JP7306130B2 - Gate break method and gate break device - Google Patents

Description

The present invention relates to a gate breaking method and a gate breaking device.

Generally, a semiconductor package is manufactured by supplying a base material such as a lead frame on which a semiconductor element is mounted to a mold, supplying a sealing resin to a pot of the mold, closing the mold, and melting the sealing resin. , is manufactured by encapsulating a semiconductor element with a molten encapsulating resin.

Specifically, the molten sealing resin flows from the pot of the mold through the cull and runner into the cavity to seal the semiconductor element. At this time, since the runner crosses the end face (edge) of the base material, the sealing resin flows and adheres along the end face of the base material. , adheres to the end face.

Unnecessary resin such as culls and runners is removed from the resin-sealed molded product thus formed. It is necessary to remove resin burrs so that they do not remain.

In the past, when resin burrs occurred on a base material, they were removed manually. As a device for removing unnecessary resin, for example, a device described in Patent Document 1 has been proposed to reduce the work load.

The cull and runner removal apparatus described in Patent Document 1 includes a support on which a resin-sealed lead frame to which the cull and runner are attached is mounted, and an extrusion provided on the top of the support for separating the cull and runner from the lead frame. Equipped with a stick.

Among the plurality of push rods for pushing out runners connected to the cavity from the cull, the push rod farther from the cull is formed longer than the push rod closer to the cull by at least the plate thickness of the lead frame.

As a result, the runner can be separated from the lead frame in the direction closer to the cull from the farther side, and the runner can be reliably removed without leaving any resin residue (resin burr) on the lead frame. That's what it means.

JP-A-5-326584

Here, FIG. 11 shows the characteristic configuration of Patent Document 1, "The runner is pushed out from the side far from the cull by the runner pushing rod, and the cull and the runner are separated and discharged." as a practical form of a recent device. It is what I did.

That is, the cull and runner removing device has a plurality of punch plates 91 corresponding to runner pushing rods, inner pins 92 and outer pins 93 arranged side by side on an upper breaking plate 90, which are integrally lifted and lowered. do.

Also, the distance (interval) from the tip of each punch plate 91 or the tips of the inner pins 92 and the outer pins 93 to the base material mounting portion 94 of the lower breaking board (not shown) is determined by the base material mounting portion 94. It is formed so that it becomes larger (separates) in order from the far side to the near side with respect to the cull 81 of the placed resin-sealed molded product 8 .

According to the above configuration of Patent Document 1, in the upper diagram of FIG. 11, the runners 82 are punched by the respective punch plates 91 in order from the left, and as shown in the enlarged left to right enlarged diagrams of FIG. When the runner 82 is punched by the runner 82, the final outer pin 93 has not yet reached the upper surface of the runner 82.

From this state, when the inner pin 92 and the outer pin 93 are further lowered, the part of the runner 82 connected to the base material is pressed by the force acting in the direction of the arrow a1 (see the enlarged right view of FIG. 11). A moment acts in the counterclockwise direction in the figure, centered on .

As a result, the fixing surface 820 of the stepped portion of the runner 82 that is fixed to the end surface 89 of the base material 80 is pressed against the end surface 89 .

Even though the runner 82 is separated from the base material 80 together with the cull 81, the sealing resin is actually left on the end surface 89 by pressing the fixing surface 820 against the end surface 89, resulting in a resin burr (Fig. 11 right enlarged view). (See the hatched part in the figure).

The present invention has been invented in view of the above points. It is an object of the present invention to provide a gate breaking method and a gate breaking device that can more reliably prevent resin burrs from remaining on the end face of a base material.

(1) To achieve the above objects, the present invention provides a gate breaking method in which unnecessary resin is punched out at a punching position from a resin-sealed molded product in which a semiconductor element is mounted on a base material, using a pressing body. a step of fixing the base material and holding the resin-sealed molded product; At the first punching position closer to the cull with the end face of the base material closer to the base as a reference, forces are applied in opposite directions along the surfaces to the end face and the fixing surface of the runner contacting the end face. After punching, the pressing body is passed through a through hole formed in the base material, and the runner is moved to a second punching position opposite to the position of the cull with respect to the end face and closest to the cull. It is a gate breaking method comprising a step of punching with.

In the gate breaking method of the present invention, the substrate is fixed and the resin-sealed molded product is held so that the position of the resin-sealed molded product is determined, and unnecessary resin can be easily punched out by the pressing body.
Further, by moving the pressing body toward the held resin-sealed molded product, it is possible to punch out the runner, which is unnecessary resin remaining in the resin-sealed molded product during molding, by the pressing body.

Furthermore, with the end face of the base material closer to the cull as a reference, the end face of the base material and the fixing surface contacting the end face of the runner are placed in opposite directions along the surfaces at the first punching position closer to the cull. By applying force to the punch, the fixing surface of the runner moves in the direction along the surface without being pressed against the end surface of the base material. can be suppressed.

After that, the pressing body is passed through a through hole formed in the base material, and the runner is punched at a second punching position opposite to the position of the cull with respect to the end face and closest to the cull, thereby temporarily obtaining the above-described runner. After punching at the first punching position, even if the runner is connected to the base material, the runner can be reliably punched and separated at the second punching position.

(2) In the gate breaking method according to the present invention, at the same time as fixing the base material, or after fixing the base material, before or after punching at the first punching position, the end of the base material closer to the cull is elastically bent. It is also possible to provide a step of deforming and peeling off the end surface and the fixing surface by relatively moving them in directions opposite to each other in the direction along the surfaces.

