JP7316033B2 - Substrate transfer device and substrate transfer method - Google Patents

Description

The present application relates to a substrate transfer apparatus and a substrate transfer method.

2. Description of the Related Art Conventionally, substrate transfer apparatuses for transferring substrates have been proposed (for example, Patent Documents 1 and 2). For example, Patent Literature 1 describes a transport robot as a substrate transport device. This transport robot has a transport arm. This transport arm can move horizontally and vertically and can hold a substrate.

The transfer arm holding the substrate descends from above with respect to the substrate mounting position in the substrate processing apparatus, so that the substrate can be mounted at the substrate mounting position. Conversely, by raising the transfer arm from below the substrate placed on the substrate placement position, the substrate can be lifted from the substrate placement position and received. Thus, the transfer robot can transfer substrates to and from the substrate processing apparatus.

Japanese Unexamined Patent Application Publication No. 2002-200001 describes a substrate take-out mechanism as a substrate transfer device. The substrate take-out mechanism takes the substrate in and out of the cassette. This substrate unloading mechanism also has a substrate transfer arm. A plurality of substrates can be stored in the cassette in a horizontal posture.

JP-A-2000-12645 JP-A-1997-148404

The transfer arm of the substrate transfer device may have a support portion, a projection portion, and a pressing portion. The support supports the bottom surface of the substrate. The projecting portion is erected on the supporting portion and faces the side surface of the substrate. The pressing portion presses the substrate toward the protrusion and holds the substrate by sandwiching it together with the protrusion.

In such a substrate transfer device, the side surface of the protrusion is pressed by the substrate, so that the side surface of the protrusion can be formed with a concave portion. Once the recess is formed, the edge of the substrate fits into the recess. In this state, when the substrate is placed on the substrate placement position, the substrate may be caught in the recess and bounce. If the board bounces, the board may be damaged. In addition, there is a possibility that particles are generated by the bouncing of the substrate and adhere to the substrate.

Moreover, the cassette that stores the substrate has an inner peripheral surface that faces the side surface of the substrate. A concave portion may be formed on the inner peripheral surface due to collision with the side surface of the substrate or the like. When the substrate is taken out with the end portion of the substrate fitted in the recess on the inner peripheral surface of the cassette, the substrate may be caught in the recess and bounce inside the cassette. If the substrate bounces, the substrate may be damaged or particles may adhere to the substrate. Moreover, there is also a possibility that the substrate may be lost.

SUMMARY OF THE INVENTION Accordingly, an object of the present application is to provide a substrate transfer apparatus and a substrate transfer method capable of reducing bounces of substrates when the substrates are transferred.

A first aspect of a substrate transfer apparatus is a substrate transfer apparatus for placing a substrate on a mounting surface, wherein a second region of a lower surface of the substrate is different from a first region supported by the mounting surface. a substrate supporting portion for supporting a region; a protrusion erected on the substrate supporting portion and including a facing surface facing a side surface of the substrate; a horizontal movement mechanism for horizontally moving the substrate support; an elevating mechanism for lifting and lowering the substrate support; the pressing portion, the horizontal movement mechanism, and a control unit for controlling an elevating mechanism, wherein the control unit lowers the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressure of the pressing unit on the substrate is released. and moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism in parallel with the descent of the substrate support, at least after the substrate contacts the mounting surface. and a designed position in the separation direction of the point where the substrate contacts the mounting surface is set to a position opposite to the separation direction by a predetermined amount from a target position for the mounting position of the substrate. When the substrate is placed on the placement surface, the substrate support moves the substrate along the placement surface from the design position toward the target position by friction .
A second aspect of the substrate transfer apparatus is a substrate transfer apparatus for placing a substrate on a mounting surface, wherein a second area of the lower surface of the substrate is different from the first area supported by the mounting surface. a substrate supporting portion for supporting the substrate, a protrusion erected on the substrate supporting portion and including a facing surface facing the side surface of the substrate, and pressing the substrate toward the protrusion side to press the substrate together with the protrusion A substrate support having a pressing portion for holding the substrate, a horizontal movement mechanism for moving the substrate support in a horizontal direction, an elevating mechanism for elevating the substrate support, the pressing portion, the horizontal movement mechanism, and the elevation a control unit for controlling a mechanism, wherein the control unit lowers the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressing of the pressing unit to the substrate is released; At least after the substrate comes into contact with the mounting surface, the horizontal movement mechanism moves the substrate support in a separation direction in which the facing surface moves away from the substrate in parallel with the descent of the substrate support. The controller counts the number of times the substrate is transported, and the number of times the substrate is transported at least in the direction of movement of the substrate support after the substrate comes into contact with the mounting surface and the angle formed by the horizontal plane is the first. The horizontal movement mechanism and the lifting mechanism are controlled so that the value of the angle when the number of times of transportation is a second value smaller than the first value is smaller than the value of the angle when the number of times of transportation is a second value smaller than the first value.
A third aspect of the substrate transfer apparatus is a substrate transfer apparatus for placing a substrate on a mounting surface, wherein a second area of the lower surface of the substrate is different from the first area supported by the mounting surface. a substrate supporting portion for supporting the substrate, a protrusion erected on the substrate supporting portion and including a facing surface facing the side surface of the substrate, and pressing the substrate toward the protrusion side to press the substrate together with the protrusion A substrate support having a pressing portion for holding the substrate, a horizontal movement mechanism for moving the substrate support in a horizontal direction, an elevating mechanism for elevating the substrate support, the pressing portion, the horizontal movement mechanism, and the elevation a control unit for controlling a mechanism, wherein the control unit lowers the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressing of the pressing unit to the substrate is released; At least after the substrate comes into contact with the mounting surface, the horizontal movement mechanism moves the substrate support in a separation direction in which the facing surface moves away from the substrate in parallel with the descent of the substrate support. , the controller reduces a moving speed of the substrate support at a reduction rate as the substrate support moves toward a design point where the substrate contacts both the substrate support and the mounting surface. and controlling the horizontal movement mechanism and the elevating mechanism so that the moving speed at the point is set to a predetermined value, and the moving speed increases at a certain rate as the substrate support moves away from the point; counting the number of times the substrate is transported, and determining at least one of the reduction rate of the moving speed when the number of times of transporting is a third value and the rate of increase of the moving speed when the number of times of transporting is the third value; It is set to be smaller than the one when the fourth value is smaller than the value.

A fourth aspect of the substrate transfer apparatus is the substrate transfer apparatus according to any one of the first to third aspects, wherein the controller controls the horizontal movement of the substrate before the substrate contacts the mounting surface. A moving mechanism moves the substrate support in the separation direction.

A fifth aspect of the substrate conveying apparatus is the substrate conveying apparatus according to any one of the first to fourth aspects, wherein the substrate is pressed by the pressing portion so that the protruding portions are opposed to each other. Form a recess in the surface.

A sixth aspect of the substrate transfer device is the substrate transfer device according to any one of the first to third aspects, wherein the rigidity of the protrusion is higher than the rigidity of the pressing portion.

A seventh aspect of the substrate transfer apparatus is the substrate transfer apparatus according to the second or third aspect, wherein the design position of the point at which the substrate contacts the mounting surface in the separation direction is is set at a position on the side opposite to the separation direction by a predetermined amount from the target position for the placement position.

An eighth aspect of the substrate transfer apparatus is a substrate transfer apparatus for taking out the substrate from a substrate container having a facing surface facing the side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate. a substrate support that supports a second region different from the first region of the lower surface of the substrate; a horizontal movement mechanism that horizontally moves the substrate support; and a controller for controlling the horizontal movement mechanism and the elevator mechanism, wherein the controller causes the elevator mechanism to raise the substrate support from below the mounting surface and support at least the substrate. After the body contacts the lower surface of the substrate, the horizontal movement mechanism moves the substrate support in a separation direction in which the substrate moves away from the facing surface in parallel with the upward movement of the substrate support, and The control unit counts the number of times the substrate is conveyed, and the number of times the substrate is conveyed is equal to a first value of the angle between the moving direction of the substrate support after the substrate contacts the mounting surface and the horizontal plane. The horizontal movement mechanism and the lifting mechanism are controlled such that the value at a given time is smaller than the value of the angle when the number of times of transportation is a second value smaller than the first value.
A ninth aspect of the substrate transfer apparatus is a substrate transfer apparatus for taking out the substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate. a substrate support that supports a second region different from the first region of the lower surface of the substrate; a horizontal movement mechanism that horizontally moves the substrate support; and a controller for controlling the horizontal movement mechanism and the elevator mechanism, wherein the controller causes the elevator mechanism to raise the substrate support from below the mounting surface and support at least the substrate. After the body contacts the lower surface of the substrate, the horizontal movement mechanism moves the substrate support in a separation direction in which the substrate moves away from the facing surface in parallel with the upward movement of the substrate support, and a controller reducing a moving speed of the substrate support by a certain reduction rate as the substrate support moves toward a design point where the substrate contacts both the substrate support and the mounting surface; controlling the horizontal movement mechanism and the elevating mechanism so that the movement speed at the point is set to a predetermined value, and the movement speed increases at a certain rate as the substrate support moves away from the point; counting the number of times of transportation, and determining at least one of the reduction rate of the moving speed when the number of times of transportation is the third value and the rate of increase of the moving speed when the number of times of transportation is the third value; is set to be smaller than the one when the fourth value is also small.

