JP7309956B1 - LAMINATING APPARATUS, LAYING METHOD AND MOLDED PRODUCT MANUFACTURING METHOD - Google Patents

Abstract

[Problem] Conventional lamination methods have a problem in that it is difficult to achieve both bubble removal and followability of the embedding material. [Solution] The lamination method has a first chamber and a second chamber in which airflow in the chambers is blocked by a thin film member, and a substrate material and a film material are placed between a first press plate and the thin film member. A method for laminating a laminating apparatus in which the laminating apparatus is conveyed in a stacked state, the pressurizing step of reducing pressure in a first chamber, pressurizing a second chamber, and pressing a film material against a substrate material using a thin film member to apply pressure. (S3), a press step (S4, S5) of forming a molded product by pressurizing the substrate material and the film material in the direction in which they are sandwiched between the first press plate and the second press plate; A peeling step (S6) is performed in which the thin film member is peeled from the molded product by applying pressure and reducing the pressure in the second chamber. [Selection diagram] Figure 3

Description

The present invention relates to, for example, a lamination apparatus, a lamination method, and a molded product manufacturing method for laminating a form material that fills the irregularities on a substrate material having irregularities on its surface.

2. Description of the Related Art In recent years, in semiconductor devices, wiring layers forming wiring layers are becoming multi-layered. In such a multilayer wiring board, a method of forming an interlayer insulating film formed between layers by pressing is sometimes adopted. Therefore, there has been proposed a lamination apparatus for laminating a film material to be an interlayer insulating film on a substrate material on which such an electronic circuit is formed. An example of such a stacking device is disclosed in Japanese Unexamined Patent Application Publication No. 2002-200013.

In the laminating apparatus described in Patent Document 1, the circuit board is carried into the vacuum laminating apparatus together with the upper and lower carrier films, and the upper laminating space is formed between the upper board and the upper carrier film by bringing the upper board and the lower board into contact with each other. In addition to forming partitions, a lower lamination molding space is partitioned between the lower plate and the lower carrier film, both the upper lamination molding space and the lower lamination molding space are decompressed, and then one lamination molding space is decompressed. By continuing to pressurize the other lamination molding space, the circuit board is pressed by the carrier film.

JP-A-2004-58349

In the lamination apparatus described in Patent Document 1, since the circuit board is pressurized by air pressure, there is an advantage that the embedding material has high followability to narrow recesses between wirings. However, in the lamination apparatus described in Patent Document 1, the pressure applied to the film materials to be laminated cannot be increased, and there is a problem that air bubbles that cannot be visually observed remain in the narrow concave portions.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to improve the ability to eliminate air bubbles while realizing high followability when embedding a film material in a substrate material.

A lamination apparatus according to one embodiment is a lamination apparatus for molding a molded product in which a film material is laminated on a substrate material, and includes a chamber configured by combining an upper case and a lower case, and A first press plate and a second press plate provided at opposing positions, and pressurization for applying pressure to the molded product by changing the relative distance between the first press plate and the second press plate The chamber is arranged at a position sandwiched between the mechanism, the first press plate, and the second press plate and facing the lamination surface on the side where the film material is laminated on the substrate material. a diaphragm dividing the inside into a first chamber in which the transfer positions of the substrate material and the film material are set, and a second chamber in which the first chamber is blocked from an air flow; an air pressure adjusting mechanism for depressurizing or pressurizing the chamber and the second chamber, respectively; and a control unit for controlling the air pressure adjusting mechanism and the pressurizing mechanism, wherein the control unit controls the first press plate and the In a state where the substrate material and the film material are positioned between the second press plate and the second press plate, the first chamber is decompressed and the second chamber is pressurized to press the film material by the diaphragm. is pressed against the substrate material and pressurized in a direction in which the substrate material and the film material are sandwiched between the first press plate and the second press plate to form the molded product. pressurizing the first chamber and depressurizing the second chamber in a state in which the first press plate and the second press plate are separated from the press step, and and a peeling step of peeling the diaphragm from the molded article.

A lamination method according to one embodiment has a first chamber and a second chamber in which an air flow in the chamber is blocked by a thin film member, a first press plate is arranged in the first chamber, and a first press plate is arranged in the first chamber. A lamination method using a lamination device in which a second press plate is arranged in two chambers, and a substrate material and a film material are transported in a state of being superimposed between the first press plate and the thin film member, With the substrate material and the film material positioned between the first press plate and the second press plate, the first chamber is depressurized and the second chamber is pressurized. a pressurizing step of pressing the film material against the substrate material by the thin film member; A press step of pressing to form a molded product, and in a state in which the first press plate and the second press plate are separated from the press step, pressurize the first chamber, and pressurize the second press plate. and depressurizing the chamber to separate the thin film member from the molded product.