In this case, the end of the base material closer to the cull is elastically deformed at the same time that the base material is fixed, and the end surface of the base material and the fixing surface of the runner are relatively moved in opposite directions along the surface. Therefore, the end surface of the base material and the fixed surface of the runner can be separated before starting the runner punching. As a result, the runner can be punched in a state in which the end face of the base material and the fixed surface of the runner are separated, so that efficient work becomes possible.

(3) In order to achieve the above object, the present invention provides a gate breaking method in which unnecessary resin is punched out at a punching position from a resin-sealed molded article in which a semiconductor element is mounted on a base material, using a pressing body. a step of fixing the base material to hold the resin-sealed molded product; A step of punching at a punching position provided from the far side to the near side with respect to the cull, and at the same time or after fixing the base material, the runner is set with the end surface of the base material closer to the cull as a reference. Before or after punching at the punching position near the cull, the end of the base material closer to the cull is elastically deformed so that the end surface and the fixing surface in contact with the end surface of the runner move in the direction along the surface. and a step of relatively moving in opposite directions to peel off.

In the gate breaking method of the present invention, the substrate is fixed and the resin-sealed molded product is held so that the position of the resin-sealed molded product is determined, and unnecessary resin can be easily punched out by the pressing body.
In addition, the pressing body is passed through a through hole formed in the base material, and the runner, which is an unnecessary resin, is punched out at a punching position provided from the far side of the base material to the near side of the base material with respect to the cull, thereby holding the cull. The runner can be separated from the molded resin-encapsulated product.

At the same time as or after fixing the base material, the end of the base material closer to the cull is elastically deformed so that the end surface of the base material and the fixing surface in contact with the end surface of the runner are mutually aligned in the direction along the surface. By relatively moving in the opposite direction, the end face of the base material and the fixing surface of the runner can be peeled off before or after starting the runner punching at the punching position closer to the cull with respect to the end face of the base material.

(4) In the gate breaking method of the present invention, in the punching step, in the runner, a plurality of punches are provided between an end face of the base material that is farther from the cull of the base material and an end face of the base material that is close to the cull of the base material. It is also possible to provide a step of sequentially punching at the punching positions before reaching the second punching position.

In this case, in the runner, at a plurality of punching positions provided between the end face of the base material far from the cull and the end face of the base material close to the cull, punching is performed sequentially at the punching positions before reaching the second punching position, It is possible to prevent a runner from being subjected to a large stress load due to deformation during punching.

(5) In the gate breaking method of the present invention, in the punching step, in the runner, a plurality of punches are provided between an end face of the base material that is farther from the cull of the base material and an end face of the base material that is close to the cull of the base material. It is also possible to provide a step of punching in random order at the punching positions before reaching the second punching position.

(6) In the gate breaking method of the present invention, in the punching step, the first punching position closer to the cull is first punched with reference to the end surface of the base material closer to the cull. can also

(7) In order to achieve the above object, the present invention provides a gate breaking device for punching and separating unnecessary resin at a punching position from a resin-sealed molded product in which a semiconductor element is mounted on a base material by a pressing body. a molded article holding portion having a first base material mounting portion and a second base material mounting portion arranged in parallel in a direction in which the base material is connected by culls and runners that are unnecessary resin; a fixing part for fixing the base material to the base material mounting part and the second base material mounting part, and holding the resin-sealed molded product in cooperation with the molded product holding part; The first base material mounting portion which is movable toward the holding portion and which is closer to the second base material mounting portion than the end portion of the first base material mounting portion closer to the second base material mounting portion. a first pressing body for punching out the unnecessary resin at a punching position; a second pressing body for punching out the unnecessary resin after punching out the unnecessary resin with the first pressing body at a second punching position of the first base material placement part closest to the part. be.

In the gate breaking device of the present invention, the base material of the resin-sealed molded product is placed on the first base material mounting part and the second base material mounting part, which are arranged side by side, of the molded product holding part by the molded product holding part. can be placed. Further, the gate breaking device can fix the base material to the base material mounting part by the fixing part, and can hold the resin-sealed molded product in cooperation with the molded product holding part.

Then, the first pressing body moves toward the molded article holding section, and the end portion of the first substrate mounting section, which is held by the molded article holding section and the fixed section, near the second substrate mounting section. As a reference, the unnecessary resin of the resin-encapsulated molded product can be punched out at the first punching position near the second substrate mounting portion.

In addition, after punching out the unnecessary resin with the first pressing body, the second pressing body moves toward the molded product holding portion, and the first substrate placing portion is closest to the second substrate placing portion. Unnecessary resin can be punched out at the second punching position.

Thus, according to the present invention, the second punching position on the first substrate mounting portion is earlier than the second punching position closest to the second substrate mounting portion on the first substrate mounting portion. Unnecessary resin is punched out at a first punching position closer to the substrate mounting portion. As a result, the fixed surface of the unnecessary resin fixed to the end face of the base material located close to the end portion near the second base material mounting part in the first base material mounting part is separated from the end face of the base material. Easy to peel off.

(8) In the gate breaking device of the present invention, the end portion of the substrate placed on the first substrate placement portion near the second substrate placement portion is placed on the first substrate placement portion. It is also possible to adopt a configuration including an action portion that elastically deforms in a direction away from the placing portion.

In this case, the end portion of the substrate placed on the first substrate placement portion near the second substrate placement portion is elastically moved away from the first substrate placement portion by the action portion. By deforming, the end face of the base material near the second base material placing portion moves in the same direction, and the unnecessary resin fixed to this end face is peeled off from the end face.

