JPWO2021181561A1 - - Google Patents

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Publication number
JPWO2021181561A1
JPWO2021181561A1 JP2022507077A JP2022507077A JPWO2021181561A1 JP WO2021181561 A1 JPWO2021181561 A1 JP WO2021181561A1 JP 2022507077 A JP2022507077 A JP 2022507077A JP 2022507077 A JP2022507077 A JP 2022507077A JP WO2021181561 A1 JPWO2021181561 A1 JP WO2021181561A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022507077A
Other languages
Japanese (ja)
Other versions
JP7316742B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021181561A1 publication Critical patent/JPWO2021181561A1/ja
Application granted granted Critical
Publication of JP7316742B2 publication Critical patent/JP7316742B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022507077A 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法 Active JP7316742B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/010522 WO2021181561A1 (ja) 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021181561A1 true JPWO2021181561A1 (enExample) 2021-09-16
JP7316742B2 JP7316742B2 (ja) 2023-07-28

Family

ID=77671320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022507077A Active JP7316742B2 (ja) 2020-03-11 2020-03-11 ３次元積層造形による実装基板の製造方法

Country Status (2)

Country Link
JP (1) JP7316742B2 (enExample)
WO (1) WO2021181561A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210021A1 (ja) * 2022-04-29 2023-11-02 株式会社Fuji 塗布情報生成方法、情報処理装置及び３次元造形装置
CN114980579B (zh) * 2022-06-08 2024-02-06 芯体素(杭州)科技发展有限公司 一种高精密多层线路板制备过程中的固化方法
JPWO2024101211A1 (enExample) * 2022-11-09 2024-05-16

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158352A (ja) * 2005-12-07 2007-06-21 Samsung Electro Mech Co Ltd 配線基板の製造方法及び配線基板
JP2012004555A (ja) * 2010-05-20 2012-01-05 Fujifilm Corp 傾斜機能材料の製造方法及び装置
WO2016147284A1 (ja) * 2015-03-16 2016-09-22 富士機械製造株式会社 形成方法及び形成装置
JP2016531770A (ja) * 2013-06-24 2016-10-13 プレジデント アンド フェローズ オブ ハーバード カレッジ 印刷３次元（３ｄ）機能部品および製造方法
US20180154573A1 (en) * 2015-05-19 2018-06-07 Dst Innovations Limited A Circuit Board and Component Fabrication Apparatus
WO2018138755A1 (ja) * 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019193644A1 (ja) * 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ ３次元構造物形成方法、および３次元構造物形成装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158352A (ja) * 2005-12-07 2007-06-21 Samsung Electro Mech Co Ltd 配線基板の製造方法及び配線基板
JP2012004555A (ja) * 2010-05-20 2012-01-05 Fujifilm Corp 傾斜機能材料の製造方法及び装置
JP2016531770A (ja) * 2013-06-24 2016-10-13 プレジデント アンド フェローズ オブ ハーバード カレッジ 印刷３次元（３ｄ）機能部品および製造方法
WO2016147284A1 (ja) * 2015-03-16 2016-09-22 富士機械製造株式会社 形成方法及び形成装置
US20180154573A1 (en) * 2015-05-19 2018-06-07 Dst Innovations Limited A Circuit Board and Component Fabrication Apparatus
WO2018138755A1 (ja) * 2017-01-24 2018-08-02 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019193644A1 (ja) * 2018-04-03 2019-10-10 株式会社Ｆｕｊｉ ３次元構造物形成方法、および３次元構造物形成装置

Also Published As

Publication number Publication date
WO2021181561A1 (ja) 2021-09-16
JP7316742B2 (ja) 2023-07-28

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