A molded article manufacturing method according to one embodiment has a first chamber and a second chamber in which an air flow in the chamber is blocked by a thin film member, and a first press plate is arranged in the first chamber. A method of manufacturing a molded product in a lamination apparatus in which a second press plate is arranged in a second chamber, and a substrate material and a film material are transported in a state of being superimposed between the first press plate and the thin film member. wherein the substrate material and the film material are positioned between the first press plate and the second press plate, the first chamber is depressurized, and the second chamber is and pressurizing the film material against the substrate material by the thin film member and pressing at 0.1 MPa to 1.0 MPa between the first press plate and the first press plate and a pressing step of forming a molded product by applying a pressure of 1.0 MPa to 5.0 MPa in a direction in which the substrate material and the film material are sandwiched between and the second press plate.

In the lamination apparatus, lamination method, and molded product manufacturing method according to one embodiment, after laminating a film material with high followability to a substrate material by diaphragm pressurization, press pressure is applied to the molded product. I do.

According to the lamination device and the lamination method according to the embodiment, it is possible to improve the ability to eliminate air bubbles while realizing high followability when embedding the film material in the substrate material.

1 is a configuration diagram of a stacking device according to Embodiment 1; FIG. 3 is a detailed configuration diagram of the chamber according to the first embodiment; FIG. 4 is a flow chart for explaining the flow of the lamination process according to the first embodiment; FIG. 10 is a detailed configuration diagram of the chamber according to the second embodiment; 9 is a flowchart for explaining the flow of a lamination process according to the second embodiment; FIG. 11 is a detailed configuration diagram of the chamber according to the third embodiment; 11 is a flow chart for explaining the flow of a lamination process according to the third embodiment; FIG. 11 is a schematic diagram illustrating a first example of the structure of a carrier film according to a fourth embodiment; FIG. 11 is a schematic diagram illustrating a second example of the structure of the carrier film according to the fourth embodiment;

For clarity of explanation, the following descriptions and drawings are omitted and simplified as appropriate. Moreover, in each drawing, the same elements are denoted by the same reference numerals, and redundant description is omitted as necessary.

Embodiment 1
FIG. 1 shows a configuration diagram of a stacking device 1 according to the first embodiment. The lamination device 1 according to the first embodiment laminates a film material on a substrate material. Here, in the following description, an example in which the circuit board A is used as the substrate material and the film material B is laminated on the wiring layer forming surface of the circuit board A will be described. In other words, the wiring layer forming surface of the circuit board A is the lamination surface on which the film material B is laminated in the following description. Further, the circuit board A is, for example, a semiconductor chip on which fine wiring is formed, and has an uneven pattern having a predetermined depth and interval on its surface. The film material B forms an insulating layer that insulates between wiring layers of the semiconductor chip, and insulates between wirings formed in one wiring layer and between wirings formed in different layers. This film material B is, for example, a thermosetting resin.

Note that FIG. 1 omits illustration of a hydraulic sensor for measuring the pressure generated by the cylinder, an air pressure sensor for measuring the pressure in the chamber, and a vacuum sensor. However, it goes without saying that information from various sensors is necessary for actual control. In the following description, terms such as a pressurized state and a decompressed state are used as the atmospheric pressure state in the chamber. It is assumed to be a thing that means a state of less than atmospheric pressure.

As shown in FIG. 1, the stacking device 1 according to the first embodiment includes a control unit 10, a hydraulic pump 11, a compressor 12, a vacuum pump 13, a chamber 14, a hydraulic valve H1, pneumatic valves P1 to P3, a vacuum valve V1. ˜V3, with silencers SL1, SL2.

Chamber 14, which will be described in detail with reference to FIG. 2, also includes at least an upper case 20, a lower case 21, a membrane member (eg, diaphragm 22), and a first press plate (eg, press plate 31). , with a second press plate (eg, press plate 41). Further, the lamination apparatus 1 has a carrier film 23 for conveying a laminated product in which the circuit board A and the film material B to be laminated are superimposed in the chamber 14 .

Chamber 14 is configured by a combination of upper case 20 and lower case 21 . At least one of the upper case 20 and the lower case 21 is configured to be vertically movable. For example, when moving the lower case 21 in the vertical direction, a hydraulic cylinder (not shown) is used to move the lower case 21 up and down.