(9) In order to achieve the above objects, the present invention provides a gate breaking device for punching and separating unnecessary resin from a resin-sealed molded product in which a semiconductor element is mounted on a substrate, wherein a molded product holding unit having a first substrate placement unit and a second substrate placement unit arranged side by side in a direction in which the substrates are connected by runners; a fixing portion for fixing the base material to the second base material mounting portion and holding the resin-sealed molded product in cooperation with the molded product holding portion; an action portion that elastically deforms an end portion of the substrate placed near the second substrate placement portion in a direction away from the first substrate placement portion; A pressing body provided corresponding to a punching position provided on the base material mounting part from a far side to a near side with respect to the second base material mounting part, and pressing and punching the unnecessary resin. It is a gate break device provided.

In the gate breaking device of the present invention, the base material of the resin-sealed molded product is placed on the first base material mounting part and the second base material mounting part, which are arranged side by side, of the molded product holding part by the molded product holding part. can be placed. Further, the gate breaking device can fix the base material to the base material mounting part by the fixing part, and can hold the resin-sealed molded product in cooperation with the molded product holding part.

Further, the end portion of the base material placed on the first base material mounting part near the second base material mounting part is elastically deformed by the action part in a direction away from the first base material mounting part. As a result, the end face of the base material near the second base material mounting portion moves in the same direction, and the unnecessary resin fixed to this end face is peeled off from the end face.

Then, the unnecessary resin is pressed and punched out by the pressing bodies provided corresponding to the punching positions provided from the far side to the near side with respect to the second base material mounting section in the first base material mounting section. be able to.

According to this, when the end portion of the base material is elastically deformed by the action portion, even if the unnecessary resin is not peeled off from the end surface of the base material and the adhered state is maintained in the deformed state of the base material, The unnecessary resin is easily peeled off from the end face of the base material by punching out the unnecessary resin with the pressing body.

(10) In the gate breaking device of the present invention, the punching device provided on the first base material mounting portion from the side farther from the second base material mounting portion to before reaching the second punching position. Each of the pressing bodies has a plurality of pressing bodies corresponding to the positions, and each of the pressing bodies has a distance from the tip of the pressing body in the pressing direction to the first base material placing portion. are formed so as to become farther in order in the direction toward the base material mounting portion, the pressing body is movable toward the first base material mounting portion, and the respective pressing bodies are moved by the same amount as each other. It can also be configured that there is.

In this case, the plurality of pressing bodies correspond to the punching positions provided on the first base material mounting portion from the side farther from the second base material mounting portion to before reaching the second punching position. Since each pressing body is provided at a corresponding punching position, unnecessary resin can be punched out.

Then, when each of the pressing bodies moves toward the first base material mounting part by the same amount of movement, the distance from the tip of each pressing body in the pressing direction to the first base material mounting part becomes the second base material mounting part. Each of the pressing bodies, which are sequentially distant in the direction toward the second substrate mounting portion, can punch out the unnecessary resin at the punching position in order from the one farthest from the second substrate mounting portion.

(11) In the gate breaking device of the present invention, the punching device provided on the first base material mounting part from the side farther from the second base material mounting part to before reaching the second punching position It has a plurality of pressing bodies corresponding to the positions, and each of the pressing bodies having different distances from the tip of the pressing body in the pressing direction to the first base material mounting part is arranged in the second base material mounting part. are arranged in random order in the direction toward the base material mounting portion, the pressing bodies are movable toward the first base material mounting part, and the respective pressing bodies have the same movement amount as each other It can also be configured as follows.

In this case, the plurality of pressing bodies correspond to the punching positions provided on the first base material mounting part from the far side to the second base material mounting part before reaching the second punching position. Since it is provided, each pressing body can punch out the unnecessary resin at the corresponding punching position.

When the pressing bodies arranged in random order in the direction toward the second base material mounting portion are moved toward the first base material mounting portion by the same amount of movement, they are in random order. Unnecessary resin can be punched out at a suitable punching position.

(12) In the gate breaking device of the present invention, the distance from the tip of the first pressing body in the pressing direction to the first base material mounting part is the above-mentioned distance from the tip of the second pressing body in the pressing direction. A configuration in which it is formed so as to be closer than the distance to the first base material placing portion can also be adopted.

In this case, when each of the pressing bodies moves toward the first base material mounting part by the same amount of movement, the first base material mounting part first moves from the end face near the second base material mounting part. The first pressing body punches the unnecessary resin at the first punching position closer to the second base material mounting part, and then the second punching position closest to the second base material mounting part on the first base material mounting part. , the unnecessary resin can be punched out by the second pressing body.

The present invention prevents resin burrs from remaining on the end face of a base material when gate breaking is performed to remove unnecessary resin such as culls and runners from a resin-sealed molded product in which a semiconductor element is placed on the base material. It is possible to provide a gate breaking method and a gate breaking device that can reliably prevent this.

BRIEF DESCRIPTION OF THE DRAWINGS It is cross-sectional explanatory drawing of the state which held the resin-sealed molded product which shows one embodiment of the gate breaking apparatus which concerns on this invention. FIG. 2 is an explanatory plan view of a resin-sealed molded product to be gate-broken by a gate-breaking device; 3 is an enlarged view of a portion P1 in FIG. 2; FIG. FIG. 4 is a cross-sectional explanatory view showing the main part when punching of the runner at the first punching position by the gate breaking device according to the present invention starts. FIG. 5 is a side view explanatory view showing a state in which a resin-sealed molded product is placed on a lower break plate in a runner punching process; FIG. 4 is a cross-sectional explanatory view showing a state in which a resin-sealed molded product is held by a clamp and a base material placement portion of a lower breaking board in a runner punching process; FIG. 7 is a cross-sectional explanatory view showing a state in which each pressing body is slightly lowered from the state shown in FIG. 6 in the runner punching process; FIG. 8 is a cross-sectional explanatory view showing a state in which each pressing body is further lowered from the state shown in FIG. 7 and the tip of the first pressing body hits the upper surface of the runner in the runner punching process; In the runner punching process, each pressing body is lowered from the state shown in FIG. 8, and the first pressing body punches the runner to a predetermined position before the tip of the second pressing body touches the runner. It is an explanatory diagram. FIG. 10 is an explanatory view showing a state in which each pressing body is lowered from the state shown in FIG. 9 and the entire runner is punched out together with the cull in the runner punching process; FIG. 2 is a cross-sectional explanatory view showing the characteristic configuration of the cull and runner removing device described in Patent Document 1 as a practical form of recent devices.

