WO2021181561A1 - ３次元積層造形による実装基板の製造方法 - Google Patents

３次元積層造形による実装基板の製造方法 Download PDF

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Publication number
WO2021181561A1
WO2021181561A1 PCT/JP2020/010522 JP2020010522W WO2021181561A1 WO 2021181561 A1 WO2021181561 A1 WO 2021181561A1 JP 2020010522 W JP2020010522 W JP 2020010522W WO 2021181561 A1 WO2021181561 A1 WO 2021181561A1
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WO
WIPO (PCT)
Prior art keywords
wiring
reinforcing member
electronic component
substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/010522
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English (en)
French (fr)
Japanese (ja)
Inventor
謙磁 塚田
亮二郎 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to JP2022507077A priority Critical patent/JP7316742B2/ja
Priority to PCT/JP2020/010522 priority patent/WO2021181561A1/ja
Publication of WO2021181561A1 publication Critical patent/WO2021181561A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Definitions

  • the present disclosure relates to a technique for manufacturing a mounting board in which electronic components are mounted on a board by using three-dimensional laminated modeling.
  • Patent Document 1 a plurality of mounting boards on which electronic components are mounted are manufactured on one worksheet (aggregate board), and the worksheets are diced to obtain individual mounting boards, so-called a large number of pieces. I am doing.
  • a plate-shaped frame member surrounding each mounting substrate is used in order to suppress the warp of the worksheet due to the stress generated when the insulating layer is formed.
  • a technique for forming a mounting substrate on which electronic components are mounted by using three-dimensional laminated modeling has been developed. For example, a resin or metal curable viscous fluid is applied onto a base material from an inkjet head, and the applied curable viscous fluid is cured to form a resin layer or wiring having a desired shape.
  • stress due to heating during curing may accumulate on the substrate in the process of repeating coating and curing, and the substrate may warp.
  • the board warps in the portion where the electronic component is mounted during or after mounting the electronic component a part of the connection portion connected to the component terminal of the electronic component such as a bump may swell or crack. ..
  • a plate-shaped frame member surrounding the mounting board on which electronic components are mounted is prepared as a member separate from the mounting board.
  • the plate-shaped frame member is arranged on a mounting substrate, that is, a non-product area (area in which electronic components are not mounted) surrounding the final product. Then, the plate-shaped frame member is separated from the mounting substrate by dicing. Therefore, depending on the mounting position of the electronic component and the size of the mounting board, the distance between the placement position where the component terminals of the electronic component are placed and the plate-shaped frame member becomes long, and the warp of the board generated at the placement position is sufficient. There is a risk that it cannot be suppressed.
  • the present disclosure has been made in view of such circumstances, and describes a method for manufacturing a mounting substrate by three-dimensional laminated molding, which can effectively suppress the warpage of the substrate generated at the arrangement position where the component terminals of electronic components are arranged.
  • the challenge is to provide.
  • the present disclosure is a method of manufacturing a mounting substrate in which wiring and component terminals of electronic components are connected by a connection portion by three-dimensional laminated molding, and the substrate contains metal particles.
  • a member forming step, a second metal fluid coating step of applying a second metal fluid containing metal particles on the wiring corresponding to the placement position, and the component terminal of the electronic component are placed at the placement position.
  • the electronic component arranging step of connecting the electronic component and the wiring via the second metal fluid, and the second metal fluid applied on the wiring are cured to form the connection portion, and the electronic component is formed.
  • a reinforcing member is formed of a resin material at a position surrounding a component terminal (arrangement position) of an electronic component and on a wiring.
  • the rigidity of the substrate at the arrangement position can be increased by filling at least a part of the wiring, forming a reinforcing member surrounding the electronic component, and increasing the thickness of the substrate.
  • the reinforcing member and the component terminal can be brought close to each other, and the warp of the substrate generated at the arrangement position can be effectively suppressed.
  • the swelling and cracking of the connection part can be suppressed, and the yield of connection of electronic components can be improved.
  • FIG. 1 It is a figure which shows the mounting board manufacturing apparatus. It is a block diagram which shows the control device. It is a block diagram which shows the control device. It is a block diagram which shows the control device. It is a schematic diagram for demonstrating the manufacturing process of a mounting board. It is a schematic diagram for demonstrating the manufacturing process of a mounting board. It is a schematic diagram for demonstrating the manufacturing process of a mounting board. It is a top view for demonstrating the manufacturing process of a mounting board. It is a schematic diagram for demonstrating the manufacturing process of a mounting board. It is a top view for demonstrating the manufacturing process of a mounting board. It is sectional drawing which shows the cross section cut by the line I (I) shown in FIG. It is a schematic diagram for demonstrating the manufacturing process of a mounting board.
  • FIG. 1 shows the mounting board manufacturing apparatus 10.
  • the mounting board manufacturing apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, a third modeling unit 29, and a control device 27 (see FIGS. 2 and 3). Be prepared.