In the chamber 14, the press plate 31 is arranged on the upper case 20 side, and the press plate 41 is arranged on the lower case 21 side. The press plate 31 is configured to be vertically movable within the upper case 20 . In FIG. 1, illustration of a configuration for raising and lowering the press plate 31 is omitted. Also, the press plate 41 is configured to be movable up and down by a hydraulic cylinder provided inside the lower case 21 . In the lamination apparatus 1 , the carrier film 23 moves the laminated product to a position sandwiched between the press plate 31 and the press plate 41 while the upper case 20 and the lower case 21 are separated from each other. Then, the stacking apparatus 1 closes the chamber 14 by bringing the upper case 20 and the lower case 21 into close contact with each other while the products to be laminated are moved to a position sandwiched between the press plate 31 and the press plate 41. It becomes possible to pressurize or depressurize the inside.

The carrier film 23 desirably has strength and flexibility that allow it to carry the laminated product. As the carrier film 23, PET or a composite film of PET and elastomer can be used. Further, in the example shown in FIG. 1, the lamination surface of the circuit board A is arranged facing the carrier film 23 side, and the film material B is arranged at a position sandwiched between the circuit board A and the carrier film 23 to be laminated. The product was placed on the carrier film 23 . As for the method of arranging the product to be laminated on the carrier film 23, the circuit board A may be arranged so that the laminated surface of the circuit board A does not face the carrier film 23, and the film material B may be arranged on the laminated surface. It is possible.

The diaphragm 22 is arranged at a position sandwiched between the press plate 31 and the press plate 41 and facing the lamination surface of the circuit board A on which the film material B is laminated. In the example shown in FIG. 1, the diaphragm 22 is provided on the lower case 21 . Although the diaphragm 22 can be provided on the side of the upper case 20, the diaphragm 22 is located between the press plate 31 and the press plate 41, and is laminated on the side where the film material B is laminated on the circuit board A. It is necessary to satisfy the condition that it is arranged at a position facing the surface. The diaphragm 22 divides the inside of the chamber into a first chamber CMB1 in which the transfer positions of the circuit board A and the film material B are set, and a second chamber CMB2 in which the first chamber CMB1 is cut off from the air flow. . In the specification of the present application, an example will be described in which the diaphragm 22 is used as a thin film member for blocking the airflow inside the chamber 14 and dividing the inside of the chamber 14 into the first chamber CMB1 and the second chamber CMB2. The member may be a member such as the diaphragm 22 that is at least partially fixed to the chamber at all times, or a member such as the carrier film 23 that is movable but fixed to the chamber 14 when the chamber 14 is formed.

The hydraulic pump 11 generates hydraulic pressure to be applied to the hydraulic cylinders that move the press plate 41 up and down. The hydraulic valve H<b>1 raises and lowers the press plate 41 by controlling the cylinders based on instructions from the control unit 10 . The ram 44 may be raised and lowered not only by hydraulic pressure, but also by pneumatic pressure, or by a method using a servomotor and a ball screw. When the thickness of the circuit board A is desired, it is desirable to use a method using a servomotor and a ball screw from the viewpoint of ease of position control. In this case, the applied force can be controlled using a load cell.

Compressor 12 provides compressed air to first chamber CMB1 through piping via pneumatic valve P1. Further, the compressor 12 supplies compressed air to the second chamber CMB2 through piping via the pneumatic valve P2. In addition, in the stacking device 1, the opening/closing states of the pneumatic valves P1 and P2 are controlled by the control unit 10 to switch whether or not to pressurize the first chamber CMB1 and the second chamber CMB2.

The vacuum pump 13 draws out the air in the first chamber CMB1 through piping via the vacuum valve V1 to depressurize the first chamber CMB1. Further, the vacuum pump 13 extracts air from the second chamber CMB2 through piping via the vacuum valve V2 to reduce the pressure in the second chamber CMB2. In the stacking apparatus 1, the opening/closing states of the vacuum valves V1 and V2 are controlled by the control unit 10 to switch whether or not to depressurize the first chamber CMB1 and the second chamber CMB2.

The air pressure valve P3 is controlled by the control unit 10 so as to be in an open state when the second chamber CMB2 is switched from the pressurized state to the depressurized state. release to The vacuum valve V3 breaks the vacuum state of the first chamber CMB1 by taking in air from the outside when the first chamber CMB1 is switched from the depressurized state to the pressurized state. Silencers SL1 and SL2 are provided to reduce the sound caused by the input and output of air.

Chamber 14 will now be described in more detail. Therefore, FIG. 2 shows a detailed configuration diagram of the chamber according to the first embodiment. FIG. 2 schematically shows the configuration of the chamber 14, and the shape of the diaphragm 22 is actually flatter than in FIG. FIG. 2 shows a state in which the transfer of the articles to be laminated into the chamber 14 has been completed and the chamber 14 has been sealed. FIG. 2 shows an example in which the lamination surface of the circuit board A to be laminated faces the carrier film 23 and the film material B is arranged so as to be sandwiched between the carrier film 23 and the circuit board A. As shown in FIG.