Mainly referring to FIGS. 1 to 4, one embodiment of the gate break device according to the present invention will be described in more detail. The cutting position in FIG. 4 corresponds to AA in FIG. 3, and the cross-sectional positions in FIGS. 5 to 10, which will be described later, are the same. The right enlarged view of FIG. 4 is a schematic cross-sectional view taken along line BB in the left enlarged view of FIG.

In addition, in the following description, regarding the expression of "front and back" when explaining the location or direction, the paper surface is " The front side will be described as the front side, and the back side of the paper will be described as the rear side.

In addition, regarding the expression of "up and down", the back side of the paper surface of the figure is defined as "upper", and the front side of the paper surface is defined as "lower". Furthermore, regarding the expression of "left and right", the left side of the paper surface of the drawing is defined as "left", and the right side of the paper surface is defined as "right".

The gate breaking device G is a post-process of molding a resin-sealed molded product 8 using a molding unit (not shown) having a mold in a resin-sealing device (not shown) that manufactures semiconductor packages. , and has a lower breaking board 1 and an upper breaking board 2 (see FIG. 1).

(Resin-encapsulated molded product 8)
Here, the resin-encapsulated molded product 8 to be gate-broken by the gate-breaking device G will be described with reference to FIGS. 2 and 3. FIG. The resin-sealed molded product 8 has two lead frames 80 as base materials arranged side by side connected by a cull 81 and a runner 82 at a required interval.

Each lead frame 80 is connected to a plurality of culls 81 at the same height via runners 82 extending two each from each cull 81 to the rear surfaces of the left and right lead frames 80 (see FIG. 1).

In each lead frame 80, a large number of packages 83 in which a semiconductor is resin-sealed and which are rectangular in plan view are provided in a state of being connected to each runner 82 via a gate 84 (see FIG. 3).

Each lead frame 80 is provided with a plurality of elongated through holes 85 (see FIGS. 3 and 4) penetrating in the front and back direction between the rows of packages 83 in the left-right direction. A punch plate 24, which is a pressing member of the upper breaking board 2, is passed through each through hole 85 as will be described later.

Furthermore, in the row direction of the through holes 85 of each lead frame 80, a circular through hole 87 is provided in the vicinity of the end surface 89 near the cull 81 so as to penetrate the front and back. 2 and 3, the inner punch pins 28, which are the second pressing members of the upper breaking board 2, are passed through the respective through holes 87 in the front-rear direction as will be described later.

(lower break board 1)
The lower breaking board 1 has a holding board 10 movable along a slide guide (not shown). The holding table 10 has a holding portion 12 (a molded product holding portion referred to in the present invention) that holds the resin-sealed molded product 8, and outlets 13 and 13a that are rectangular in plan view on the left and right sides (FIGS. 1 and 2). See Fig. 4, etc.).

Above the outlets 13, 13a, upper outlets 130, 130a having a slightly smaller diameter than the outlets 13, 13a are provided. A plurality of receiving members 14 are provided on the upper openings 130, 130a so as to span the left and right inner walls at predetermined intervals in the front-rear direction (see the left-right enlarged view of FIG. 4).

The upper surface 140 of each receiving member 14 is slightly lower than the upper surface 120 of the holding part 12 (see left enlarged view in FIG. 5) and is provided in parallel with the upper surface 120, and the upper surfaces 140 are at the same height. is set to Each upper surface 140 serves as a portion that receives the lead frame 80 deformed downward when the lead frame 80 is clamped as will be described later (see left and right enlarged views in FIG. 4).

Each receiving member 14 is set at intervals such that each punch plate 24, inner punch pins 28, outer punch pins 27, and runners 82 of the resin-sealed molded product 8, which will be described later, can pass through the space 142 (Fig. 4 See the enlarged view on the right).

At the inner end (the right end in FIG. 5) of the upper surface 140 of each receiving member 14, a projection 141 (action portion referred to in the present invention) having a required height is provided in the front-rear direction so as to partition the upper surfaces 140. There is. The height of the upper surface (reference numerals omitted) of the projection 141 is the same as that of the upper surface 120 of the holding portion 12 (see FIG. 5 left-right enlarged view). , the first substrate mounting portion 11 for mounting the lead frame 80 of the resin-sealed molding 8 . In addition, on the holding table 10, a second substrate mounting portion having a line-symmetrical structure with the first substrate mounting portion 11 is provided so as to be adjacent to the first substrate mounting portion 11 in the right direction. 11a is provided (see FIG. 1).

(Upper break board 2)
The upper breaking board 2 is arranged above the lower breaking board 1. - 特許庁The upper breaking board 2 has a pressing board 20 . In addition, by connecting a lifting operation unit (not shown) with a plurality of connecting members 21 provided on the upper surface of the pressing platen 20 via attachments 210, the pressing platen 20 can be moved up and down in a horizontal state.