A tenth aspect of the substrate transfer apparatus is the substrate transfer apparatus according to the eighth or ninth aspect, wherein the controller controls the horizontal movement of the substrate before the substrate support comes into contact with the lower surface of the substrate. A mechanism moves the substrate support in the separation direction.

An eleventh aspect of the substrate transfer apparatus is the substrate transfer apparatus according to any one of the first to tenth aspects, wherein the controller controls the substrate support to move along a predetermined movement path. and controlling the horizontal movement mechanism and the elevating mechanism, wherein the predetermined movement path includes a first point where both the substrate support and the mounting surface are in contact with the substrate, and a distance from the first point. It includes a route that connects, in this order, a second point that has moved vertically downward in a direction and a third point that has moved vertically downward from the second point.

A twelfth aspect of the substrate transfer apparatus is the substrate transfer apparatus according to any one of the first to eleventh aspects, wherein the control unit controls the operation of the substrate when the substrate is placed on the substrate support. The horizontal movement mechanism and the elevating mechanism are controlled so that the maximum value of the movement speed of the substrate support is lower than the maximum value of the movement speed when the substrate is not placed on the substrate support. do.

A first aspect of a substrate transfer method is a substrate transfer method for placing a substrate on a placement surface, wherein a second region of a lower surface of the substrate, which is different from a first region supported by the placement surface, is supported by the placement surface. a step of supporting the region with a substrate support portion of a substrate support; and pressing the substrate against a pressing portion toward a projection portion side including an opposing surface facing a side surface of the substrate, which is erected on the substrate support portion. a step of holding the substrate together with the protrusion, a step of causing the horizontal movement mechanism to move the substrate supporter toward the upper side of the mounting surface, and a step of releasing the pressing of the pressing portion to the substrate. state, the substrate support is lowered from above the mounting surface by an elevating mechanism, and at least after the substrate contacts the mounting surface, the horizontal movement is performed in parallel with the descent of the substrate support. moving the substrate support by a mechanism in a separation direction in which the facing surface moves away from the substrate, and the design position of a point at which the substrate contacts the mounting surface in the separation direction is set to the The substrate mounting position is set at a position opposite to the separation direction by a predetermined amount from the target position, and when the substrate is mounted on the mounting surface, the substrate support is positioned to the designed position. Friction moves the substrate along the mounting surface from a position toward the target position.
A second aspect of the substrate transfer method is a substrate transfer method for placing a substrate on a placement surface, wherein a second region of the lower surface of the substrate is different from the first region supported by the placement surface. is supported by the substrate support portion of the substrate support; and the substrate is pushed to the pressing portion toward the projection portion including the facing surface facing the side surface of the substrate, which is erected on the substrate support portion. a second step of pressing to hold the substrate together with the protrusions; a third step of moving the substrate support upward above the mounting surface by a horizontal movement mechanism; is released, the lifting mechanism lowers the substrate support from above the mounting surface, and at least after the substrate contacts the mounting surface, parallel to the descent of the substrate support. a fourth step of moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism; and a fifth step of counting the number of times the substrate has been transported. In the step, the value of the angle between the moving direction of the substrate support after at least the substrate comes into contact with the mounting surface and the horizontal plane is the value when the number of transfers is a first value. The horizontal movement mechanism and the lifting mechanism are controlled so that the angle is smaller than the value of the angle when the second value is smaller than the first value.
A third aspect of the substrate transfer method is a substrate transfer method for placing a substrate on a mounting surface, wherein a second region of the lower surface of the substrate is different from the first region supported by the mounting surface. is supported by the substrate support portion of the substrate support; and the substrate is pushed to the pressing portion toward the projection portion including the facing surface facing the side surface of the substrate, which is erected on the substrate support portion. a second step of pressing to hold the substrate together with the protrusions; a third step of moving the substrate support upward above the mounting surface by a horizontal movement mechanism; is released, the lifting mechanism lowers the substrate support from above the mounting surface, and at least after the substrate contacts the mounting surface, parallel to the descent of the substrate support. a fourth step of moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism; and a fifth step of counting the number of times the substrate has been transported. In the step, reducing a speed of movement of the substrate support by a reduction rate as the substrate support approaches a design point where the substrate contacts both the substrate support and the mounting surface, and controlling the horizontal movement mechanism and the elevating mechanism so that the movement speed at a point is set to a predetermined value, and the movement speed increases at a certain rate as the substrate support moves away from the point; At least one of the reduction rate of the moving speed when the third value and the increase rate of the moving speed are set to the above when the number of times of transportation is a fourth value smaller than the third value. Set smaller than one.

A fourth aspect of the substrate transfer method is a substrate transfer method for taking out the substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate. a first step of causing a horizontal movement mechanism to move a substrate support that supports a second region different from the first region of the lower surface of the substrate below the mounting surface; and, after the substrate support is lifted from below the mounting surface, and at least after the substrate support contacts the lower surface of the substrate, in parallel with the lifting of the substrate support, a horizontal movement mechanism: a second step of moving the substrate support in a separation direction in which the substrate moves away from the facing surface; and a third step of counting the number of times the substrate has been transferred, A second value of an angle formed by the moving direction of the substrate support after coming into contact with the placement surface and a horizontal plane when the number of times of transportation is the first value is a second value smaller than the first value of the number of times of transportation. The horizontal movement mechanism and the lifting mechanism are controlled to be smaller than the value of the angle when the angle is a value.
A fifth aspect of the substrate transfer method is a substrate transfer method for taking out the substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate. a first step of causing a horizontal movement mechanism to move a substrate support that supports a second region different from the first region of the lower surface of the substrate below the mounting surface; and, after the substrate support is lifted from below the mounting surface, and at least after the substrate support contacts the lower surface of the substrate, in parallel with the lifting of the substrate support, a horizontal movement mechanism: a second step of moving the substrate support in a separation direction in which the substrate moves away from the facing surface; and a third step of counting the number of times the substrate has been transferred, As the substrate support approaches a designed point where it contacts both the body and the mounting surface, the moving speed of the substrate support is reduced at a reduction rate to bring the moving speed at the point to a predetermined value. controlling the horizontal movement mechanism and the lifting mechanism such that the movement speed is increased at a certain rate as the substrate support moves away from the point, and the movement when the number of times of transportation is a third value; At least one of the reduction rate of the speed and the increase rate of the moving speed is set smaller than the one when the number of times of transportation is a fourth value smaller than the third value.

According to the fifth aspect of the substrate transfer apparatus, the substrate is pressed toward the protrusion by the pressing portion, so that the facing surface of the protrusion is pressed by the substrate. This pressing can form a recess in the facing surface of the protrusion. When the substrate support descends vertically downward with the edge of the substrate fitted in the recess and the substrate is placed on the substrate surface, the edge of the substrate is placed in the recess on the opposite surface when the substrate is placed. The substrate can bounce when caught in the

According to the fifth aspect of the substrate transfer apparatus, the horizontal movement mechanism moves the substrate support in the direction in which the substrate W is separated from the facing surface when the substrate is placed. Therefore, the substrate is less likely to get caught in the concave portion of the protrusion, and the degree of bouncing of the substrate can be reduced. Therefore, the degree of damage to the substrate or the degree of adhesion of particles can be reduced. Moreover, it is possible to reduce the depth of the recess formed on the surface facing the protrusion.

According to the fourth aspect of the substrate transfer apparatus, even if the height points of the mounting surface vary, the substrate support can be more reliably moved in the separating direction when the substrate comes into contact with the mounting surface. can be done.

According to the sixth aspect of the substrate transfer apparatus, it is possible to reduce the depth of the recess formed in the surface facing the projection.

According to the first and seventh aspects of the substrate transfer apparatus and the first aspect of the substrate transfer method, the hand moves the substrate in the separation direction on the mounting surface due to the frictional force between the hand and the substrate. , the substrate can be placed at a position close to the target position.
According to the second aspect of the substrate transfer apparatus and the second aspect of the substrate transfer method, the greater the number of transfers, the deeper the recessed portion of the facing surface. Since it follows the direction, the substrate is less likely to get caught in the recess even if the depth of the recess is deep.
Further, according to the third aspect of the substrate transfer apparatus and the third aspect of the substrate transfer method, the reduction rate and/or increase rate of the moving speed is reduced when the number of transfers is large. Therefore, it is more likely that the movement speed at the contact point where the substrate contacts both the substrate support and the mounting surface will be reduced. That is, when the concave portion of the facing surface is deep, the moving speed is more likely to decrease, so even if the edge of the substrate is caught in the deep concave portion, the extent to which the substrate bounces can be reduced.
On the other hand, when the number of transfers is small, the moving speed is high. When the concave portion is shallow, even if the moving speed is high, the degree of bounce of the substrate is not so large. In addition, since the movement speed is high, the throughput can be improved.

According to the eighth and ninth aspects of the substrate transfer apparatus and the fourth and fifth aspects of the substrate transfer method, the side surfaces of the substrates can collide with the opposed surfaces of the substrate container. Due to this collision, a concave portion may be formed in the facing surface of the substrate container. When the substrate support moves vertically upward to lift the substrate while the edge of the substrate is fitted in the recess, the edge of the substrate may be caught in the recess on the opposite surface of the substrate container and the substrate may bounce.