  • the transfer device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, and the third modeling unit 29 are arranged on the base 28 of the mounting board manufacturing apparatus 10.
  • the base 28 is generally rectangular in plan view.
  • the longitudinal direction of the base 28 will be referred to as the X-axis direction
  • the lateral direction of the base 28 will be referred to as the Y-axis direction
  • the direction orthogonal to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is arranged on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is slidably held in the X-axis direction by the X-axis slide rail 34.
  • the X-axis slide mechanism 30 has an electromagnetic motor 38 (see FIG. 2), and the X-axis slider 36 is moved to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y-axis slide mechanism 32 has a Y-axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is arranged on the base 28 so as to extend in the Y-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction.
  • the stage 52 is slidably held in the Y-axis direction by the Y-axis slide rail 50.
  • the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see FIG. 2), and the stage 52 is moved to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60, a holding device 62, and an elevating device 64.
  • the base 60 is formed in a flat plate shape, and the base material 70 is placed on the upper surface.
  • the holding devices 62 are provided on both sides of the base 60 in the X-axis direction.
  • the holding device 62 holds the base material 70 fixedly to the base 60 by sandwiching both edges of the base material 70 placed on the base 60 in the X-axis direction.
  • the elevating device 64 is arranged below the base 60, and raises and lowers the base 60 in the Z-axis direction.
  • the first modeling unit 22 is a unit for modeling wiring on a base material 70 placed on a base 60 of a stage 52, and has a first printing unit 72 and a firing unit 74.
  • the first printing unit 72 has an inkjet head 76 (see FIG. 2), and linearly ejects conductive ink onto the base material 70 placed on the base 60.
  • the conductive ink is an example of a fluid containing the metal particles of the present disclosure.
  • the conductive ink contains, for example, nanometer-sized metal (silver or the like) fine particles dispersed in a solvent as a main component, and is cured by being fired by heat.
  • the conductive ink contains, for example, metal nanoparticles having a size of several hundred nanometers or less.
  • the surface of the metal nanoparticles is, for example, coated with a dispersant to suppress agglutination in the solvent.
  • the inkjet head 76 ejects conductive ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the device for ejecting the conductive ink is not limited to the inkjet head provided with a plurality of nozzles, and for example, a dispenser provided with one nozzle may be used.
  • the type of metal nanoparticles contained in the conductive ink is not limited to silver, and may be copper, gold, or the like.
  • the number of types of metal nanoparticles contained in the conductive ink is not limited to one, and may be a plurality of types.
  • the firing unit 74 has an irradiation device 78 (see FIG. 2).
  • the irradiation device 78 includes, for example, an infrared heater that heats the conductive ink ejected onto the base material 70.
  • the conductive ink is fired by applying heat from an infrared heater to form wiring.
  • the solvent is vaporized and the protective film of the metal nanoparticles, that is, the dispersant is decomposed, and the metal nanoparticles are brought into contact with or fused together. This is a phenomenon in which the conductivity is increased.
  • the wiring can be formed by firing the conductive ink.
  • the device for heating the conductive ink is not limited to the infrared heater.
  • a device for heating the conductive ink an infrared lamp, a laser irradiation device that irradiates the conductive ink with laser light, or a base material 70 to which the conductive ink is discharged is placed in the furnace. It may be provided with an electric furnace for heating.
  • the second modeling unit 24 is a unit that forms a resin layer on the base material 70 placed on the base 60, and has a second printing unit 84 and a curing unit 86.
  • the second printing unit 84 has an inkjet head 88 (see FIG. 2), and discharges the ultraviolet curable resin onto the base material 70 placed on the base 60.
  • the ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the method in which the inkjet head 88 discharges the ultraviolet curable resin may be, for example, a piezo method using a piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and discharged from a plurality of nozzles.
  • the cured portion 86 has a flattening device 90 (see FIG. 2) and an irradiation device 92 (see FIG. 2).
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged onto the base material 70 by the inkjet head 88.
  • the flattening device 90 makes the thickness of the UV curable resin uniform by, for example, scraping the excess resin with a roller or a blade while leveling the surface of the UV curable resin.
  • the irradiation device 92 includes a mercury lamp or an LED as a light source, and irradiates the ultraviolet curable resin discharged on the base material 70 with ultraviolet rays. As a result, the ultraviolet curable resin discharged onto the base material 70 is cured, and a resin layer can be formed.
  • the mounting unit 26 is a unit for arranging electronic components on the base material 70 mounted on the base 60, and has a supply unit 100 and a mounting unit 102.
  • the supply unit 100 has a plurality of tape feeders 110 (see FIG. 2) that send out taped electronic components one by one, and supplies the electronic components at each supply position.
  • the electronic component is, for example, a sensor element such as a temperature sensor.
  • the electronic components are not limited to the tape feeder 110 and may be supplied by the tray.