Buffer mechanisms 22 and 22a are provided at the left and right ends of the pressing platen 20 to absorb impacts from below using the elasticity of coil springs. A fixed platen 23 (fixed portion referred to in the present invention) for fixing the resin-sealed molding 8 from above is provided in parallel with the pressing platen 20 at a predetermined interval at the lower ends of the cushioning mechanism portions 22 and 22a. (see Figure 1).

In FIG. 1, the punch plates 24 are arranged on a straight line in plan view with a certain interval in the left-right direction (the direction connecting the far side and the near side with respect to the cull 81) to the left of the center line. (See also FIG. 3). In FIG. 1, hatching of each punch plate 24 is omitted for convenience of illustration.

A plurality of (five in the present embodiment) punch plates 24 of a predetermined length are provided on the lower surface of the pressing platen 20 with fixtures 25 interposed therebetween so as to face vertically downward. A set of five punch plates 24 are provided in a plurality of rows corresponding to the gaps (reference numerals omitted) of the receiving members 14 (see FIGS. 2 and 3).

Note that the tip (lower end) of each punch plate 24 is linearly inclined upward to the right in FIG. 4 and the like. This angle of inclination is matched to the angle of the straight line connecting the tip left corner of the leftmost punch plate 24 and the tip of the inner punch pin 28 in FIG. is possible. Moreover, the shape of the inclination is not limited to a straight line, and may be curved.

Through holes 233 through which the punch plates 24 can pass are provided in the fixed platen 23 in the vertical direction through the upper and lower surfaces of the fixed platen 23 . Each through hole 233 corresponds to the through hole 85 of the lead frame 80 of the resin-sealed molding 8 set on the lower breaking plate 1 .

A clamp 231 for fixing the lead frame 80 of the resin-sealed molded product 8 is provided on the lower surface of the stationary platen 23 to the left of the through hole 233 provided at the left end in the left-right direction. A clamp 232 for fixing the lead frame 80 of the resin-sealed molding 8 is provided on the lower surface of the fixed platen 23 to the right of the through hole 233 provided at the right end in the left-right direction.

The tip side (lower side) of each punch plate 24 is inserted through the corresponding through hole 233 . 1 from the tip of each punch plate 24 to the upper surface 140 of the receiving member 14, in the left-right direction, the distance increases (farther) in order from the farther side to the closer side to the cull 81 (the length is increased in order). (See FIGS. 1 and 4).

Further, an outer punch pin 27 as a first pressing body and an inner punch pin 28 as a second pressing body are arranged side by side at the inner end of the pressing platen 20 at a required interval.

The outer punch pin 27 is located at a punching position closer to the second base material mounting portion 11a than the end face 89 of the lead frame 80 (in the present invention, a first punching position closer to the cull with respect to the end face of the base material closer to the cull). position), and has a rectangular cross-sectional shape (see FIG. 3).

Further, the inner punch pins 28 correspond to the clamps 232 and are located at the punching position closest to the second substrate mounting portion 11a in the first substrate mounting portion 11. It is inserted through a through hole 235 vertically provided corresponding to a position opposite to the position of the cull with respect to the end face of the base material and the second punching position closest to the cull, and has a circular cross-sectional shape. (see FIG. 3).

Although the cross-sectional shapes of the outer punch pins 27 and the inner punch pins 28 are as described above, they are not limited to these shapes. For example, the outer punch pins 27 may be polygonal, circular, or elliptical other than rectangular, and the inner punch pins 28 may be polygonal or elliptical other than circular.

The outer punch pins 27 and the inner punch pins 28 are provided in the same row as the punch plates 24 . The inner punch pin 28 closer to the punch plate 24 has a slightly larger (longer) distance from the tip of the punch plate 24 on the rightmost side to the upper surface 140 of the receiving member 14 in FIG. (see FIG. 1).

In addition, the outer punch pins 27 are set so that the distance in FIG. See Figure 4).

The length difference between the outer punch pins 27 and the inner punch pins 28 can be appropriately set by adjusting the mounting position of each punch pin, and the timing at which the outer punch pins 27 and the inner punch pins 28 punch the runners 82 is adjusted. be able to.

The punch plate 24, the outer punch pins 27, and the inner punch pins 28 all move up and down by the same amount of movement, but the present invention is not limited to this. It can also be configured to move forward and backward independently in each direction.

The punch plates 24, the inner punch pins 28, and the outer punch pins 27, which are different in length, are arranged on the left and right in FIG. A description of the punch plates and punch pins that are symmetrically arranged and operate in the same manner as the punch plates 24, the inner punch pins 28 and the outer punch pins 27 will be omitted here.

In the upper breaking board 2 of FIG. 1, another embodiment is shown in which punch pins 24a are employed in place of the punch plate 24 on the right side of the center line.

This structure is substantially the same as the above except that the plate-shaped punch plate 24 is changed to a round-bar-shaped punch pin 24a similar to the inner punch pin 28, and although there is a difference in the shape of the tip that contacts the runner 82. Since the punch pin 24a has the same structure and function as those described below, the description of the function of the punch pin 24a is omitted.

(action)
The operation of the gate breaking device G when breaking the gate of the resin-sealed molding 8 will be described with reference to FIGS. 5 to 10. FIG. The gate breaking of the resin-encapsulated molded product 8 by the gate breaking device G is performed on all of the runners 82 and the culls 81 of each lead frame 80 at the same time.

In the following description, of the two lead frames 80 integral with the resin-encapsulated molded product 8, the left lead frame 80 in FIG. 1 will be mainly described, and the right lead frame 80 will be described. is omitted.