According to the eighth and ninth aspects of the substrate transfer apparatus and the fourth and fifth aspects of the substrate transfer method, the substrate support moves in the separating direction when the substrate is lifted. Therefore, the substrate is less likely to get caught in the concave portion of the opposing surface, and the degree of bouncing of the substrate can be reduced.
Moreover, according to the eighth aspect of the substrate transfer apparatus and the fourth aspect of the substrate transfer method, the greater the number of transfers, the deeper the recessed portion of the facing surface. Since it extends in the horizontal direction, the substrate is less likely to get caught in the recess even if the recess is deep.
Further, according to the ninth aspect of the substrate transfer apparatus and the fifth aspect of the substrate transfer method, the rate of decrease and/or the rate of increase in the moving speed when the number of transfers is large is reduced. Therefore, it is more likely that the movement speed at the contact point where the substrate contacts both the substrate support and the mounting surface will be reduced. That is, when the concave portion of the facing surface is deep, the moving speed is more likely to decrease, so even if the edge of the substrate is caught in the deep concave portion, the extent to which the substrate bounces can be reduced.
On the other hand, when the number of transfers is small, the moving speed is high. When the concave portion is shallow, even if the moving speed is high, the degree of bounce of the substrate is not so large. In addition, since the movement speed is high, the throughput can be improved.

According to the tenth aspect of the substrate transfer apparatus, even if the height position of the mounting surface varies, the substrate support can be more reliably moved in the separating direction at the time when the substrate support comes into contact with the substrate or immediately after that. can be moved.

According to the eleventh aspect of the substrate transfer apparatus, the route connecting the first point and the second point is more convenient than the route connecting the first point and the third point in a straight line without passing through the second point. The slope of the route can be made gentler. In other words, the direction of movement can be made more horizontal. According to this, it is possible to further reduce the extent to which the substrate is caught in the concave portion of the opposing surface when the substrate is placed or lifted.

According to the twelfth aspect of the substrate transfer apparatus, the substrate support moves slowly when the substrate is placed thereon, so that the vibration generated in the substrate support is small. Therefore, problems (for example, damage or adhesion of particles) to the substrate caused by the vibration can be reduced. Moreover, since the substrate support can move quickly when no substrate is placed, the throughput can be improved.

It is a figure which shows roughly an example of a structure of a substrate processing system. It is a perspective view which shows an example of a structure of a board|substrate container roughly. It is a figure which shows an example of a structure of a board|substrate container and a board|substrate conveying apparatus. 2 is an enlarged view showing a configuration of a portion of the hand 11; FIG. It is a figure which shows an example of a movement path|route. FIG. 10 is a diagram schematically showing an example of how the hand is separated from the substrate; It is a graph which shows an example of the target value of a moving speed. It is a figure which shows an example of a movement path|route. It is a figure which shows an example of a movement path|route. It is a figure which shows an example of a movement path|route. It is a figure which shows an example of a movement path|route. It is a graph which shows an example of a moving speed. It is a figure which shows an example of a movement path|route. It is a figure which shows an example of a movement path|route.

Embodiments will be described below with reference to the attached drawings. It should be noted that the drawings are shown schematically, and for the convenience of explanation, the configuration may be omitted or simplified as appropriate. Also, the interrelationships of the sizes and positions of the configurations shown in the drawings are not necessarily described accurately, and may be changed as appropriate.

In addition, in the description given below, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, a detailed description thereof may be omitted to avoid duplication.

In the following, XYZ coordinates are set to describe the positional relationship of each component. The X-axis, Y-axis and Z-axis are orthogonal to each other, and the Z-axis is set along the vertical direction. Hereinafter, the one side and the other side of the X axis are also referred to as the +X side and the -X side, respectively. The same applies to the Y-axis and Z-axis. In the following description, the vertically upward direction is called the +Z side, and the vertically downward direction is called the -Z side.

First embodiment.
<Overview of substrate processing system>
FIG. 1 is a diagram schematically showing an example of the configuration of a substrate processing system 100 having a substrate transfer apparatus 10. As shown in FIG. This substrate processing system 100 includes an indexer section 110 , a substrate processing apparatus 120 and a control section 9 .

A substrate holder 20 for holding substrates W is placed on the indexer section 110 . The substrate W is, for example, a semiconductor substrate. When the substrate W is a semiconductor substrate, the substrate W has a substantially disk-like shape. The substrate container 20 may be, for example, a FOUP (front opening unified pod) or SMIF (Standard Mechanical Interface) pod that stores the substrates W in a sealed space, or an OC (open cassette) that exposes the substrates W in the stored state to the outside air. ) can be adopted. In the example of FIG. 1, a plurality of substrate containers 20 are placed along the Y-axis direction.

A substrate transfer device 10 is provided in the indexer section 110 . The substrate transfer device 10 transfers the substrates W to and from the substrate container 20 . In the example of FIG. 1, the substrate transfer device 10 is provided on the +X side with respect to the area where the plurality of substrate containers 20 are placed. The indexer section 110 is provided with a moving mechanism (not shown) for moving the substrate transfer device 10 . This moving mechanism moves the substrate transfer device 10 along the Y-axis direction and stops at a position facing each of the plurality of substrate containers 20 . The substrate transfer device 10 can transfer the substrate W to and from the one substrate container 20 while stopped at a position facing the one substrate container 20 .

The substrate transfer apparatus 10 takes out an unprocessed substrate W from the substrate container 20 and transfers the substrate W to the substrate processing apparatus 120 . The substrate processing apparatus 120 performs various processes on the substrate W transferred from the substrate transfer apparatus 10 . Although this treatment is not particularly limited, it includes, for example, cleaning treatment, film formation treatment, heat treatment, exposure treatment and etching treatment. The substrate transfer apparatus 10 receives the processed substrate W from the substrate processing apparatus 120 and places the substrate W on the placement surface within the substrate container 20 .

The control unit 9 can centrally control the substrate processing system 100 . Specifically, the controller 9 controls the substrate transfer device 10 and the substrate processing device 120 .

The hardware configuration of the control unit 9 is the same as that of a general computer. That is, the control unit 9 stores a CPU that performs various arithmetic processing, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It is configured with a magnetic disk or the like to store. Each operation mechanism of the substrate processing system 100 is controlled by the control unit 9 by the CPU of the control unit 9 executing a predetermined processing program, and processing in the substrate processing system 100 proceeds. Further, image processing is performed by the CPU of the control unit 9 executing a predetermined processing program. Part or all of the functions of the control unit 9 may be realized by dedicated hardware.

<Substrate container>
2 and 3 are diagrams schematically showing an example of the configuration of the substrate container 20. FIG. 2 shows a perspective view of an example of the substrate container 20, and FIG. 3 shows a cross-sectional view of an example of the internal configuration of the substrate container 20. As shown in FIG.

The substrate container 20 has a housing 21 and a pair of support members 22 . The housing 21 has a box-like shape with an opening on the +X side. The substrate container 20 may be provided with a lid that airtightly closes the opening of the housing 21 .

The pair of support members 22 are erected on the bottom surface of the housing 21 inside the housing 21 . A pair of raising members may be provided on the bottom surface of the housing 21, and the support member 22 may be provided on the raising members. The pair of support members 22 are arranged with a gap in the Y-axis direction. That is, the pair of support members 22 face each other in the Y-axis direction. Each support member 22 is arranged along the Z-axis direction. A groove 22a for supporting the edge of the substrate W is formed in each support member 22 . In the example of FIG. 2, a plurality of grooves 22a are formed at intervals in the Z-axis direction. A groove 22a formed in one of the support members 22 opens toward the other support member 22 and also opens on the +X side. Each groove 22a of one support member 22 and each groove 22a of the other support member 22 are formed at substantially the same height. The width of each groove 22a in the Z-axis direction is set to be larger than the thickness of the substrate W. As shown in FIG.

The substrate W is inserted along the X-axis direction from the +X side to the -X side into the pair of grooves 22a formed at approximately the same height. Thereby, the pair of supporting members 22 can support both ends of the substrate W, respectively. Since the grooves 22a are formed at approximately the same height, the substrate W is supported by the pair of support members 22 in a substantially horizontal posture. Of the surfaces forming each groove 22a of the support member 22, the -Z side surface (hereinafter also referred to as the bottom surface) functions as a mounting surface on which the substrate W is mounted. Below, this surface is also referred to as a mounting surface 22b.

In the example of FIG. 3, the inner side surface 22c of the groove 22a of the support member 22 is along the X-axis direction on the +X side in plan view. The distance between the inner side surfaces 22c of the pair of support members 22 (the distance along the Y-axis direction) is set slightly wider than the diameter of the substrate W on the +X side. As a result, both ends of the substrate W can be inserted into the grooves 22a of the support member 22, respectively.

In the example of FIG. 3, the inner side surface 22c of the support member 22 has an arc shape along the periphery of the substrate W on the -X side in plan view. That is, the space between the inner side surfaces 22c of the pair of support members 22 narrows toward the -X side. According to this, the inner side surface 22c of the support member 22 comes into contact with a portion of the side surface of the substrate W in the circumferential direction on the -X side. That is, the inner side surface 22c can function as a stopper that inhibits movement of the substrate W on the -X side. The inner surface 22c may be made of a soft material such as a cushioning material.

<Substrate transfer device>
In the example of FIG. 3, an example of the configuration of a portion of the substrate transfer apparatus 10 is also schematically shown. In addition, in the example of FIG. 3, the substrate W transported by the substrate transport device 10 is indicated by a chain double-dashed line. The substrate transfer device 10 includes a hand (substrate support) 11 , an arm portion 12 , a horizontal movement mechanism 13 and an elevating mechanism 14 .