As shown in FIG. 2, the chamber 14 is constructed by combining an upper case 20 and a lower case 21 . Carrier film 23 extends so as to be sandwiched between upper case 20 and lower case 21 . Then, the circuit board A and the film material B to be laminated are arranged on the upper case 20 side of the carrier film 23 .

A press plate 31 is provided in the upper case 20 . The press plate 31 may be configured to be vertically movable within the upper case 20 . In FIG. 2, the press plate 31 is fixed. A surface elastic body 32 is provided on the surface of the press plate 31 facing the circuit board A. As shown in FIG. The surface elastic body 32 is desirably made of a material having both heat resistance and flexibility. For example, silicone rubber, fluororubber, polyimide, or the like can be used.

A diaphragm 22 is provided in the upper case 20 . The diaphragm 22 divides the chamber 14 into a first chamber CMB1 that serves as a transfer position for the circuit board A and the film material B, and a second chamber CMB2 that blocks airflow from the first chamber CMB1. do. Further, the diaphragm 22 expands toward the first chamber CMB1, thereby applying pressure to the laminated surface of the circuit board A against the film material B. As shown in FIG. The diaphragm 22 is desirably made of a material having both heat resistance and flexibility, such as silicone rubber or fluororubber. Further, the thickness of the diaphragm 22 is, for example, 0.5 mm to 5.0 mm, more preferably 1.0 mm to 3.0 mm. Furthermore, the hardness (Shore A hardness) of the diaphragm is, for example, 20 degrees to 80 degrees, more preferably 40 degrees to 60 degrees. By making the hardness of the diaphragm 22 relatively soft, the unevenness of the circuit board A can be suitably followed. In addition, since the diaphragm 22 is flexibly stretched, it does not interfere with the operation of the ram and the operation of air pressure adjustment in the first and second press steps, which will be described later.

Moreover, although FIG. 2 shows an example in which the diaphragm 22 is provided as a separate configuration, the diaphragm 22 can be replaced by the carrier film 23 .

A press plate 41 , a surface elastic body 42 , a piston 43 and a ram 44 are provided inside the upper case 20 . The piston 43 is a sliding portion of a cylinder that displaces the press plate 41 toward the first chamber CMB1. The ram 44 has one end joined to the piston 43 and the other end joined to the press plate 41 . A surface elastic body 42 is provided on the surface of the press plate 41 facing the diaphragm 22 . The surface elastic body 42 is desirably made of a material having both heat resistance and flexibility. For example, silicone rubber, fluororubber, polyimide, or the like can be used.

Further, the upper case 20 is provided with an airport AP1. The air port AP1 is a connection port for inflowing or discharging air from the first chamber CMB1, and pipes connected to the compressor 12 and the vacuum pump 13 are connected. The lower case 21 is provided with an airport AP2. The air port AP2 is a connection port for inflowing or discharging air from the second chamber CMB2, and pipes connected to the compressor 12 and the vacuum pump 13 are connected.

In addition to the configuration of the chamber 14, the lamination apparatus 1 according to the first embodiment has one of the features in the lamination procedure for laminating the film material B on the circuit board A. As shown in FIG. Therefore, FIG. 3 shows a flow chart for explaining the flow of the lamination process according to the first embodiment. Pressurization control and pressure reduction control in the procedure shown in FIG. 3 are controlled by the control unit 10 . It should be noted that the flowcharts to be described below, including FIG. 3, mainly show important points in the pressure control for the stacked products, and other control procedures may be interposed.

As shown in FIG. 3, in the lamination apparatus 1 according to the first embodiment, when the lamination process is started, the circuit board A is first conveyed between the press plate 31 and the press plate 41, which are pressure positions (step S1). ). Subsequently, the lower case 21 is lifted to seal the chamber 14, and the pressure in the first chamber CMB1 and the second chamber CMB2 is reduced (step S2).