[1] Placement of resin-encapsulated molded product 8 (see FIG. 5)
A resin-sealed molded product 8 molded by the molding unit is received from the lower mold by an unloader (not shown) and transported to a predetermined position of the lower breaking plate 1 stopped at the receiving position of the gate breaking device G. is placed on

Specifically, the resin-sealed molded product 8 has the right end portion of the lead frame 80 in FIG. Put it on 120. As a result, the resin-encapsulated molded product 8 is placed horizontally.

Also, at this time, each runner 82 of the resin-encapsulated molded product 8 is positioned above the corresponding gap portion of each receiving member 14 .

[2] Holding the resin-encapsulated molded product 8 (see FIG. 6)
The upper breaking plate 2 of the gate breaking device G moves to a predetermined position above the lower breaking plate 1, stops there, descends, and clamps 231 and 232 of the fixed plate 23 clamp the resin-encapsulated molded product 8. Push the lead frame 80 down.

At this time, the pressing forces of the clamps 231 and 232 are kept substantially constant by the cushioning mechanisms 22 and 22a, and damage to the lead frame 80 is suppressed. 6, the clamp 232 on the right side is set so as to protrude slightly downward from the clamp 231 on the left side.

As a result, the lead frame 80 resting on the upper surface 120 of the lip of the left holding portion 12 is pressed from above at the same height, and the right clamp 232 holds the end of the lead frame 80 as a receiving member. It is elastically deformed until it hits the upper surface 140 of 14 and is pushed down.

Due to the elastic deformation of the lead frame 80, the right end portion of the lead frame 80 in FIG. 6 is stopped by the protrusion 141 and inclined upward to the right. Moreover, since the lead frame 80 is lowered by the height of the projection 141, the runner 82 is also lowered.

Since the deformation of the lead frame 80 due to clamping is elastic deformation, the lead frame 80 returns to its original flat shape after the clamping is released, so that there is no problem in holding the product during transportation such as product storage.

Further, in the present embodiment, the lead frame 80 is deformed by the projection 141 protruded by lowering the clamp 232. However, the present invention is not limited to this. It can also be configured to be deformed by pressing.

As a result, the right end surface 89 of the lead frame 80 is peeled off from the fixing surface 820 of the stepped portion of the runner 82 , and the portion that hits the projection 141 is deformed, or part of the fixing surface 820 is removed from the end surface 89 . , the lead frame 80 is stopped and is not deformed (see left and right enlarged views in FIG. 4).

Since the end surface 89 and the fixing surface 820 move in the direction of separation when peeled off, resin burrs are less likely to remain on the end surface 89 . Moreover, the elastic deformation of the end of the lead frame 80 is not limited to one side (right) as in the present embodiment. ).

[3] Punching the runner 82 with the punch plate 24 (see FIGS. 4, 7 and 8)
Then, the upper breaking board 2 of the gate breaking device G descends further against the urging forces of the buffering mechanisms 22, 22a.

Along with this, the punch plates 24, the inner punch pins 28 and the outer punch pins 27 descend simultaneously, and first, the punch plates 24 punch the runners 82 at the punching positions in order from the left in FIGS. At this time, each punch plate 24 passes through the through hole 85 of the lead frame 80 from the through hole 233 , and the runner 82 and each punch plate 24 pass through the gaps between the receiving members 14 .

Thereafter, in FIG. 8, at the height at which the punching of the runner 82 by the rightmost punch plate 24 starts, the tip (lower end) of the outer punch pin 27 hits the upper surface of the runner 82 (see enlarged left and right views in FIG. 4). Also, at this time, the tip of the inner punch pin 28 has not yet reached the upper surface of the runner 82 .

That is, of the punch plates 24 and the inner punch pins 28 corresponding to the lead frame 80 , before the inner punch pin 28 at the position (second punching position) that pushes the runner 82 at the final timing hits the runner 82 , the lead frame 80 is The runner 82 is punched by the outer punch pin 27 closer to the cull 81 than the end face 89 closer to the cull 81 .

[4] Punching runner 82 with outer punch pin 27 (see FIGS. 4 and 9)
When the upper breaking plate 2 is further lowered, the outer punch pins 27 pass through the through holes 234 as shown in FIG. 9 from the state shown in FIG. Punching at a punching position located between

As a result, in the above [1], if there is a portion where the end surface 89 of the lead frame 80 and the fixing surface 820 of the runner 82 remain fixed, the end surface 89 and the fixing surface 820 are peeled off again here (enlarged view in FIG. 9). (see diagram).

That is, the punching is performed by applying forces in directions opposite to each other along the surfaces of the end surface 89 of the lead frame 80 and the fixing surface 820 of the runner 82. In addition to the fact that both surfaces were not pressed during elastic deformation, the fixing surface 820 moves in the direction along the surface without being pressed against the end surface 89 in this process as well.

Note that "the end surface 89 of the lead frame 80 and the fixing surface 820 of the runner 82 move in the direction along the surface" includes the case where the end surface 89 and the fixing surface 820 move independently and the case where both move. .

Therefore, the fixing surface 820 is easily peeled off from the end surface 89, and the occurrence of resin burrs on the end surface 89 of the lead frame 80 can be suppressed.

[5] Punching the runner 82 with the inner punch pin 28 (see FIG. 10)
When the upper breaking plate 2 is further lowered, the inner punch pins 28 are lowered together with the outer punch pins 27, pass through the through holes 235 and the through holes 87 of the lead frame 80, and punch the runners 82 at the punching position.

Even if the runner 82 pressed by the outer punch pin 27 is greatly deformed and stops at the same height at the punching position of the inner punch pin 28, the descending inner punch pin 28 surely punches and separates from the lead frame 80. - 特許庁be able to.