  • the mounting unit 102 has a mounting head 112 (see FIG. 2) and a moving device 114 (see FIG. 2).
  • the mounting head 112 has a suction nozzle for sucking and holding electronic components.
  • the suction nozzle sucks and holds electronic components by sucking air by supplying negative pressure from a positive / negative pressure supply device (not shown). Then, when a slight positive pressure is supplied from the positive / negative pressure supply device, the electronic component is separated. Further, the moving device 114 moves the mounting head 112 between the supply position of the tape feeder 110 and the base material 70 mounted on the base 60. As a result, the mounting portion 102 holds the electronic component by the suction nozzle, and arranges the electronic component held by the suction nozzle on the base material 70.
  • the third modeling unit 29 is a unit for applying a conductive paste or an underfill resin on the base material 70 placed on the base 60.
  • the conductive paste is, for example, a viscous fluid containing micro-sized metal particles (such as microfilament) in a resin adhesive.
  • Micro-sized metal microparticles are, for example, flake-state metals (such as silver).
  • the metal microparticles are not limited to silver, but may be gold, copper, or a plurality of types of metals.
  • the adhesive contains, for example, an epoxy resin as a main component.
  • the conductive paste is cured by heating and is used, for example, to form connection terminals connected to wiring.
  • the connection terminal is, for example, a bump connected to a component terminal of an electronic component, an external electrode connected to an external device, or the like.
  • the underfill resin is a resin used for encapsulating electronic parts, and is, for example, an epoxy resin as a main material.
  • the underfill resin is, for example, a thermosetting resin that is cured by heat.
  • an ultraviolet curable resin that is cured by ultraviolet rays may be used.
  • the third modeling unit 29 has a dispenser 130 as a device for discharging (applying) the conductive paste or the underfill resin.
  • the device for applying the conductive paste or the underfill resin is not limited to the dispenser, but may be a screen printing device or a gravure printing device.
  • the mounting substrate manufacturing apparatus 10 may separately include a dispenser 130 for discharging the conductive paste and the underfill resin, or the same dispenser 130 may be switched and used.
  • the "coating" in the present disclosure is a concept including an operation of discharging a fluid from a nozzle or the like, an operation of adhering a fluid on an object by screen printing or gravure printing, an operation of applying the fluid with a pin or the like, and the like. be.
  • the dispenser 130 discharges the conductive paste or the underfill resin onto the base material 70 or the resin layer.
  • the discharged conductive paste is heated and cured by the fired portion 74 of the first modeling unit 22, for example, to form a connection terminal (external electrode or the like). Further, the discharged underfill resin is heated and cured by, for example, the firing unit 74 to seal the electronic component.
  • the conductive paste contains, for example, metal microparticles having a size of several tens of micrometers or less.
  • the adhesive resin or the like
  • the flaky metals are cured in contact with each other.
  • the conductive ink becomes an integrated metal by fusing the metal nanoparticles to each other by heating, and the conductivity is higher than that in the state where the metal nanoparticles are only in contact with each other.
  • the conductive paste is cured by bringing micro-sized metal microparticles into contact with each other by curing the adhesive.
  • the resistance (electric resistivity) of the wiring formed by curing the conductive ink is extremely small, for example, several to several tens of micro ⁇ ⁇ cm, and the resistance of the wiring formed by curing the conductive paste (several tens to several tens to severals). It is smaller than 1000 micro ⁇ ⁇ cm). Therefore, the conductive ink is suitable for modeling a modeled object that requires a low resistance value, such as a circuit wiring having a low resistance.
  • the conductive paste can improve the adhesiveness with other members by curing the adhesive at the time of curing, and is superior in adhesion to other members as compared with the conductive ink.
  • the other member referred to here is a member to which the conductive paste is discharged and adhered, and is, for example, a resin layer, wiring, a component terminal of an electronic component, and the like. Therefore, the conductive paste is suitable for modeling a modeled object that requires mechanical strength (tensile strength, etc.), such as a connection terminal for fixing an electronic component to a resin layer.
  • mechanical strength tensile strength, etc.
  • the control device 27 includes a controller 120, a plurality of drive circuits 122, and a storage device 124.
  • the plurality of drive circuits 122 include the electromagnetic motors 38 and 56, a holding device 62, an elevating device 64, an inkjet head 76, an irradiation device 78, an inkjet head 88, a flattening device 90, an irradiation device 92, a tape feeder 110, and a mounting head 112. , Connected to the mobile device 114 (see FIG. 2). Further, the drive circuit 122 is connected to the third modeling unit 29 (see FIG. 3).
  • the controller 120 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 122.
  • the storage device 124 includes a RAM, a ROM, a hard disk, and the like, and stores a control program 126 that controls the mounting board manufacturing device 10.
  • the controller 120 can control the operations of the transfer device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the third modeling unit 29, and the like by executing the control program 126 on the CPU. ..
