表示装置及び配線切断方法
JP2011517090A (ja) 2008-03-31 2011-05-26 クリー インコーポレイテッド 発光調整方法及びその方法を用いて製造されたデバイス
JP2016523450A (ja) 2013-06-18 2016-08-08 ルクスビュー テクノロジー コーポレイション 波長変換層を有するｌｅｄディスプレイ
JP2018523848A (ja) 2015-07-23 2018-08-23 ソウル セミコンダクター カンパニー リミテッド ディスプレイ装置及びその製造方法
US20180190712A1 (en) 2016-12-30 2018-07-05 Fang Xu Semiconductor LED Display Devices
US20190080970A1 (en) 2017-09-11 2019-03-14 Vuereal Inc. Repair techniques for micro-led devices and arrays
US20190181122A1 (en) 2017-12-13 2019-06-13 Innolux Corporation Electronic device and method of manufacturing the same

Also Published As

Publication number Publication date
TWI753549B (zh) 2022-01-21
CN112447120A (zh) 2021-03-05
TW202115941A (zh) 2021-04-16
CN112447120B (zh) 2023-08-01
JP2021033178A (ja) 2021-03-01

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