[6] Separation of Runner and Cull (See Figure 10)
By separating the runners 82 from the lead frame 80, all the runners 82 adhering to the resin-sealed molded product 8 drop by their own weight together with the cull 81, completing the gate break. As a result, a molded product having no resin burrs on the end faces of the lead frame 80 can be obtained.

As described above, according to the gate breaking device G according to the present invention, gate breaking is performed to remove unnecessary resin such as the cull 81 and the runner 82 from the resin-encapsulated molded product 8 in which the semiconductor element is mounted on the lead frame 80. In this case, it is possible to more reliably prevent resin burrs from remaining on the end face 89 of the lead frame 80 .

The terms and expressions used in the specification and claims are for the purpose of description only and should not be regarded as limiting the features described and claimed herein. There is no intention to exclude some equivalent terms or expressions. Moreover, it goes without saying that various modifications are possible within the scope of the technical idea of the present invention.

G gate breaking device 1 lower breaking board 10 holding table 11 first base material mounting part 11a second base material mounting part 12 holding part 120 upper surface 13, 13a discharge port 130, 130a upper opening 14 receiving member 140 upper surface 141 projection 142 space 2 upper breaking plate 20 pressing plate 21 connecting member 210 fixture 22, 22a cushioning mechanism 23 fixed plate 231, 232 clamp 233 through hole 234 through hole 235 through hole 24 punch plate 25 fixture 27 outer punch pin 28 Inner punch pin 24a Punch pin 8 Resin sealing molding 80 Lead frame 81 Cull 82 Runner 820 Fixing surface 83 Package 84 Gate 85 Through hole 87 Through hole 89 End surface

Claims (14)