  • the fact that the controller 120 executes the control program 126 to control each device may be simply described as "device". For example, "the controller 120 moves the stage 52" means that "the controller 120 executes the control program 126, controls the operation of the transfer device 20 via the drive circuit 122, and causes the stage by the operation of the transfer device 20.” It means "move 52".
  • the mounting board manufacturing apparatus 10 of the present embodiment manufactures a mounting board 171 (see FIGS. 15 and 16) including wiring, connection terminals, and electronic components as a modeled object by the above-described configuration.
  • the structure, manufacturing procedure, etc. of the modeled object described below are examples.
  • the control program 126 of the storage device 124 three-dimensional data of each layer obtained by slicing the mounting board 171 at the time of completion is set.
  • the controller 120 controls the first modeling unit 22 and the like based on the data of the control program 126, and discharges and cures the ultraviolet curable resin and the like to form the mounting substrate 171.
  • the controller 120 forms the mounting board 171 on the base material 70 while moving the stage 52.
  • a release film 133 that can be peeled off by heat is attached to the upper surface of the base material 70, and a mounting substrate 171 (modeled object) is formed on the release film 133. ..
  • the release film 133 is separated from the base material 70 together with the mounting substrate 171 by being heated.
  • the method of separating the base material 70 and the mounting substrate 171 is not limited to the method of using the release film 133.
  • a member (support material or the like) that is melted by heat may be arranged between the base material 70 and the mounting board 171 to be melted and separated.
  • the mounting substrate 171 may be formed directly on the base material 70 without using a separating member such as the release film 133.
  • the controller 120 forms the circuit board 141 on the release film 133 as shown in FIG.
  • the controller 120 forms a resin layer 143 having wiring 145 and through holes 147.
  • the wiring pattern and the like of the wiring 145 are set in the data of the control program 126 stored in the storage device 124, for example.
  • FIG. 5 schematically shows a cross section of the circuit board 141.
  • the controller 120 when the controller 120 forms the resin layer 143, the controller 120 discharges the ultraviolet curable resin from the inkjet head 88 of the second modeling unit 24 onto the release film 133, and the discharged ultraviolet curable resin.
  • the resin layer 143 is formed by repeatedly executing the process of irradiating ultraviolet rays from the irradiation device 92 of the cured portion 86.
  • the controller 120 moves the stage 52 below the second modeling unit 24 and controls the second printing unit 84 to control the second printing unit 84 from the inkjet head 88 to the ultraviolet curable resin 135.
  • the droplets are ejected into a thin film on the release film 133.
  • the controller 120 controls the inkjet head 88 to discharge the ultraviolet curable resin 135 at a position corresponding to the resin layer 143.
  • the curing unit 86 irradiates the thin film ultraviolet curable resin 135 with ultraviolet rays by the irradiation device 92. As a result, a thin-film resin layer is formed on the release film 133.
  • the controller 120 may appropriately perform a process of flattening the ultraviolet curable resin discharged in the form of a thin film by the flattening device 90.
  • the controller 120 adjusts the ejection position of the ultraviolet curable resin 135, and repeatedly executes the ejection of the ultraviolet curable resin 135, the flattening of the ultraviolet curable resin 135, and the irradiation of ultraviolet rays to form the resin layer 143.
  • the controller 120 appropriately executes the formation of the wiring 145 and the through hole 147 in the process of forming the resin layer 143.
  • the controller 120 moves the stage 52 below the first modeling unit 22.
  • the controller 120 controls the first printing unit 72 and ejects the conductive ink onto the release film 133, the resin layer 143, and the like by the inkjet head 76.
  • the inkjet head 76 ejects conductive ink linearly according to the wiring pattern.
  • This wiring pattern is set in the control program 126, for example, according to the modeled object to be manufactured.
  • the controller 120 controls the firing unit 74 to heat the conductive ink discharged onto the release film 133, the resin layer 143, or the like by the infrared heater of the irradiation device 78.
  • the wiring 145 can be formed on the resin layer 143 by firing the conductive ink.
  • the controller 120 moves the stage 52 below the third modeling unit 29.
  • the controller 120 controls the third modeling unit 29 and discharges the conductive paste onto the release film 133, the resin layer 143, the wiring 145, and the like by the dispenser 130.
  • the controller 120 controls the firing unit 74 of the first modeling unit 22 to heat the discharged conductive paste by the infrared heater of the irradiation device 78.
  • through holes 147 can be formed in the resin layer 143 by firing the conductive paste, as shown in FIG.
  • the controller 120 appropriately executes the above-mentioned formation of the resin layer 143, the formation of the wiring 145, and the formation of the through hole 147 to form the circuit board 141.
  • the above-mentioned circuit board 141 forming process is an example.
  • the upper layer wiring 145 and the lower layer wiring 145 may be directly connected without forming the through hole 147.
  • a metal rod-shaped pin or the like may be used to ensure the continuity between the lower layer wiring 145 and the upper layer wiring 145.