The hand 11 has a substrate support portion 111 , a projection portion 112 and a pressing portion 113 . The substrate supporting portion 111 has a substantially plate-like shape and is arranged so that its thickness direction is along the Z-axis direction. The upper surface of the substrate support part 111 can support the lower surface of the substrate W. As shown in FIG. The width of the substrate support portion 111 in the Y-axis direction is set to be narrower than the space between the pair of support members 22 . Thereby, the hand 11 can be pulled out and inserted between the pair of support members 22 along the X-axis direction. The substrate supporting portion 111 supports a second area of the lower surface of the substrate W, which is different from the first area supported by the mounting surfaces 22b of the pair of supporting members 22 . Here, the first region is both ends of the substrate W in the Y-axis direction, and the second region is a part of the region sandwiched between the both ends.

The projecting portion 112 is erected on the upper surface of the substrate supporting portion 111, and when the substrate W is placed on the hand 11 (more specifically, the substrate supporting portion 111), the side surface of the substrate W is projected in the circumferential direction. Face to face with a part of In the example of FIG. 3, a plurality of (here, two) protrusions 112 are provided. In the example of FIG. 3, both of the pair of protrusions 112 are provided on the -X side with respect to a straight line passing through the center of the substrate W and parallel to the Y axis. The pair of protrusions 112 are provided on opposite sides of a straight line passing through the center of the substrate W and parallel to the X-axis. The protrusion 112 is made of resin such as PPT (polypropylene terephthalate) resin.

Below, a surface of the side surface of the protrusion 112 that faces the side surface of the substrate W is referred to as a facing surface 112a. The facing surface 112a of the protrusion 112 has a shape along the side surface of the substrate W in the example of FIG.

The pressing portion 113 is a member that presses the substrate W toward the protruding portion 112 while the substrate W is placed on the hand 11 . In the example of FIG. 3 , the pressing portion 113 is arranged on the +X side with respect to a straight line passing through the center of the substrate W and parallel to the Y-axis, that is, on the side opposite to the protrusion 112 . In the example of FIG. 3, the pressing part 113 is positioned on a straight line passing through the center of the substrate W and parallel to the X-axis. The pressing portion 113 has, for example, a rectangular shape in plan view.

The pressing portion 113 can alternately switch between a pressing state in which the side surface of the substrate W is pressed toward the protruding portion 112 and a release state in which the side surface of the substrate W is separated. For example, the pressing portion 113 can be moved along the X-axis direction by an air cylinder or the like. By moving the pressing portion 113 to the -X side, the side surface of the substrate W is pressed toward the projection portion 112 side, and moved toward the +X side. By moving, the pressure is released. The state of the pressing portion 113 is controlled by the control portion 9 . Note that the pressing portion 113 may be stretchable in the X-axis direction. In this case, when the pressing portion 113 expands, the pressing portion 113 presses the side surface of the substrate W toward the projecting portion 112, and when the pressing portion 113 contracts, the pressing is released.

With the substrate W placed on the hand 11 , the pressing portion 113 presses the substrate W, so that the projection portion 112 and the pressing portion 113 can sandwich and hold the substrate W from opposite sides. Specifically, as already described with reference to FIG. 3, the protrusion 112 and the pressing portion 113 sandwich the substrate W from opposite sides of a straight line passing through the center of the substrate W and parallel to the Y-axis.

The arm part 12 is a member that is connected to the +X side end of the hand 11 and supports the hand 11 . In the example of FIG. 3, the arm portion 12 has a substantially rectangular shape in plan view. A pressing portion 113 may be provided at the -X side end portion of the arm portion 12 so as to be movable in the X-axis direction.

The horizontal movement mechanism 13 moves the hand 11 in the horizontal direction by moving the arm portion 12 in the horizontal direction (X-axis direction here). The horizontal movement mechanism 13 has, for example, a servomotor. The horizontal movement mechanism 13 is controlled by the controller 9 .

The elevating mechanism 14 can elevate the hand 11 by elevating the arm portion 12 along the vertical direction (Z-axis direction). The lifting mechanism 14 has, for example, a ball screw mechanism. The lifting mechanism 14 is controlled by the controller 9 .

Such a substrate transport apparatus 10 can take out a substrate W from a substrate container 20, for example, as described below. First, the substrate transfer device 10 moves along the Y-axis direction to a position facing the substrate container 20 . Next, the elevating mechanism 14 elevates the hand 11 to adjust the height position of the hand 11 . Here, the hand 11 is stopped at a position slightly lower than the mounting position of the substrate W inside the substrate container 20 . Next, the horizontal movement mechanism 13 moves the hand 11 to the -X side so that the hand 11 is positioned directly below the substrate W. As shown in FIG. Next, the elevating mechanism 14 raises the hand 11 to lift the substrate W from the mounting position. Next, the hand 11 holds the substrate W by the pressing portion 113 pressing the substrate W toward the protruding portion 112 . Next, the horizontal movement mechanism 13 moves the hand 11 to the +X side and pulls out the hand 11 and the substrate W from the substrate container 20 . Thereby, the substrate transfer device 10 can take out the substrate W from the substrate container 20 .

FIG. 4 is a cross-sectional view schematically showing an example of the vicinity of the protrusion 112 while the hand 11 holds the substrate W. As shown in FIG. As described above, the substrate W presses the projecting portion 112 to the −X side by the pressing portion 113 . Accordingly, a recess 112b corresponding to the shape of the edge of the substrate W can be formed on the facing surface 112a of the protrusion 112, as illustrated in FIG. The depth (the depth along the X-axis direction) of this concave portion 112b is, for example, about several hundred [μm] or less. When the recess 112b is formed, the edge of the substrate W fits into this recess 112b.

In this state, when the substrate W is placed on the placement surface 22b in the substrate container 20, the substrate W may be caught by the concave portion 112b and bounce during the placement. Bouncing of the substrate W is undesirable because it may damage the substrate W or cause particles to adhere to the substrate W. Therefore, in the first embodiment, the substrate W is mounted on the mounting surface of the substrate container 20 as described below.

<Placement of Substrate on Placement Surface in Substrate Container>
FIG. 5 schematically shows an example of a movement route R1 of the hand 11 when placing the substrate W on the placement surface 22b of the substrate container 20. As shown in FIG. In the example of FIG. 5, the hand 11 moves from point P1 to point P6 in this order. In the example of FIG. 5, the hand 11 moves linearly from point to point. A point P1 is a point where the hand 11 faces the substrate container 20 in the X-axis direction. In this state, the hand 11 is still positioned outside the substrate container 20 .

A point P2 is a point moved from the point P1 to the -X side. The hand 11 can be moved to the point P2 by the horizontal movement mechanism 13 moving the hand 11 from the point P1 to the -X side. At this time, the lifting mechanism 14 does not have to be in operation.

The point P<b>3 is ideally the point of the hand 11 when the substrate W contacts the mounting surface 22 b of the substrate container 20 . It can also be said that the point P3 is a designed point when the substrate W comes into contact with the mounting surface 22b of the substrate container 20 . It can also be said that the point P3 is a designed point where both the hand 11 and the mounting surface 22b contact the substrate W. FIG. In the example of FIG. 5, the point P3 is a point moved to the -X side and the -Z side with respect to the point P2.

While the horizontal movement mechanism 13 moves the hand 11 to the -X side, the lifting mechanism 14 lowers the hand 11 to the -Z side, whereby the hand 11 can be moved obliquely from the point P2 to the point P3. . That is, during the movement from point P2 to point P3, the horizontal movement mechanism 13 and the lifting mechanism 14 operate in parallel with each other. By setting a constant ratio between the horizontal component of the moving speed of the hand 11 by the horizontal moving mechanism 13 and the vertical component of the moving speed of the hand 11 by the lifting mechanism 14, the hand 11 is linearly moved from the point P2 to the point P3. can be moved to

By the time the hand 11 reaches the point P3, the pressing portion 113 is switched from the pressed state to the released state. As a more specific example, when the hand 11 reaches the point P<b>2 , the control section 9 releases the pressing state of the pressing section 113 .

A point P4 is a point moved to the -X side and the -Z side with respect to the point P3. The distance between the point P3 and the point P4 in plan view (the distance along the X-axis direction) is set wider than the depth of the concave portion 112b of the hand 11, for example, 0.5 [mm] or more. Movement of the hand 11 from the point P3 to the point P4 is realized by the parallel operation of the horizontal movement mechanism 13 and the lifting mechanism 14 as described above. The substrate W is separated from the hand 11 by moving the hand 11 from the point P3 to the point P4. Thereby, the substrate W can be mounted on the mounting surface 22b of the substrate container 20. As shown in FIG.

As illustrated in FIG. 5, the angle formed with the horizontal plane of the straight line connecting the points P2 and P3 may be equal to or different from the angle formed with the horizontal plane of the straight line connecting the points P3 and P4. may In order to make both angles equal to each other, the ratio between the horizontal component and the vertical component of the moving speed of the hand 11 should be kept constant during the movement from the point P2 to the point P4. According to this, the hand 11 moves in a straight line from the point P2 to the point P4. This angle can be set, for example, within the range of 35 degrees to 65 degrees.