After that, in the stacking apparatus 1, the first chamber CMB1 is maintained in a decompressed state, and a diaphragm pressurization step is performed to pressurize the second chamber CMB2 (step S3). In this step S3, the pneumatic valve P2 and the vacuum valve V1 are opened, and the pneumatic valve P1 and the vacuum valve V2 are closed. In this step S3, the diaphragm 22 bulges toward the first chamber CMB1, and pressure is applied so that the film material B is sandwiched between the laminated surface of the circuit board A and the diaphragm 22. As shown in FIG. The surface pressure at this time depends on the type of the molded article, but is from atmospheric pressure to 1.0 MPa, more preferably from 0.1 MPa to 1.0 MPa. By this diaphragm pressurizing process, the film material B adheres to the irregularities formed on the laminated surface of the circuit board A with high followability. This diaphragm pressurization process ends when a preset pressurization time has elapsed. After the first chamber CMB1 and the second chamber CMB2 are both decompressed in step S2, the second chamber CMB2 is pressurized so that the diaphragm 22 of the circuit board A having unevenness is pressed to follow. Therefore, the conformability of the film material B to the surface is improved.

Subsequently, the laminating apparatus 1 performs a pressing step in which the press plate 31 and the press plate 41 apply pressure in the direction in which the circuit board A and the film material B are sandwiched to form a molded product. In FIG. 3, this pressing process is divided into a first pressing process and a second pressing process. In the first pressing step, both the first chamber CMB1 and the second chamber CMB2 are put into a decompressed state, and the ram 44 is pushed up to press the press plate 41 against the press plate 31 (step S4). The second chamber CMB2 is decompressed in the first pressing step by first opening the air pressure valve P3 and reducing the pressure of the second chamber CMB2, which is above the atmospheric pressure in step S3, to about the atmospheric pressure. After reducing the pressure, the air pressure valve P3 is closed and the vacuum valve V2 is opened to reduce the pressure in the second chamber CMB2 to below atmospheric pressure. The air pressure in the second chamber CMB2 in the first pressing process can be arbitrarily adjusted within a range not exceeding the air pressure in the diaphragm pressurizing process, but it is preferably in a reduced pressure state below the atmospheric pressure. Then, this first pressing step is terminated when a preset pressurizing force is obtained by the cylinder.

In the second press process, the second chamber CMB2 is put into a pressurized state while maintaining the depressurized state of the first chamber CMB1, and the ram 44 is pushed up in the first press process to move the press plate 41 to the press plate 31 side. is further pressed against (step S5). The surface pressure applied to the film material B in this second pressing step is about 5 MPa. This second pressing process ends when a preset pressing time has elapsed. In this pressing step, since the circuit board A and the film material B are pressurized under a high pressure in a vacuum atmosphere, air bubbles generated between the circuit board A and the film material B are removed with a high removing ability. Alternatively, the second chamber CMB2 is pressurized after a small amount of air is first introduced into the second chamber CMB2, or the ram is raised to press the diaphragm 22, which is in close contact with the press plate 41, against the molded product. In this state, the side of the molded product can be pressed by the diaphragm 22, so that the phenomenon that the film material B flows out from the side of the molded product, that is, the molding failure due to the so-called outflow of resin can be prevented, and the desired molded product can be produced more preferably. can be produced. Therefore, it is preferable to divide the pressing process into a first pressing process and a second pressing process. Also, the air pressure in the second chamber CMB2 in the second press process can be arbitrarily adjusted within a range not exceeding the air pressure in the diaphragm pressurization process, but should be equal to or higher than the air pressure in the second chamber CMB2 in the first press process. is preferred.

Subsequently, the stacking apparatus 1 pressurizes the first chamber CMB1 and depressurizes the second chamber CMB2 in a state in which the press plate 31 and the press plate 41 are spaced further apart than in the second press step, thereby forming the A peeling process for peeling the diaphragm 22 from the product is performed (step S6). Thereafter, the lamination apparatus 1 lowers the lower case 21 to release the sealed state of the chamber 14 (step S7), conveys the circuit board A as a molded product to the subsequent stage (step S8), and performs the lamination process. terminate.

As described above, in the lamination device 1 according to the first embodiment, after the diaphragm pressurization is performed to bring the film material B into close contact with the small irregularities formed on the lamination surface of the circuit board A with high followability, high air bubbles are generated. By applying pressurization with removal ability, a molded product is formed in which very few air bubbles are generated between the circuit board A and the film material B and the film material B is sufficiently filled against the unevenness of the circuit board A. can do.

In addition, in the stacking device 1, since the valves control the air pressure states of the first chamber CMB1 and the second chamber CMB2, there is no need for a single pump to have an air delivery capability and an air discharge capability, and the device can be made compact. can do.

Embodiment 2
In Embodiment 2, a chamber 14a, which is another form of the chamber 14, will be described. In the description of the second embodiment, the same reference numerals as in the first embodiment are given to the same constituent elements as in the first embodiment, and the description thereof is omitted.