  • the circuit board 141 does not have to be formed by three-dimensional laminated modeling.
  • a circuit board 141 manufactured in advance by using a photolithography method, an electrolytic plating method, or the like may be used.
  • the controller 120 forms a wiring connected to an electronic component on the circuit board 141.
  • the controller 120 moves the stage 52 below the first modeling unit 22, and ejects the conductive ink 137 onto the circuit board 141 by the inkjet head 76 of the first printing unit 72, as shown in FIG.
  • the inkjet head 76 linearly ejects the conductive ink 137 according to the wiring pattern connected to the electronic component 161 shown in FIG.
  • the controller 120 heats the conductive ink 137 discharged onto the circuit board 141 by the infrared heater of the irradiation device 78 and fires it to form the wiring 149 shown in FIGS. 6 and 7 on the circuit board 141. ..
  • FIG. 7 shows a state in which the circuit board 141 is viewed in a plan view from above.
  • a square circuit board 141 is formed in a plan view, and an electronic component 161 is mounted in the center of an upper surface 141A thereof.
  • the wiring 149 is formed at a position where, for example, the component terminal 163 of the electronic component 161 and the wiring 145 (see FIG. 6) of the circuit board 141 are connected.
  • the wiring 149 is formed so as to surround the electronic component 161.
  • the controller 120 forms the reinforcing member 153 shown in FIGS. 8 and 9 after forming the wiring 149.
  • the mounting board 171 (see FIGS. 15 and 16) on which the electronic component 161 is mounted is formed by three-dimensional laminated molding
  • heat is applied to the circuit board 141 in the forming step.
  • the conductive ink or the conductive paste is fired in order to form the wiring 149 and the bump 155 (see FIG. 13) described later
  • heat is applied to the circuit board 141.
  • thermal stress is generated and warpage occurs. This thermal stress can accumulate each time heat is applied during the manufacturing process.
  • the reinforcing member 153 that reinforces the position where the electronic component 161 is mounted is formed by three-dimensional laminated molding to increase the rigidity of the circuit board 141 and reduce the warp.
  • the controller 120 forms a reinforcing member 153 that surrounds the arrangement position 151 where the component terminals 163 (see FIG. 14) of the electronic component 161 are to be arranged.
  • the controller 120 ejects the ultraviolet curable resin 135 from the inkjet head 88 (see FIG. 4) of the second modeling unit 24 onto the circuit board 141 and the wiring 149 in the form of a thin film.
  • the controller 120 controls the inkjet head 88 to discharge the ultraviolet curable resin 135 at a position corresponding to the reinforcing member 153.
  • the controller 120 appropriately executes a process of flattening the discharged ultraviolet curable resin 135 by the flattening device 90. Further, the controller 120 irradiates the discharged ultraviolet curable resin 135 with ultraviolet rays from the irradiation device 92 of the cured portion 86. The controller 120 repeatedly executes the ejection of the ultraviolet curable resin 135, the flattening of the ultraviolet curable resin 135, and the irradiation of ultraviolet rays to form the reinforcing member 153.
  • the reinforcing member 153 has, for example, a square frame shape surrounding the arrangement position 151 and the electronic component 161.
  • the reinforcing member 153 has a square frame shape in which the two walls along the vertical direction and the ends of the two walls along the horizontal direction are connected to each other when the circuit board 141 is viewed in a plan view.
  • FIG. 10 shows a cross section cut along the line II shown in FIG.
  • a plurality of wirings 149 arranged at a predetermined pitch are partially filled with the reinforcing member 153.
  • the gap between each wiring 149 is filled with the ultraviolet curable resin of the reinforcing member 153.
  • the controller 120 forms the bump 155 that connects to the component terminal 163 of the electronic component 161 after forming the reinforcing member 153. Specifically, the controller 120 moves the stage 52 below the third modeling unit 29 after forming the reinforcing member 153. As shown in FIG. 11, the controller 120 controls the third modeling unit 29 and discharges the conductive paste 157 onto the wiring 149 by the dispenser 130. The controller 120 discharges the conductive paste 157 in accordance with the position where the bump 155 is formed.
  • the controller 120 discharges the conductive paste 157, then moves the stage 52 below the mounting unit 26, and mounts the electronic components by the mounting unit 102.
  • the mounting head 112 of the mounting unit 102 sucks and holds the electronic component 161 by the suction nozzle 159, and conveys it above the circuit board 141.
  • the mounting portion 102 arranges the electronic component 161 sucked by the suction nozzle 159 so that the component terminal 163 of the electronic component 161 is at the position of the conductive paste 157.
  • the controller 120 forms bumps by heating and curing the conductive paste 157 by the firing portion 74 of the first modeling unit 22.
  • the component terminal 163 of the electronic component 161 is electrically connected to the wiring 149 via the bump 155. That is, the electronic component 161 is mounted on the circuit board 141.