A point P5 is a point moved from the point P4 to the -Z side. The lifting mechanism 14 lowers the hand 11 from the point P4 to the -Z side, so that the hand 11 can be moved to the point P5. At this time, the horizontal movement mechanism 13 does not have to operate.

A point P6 is a point moved from the point P5 to the +X side. A point P6 is a point where the hand 11 faces the substrate container 20 in the X-axis direction. However, the point P6 is set at a position lower than the point P1. The hand 11 can be moved to the point P6 by the horizontal movement mechanism 13 moving the hand 11 from the point P5 to the +X side. At this time, the lifting mechanism 14 does not need to operate.

According to such a moving route R1, the hand 11 descends obliquely on the -X side and the -Z side from the point P3 where the substrate W is placed on the placing surface 22b to the point P4. In other words, the hand 11 leaves the substrate W while moving obliquely with respect to the substrate W. As shown in FIG. FIG. 6 is a diagram schematically showing an example of how the substrate W is separated from the hand 11. As shown in FIG. Since the hand 11 descends obliquely on the -X side and -Z side, the facing surface 112a of the protrusion 112 is the side surface of the substrate W in the X-axis direction when the hand 11 is separated from the substrate W in the Z-axis direction. away from In the example of FIG. 6, the moving direction of the hand 11 is schematically indicated by block arrows.

In short, during the movement from the point P3 to the point P4, the horizontal movement mechanism 13 moves the hand 11 in the separation direction (-X side) in which the facing surface 112a of the protrusion 112 moves away from the substrate W in plan view.

Therefore, the substrate W is less likely to get caught on the recessed portion 112b of the projecting portion 112 compared to the case where the hand 11 descends along the Z-axis direction from the point P3. Therefore, the degree to which the substrate W bounces when the substrate W is placed can be reduced. Therefore, the degree of damage to the substrate W or the degree of adhesion of particles can be reduced.

<Hand movement speed>
Next, the moving speed of the hand 11 will be described. FIG. 7 is a graph showing an example of the target value of the moving speed of the hand 11. As shown in FIG. In the example of FIG. 7, an example of the target value of the movement speed during movement from the point P2 to the point P5 is shown. The control unit 9 controls the horizontal movement mechanism 13 and the lifting mechanism 14 so that the moving speed of the hand 11 approaches the target value.

In the illustration of FIG. 7, the target value momentarily becomes zero at each of the points P2 to P5. That is, ideally, the hand 11 stops momentarily at each of the points P2 to P5. Point P2, point P4, and point P5 are points at which the movement direction is changed, and point P3 is ideally the point at which the substrate W contacts the mounting surface 22b. If the moving speed of the hand 11 becomes zero at the point P3, it is possible to minimize the collision force between the substrate W and the mounting surface 22b during mounting. According to this, the degree of damage to the substrate W or the degree of adhesion of particles can be reduced.

In the example of FIG. 7, the maximum value of the moving speed (maximum value in the period from the point P2 to the point P3) with the substrate W placed on the hand 11 is It is lower than the maximum value of the movement speed in the state (maximum value in the period from point P3 to point P5). According to this, when the substrate W is placed on the hand 11, vibration of the hand 11 caused by movement is small. Therefore, it is possible to reduce defects (for example, damage or adhesion of particles) to the substrate W caused by the vibration. On the other hand, since the maximum value of the moving speed is large when the substrate W is not placed on the hand 11, the time required for the hand 11 to move along the moving path R1 can be shortened. In other words, throughput can be improved.

In addition, as illustrated in FIG. 7, the maximum value of the movement speed during movement from the point P3 to the point P4 may be smaller than the maximum value of the movement speed during movement from the point P4 to the point P5. In other words, the maximum value of the movement speed during the movement in the diagonal direction on the -X side and the -Z side may be smaller than the maximum value of the subsequent movement speed.

<Other examples of moving route>
Next, another example of the moving route of the hand 11 will be described. FIG. 8 is a diagram schematically showing an example of the moving route R2 of the hand 11. As shown in FIG. On the moving route R2, the hand 11 goes from the point P1 to the point P6 via the points P2, P3 and P5. Points P1 to P3 are as described above. A point P5 is a point moved from the point P3 to the -X side and the -Z side. In the example of FIG. 8, the point P5 is set on a straight line connecting the points P2 and P3.

Even with such a movement route R2, the movement direction of the hand 11 during movement from the point P3 to the point P5 is the diagonal direction of the -X side and the -Z side. Therefore, the substrate W is less likely to get caught in the recessed portion 112b of the hand 11 . Therefore, the substrate W can be placed inside the substrate container 20 while suppressing the degree of bounce of the substrate W.

However, in terms of reducing the degree of bounce of the substrate W, the movement route R1 is more desirable than the movement route R2. The reason is explained below.

First, in order to reduce the degree of bouncing of the substrate W, it is desirable that the hand 11 leaves the substrate W in a movement direction closer to the horizontal direction. This is because the closer the movement direction is to the horizontal direction, the easier it is for the edge of the substrate W to come out of the recess 112b of the hand 11 (see also FIG. 6). In other words, the closer the movement direction is to the horizontal direction, the more difficult it is for the substrate W to get caught in the concave portion 112b.

By the way, the point P5 cannot be set at an arbitrary position, and is set within a predetermined setting range. For example, the position of the point P5 in the X-axis direction is set so that the hand 11 does not collide with the inner surface of the housing 21 of the substrate container 20 on the -X side. The position of the point P5 in the Z-axis direction is set so as not to collide with the substrate W placed on each of the mounting surfaces 22b between the plurality of mounting surfaces 22b arranged in the Z-axis direction. The same applies to the position of the point P2 in the Z-axis direction.

A point P3 ideally indicates the position of the hand 11 when the substrate W contacts the mounting surface 22b. Since there is a suitable placement position for the substrate W, there is also a suitable position for the point P3.

On the moving route R2, the hand 11 moves linearly from the point P3 to the point P5. Since the position of the point P3 is predetermined, in order to make the moving direction closer to the horizontal direction during this movement, it is necessary to set the point P5 closer to the -X side or to set the point P5 closer to the +Z side. . However, as described above, the position of the point P5 in the X-axis direction and the position in the Z-axis direction must be set within the set range, so the movement direction cannot be made closer to the horizontal direction beyond this range.

On the other hand, on the moving route R1, the hand 11 moves linearly from the point P3 to the point P4, then changes the moving direction and moves from the point P4 to the point P5 toward the -Z side. In this moving route R1, the point P4 can be set at a position higher than the point P5, so the moving direction can be made closer to the horizontal direction during the movement from the point P3 to the point P4. Therefore, when the substrate W is placed on the movement path R1, the end of the substrate W is easily pulled out of the concave portion 112b of the hand 11, and the degree of bounce of the substrate W can be further reduced.

FIG. 9 is a diagram schematically showing an example of the moving route R3 of the hand 11. As shown in FIG. On the moving route R3, similarly to the moving route R1, the hand 11 passes from the point P1 to the point P2, the point P3, the point P4, and the point P5 in this order to the point P6. However, the point P2 is located directly above the point P3. That is, the point P2 is located on a straight line passing through the point P3 and parallel to the Z-axis.

According to this movement route R3, the hand 11 moves to the -X side during movement from the point P3 to the point P4. That is, the hand 11 moves in the separation direction (-X side) in which the facing surface 112a of the protrusion 112 separates from the substrate W. As shown in FIG. Therefore, when the substrate W is placed, the substrate W is less likely to be caught by the recessed portion 112b of the hand 11, and the degree of bounce of the substrate W can be reduced.

In other words, the hand 11 does not necessarily have to move obliquely before the substrate W comes into contact with the mounting surface. In short, at least when the substrate W comes into contact with the mounting surface or immediately after that, the moving direction should have an X-axis component on the -X side. The term "immediately after" as used herein refers to an arbitrary point in time until the edge of the substrate W is completely removed from the recess 112b.

Although the movement route R3 can also reduce the degree of bounce of the substrate W, the movement route R1 or the movement route R2 is preferable from the viewpoint of reducing the degree of bounce of the substrate W more reliably. In other words, it is desirable that the horizontal movement mechanism 13 moves the hand 11 to the -X side before the hand 11 reaches the point P3. This is because the placement position of the substrate W varies due to manufacturing variations and the like. For example, the position of the mounting surface 22b of the substrate container 20 in the Z-axis direction varies due to manufacturing variations.

As a specific example, a case where the contact point WP1 where the substrate W actually contacts the mounting surface of the substrate container 20 is located on the +Z side of the point P3 will be described. In this case, the substrate W is mounted on the mounting surface at the contact point WP1 while the hand 11 is descending from the point P2 to the point P3 along the Z-axis direction. According to this, the substrate W is easily caught by the concave portion 112b of the hand 11, and the substrate W bounces relatively large.

On the other hand, according to the moving route R1 or the moving route R2, the hand 11 moves diagonally to the -X side and the -Z side before the hand 11 reaches the point P3. Specifically, the hand 11 moves diagonally to the -X side and -Z side even during the movement from the point P2 to the point P3. According to this, the hand 11 moves in the -X and -Z side oblique directions before the substrate W contacts the mounting surface 22b. Therefore, even if the actual placement position (contact point WP1) of the substrate W varies in the Z-axis direction, the hand 11 will be able to: Move diagonally to the X and -Z sides. Therefore, the degree of bounce of the substrate W can be reduced more reliably.