FIG. 4 shows a detailed configuration diagram of the chamber 14a according to the second embodiment. As shown in FIG. 4, the chamber 14a according to the second embodiment replaces the press plates 31, 41 with hot plates 31a, 41a. In Embodiment 2, a hot plate is used as the temperature adjusting member, and an example in which the hot plate is used to heat the film material B in the temperature adjusting process will be described. The temperature applied to the film material B from the temperature control section can be changed according to the specifications of the film material B and the type of material of the film material B. That is, in the temperature adjustment process described below, the temperature is adjusted for the purpose of adjusting the viscosity of the film material B. FIG.

A molding process using the hot plates 31a and 41a will be described. Therefore, FIG. 5 shows a flow chart for explaining the flow of the lamination process according to the second embodiment. As shown in FIG. 5, in the stacking process according to the second embodiment, the diaphragm pressing process (step S3) and the first press pressing process (step S4) of the stacking process according to the first embodiment shown in FIG. ), the temperature adjustment step (step S11) is performed. In the temperature adjustment process, the circuit board A and the film material B are warmed by heating the hot plates 31a and 41a.

By providing such a heating step, in the lamination method according to the second embodiment, it becomes easier to control the viscosity of the film material B, which is a thermosetting resin, and the embedding property of the film material B into the irregularities of the circuit board A is improved. The time required for raising and pressurizing can be shortened.

Embodiment 3
In Embodiment 3, a chamber 14b that is another form of the chamber 14 according to Embodiment 1 will be described. Also in the description of the third embodiment, the same reference numerals as in the first embodiment are assigned to the same constituent elements as in the first embodiment, and the description thereof is omitted.

FIG. 6 shows a detailed configuration diagram of the chamber 14b according to the third embodiment. As shown in FIG. 6, the chamber 14b has a diaphragm 51 which can be regarded as a second diaphragm when the diaphragm 22 of the chamber 14 is taken as the first diaphragm. The diaphragm 51 is located between the press plate 31 and the press plate 41 and is arranged at a position facing the first diaphragm (eg, the carrier film 23) with the circuit board A and the film material B interposed therebetween. Then, the diaphragm 51 divides the first chamber CMB1 into the first chamber CMB1 and the third chamber CMB3 in which the first chamber CMB1 and the airflow are interrupted. More specifically, in the chamber 14b, the area sandwiched between the carrier film 23 and the diaphragm 51 is the first chamber CMB1, and the area of the third chamber CMB3 on the side of the upper case 20 is the third chamber CMB3. In the chamber 14b, the lower case 21 is provided with an air port AP1 for the first chamber CMB1, and the upper case 20 is provided with an air port AP3 for the third chamber CMB3.

Next, a stacking method according to the third embodiment using the chamber 14b will be described. Therefore, FIG. 7 shows a flow chart for explaining the flow of the lamination process according to the third embodiment. As shown in FIG. 7, the stacking process according to the third embodiment is obtained by replacing steps S3 to S6 of the stacking process according to the first embodiment described with reference to FIG. 3 with steps S21 to S25. In particular, the stacking process according to the third embodiment is characterized in that there are two diaphragm pressurizing processes.

As shown in FIG. 7, in the stacking process according to the third embodiment, after the chamber 14b is sealed in step S2, the first chamber CMB1 is depressurized, the second chamber CMB2 is pressurized, and the third chamber CMB2 is pressurized. A first diaphragm pressurization step is performed in which the pressure in the chamber CMB3 is set to atmospheric pressure (step S21). Subsequently, as a second diaphragm pressurization step, the first chamber CMB1 is depressurized, the second chamber CMB2 is pressurized, and the third chamber CMB3 is pressurized (step S22). Through the first diaphragm pressurizing process and the second diaphragm pressurizing process, the circuit board A and the film material B are entirely covered with the diaphragm. Therefore, in the third embodiment, the film material B can be prevented from leaking out of the circuit board A by the diaphragm surrounding the circuit board A and the film material B. FIG.

Subsequently, in the stacking process according to the third embodiment, the ram 44 is raised to apply a stronger pressure to the press plates 31, 41 while the first chamber CMB1 to the third chamber CMB3 are all in a decompressed state. 1 press step is performed (step S23). After that, the ram 44 is lifted while maintaining the depressurized state of the first chamber CMB1, and the second chamber CMB2 and the third chamber CMB3 are pressurized at the linear timing when the ram 44 completes the lift or when the lift is completed. A second pressing process is performed to increase the pressure applied to the circuit board A and the film material B (step S24). As a result, a molded product in which the film material B is laminated on the circuit board A is completed.

Thereafter, in the lamination process according to the third embodiment, the first chamber CMB1 is pressurized and the second chamber CMB2 and the third chamber CMB3 are depressurized to perform a peeling process of peeling the diaphragm from the molded product. (Step S25). After that, steps S7 and S8 are performed in the same manner as in the first embodiment, and the stacking process according to the third embodiment is completed.