  • the bump 155 is formed on the wiring 149 arranged inside the reinforcing member 153. In other words, the reinforcing member 153 is formed on the wiring 149 so as to penetrate a part of the wiring 149 inward.
  • the position where the electronic component 161 and the component terminal 163 are mounted is surrounded by the reinforcing member 153.
  • the partial thickness of the circuit board 141 can be intentionally increased, and the rigidity of the portion surrounded by the reinforcing member 153 can be increased.
  • the reinforcing member 153 can increase the rigidity to suppress the occurrence of warpage. As a result, it is possible to suppress the occurrence of cracks in the bumps 155 and the wiring 149.
  • the reinforcing member 153 can be formed at an arbitrary position, and after the circuit board 141 is formed, the necessary portion of the circuit board 141 can be reinforced.
  • the controller 120 may remove excess resin on the wiring 149 before discharging the conductive paste 157 forming the bump 155.
  • the excess ultraviolet curable resin 135 may adhere to the wiring 149 exposed inside the reinforcing member 153. Therefore, for example, the controller 120 may irradiate the wiring 149 exposed inside the reinforcing member 153 with a laser or the like to remove excess resin residue on the wiring 149. As a result, the resistance at the connection portion between the wiring 149 and the bump 155 can be reduced.
  • the controller 120 fills the inside of the reinforcing member 153 with an underfill resin.
  • the controller 120 moves the stage 52 below the third modeling unit 29 after mounting the electronic component 161.
  • the controller 120 controls the third modeling unit 29 and discharges the underfill resin inside the reinforcing member 153 by the dispenser 130.
  • the controller 120 heats and cures the underfill resin, for example, by the firing portion 74 of the first modeling unit 22.
  • the electronic component 161 is filled and sealed with the underfill resin 165 filled in the portion surrounded by the reinforcing member 153.
  • the mounting board manufacturing apparatus 10 of the present embodiment can manufacture the mounting board 171 on which the electronic component 161 is mounted.
  • the step of forming the bump 155 is executed after the reinforcing member 153 is formed (see FIGS. 11 to 13).
  • the conductive paste 157 is applied onto the wiring 149 inside the reinforcing member 153 in the wiring 149 (see FIG. 11).
  • the conductive paste 157 applied on the wiring 149 is heated and cured by the fired portion 74 of the first modeling unit 22 (see FIG. 13).
  • the reinforcing member 153 surrounding the electronic component 161 is formed, and then the bump 155 is formed on the wiring 149 exposed inside the reinforcing member 153.
  • the reinforcing member 153 can prevent the conductive paste 157 from flowing out to an unnecessary place. Further, it is possible to suppress the occurrence of a situation in which the conductive paste 157 that has flowed out to an unnecessary place is cured and causes a connection failure of the bump 155 and the wiring 149.
  • the reinforcing member 153 of the present embodiment is a frame-shaped member formed by connecting walls surrounding the arrangement position 151 (see FIG. 9) of the electronic component 161 when the circuit board 141 is viewed in a plan view. According to this, a wall surrounding the component terminal 163 (arrangement position 151) is formed, and the walls are connected to each other to form a frame-shaped wall as a reinforcing member 153. By connecting the walls to each other, the strength of the reinforcing member 153 can be increased, and the rigidity of the circuit board 141 at the arrangement position 151 can be further increased.
  • the underfill resin 165 is filled inside the reinforcing member 153 to seal the electronic component 161.
  • the thickness of the resin at the position where the electronic component 161 is mounted is increased, and the reinforcing member 153 is supported from the inside by the underfill resin 165.
  • the rigidity of the circuit board 141 can be further increased. It is possible to suppress the warp of the circuit board 141 and more reliably suppress the occurrence of connection failure due to cracking of the bump 155 or the like.
  • the underfill resin 165 that seals the electronic component 161 tries to flow out from the position where the electronic component 161 is mounted, the underfill resin 165 that flows out can be blocked by the reinforcing member 153. It is possible to suppress the underfill resin 165 from flowing out to an unnecessary portion, and it is possible to suppress the occurrence of poor connection and the like. Further, when the underfill resin 165 is filled, the flow of the underfill resin 165 can be easily controlled.
  • the reinforcing member 153 from the upper surface 141A is compared with the first distance L1 from the upper surface 141A of the circuit board 141 to the upper end of the electronic component 161.
  • the second distance L2 to the upper end is long.
  • the reinforcing member 153 of the present embodiment is formed up to a position higher than the electronic component 161 mounted on the circuit board 141. According to this, by forming the reinforcing member 153 to a position higher than the electronic component 161, the underfill resin 165 is filled in the reinforcing member 153, and the reinforcing plate described later is fixed on the reinforcing member 153. , It becomes possible to carry out further reinforcement.
  • the reinforcing plate 173 may be mounted on the reinforcing member 153.
  • the reinforcing plate 173 is made of a material such as metal, glass, or ceramic that is less likely to change in heat than the resin circuit board 141.
