JP7316742B2 - ３次元積層造形による実装基板の製造方法 - Google Patents

３次元積層造形による実装基板の製造方法 Download PDF

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JP7316742B2
JP7316742B2 JP2022507077A JP2022507077A JP7316742B2 JP 7316742 B2 JP7316742 B2 JP 7316742B2 JP 2022507077 A JP2022507077 A JP 2022507077A JP 2022507077 A JP2022507077 A JP 2022507077A JP 7316742 B2 JP7316742 B2 JP 7316742B2
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Japan
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reinforcing member
electronic component
substrate
manufacturing
mounting
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JP2022507077A
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Japanese (ja)
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JPWO2021181561A1 (enExample
Inventor
謙磁 塚田
亮二郎 富永
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022507077A 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法 Active JP7316742B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/010522 WO2021181561A1 (ja) 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法

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JPWO2021181561A1 JPWO2021181561A1 (enExample) 2021-09-16
JP7316742B2 true JP7316742B2 (ja) 2023-07-28

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JP (1) JP7316742B2 (enExample)
WO (1) WO2021181561A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210021A1 (ja) * 2022-04-29 2023-11-02 株式会社Fuji 塗布情報生成方法、情報処理装置及び３次元造形装置
CN114980579B (zh) * 2022-06-08 2024-02-06 芯体素(杭州)科技发展有限公司 一种高精密多层线路板制备过程中的固化方法
JPWO2024101211A1 (enExample) * 2022-11-09 2024-05-16

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158352A (ja) 2005-12-07 2007-06-21 Samsung Electro Mech Co Ltd 配線基板の製造方法及び配線基板
WO2016147284A1 (ja) 2015-03-16 2016-09-22 富士機械製造株式会社 形成方法及び形成装置
JP2016531770A (ja) 2013-06-24 2016-10-13 プレジデント アンド フェローズ オブ ハーバード カレッジ 印刷３次元（３ｄ）機能部品および製造方法
US20180154573A1 (en) 2015-05-19 2018-06-07 Dst Innovations Limited A Circuit Board and Component Fabrication Apparatus
WO2018138755A1 (ja) 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019193644A1 (ja) 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ ３次元構造物形成方法、および３次元構造物形成装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5734737B2 (ja) * 2010-05-20 2015-06-17 富士フイルム株式会社 傾斜機能材料の製造方法及び装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158352A (ja) 2005-12-07 2007-06-21 Samsung Electro Mech Co Ltd 配線基板の製造方法及び配線基板
JP2016531770A (ja) 2013-06-24 2016-10-13 プレジデント アンド フェローズ オブ ハーバード カレッジ 印刷３次元（３ｄ）機能部品および製造方法
WO2016147284A1 (ja) 2015-03-16 2016-09-22 富士機械製造株式会社 形成方法及び形成装置
US20180154573A1 (en) 2015-05-19 2018-06-07 Dst Innovations Limited A Circuit Board and Component Fabrication Apparatus
WO2018138755A1 (ja) 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019193644A1 (ja) 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ ３次元構造物形成方法、および３次元構造物形成装置

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JPWO2021181561A1 (enExample) 2021-09-16

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