As described above, by using the chamber 14b according to the third embodiment, the circuit board A and the film material B can be surrounded by the diaphragm during pressurization, so that the problem of resin outflow failure during pressurization can be prevented. be able to.

Embodiment 4
In Embodiment 4, details of the carrier film 23 will be described. In Embodiment 4, two forms of carrier film 23 will be described. In the following description, the first example of the carrier film 23 is the carrier film 23a, and the second example is the carrier film 23b.

FIG. 8 shows a schematic diagram for explaining a first example (carrier film 23a) of the structure of the carrier film according to the fourth embodiment. In FIG. 8, the top view of the carrier film 23a is shown in the upper figure, and the sectional view near the center of the carrier film 23a in the width direction is shown in the lower figure. As shown in FIG. 8, the carrier film 23a has a structure in which a base film 61 and a mounting film 62 are overlaid. Further, the mounting film 62 is provided with a hole large enough to receive an object to be transported (for example, the circuit board A). Therefore, in the state where the base film 61 and the mounting film 62 are bonded together, the carrier film 23a has a shape in which a concave portion into which the circuit board A is fitted is formed on the mounting surface on which the circuit board A is mounted.

FIG. 9 shows a schematic diagram for explaining a second example (carrier film 23b) of the structure of the carrier film according to the fourth embodiment. As shown in FIG. 9, the carrier film 23b differs from the carrier film 23a in the shape of the holes provided in the mounting film 62. As shown in FIG. Specifically, the outer peripheral shape of the hole of the carrier film 23b has a convex side in which the contour side of the hole protrudes toward the conveyed object. That is, the outer peripheral shape of the holes in the carrier film 23b has a wave shape.

Here, the base film 61 and the mounting film 62 may be made of the same material or different materials. Also, the number of films to be superimposed should be two or more.

The circuit board A, which is an object to be conveyed, is placed on the carrier film, and the circuit board A is fitted in the concave portion formed on the film, thereby preventing the circuit board A from slipping on the carrier film. In other words, by using a carrier film having a concave portion into which the circuit board A is fitted, the accuracy of the relative position between the press plates 31 and 41 and the circuit board A can be increased, and the unevenness of pressure applied to the circuit board A can be reduced. be able to.

Also, the carrier film is used under tension in the transport direction (for example, the longitudinal direction). At this time, by having a corrugated outer peripheral shape like the carrier film 23b, it is possible to prevent tension from being dispersed in an oblique direction and wrinkles being generated on the bottom surface of the recess. Further, by adopting a corrugated outer peripheral shape like the carrier film 23b, it is possible to prevent the circuit board A from being displaced in the concave portion, thereby further improving the positional accuracy.

In addition, by using different materials for the base film 61 and the mounting film 62, it is possible to enhance the effect of preventing wrinkles caused by the tension applied in the transport direction.

It should be noted that the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the scope of the invention.

(Appendix 1)
a base film;
a mounting film superimposed on the base film and having a hole sized to receive the object to be conveyed;
A carrier film having a

(Appendix 2)
1. The carrier film according to appendix 1, wherein the outer peripheral shape of the hole has a convex side in which the contour side of the hole protrudes toward the conveyed object.

(Appendix 3)
The carrier film according to appendix 1, wherein the base film and the mounting film are made of different materials.

(Appendix 4)
The carrier film according to Supplementary Note 1, wherein the base film also functions as a diaphragm that partitions a chamber in which the object to be conveyed is molded.

Reference Signs List 1 stacking device 10 control unit 11 hydraulic pump 12 compressor 13 vacuum pump 14 chamber 20 upper case 21 lower case 22 diaphragm 23 carrier film 31, 41 press plate 31a, 41a hot plate 32, 42 surface elastic body 43 piston 44 ram 51 diaphragm 61 base film 62 mounting film A circuit board B film material CMB1 first chamber CMB2 second chamber CMB3 third chamber

Claims (13)