FIG. 10 is a diagram schematically showing an example of the moving route R4 of the hand 11. As shown in FIG. On the moving route R4, the hand 11 goes from the point P1 to the point P6 via the points P2, P3 and P5, similarly to the moving route R2. However, the moving route R4 differs from the moving route R2 in that the point P2 is located directly above the point P3. That is, the point P2 is located on a straight line passing through the point P3 and parallel to the Z-axis.

According to this moving route R4, the hand 11 moves to the -X side while moving from the point P3 to the point P4. Therefore, if the contact point WP1 where the substrate W actually contacts the mounting surface of the substrate container 20 is approximately the same as the point P3, or is located on the -Z side of the point P3, the bounce of the substrate W will increase. degree can be reduced.

<Position of point P3 in the X-axis direction>
Next, a method for setting the position of the point P3 in the X-axis direction will be described. As described above, when the moving direction at the contact point WP1 (ideally, point P3) where the substrate W contacts the mounting surface 22b is an oblique direction on the -X side and the -Z side, the hand 11 and the substrate The hand 11 pushes the substrate W toward the -X side due to friction with W. As a result, the substrate W can move to the -X side on the mounting surface 22b of the substrate container 20. FIG.

Therefore, the position of the point P3 in the X-axis direction may be set to a position shifted by a predetermined amount to the +X side from a position (target position) predetermined as a suitable placement position of the substrate W. The predetermined amount is the amount by which the substrate W moves to the -X side on the mounting surface 22b when the substrate W is mounted on the mounting surface 22b, and can be set in advance by, for example, experiments or simulations.

According to this, the substrate W can be placed at a predetermined position close to the target position in consideration of the pushing movement due to friction between the hand 11 and the substrate W. In other words, by moving the hand 11 in the -X side and -Z side oblique directions, the substrate W is moved along the -X side on the mounting surface 22b, and the substrate W is mounted at a predetermined position. .

<Transportation times and movement direction>
Next, an example of the relationship between the number of times the substrate W is transported and the moving direction of the hand 11 will be described. The movement direction here is the movement direction of the hand 11 at the time when the substrate W comes into contact with the mounting surface 22b or immediately after that. As the number of times the substrate W is transported increases, the number of times the projection 112 of the hand 11 is pressed from the substrate W also increases. Therefore, the depth (the depth along the X-axis direction) of the concave portion 112b of the protrusion 112 can increase as the number of times of transportation increases.

Therefore, the controller 9 counts the number of times the substrate W has been transported. For example, the control unit 9 increments the number of times (that is, the number of times of transportation) each time the substrate W is received on the hand 11 . Thereby, the number of times the substrate W is transported can be counted.

Then, the control unit 9 determines that the moving direction of the hand 11 when the number of times of transport of the substrate W is the first value is more horizontal than the moving direction when the number of times of transport is a second value smaller than the first value. The horizontal movement mechanism 13 and the lifting mechanism 14 may be controlled along the direction. In other words, the control unit 9 controls that the ratio of the X-axis component to the Z-axis component of the moving speed of the hand 11 when the number of times of transportation is the first value is higher than the ratio when the number of times of transportation is the second value. The horizontal movement mechanism 13 and the lifting mechanism 14 may be controlled so as to increase. That is, the control unit 9 determines that the value of the angle formed by the moving direction of the hand 11 and the horizontal plane when the number of times of transportation is the first value is the angle when the number of times of transportation is the second value smaller than the first value. The horizontal movement mechanism 13 and the lifting mechanism 14 may be controlled so as to be smaller than the value.

For example, the relationship between the number of times of transportation and the direction of movement may be set in advance and stored in the storage medium of the control section 9 . The control unit 9 may determine the moving direction based on the current number of times of transportation and the relationship stored in the storage medium.

FIG. 11 is a diagram showing an example of the moving route R1' of the hand 11. As shown in FIG. The movement route R1' is the same as the movement route R1 except for the moving direction of the hand 11 during movement from the point P2' to the point P4'. In the movement route R1', the direction of movement is more horizontal than in the movement route R1. The movement route R1' is adopted when the number of times of transportation is the first value, and the movement route R1 is adopted when the number of times of transportation is the second value.

According to this, when the concave portion 112b of the hand 11 is deep, the moving direction of the hand 11 is along the horizontal direction, so that the substrate W is less likely to be caught in the concave portion 112b. On the other hand, when the recess 112b of the hand 11 is shallow, the moving direction is along the Z-axis direction compared to when the recess 112b of the hand 11 is deep. According to this, the distance between the point P1 and the point P2 can be lengthened. Between the point P1 and the point P2, the hand 11 holds the substrate W by the projecting portion 112 and the pressing portion 113, so that the moving speed of the hand 11 can be set high. Therefore, the time required for moving from the point P1 to the point P6 can be shortened. In other words, the transportation time can be shortened.

In the above example, the moving directions are different when the number of times of transportation takes the first value and the second value, but the moving directions may be different depending on a plurality of values.

<Transportation times and moving speed>
Next, an example of the relationship between the number of times the substrate W is transported and the moving speed of the hand 11 will be described. As described above, the recess 112b of the hand 11 can become deeper as the number of times of transportation increases. Further, the higher the moving speed of the substrate W when placed, the more the substrate W bounces. Therefore, when the number of transfers is large and the moving speed of the substrate W during placement is high, the degree of bounce of the substrate W increases.

Therefore, the control unit 9 controls the movement speed when the number of times of transportation of the substrate W is the third value and the movement speed when the number of times of transportation is a fourth value smaller than the third value. The horizontal movement mechanism 13 and the lifting mechanism 14 may be controlled so as to be lower than .

Referring to FIG. 7, since the target value of the moving speed at the point P3 is set to zero, the moving speed is ideally zero when the actual contact point WP1 of the substrate W coincides with the point P3. is. However, in reality, the contact point WP1 may vary in the Z-axis direction from the point P3, and the moving speed does not always match the target value. Therefore, the moving speed at the contact point WP1 is not always zero.

Therefore, here, in order to adjust the moving speed at the contact point WP1, the moving speed decrease rate α1 when the hand 11 approaches the point P3 and the moving speed increase rate α2 when the hand 11 leaves the point P3 are adjusted. Adjust at least one of them. In short, at least one of the rate of decrease α1 and the rate of increase α2 is set according to the number of times of transportation.

FIG. 12 is a graph showing another example of the target value of the moving speed. In FIG. 12, the target value of the moving speed in FIG. 7 is indicated by a two-dot chain line. In the example of FIG. 12, the decrease rate α1 is set smaller than in FIG. 7, and the increase rate α2 is also set smaller. According to this, even if the contact point WP1 deviates from the point P3 in the Z-axis direction, the moving speed at the contact point WP1 is likely to be low.

Therefore, the control unit 9 controls the rate of decrease α1 when the number of transports is the first value to be smaller than the rate of decrease α1 when the number of times of transport is the second value, and/or the number of times of transport is the second value. The horizontal movement mechanism 13 and the lifting mechanism 14 may be controlled such that the increase rate α2 when the transport count is 1 is greater than the increase rate α2 when the transport count is the second value.

According to this, when the concave portion 112b is deep, the movement speed at the contact point WP1 tends to be low. That is, when the substrate W tends to bounce greatly due to the depth of the concave portion 112b, the degree of bounce of the substrate W due to the movement speed can be reduced. Therefore, the degree of bouncing of the substrate W can be reduced as a whole.

On the other hand, when the concave portion 122b is shallow, the moving speed at the contact point WP1 tends to increase. According to this, since the degree of bounce of the substrate W caused by the depth of the recess 112b is small, even if the movement speed is increased, the degree of bounce of the substrate W as a whole does not increase that much. Further, by increasing the moving speed, it is possible to shorten the time required for moving the hand 11 along the moving path. That is, throughput can be improved.

In the above example, the moving speeds are different when the number of times of transportation takes the first value and the second value.

<Rigidity>
Next, the hardness of the projecting portion 112 and the pressing portion 113 will be described. The protrusion 112 may be harder than the pressing portion 113 . As a more specific example, the pressing hardness of the protrusion 112 may be higher than the pressing hardness of the pressing portion 113 . According to this, it is difficult for the concave portion 112b to be formed in the facing surface 112a of the projection portion 112 . In other words, the depth of the recess 112b can be reduced. Therefore, the extent to which the substrate W is caught in the recess 112b can be reduced, and the extent to which the substrate W bounces can be reduced.

In addition, the impact force exerted on the substrate W by the protrusions 112 and the pressing portions 113 during pressing can be reduced compared to when the protrusions 112 and the pressing portions 113 are equally hard. Therefore, the degree of damage to the substrate W can be reduced.

In the above-described example, the substrate container 20 is used as an object on which the substrates W are placed. However, it is not necessarily limited to this. For example, the substrate processing apparatus 120 may be used as the object on which the substrate W is placed. A temporary receiving portion for temporarily receiving the substrate W may be provided between the indexer portion 110 and the substrate processing apparatus 120 . In this case, the temporary receiving portion may be adopted as the object on which the substrate W is placed.

Second embodiment.
A substrate processing system 100 according to the second embodiment is similar to that of the first embodiment. However, the substrate transfer device 10 does not necessarily need to have the protrusion 112 and the pressing portion 113 .