  • the reinforcing plate 173 has, for example, a square plate shape that covers the upper surfaces of the underfill resin 165 and the reinforcing member 153.
  • the method of attaching the reinforcing plate 173 to the mounting board 171 is not particularly limited. For example, it may be fixed to the reinforcing member 153 or the underfill resin 165 using an adhesive or screws.
  • the controller 120 may form a screw hole for fixing the reinforcing plate 173 in the reinforcing member 153.
  • the reinforcing plate 173 may be fixed manually or by the mounting board manufacturing apparatus 10.
  • the mounting board manufacturing apparatus 10 may include a robot arm, grip the reinforcing plate 173 with the robot arm, and fix the reinforcing plate 173 on the reinforcing member 153 and the underfill resin 165.
  • a step of fixing the reinforcing plate 173 covering the upper surface of the electronic component 161 to the reinforcing member 153 may be provided. According to this, by using a material that is less likely to change in heat than the circuit board 141 mainly made of resin as the reinforcing plate 173, the rigidity of the circuit board 141 is further increased by the reinforcing plate 173 via the reinforcing member 153. be able to. The warp of the circuit board 141 can be reduced more effectively.
  • the reinforcing plate 173 may be made of resin as well as the circuit board 141.
  • the reinforcing plate 173 may be a member in which glass or the like is inserted inside the resin.
  • the reinforcing plate 173 may be attached to the underfill resin 165, or may be attached to both the reinforcing member 153 and the underfill resin 165.
  • the member for reinforcing the reinforcing member 153 is not limited to the plate-shaped member, and may be a rod-shaped member.
  • the reinforcing member 153 may be reinforced with a rod-shaped member connecting the two opposing walls.
  • the shape, structure, number of members, etc. of the mounting board 171 described above are examples.
  • the component terminals 163 are arranged below the electronic component 161 and the electronic component 161 is mounted on the circuit board 141 and the upper surface 141A of the wiring 149, but the present invention is not limited to this.
  • the component terminal 163 and the wiring 149 may be connected by a bump 155 above the electronic component 161.
  • a reinforcing member 153 or a reinforcing plate 173 may be formed on the wiring 149.
  • the electronic component 161 may be embedded in the circuit board 141, the component terminal 163 may be exposed on the upper surface 141A (see FIG.
  • the warp of the circuit board 141 can be suppressed by forming the reinforcing member 153 so as to surround the electronic component 161 and the component terminal 163. Further, as shown in FIG. 18, it is not necessary to fill the inside of the reinforcing member 153 with the underfill resin 165 (see FIG. 17). Therefore, the orientation, arrangement, and the like of the electronic components 161 and component terminals 163 described above are appropriately changed according to the structure and the like of the mounting board 171.
  • a recess may be formed as a reinforcing member.
  • the reinforcing member 153 shown in FIGS. 15 and 16 was formed by a wall surrounding the mounting position of the electronic component 161.
  • the reinforcing member 253 shown in FIGS. 19 and 20 has a shape in which the outside of the portion surrounding the electronic component 161 is filled with the ultraviolet curable resin 135.
  • the wiring 149 arranged outside the portion surrounding the arrangement position 151 (see FIG. 9) in which the component terminal 163 is arranged is filled with the ultraviolet curable resin 135.
  • the reinforcing member 253 is formed on the upper surface 141A, for example, in the plan view of the circuit board 141, except for the square region surrounding the electronic component 161 and the component terminal 163.
  • the reinforcing member 253 has a square plate shape with a square hole formed in the center. In other words, in the wiring 149, the outside of the portion (square hole) in which the electronic component 161 is surrounded by the reinforcing member 253 is filled with the reinforcing member 253.
  • the reinforcing member 253 forms a recess in which the upper surface 141A of the circuit board 141 of the portion surrounding the component terminal 163 is exposed and the upper surface 141A of the circuit board 141 is the bottom surface.
  • the recess is filled with, for example, an underfill resin 165.
  • a member that fills the wiring 149 outside the arrangement position 151 (see FIG. 9) of the component terminal 163 is formed as the reinforcing member 253.
  • the thickness of the circuit board 141 outside the arrangement position 151 can be increased as a whole.
  • the rigidity of the circuit board 141 at the arrangement position 151 can be further increased. It is not necessary to fill the recess of the reinforcing member 253 with the underfill resin 165. Further, a reinforcing plate 173 (see FIG. 17) may be attached to the reinforcing member 253 in addition to the underfill resin 165 or in place of the underfill resin 165.
  • the ultraviolet curable resin 135 is an example of a resin material.
  • the conductive ink 137 is an example of the first metal fluid.
  • the circuit board 141 is an example of a substrate.
  • the bump 155 is an example of a connecting portion.
  • the conductive paste 157 is an example of a second metal fluid.
  • the process of FIG. 5 is an example of the first metal fluid coating process.
