JP7303155B2 - パターン測定方法 - Google Patents

パターン測定方法 Download PDF

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Publication number
JP7303155B2
JP7303155B2 JP2020088016A JP2020088016A JP7303155B2 JP 7303155 B2 JP7303155 B2 JP 7303155B2 JP 2020088016 A JP2020088016 A JP 2020088016A JP 2020088016 A JP2020088016 A JP 2020088016A JP 7303155 B2 JP7303155 B2 JP 7303155B2
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pattern
cad
edge
measurement
patterns
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JP2020088016A
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Japanese (ja)
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JP2021182601A (ja
JP2021182601A5 (enExample
Inventor
伸一 中澤
Original Assignee
東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社
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Priority to JP2020088016A priority Critical patent/JP7303155B2/ja
Application filed by 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社 filed Critical 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社
Priority to US17/925,810 priority patent/US20230186459A1/en
Priority to KR1020227043907A priority patent/KR20230012016A/ko
Priority to CN202180035695.5A priority patent/CN115699278A/zh
Priority to PCT/JP2021/017356 priority patent/WO2021235227A1/ja
Priority to TW110117504A priority patent/TW202201590A/zh
Publication of JP2021182601A publication Critical patent/JP2021182601A/ja
Publication of JP2021182601A5 publication Critical patent/JP2021182601A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
    • G06T7/337—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/421—Imaging digitised image, analysed in real time (recognition algorithms)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Quality & Reliability (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2020088016A 2020-05-20 2020-05-20 パターン測定方法 Active JP7303155B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020088016A JP7303155B2 (ja) 2020-05-20 2020-05-20 パターン測定方法
KR1020227043907A KR20230012016A (ko) 2020-05-20 2021-05-06 패턴 측정 방법
CN202180035695.5A CN115699278A (zh) 2020-05-20 2021-05-06 图案测量方法
PCT/JP2021/017356 WO2021235227A1 (ja) 2020-05-20 2021-05-06 パターン測定方法
US17/925,810 US20230186459A1 (en) 2020-05-20 2021-05-06 Pattern measuring method
TW110117504A TW202201590A (zh) 2020-05-20 2021-05-14 圖案測量方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020088016A JP7303155B2 (ja) 2020-05-20 2020-05-20 パターン測定方法

Publications (3)

Publication Number Publication Date
JP2021182601A JP2021182601A (ja) 2021-11-25
JP2021182601A5 JP2021182601A5 (enExample) 2022-07-29
JP7303155B2 true JP7303155B2 (ja) 2023-07-04

Family

ID=78606786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020088016A Active JP7303155B2 (ja) 2020-05-20 2020-05-20 パターン測定方法

Country Status (6)

Country Link
US (1) US20230186459A1 (enExample)
JP (1) JP7303155B2 (enExample)
KR (1) KR20230012016A (enExample)
CN (1) CN115699278A (enExample)
TW (1) TW202201590A (enExample)
WO (1) WO2021235227A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7574157B2 (ja) * 2021-08-27 2024-10-28 株式会社ニューフレアテクノロジー 検査装置及び参照画像生成方法
JP2025144774A (ja) * 2024-03-21 2025-10-03 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社 パターン測定方法およびパターン測定装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149055A (ja) 2005-05-19 2007-06-14 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2008235575A (ja) 2007-03-20 2008-10-02 Toshiba Corp パターン測定方法、パターン測定装置およびプログラム
JP2009243993A (ja) 2008-03-31 2009-10-22 Hitachi High-Technologies Corp 走査型電子顕微鏡を用いた回路パターンの寸法計測装置およびその方法
JP2014025700A (ja) 2012-07-24 2014-02-06 Hitachi High-Technologies Corp パターン計測装置及び方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011137901A (ja) * 2009-12-28 2011-07-14 Hitachi High-Technologies Corp パターン計測条件設定装置
JP2011191296A (ja) * 2010-03-16 2011-09-29 Ngr Inc パターン検査装置および方法
JP5438741B2 (ja) 2011-10-26 2014-03-12 株式会社アドバンテスト パターン測定装置及びパターン測定方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149055A (ja) 2005-05-19 2007-06-14 Nano Geometry Kenkyusho:Kk パターン検査装置および方法
JP2008235575A (ja) 2007-03-20 2008-10-02 Toshiba Corp パターン測定方法、パターン測定装置およびプログラム
JP2009243993A (ja) 2008-03-31 2009-10-22 Hitachi High-Technologies Corp 走査型電子顕微鏡を用いた回路パターンの寸法計測装置およびその方法
JP2014025700A (ja) 2012-07-24 2014-02-06 Hitachi High-Technologies Corp パターン計測装置及び方法

Also Published As

Publication number Publication date
JP2021182601A (ja) 2021-11-25
US20230186459A1 (en) 2023-06-15
KR20230012016A (ko) 2023-01-25
TW202201590A (zh) 2022-01-01
WO2021235227A1 (ja) 2021-11-25
CN115699278A (zh) 2023-02-03

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