As described in the first embodiment, the substrate W is placed by inserting both ends of the substrate W into the grooves 22 a of the pair of support members 22 in the substrate container 20 . In this state, the inner side surface (opposing surface) 22c of the groove 22a faces the side surface of the substrate W. As shown in FIG. When the substrate W is pressed toward the -X side against the inner side surface 22c, a concave portion that is recessed toward the -X side can also be formed on the inner side surface 22c.

Once the recess is formed, the edge of the substrate W can fit into the recess in the inner surface 22c. When the hand 11 lifts the substrate W along the Z-axis direction in a state where the edge of the substrate W is fitted in the concave portion of the inner side surface 22c, the substrate W is caught in the concave portion. Therefore, when the substrate W is taken out, the substrate W bounces relatively large.

Therefore, the control unit 9 may control the horizontal movement mechanism 13 and the lifting mechanism 14 to move the hand 11 along the movement path R1 (FIG. 5) or the movement path R2 (FIG. 8) in the opposite direction. Note that in the second embodiment, the point P3 is a designed point where the substrate supporting portion 111 of the hand 11 contacts the bottom surface of the substrate W. As shown in FIG.

According to this, at least at the time when the substrate supporting portion 111 of the hand 11 contacts the lower surface of the substrate W or immediately after that, the hand 11 moves in the +X and +Z side oblique directions. The term "immediately after" as used herein means an arbitrary time until the edge of the substrate W is completely removed from the concave portion of the inner side surface 22c of the substrate container 20 .

In short, the control unit 9 causes the horizontal movement mechanism 13 to move the hand 11 to the +X side in parallel with the elevation by the elevation mechanism 14 at least at the time of contact or immediately thereafter. That is, the hand 11 moves in the separation direction (+X side) in which the substrate W moves away from the inner side surface 22c of the support member 22 in plan view. Therefore, even if the substrate W is fitted in the recess of the inner side surface 22c, the substrate W is less likely to get caught in the recess. Therefore, the degree of bouncing of the substrate W when the substrate W is lifted can be reduced, and the degree of damage to the substrate W or the degree of adhesion of particles can be reduced.

As in the first embodiment, the movement direction during movement from the point P3 to the point P2 is more horizontal on the movement route R1 than on the movement route R2. Therefore, from the viewpoint of reducing bounce of the substrate W, the movement route R1 is preferable to the movement route R2.

When the substrate W is placed on the mounting surface of the substrate container 20 or when the substrate W is taken out from the mounting surface of the substrate container 20, the same moving route may be adopted. According to this, the parameter of the movement speed set between each point of the movement route can be made common at the time of placing and at the time of taking out. Therefore, parameter management is easy.

Next, other moving routes will also be explained. FIG. 13 is a diagram schematically showing an example of the moving route R5. On the movement route R5, the hand 11 moves from the point P6 to the point P1 via points P5, points P3 and P2 in this order. On the movement route R5, the point P5 is located directly below the point P3. That is, the point P5 is located on a straight line passing through the point P3 and parallel to the Z-axis.

According to this, when the contact point WP2 where the hand 11 actually contacts the lower surface of the substrate W is located at the same level as the point P3 or on the +Z side of the point P3, the degree of bounce of the substrate W can be reduced. .

However, from the viewpoint of reducing the bouncing of the substrate W more reliably, it is desirable that the hand 11 moves diagonally on the +X side and the +Z side before reaching the point P3. According to this, the hand 11 can move in the +X-side and +Z-side oblique directions before contacting the lower surface of the substrate W. As shown in FIG. Therefore, even if the contact point WP2 varies in the Z-axis direction, the degree of bounce of the substrate W can be reduced more reliably.

Modification.
In the first embodiment, by moving the substrate W obliquely, the substrate W is mounted on the mounting surface in the substrate container 20 while reducing the degree of bounce of the substrate W. FIG. Here, it is intended to pull out the substrate W from the concave portion 112b of the hand 11 using the inner side surface 22c of the support member 22 of the substrate container 20. FIG.

FIG. 14 is a diagram schematically showing an example of a moving route R6 of the hand 11. As shown in FIG. On the moving route R6, the hand 11 moves through points P1, P2, P21, P3, P5 and P6 in this order. The point P2 is a position set on the -X side of the point P1 as in the first embodiment. 22 c , and moved to the +X side with respect to the hand 11 . That is, when the hand 11 reaches a point on the +X side of the point P2 by a predetermined amount, the substrate W contacts the inner side surface 22c of the support member 22, and the hand 11 moves from this point to the point P2 by -X. Since the substrate W does not move to the -X side when it moves to the axial side, only the hand 11 moves to the -X side. Therefore, the substrate W moves to the +X side relative to the hand 11 . As a result, the substrate W is pulled out from the recess 112b of the hand 11. As shown in FIG.

Next, the hand 11 moves from point P2 to point P21. The point P21 is located on the +X side of the point P2. The point P21 is set directly above the point P3.

Next, the hand 11 descends along the Z-axis direction from point P21 to point P5 via point P3. As a result, the substrate W is placed on the placement surface, and the hand 11 is separated from the substrate W. As shown in FIG. Although the hand 11 is descending along the Z-axis direction, the substrate W has already been pulled out of the recess 112b of the hand 11 when the hand 11 reaches the point P2. Bouncing is less likely to occur.

Although the embodiments of the substrate transfer apparatus and the substrate transfer method have been described above, the embodiments can be modified in various ways without departing from the scope of the invention. The various embodiments and modifications described above can be implemented in appropriate combinations.

Also, as the substrate W, a semiconductor substrate was used in the description, but the substrate W is not limited to this. For example, substrates such as photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, or magneto-optical disk substrates may be used. good.

9 control unit 10 substrate transfer device 11 substrate support (hand)
REFERENCE SIGNS LIST 13 Horizontal movement mechanism 14 Elevating mechanism 20 Substrate container 111 Substrate supporter 112 Protruding portion 113 Pressing portion

Claims (17)