  • the steps of FIGS. 6 and 7 are examples of wiring forming steps.
  • the steps of FIGS. 8 and 9 are examples of a resin material coating step and a reinforcing member forming step.
  • the process of FIG. 11 is an example of the second metal fluid coating process.
  • FIG. 17 is an example of the reinforcing plate fixing process.
  • the manufacturing process of the mounting substrate 171 of the present embodiment includes the step of FIG. 5 in which the conductive ink 137 is applied onto the circuit board 141 and the wiring 149 by curing the conductive ink 137 coated on the circuit board 141. It has the steps of FIGS. 6 and 7 for forming the above. Further, in the manufacturing process, the step of applying the ultraviolet curable resin 135 to the position above the wiring 149 and surrounding the arrangement position 151 where the component terminal 163 of the electronic component 161 is arranged, and the step of curing the applied ultraviolet curable resin 135. It has the steps of FIGS. 8 and 9 for forming the reinforcing member 153 surrounding the arrangement position 151.
  • the process of applying the conductive paste 157 on the wiring 149 corresponding to the arrangement position 151 and the component terminal 163 of the electronic component 161 are arranged at the arrangement position 151, and the conductive paste 157 is arranged.
  • the manufacturing process includes the steps of FIGS. 13 and 14 in which the conductive paste 157 applied on the wiring 149 is cured to form bumps 155, and the electronic component 161 is mounted.
  • the reinforcing member 153 is formed of the ultraviolet curable resin 135 at the position surrounding the component terminal 163 (arrangement position 151) of the electronic component 161 and on the wiring 149.
  • the rigidity of the circuit board 141 at the arrangement position 151 can be increased by filling at least a part of the wiring 149, forming the reinforcing member 153 surrounding the electronic component 161 and increasing the thickness of the circuit board 141.
  • the reinforcing member 153 and the component terminal 163 can be brought close to each other, and the warp of the circuit board 141 generated at the arrangement position 151 can be effectively suppressed. be able to.
  • the swelling and cracking of the bump 155 can be suppressed, and the connection yield of the electronic component 161 can be improved.
  • the present disclosure is not limited to the above embodiment, and can be carried out in various modes with various changes and improvements based on the knowledge of those skilled in the art.
  • the circuit board 141 provided with the wiring 145 and the through hole 147 is adopted as the substrate of the present disclosure, but the present invention is not limited to this.
  • the substrate of the present disclosure may be a resin layer 143 not provided with wiring 145 or through holes 147.
  • the bump 155 is formed after the reinforcing member 153 is formed in FIG. However, the bump 155 may be formed first, and then the reinforcing member 153 may be formed (after mounting the electronic component 161). In this case, the bump 155 may be filled with the ultraviolet curable resin 135 forming the reinforcing member 153, and the bump 155 may be filled with the reinforcing member 153.
  • the second distance L2 may be the same as the first distance L1 or a distance equal to or less than the first distance L1.
  • the reinforcing member 153 may be a wall lower than the upper end of the electronic component 161.
  • an ultraviolet curable resin that is cured by irradiation with ultraviolet rays is adopted, but various curable resins such as a thermosetting resin that is cured by heat can be adopted.
  • the method of three-dimensional lamination modeling in the present disclosure is not limited to the inkjet method and the stereolithography method (SL: Stereolithography), and for example, other methods such as Fused Deposition Modeling (FDM) are adopted. can.
  • UV curable resin resin material
  • 137 conductive ink first metal fluid
  • 141 circuit board board
  • 141A top surface 149 wiring
  • 151 placement position 153
  • 253 reinforcement member 253 reinforcement member
  • 155 bump connection part
  • Conductive paste second metal fluid
  • 161 electronic parts 163 parts terminals
  • 165 underfill resin 171 mounting board, 173 reinforcing plate, L1 first distance, L2 second distance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PCT/JP2020/010522 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法 Ceased WO2021181561A1 (ja)

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PCT/JP2020/010522 WO2021181561A1 (ja) 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法

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WO2024101211A1 (ja) * 2022-11-09 2024-05-16 株式会社村田製作所 セラミック電子部品の製造方法
JP2024526415A (ja) * 2022-06-08 2024-07-18 芯体素（杭州）科技発展有限公司 高精度多層回路基板及びその３ｄ印刷製造方法

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WO2018138755A1 (ja) * 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019193644A1 (ja) * 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ ３次元構造物形成方法、および３次元構造物形成装置

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JP2024526415A (ja) * 2022-06-08 2024-07-18 芯体素（杭州）科技発展有限公司 高精度多層回路基板及びその３ｄ印刷製造方法
JP7675461B2 (ja) 2022-06-08 2025-05-13 芯体素（杭州）科技発展有限公司 高精度多層回路基板及びその３ｄ印刷製造方法
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JPWO2024101211A1 (enExample) * 2022-11-09 2024-05-16

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