A gate breaking method for punching and separating unnecessary resin at a punching position from a resin-encapsulated molded product in which a semiconductor element is placed on a base material by a pressing body,
a step of fixing the base material to hold the resin-encapsulated molded product;
The pressing body is moved toward the held resin-sealed molded product, and the runner, which is the unnecessary resin, is removed at a first punching position near the cull with reference to the end face of the base material near the cull. After the end surface and the fixing surface of the runner contacting the end surface are punched out by applying force in directions opposite to each other along the surface, the pressing body is passed through the through hole formed in the base material, punching the runner at a second punching position opposite to the position of the cull with respect to the end face and closest to the cull;
Simultaneously with fixing the base material, or after fixing the base material, before or after punching at the first punching position, the end portion of the base material closer to the cull is elastically deformed to separate the end surface and the fixing surface. A gate breaking method comprising a step of peeling off by relatively moving in opposite directions along a surface. A gate breaking method for punching and separating unnecessary resin at a punching position from a resin-encapsulated molded product in which a semiconductor element is placed on a base material by a pressing body,
a step of fixing the base material to hold the resin-encapsulated molded product;
a step of penetrating the pressing body through a through hole formed in the base material and punching out the runner, which is the unnecessary resin, at a punching position provided from a far side to a near side with respect to the cull of the base material;
Simultaneously with or after fixing the base material, before or after punching the runner at a punching position closer to the cull with reference to the end surface of the base material closer to the cull, the runner is applied to the cull of the base material. a step of elastically deforming a nearer end to separate the end surface and the fixing surface of the runner in contact with the end surface by relatively moving them in opposite directions along the surface. A gate breaking method for punching and separating unnecessary resin at a punching position from a resin-encapsulated molded product in which a semiconductor element is placed on a base material by a pressing body,
a step of fixing the base material to hold the resin-encapsulated molded product;
The pressing body is moved toward the held resin-sealed molded product, and the runner, which is the unnecessary resin, is removed at a first punching position near the cull with reference to the end face of the base material near the cull. After the end surface and the fixing surface of the runner contacting the end surface are punched out by applying force in directions opposite to each other along the surface, the pressing body is passed through the through hole formed in the base material, punching the runner at a second punching position opposite to the position of the cull with respect to the end face and closest to the cull;
In the punching step, the runner is positioned at a plurality of punching positions provided between an end face of the base material farther from the cull and an end face of the base material closer to the cull, at punching positions before reaching the second punching position. A gate breaking method comprising a step of punching out in order. In the punching step, the runner is positioned at a plurality of punching positions provided between an end face of the base material farther from the cull and an end face of the base material closer to the cull, at punching positions before reaching the second punching position. 2. The gate breaking method according to claim 1, comprising a step of punching out in order at . A gate breaking method for punching and separating unnecessary resin at a punching position from a resin-encapsulated molded product in which a semiconductor element is placed on a base material by a pressing body,
a step of fixing the base material to hold the resin-encapsulated molded product;
The pressing body is moved toward the held resin-sealed molded product, and the runner, which is the unnecessary resin, is removed at a first punching position near the cull with reference to the end face of the base material near the cull. After the end surface and the fixing surface of the runner contacting the end surface are punched out by applying force in directions opposite to each other along the surface, the pressing body is passed through the through hole formed in the base material, punching the runner at a second punching position opposite to the position of the cull with respect to the end face and closest to the cull;
In the punching step, the runner is positioned at a plurality of punching positions provided between an end face of the base material farther from the cull and an end face of the base material closer to the cull, at punching positions before reaching the second punching position. A gate breaking method comprising a step of punching in random order. In the punching step, the runner is positioned at a plurality of punching positions provided between an end face of the base material farther from the cull and an end face of the base material closer to the cull, at punching positions before reaching the second punching position. 2. The gate breaking method according to claim 1, further comprising a step of punching in random order. 2. The gate breaking method according to claim 1, wherein said punching step includes a step of first punching said first punching position closer to said cull with reference to an end face of said base material closer to said cull. A gate breaking device for punching and separating unnecessary resin at a punching position from a resin-sealed molded product in which a semiconductor element is placed on a base material by a pressing body,
a molded product holding portion having a first substrate placement portion and a second substrate placement portion arranged side by side in a direction in which the substrates are connected by culls and runners, which are unnecessary resins;
a fixing part that fixes the base material to the first base material mounting part and the second base material mounting part and holds the resin-sealed molded product in cooperation with the molded product holding part;
It is movable toward the molded article holding part and is close to the second base material mounting part with reference to the end of the first base material mounting part closer to the second base material mounting part. a first pressing body that punches out the unnecessary resin at the first punching position of
The first base material mounting portion which is movable toward the molded product holding portion, is positioned opposite to the second base material mounting portion, and is closest to the second base material mounting portion. a second pressing body for punching out the unnecessary resin after punching out the unnecessary resin with the first pressing body at the second punching position;
An action of elastically deforming an end portion of the base material placed on the first base material mounting part near the second base material mounting part in a direction away from the first base material mounting part. A gate break device comprising a part. A gate break device for punching and separating unnecessary resin from a resin-sealed molded product in which a semiconductor element is placed on a base material,
a molded product holding portion having a first substrate placement portion and a second substrate placement portion arranged side by side in a direction in which the substrates are connected by culls and runners, which are unnecessary resins;
a fixing part that fixes the base material to the first base material mounting part and the second base material mounting part and holds the resin-sealed molded product in cooperation with the molded product holding part;
Among the end portions of the substrate placed on the first substrate placement portion, the end portion near the second substrate placement portion is moved away from the first substrate placement portion. an action portion that elastically deforms;
It is provided corresponding to the punching position of the first base material mounting part, which is provided from the far side to the near side with respect to the second base material mounting part, and presses and punches the unnecessary resin. and a pressing body. A gate breaking device for punching and separating unnecessary resin at a punching position from a resin-sealed molded product in which a semiconductor element is placed on a base material by a pressing body,
a molded product holding portion having a first substrate placement portion and a second substrate placement portion arranged side by side in a direction in which the substrates are connected by culls and runners, which are unnecessary resins;
a fixing part that fixes the base material to the first base material mounting part and the second base material mounting part and holds the resin-sealed molded product in cooperation with the molded product holding part;
It is movable toward the molded article holding part and is close to the second base material mounting part with reference to the end of the first base material mounting part closer to the second base material mounting part. a first pressing body that punches out the unnecessary resin at the first punching position of
The first base material mounting portion which is movable toward the molded product holding portion, is positioned opposite to the second base material mounting portion, and is closest to the second base material mounting portion. a second pressing body that punches out the unnecessary resin after punching out the unnecessary resin with the first pressing body at the second punching position of
A plurality of pressing bodies are provided in correspondence with the punching positions provided on the first base material mounting part from the side farther from the second base material mounting part to before reaching the second punching position. and the distance from the tip of each pressing body in the pressing direction to the first base material mounting part is in order in the direction toward the second base material mounting part. The gate breaking device is formed so as to be distant from each other, the pressing bodies are movable toward the first base material placing portion, and the respective pressing bodies have the same amount of movement as each other. A plurality of pressing bodies are provided in correspondence with the punching positions provided on the first base material mounting part from the side farther from the second base material mounting part to before reaching the second punching position. and the distance from the tip of each pressing body in the pressing direction to the first base material mounting part is in order in the direction toward the second base material mounting part. 9. The gate breaking device according to claim 8, wherein the pressing bodies are formed so as to be distant from each other, the pressing bodies are movable toward the first base material placing portion, and the respective pressing bodies have the same amount of movement. A gate breaking device for punching and separating unnecessary resin at a punching position from a resin-sealed molded product in which a semiconductor element is placed on a base material by a pressing body,
a molded product holding portion having a first substrate placement portion and a second substrate placement portion arranged side by side in a direction in which the substrates are connected by culls and runners, which are unnecessary resins;
a fixing part that fixes the base material to the first base material mounting part and the second base material mounting part and holds the resin-sealed molded product in cooperation with the molded product holding part;
It is movable toward the molded article holding part and is close to the second base material mounting part with reference to the end of the first base material mounting part closer to the second base material mounting part. a first pressing body that punches out the unnecessary resin at the first punching position of
The first base material mounting portion which is movable toward the molded product holding portion, is positioned opposite to the second base material mounting portion, and is closest to the second base material mounting portion. a second pressing body that punches out the unnecessary resin after punching out the unnecessary resin with the first pressing body at a second punching position of the second substrate of the first substrate placing portion; A plurality of pressing bodies are provided corresponding to the punching positions provided from the far side to the placing part until reaching the second punching position, and the tip of each pressing body in the pressing direction The pressing bodies having different distances to the first base material mounting part are arranged in random order in a direction toward the second base material mounting part, and the pressing bodies are aligned with the first base material. The gate breaking device is movable toward the material placing portion, and each of the pressing bodies has the same amount of movement. A plurality of pressing bodies are provided in correspondence with the punching positions provided on the first base material mounting part from the side farther from the second base material mounting part to before reaching the second punching position. and the pressing bodies having different distances from the tip of the pressing body in the pressing direction to the first base material mounting part are arranged in random order in the direction toward the second base material mounting part. 9 . The gate breaking device according to claim 8 , wherein the pressing bodies are movable toward the first substrate mounting portion, and the pressing bodies have the same amount of movement as each other. The distance from the tip of the first pressing body in the pressing direction to the first base material mounting part is the distance from the tip of the second pressing body in the pressing direction to the first base material mounting part. 14. A gate break device according to claim 10, 11, 12 or 13, formed to be closer.

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