A lamination device for molding a molded product in which a film material is laminated on a substrate material,
a chamber configured by combining an upper case and a lower case;
a first press plate and a second press plate provided at positions facing each other in the chamber;
a pressure mechanism that applies pressure to the molded product by changing the relative distance between the first press plate and the second press plate;
The film material is sandwiched between the first press plate and the second press plate, and is arranged at a position facing the lamination surface on the side where the film material is laminated on the substrate material. a diaphragm that divides the first chamber into a first chamber in which transport positions of the substrate material and the film material are set and a second chamber in which the first chamber is interrupted by an air flow;
an air pressure adjustment mechanism that decompresses or pressurizes the first chamber and the second chamber, respectively;
a control unit that controls the air pressure adjustment mechanism and the pressurization mechanism,
In a state in which the substrate material and the film material are positioned between the first press plate and the second press plate, the control unit is configured to:
a diaphragm pressurizing step of depressurizing the first chamber, pressurizing the second chamber, and pressing the film material against the substrate material by the diaphragm;
a pressing step of forming the molded article by applying pressure in a direction in which the substrate material and the film material are sandwiched between the first press plate and the second press plate;
In a state in which the first press plate and the second press plate are separated from the press step, the first chamber is pressurized and the second chamber is depressurized to remove the molded article from the a stripping step of stripping the diaphragm;
Lamination device for carrying out. The pressing step includes
a first pressing step of pressurizing the substrate material and the film material while both the first chamber and the second chamber are decompressed;
a second pressing step of pressurizing the substrate material and the film material while pressurizing the first chamber and depressurizing the second chamber;
The lamination device of claim 1, comprising: At least one of the first press plate and the second press plate is a temperature adjusting member that adjusts the temperature of the film material,
The control unit
2. The laminating apparatus according to claim 1, wherein a temperature adjusting step of adjusting the temperature of said film material is performed between said diaphragm pressurizing step and said pressing step. the diaphragm being a first diaphragm;
a second diaphragm disposed at a position sandwiched between the first press plate and the second press plate and facing the first diaphragm across the substrate material and the film material; have
2. The stacking device according to claim 1, wherein the second diaphragm divides the first chamber into the first chamber and a third chamber in which air flow is interrupted from the first chamber. . The control unit, as the diaphragm pressurizing step,
The first chamber is depressurized, the second chamber is pressurized while the third chamber is atmospheric pressure, and the film material is pressed against the substrate material by the first diaphragm. A diaphragm pressurization process of
5. The stacking apparatus according to claim 4, further comprising a second diaphragm pressurizing step of depressurizing the first chamber and pressurizing the first chamber and the third chamber. 2. The stacking device according to claim 1, wherein the first press plate and the second press plate are provided with elastic members on surfaces facing each other. 2. The laminating apparatus according to claim 1, wherein the substrate material and the film material are transported by a carrier film in a state where the film material is placed on the diaphragm side. 2. The stacking device according to claim 1, wherein said substrate material is an electronic circuit board, and unevenness is formed on said stacking surface by a wiring material of an electronic circuit. 2. The lamination device according to claim 1, wherein said diaphragm is a carrier film for carrying said substrate material. 2. The stacking apparatus according to claim 1, wherein the pressurized state is a pressure state equal to or higher than the atmospheric pressure, and the depressurized state is a pressure state lower than the atmospheric pressure. 2. The stacking apparatus according to claim 1, wherein the pressurizing mechanism uses hydraulic pressure, pneumatic pressure, a servomotor and a ball screw to move the first press plate and the second press plate. It has a first chamber and a second chamber in which an air flow in the chamber is blocked by a thin film member, the first press plate is arranged in the first chamber, and the second press plate is arranged in the second chamber. A lamination method using a lamination device arranged between the first press plate and the thin film member, wherein the substrate material and the film material are transported in an overlapping state,
In a state where the substrate material and the film material are positioned between the first press plate and the second press plate,
a pressurizing step of depressurizing the first chamber, pressurizing the second chamber, and pressing the film material against the substrate material by the thin film member;
a pressing step of forming a molded product by applying pressure in a direction in which the substrate material and the film material are sandwiched between the first press plate and the second press plate;
In a state in which the first press plate and the second press plate are separated from the press step, the first chamber is pressurized and the second chamber is depressurized to remove the molded article from the A peeling step of peeling the thin film member;
A lamination method for a lamination device for carrying out the above. It has a first chamber and a second chamber in which an air flow in the chamber is blocked by a thin film member, the first press plate is arranged in the first chamber, and the second press plate is arranged in the second chamber. A method for manufacturing a molded product in a laminating device in which a substrate material and a film material are arranged and conveyed in a state of being superimposed between the first press plate and the thin film member,
With the substrate material and the film material positioned between the first press plate and the second press plate, the first chamber is depressurized and the second chamber is pressurized. a pressurizing step of pressing the film material against the substrate material by the thin film member and pressing the film material against the first press plate at 0.1 MPa to 1.0 MPa;
After the pressurizing step is completed, the substrate material and the film material are pressed between the first press plate and the second press plate at 1.0 MPa to 5.0 MPa in the direction in which they are sandwiched to form a molded product. a pressing process for molding;
A method for manufacturing a molded product.

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