A substrate transfer device for placing a substrate on a placement surface,
a substrate supporting portion that supports a second region different from the first region supported by the mounting surface on the lower surface of the substrate; a substrate support having a projection including a surface and a pressing portion that presses the substrate toward the projection and holds the substrate together with the projection;
a horizontal movement mechanism for horizontally moving the substrate support;
an elevating mechanism for elevating the substrate support;
A control unit that controls the pressing unit, the horizontal movement mechanism and the lifting mechanism,
The control unit
lowering the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressing portion is released from pressing the substrate;
At least after the substrate comes into contact with the mounting surface, the horizontal movement mechanism moves the substrate support in a separation direction in which the facing surface moves away from the substrate in parallel with the descent of the substrate support. ,
setting a designed position in the separating direction of the point where the substrate contacts the mounting surface, at a position opposite to the separating direction by a predetermined amount from a target position for the mounting position of the substrate;
A substrate transfer apparatus, wherein when the substrate is placed on the placement surface , the substrate support moves the substrate along the placement surface from the design position toward the target position by friction. . A substrate transfer device for placing a substrate on a placement surface,
a substrate supporting portion that supports a second region different from the first region supported by the mounting surface on the lower surface of the substrate; a substrate support having a projection including a surface and a pressing portion that presses the substrate toward the projection and holds the substrate together with the projection;
a horizontal movement mechanism for horizontally moving the substrate support;
an elevating mechanism for elevating the substrate support;
A control unit that controls the pressing unit, the horizontal movement mechanism and the lifting mechanism,
The control unit
lowering the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressing portion is released from pressing the substrate;
At least after the substrate comes into contact with the mounting surface, the horizontal movement mechanism moves the substrate support in a separation direction in which the facing surface moves away from the substrate in parallel with the descent of the substrate support. ,
The control unit
counting the number of times the substrate is transported;
The value of the angle between the moving direction of the substrate support after at least the substrate comes into contact with the mounting surface and the horizontal plane is the value when the number of transfers is the first value. A substrate transport apparatus that controls the horizontal movement mechanism and the lifting mechanism so that the angle is smaller than the second value that is smaller than the second value. A substrate transfer device for placing a substrate on a placement surface,
a substrate supporting portion that supports a second region different from the first region supported by the mounting surface on the lower surface of the substrate; a substrate support having a projection including a surface and a pressing portion that presses the substrate toward the projection and holds the substrate together with the projection;
a horizontal movement mechanism for horizontally moving the substrate support;
an elevating mechanism for elevating the substrate support;
A control unit that controls the pressing unit, the horizontal movement mechanism and the lifting mechanism,
The control unit
lowering the substrate support from above the mounting surface by the elevating mechanism in a state in which the pressing portion is released from pressing the substrate;
At least after the substrate comes into contact with the mounting surface, the horizontal movement mechanism moves the substrate support in a separation direction in which the facing surface moves away from the substrate in parallel with the descent of the substrate support. ,
The control unit
As the substrate support approaches a design point where the substrate contacts both the substrate support and the mounting surface, the speed of movement of the substrate support is reduced at a rate of reduction such that the controlling the horizontal movement mechanism and the lifting mechanism so that the movement speed is a predetermined value and increases at a certain rate as the substrate support moves away from the point;
counting the number of times the substrate is transported;
At least one of the reduction rate of the moving speed and the increase rate of the moving speed when the number of times of transportation is a third value is set to a fourth value smaller than the third value of the number of times of transportation. A substrate transfer device that is set to be smaller than one of the above at a certain time. The substrate transfer apparatus according to any one of claims 1 to 3 ,
The substrate transfer device, wherein the control unit causes the horizontal movement mechanism to move the substrate support in the separation direction before the substrate contacts the mounting surface. The substrate transfer apparatus according to any one of claims 1 to 4 ,
A substrate conveying device, wherein a concave portion is formed in the facing surface of the projection portion by pressing the substrate from the pressing portion. The substrate transfer apparatus according to any one of claims 1 to 3 ,
The substrate transfer device, wherein the rigidity of the protrusion is higher than that of the pressing section. The substrate transfer apparatus according to claim 2 or 3 ,
setting a designed position in the separation direction of the point where the substrate contacts the mounting surface, at a position opposite to the separation direction by a predetermined amount from a target position for the mounting position of the substrate; Substrate transfer device. A substrate transfer device for taking out a substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate,
a substrate support that supports a second region of the bottom surface of the substrate that is different from the first region;
a horizontal movement mechanism for horizontally moving the substrate support;
an elevating mechanism for elevating the substrate support;
A control unit that controls the horizontal movement mechanism and the lifting mechanism,
The control unit
causing the lifting mechanism to lift the substrate support from below the mounting surface;
At least after the substrate support comes into contact with the lower surface of the substrate, the horizontal movement mechanism moves the substrate support in a separation direction in which the substrate moves away from the facing surface in parallel with the upward movement of the substrate support. move,
The control unit
counting the number of times the substrate is transported;
The value of the angle between the moving direction of the substrate support after at least the substrate comes into contact with the mounting surface and the horizontal plane is the value when the number of transfers is the first value. A substrate transport apparatus that controls the horizontal movement mechanism and the lifting mechanism so that the angle is smaller than the second value that is smaller than the second value. A substrate transfer device for taking out a substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate,
a substrate support that supports a second region of the bottom surface of the substrate that is different from the first region;
a horizontal movement mechanism for horizontally moving the substrate support;
an elevating mechanism for elevating the substrate support;
A control unit that controls the horizontal movement mechanism and the lifting mechanism,
The control unit
causing the lifting mechanism to lift the substrate support from below the mounting surface;
At least after the substrate support comes into contact with the lower surface of the substrate, the horizontal movement mechanism moves the substrate support in a separation direction in which the substrate moves away from the facing surface in parallel with the upward movement of the substrate support. move,
The control unit
As the substrate support approaches a design point where the substrate contacts both the substrate support and the mounting surface, the speed of movement of the substrate support is reduced at a rate of reduction such that the controlling the horizontal movement mechanism and the lifting mechanism so that the movement speed is a predetermined value and increases at a certain rate as the substrate support moves away from the point;
counting the number of times the substrate is transported;
At least one of the reduction rate of the moving speed and the increase rate of the moving speed when the number of times of transportation is a third value is set to a fourth value smaller than the third value of the number of times of transportation. A substrate transfer device that is set to be smaller than one of the above at a certain time. The substrate transfer apparatus according to claim 8 or 9 ,
The substrate conveying device, wherein the control unit causes the horizontal movement mechanism to move the substrate support in the separation direction before the substrate support contacts the lower surface of the substrate. The substrate transfer apparatus according to any one of claims 1 to 10 ,
The control unit controls the horizontal movement mechanism and the lifting mechanism so that the substrate support moves along a predetermined movement path,
The predetermined moving path includes a first point where both the substrate support and the mounting surface are in contact with the substrate, a second point moved from the first point in the separation direction and vertically downward, and the second point. A substrate transfer apparatus including a route connecting two points to a third point moved vertically downward in this order. The substrate transfer apparatus according to any one of claims 1 to 11 ,
The control unit sets the maximum value of the moving speed of the substrate support when the substrate is placed on the substrate support to the moving speed when the substrate is not placed on the substrate support. substrate transport device for controlling the horizontal movement mechanism and the elevating mechanism to be lower than the maximum value of A substrate transport method for placing a substrate on a placement surface, comprising:
a step of supporting a second region of the lower surface of the substrate, which is different from the first region supported by the mounting surface, with a substrate supporting portion of a substrate support;
a step of holding the substrate together with the projecting portion by causing the pressing portion to press the substrate against the projecting portion side including the facing surface facing the side surface of the substrate, the projecting portion being erected on the substrate supporting portion;
causing a horizontal movement mechanism to move the substrate support above the mounting surface;
In a state in which the pressure applied to the substrate by the pressing portion is released, the substrate support is lowered from above the mounting surface by an elevating mechanism, and at least after the substrate comes into contact with the mounting surface, the substrate is moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism in parallel with the lowering of the support;
setting a designed position in the separating direction of the point where the substrate contacts the mounting surface, at a position opposite to the separating direction by a predetermined amount from a target position for the mounting position of the substrate;
A method of transporting a substrate, wherein when the substrate is placed on the placement surface , the substrate support moves the substrate along the placement surface from the design position toward the target position by friction . . A substrate transport method for placing a substrate on a placement surface, comprising:
a first step of supporting a second region of the lower surface of the substrate, which is different from the first region supported by the mounting surface, with a substrate support portion of a substrate support;
a second step of holding the substrate together with the projecting portion by causing the pressing portion to press the substrate toward the side of the projecting portion including the facing surface facing the side surface of the substrate, which is provided upright on the substrate supporting portion; ,
a third step of moving the substrate support above the mounting surface by a horizontal movement mechanism;
In a state in which the pressure applied to the substrate by the pressing portion is released, the substrate support is lowered from above the mounting surface by an elevating mechanism, and at least after the substrate comes into contact with the mounting surface, the substrate is a fourth step of moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism in parallel with the lowering of the support;
and a fifth step of counting the number of times the substrate is transported,
In the fourth step, the value of the angle formed by the moving direction of the substrate support after at least the substrate comes into contact with the mounting surface and the horizontal plane when the number of times of transportation is the first value is A substrate transfer method, wherein the horizontal movement mechanism and the lift mechanism are controlled so as to be smaller than the value of the angle when the number of times of transfer is a second value smaller than the first value. A substrate transport method for placing a substrate on a placement surface, comprising:
a first step of supporting a second region of the lower surface of the substrate, which is different from the first region supported by the mounting surface, with a substrate support portion of a substrate support;
a second step of holding the substrate together with the projecting portion by causing the pressing portion to press the substrate toward the side of the projecting portion including the facing surface facing the side surface of the substrate, which is provided upright on the substrate supporting portion; ,
a third step of moving the substrate support above the mounting surface by a horizontal movement mechanism;
In a state in which the pressure applied to the substrate by the pressing portion is released, the substrate support is lowered from above the mounting surface by an elevating mechanism, and at least after the substrate comes into contact with the mounting surface, the substrate is a fourth step of moving the substrate support in a separation direction in which the facing surface moves away from the substrate by the horizontal movement mechanism in parallel with the lowering of the support;
and a fifth step of counting the number of times the substrate is transported,
In the fourth step,
As the substrate support approaches a design point where the substrate contacts both the substrate support and the mounting surface, the speed of movement of the substrate support is reduced at a rate of reduction such that the controlling the horizontal movement mechanism and the lifting mechanism so that the movement speed is a predetermined value and increases at a certain rate as the substrate support moves away from the point;
At least one of the reduction rate of the moving speed and the increase rate of the moving speed when the number of times of transportation is a third value is set to a fourth value smaller than the third value of the number of times of transportation. A method of transporting a substrate, wherein the substrate is set to be smaller than one of the above. A substrate transport method for taking out a substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate, comprising:
a first step of causing a horizontal movement mechanism to move a substrate support that supports a second region different from the first region of the lower surface of the substrate below the mounting surface;
A lifting mechanism causes the substrate support to rise from below the mounting surface, and at least after the substrate support comes into contact with the lower surface of the substrate, a horizontal movement mechanism is operated in parallel with the lifting of the substrate support. a second step of moving the substrate support in a separation direction in which the substrate moves away from the facing surface;
and a third step of counting the number of times the substrate is transported,
In the second step, the value of the angle formed by the moving direction of the substrate support after at least the substrate comes into contact with the mounting surface and the horizontal plane when the number of times of transportation is the first value is A substrate transfer method, wherein the horizontal movement mechanism and the lift mechanism are controlled so as to be smaller than the value of the angle when the number of times of transfer is a second value smaller than the first value. A substrate transport method for taking out a substrate from a substrate container having a facing surface facing a side surface of the substrate and a mounting surface supporting a first region of the lower surface of the substrate, comprising:
a first step of causing a horizontal movement mechanism to move a substrate support that supports a second region different from the first region of the lower surface of the substrate below the mounting surface;
A lifting mechanism causes the substrate support to rise from below the mounting surface, and at least after the substrate support comes into contact with the lower surface of the substrate, a horizontal movement mechanism is operated in parallel with the lifting of the substrate support. a second step of moving the substrate support in a separation direction in which the substrate moves away from the facing surface;
and a third step of counting the number of times the substrate is transported,
In the second step,
As the substrate support approaches a design point where the substrate contacts both the substrate support and the mounting surface, the speed of movement of the substrate support is reduced at a rate of reduction such that the controlling the horizontal movement mechanism and the lifting mechanism so that the movement speed is a predetermined value and increases at a certain rate as the substrate support moves away from the point;
At least one of the reduction rate of the moving speed and the increase rate of the moving speed when the number of times of transportation is a third value is set to a fourth value smaller than the third value of the number of times of transportation. A method of transporting a substrate, wherein the substrate is set to be smaller than one of the above.

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