JP7290650B2 - ピンフィン型パワーモジュールを製造する方法および治具 - Google Patents

ピンフィン型パワーモジュールを製造する方法および治具 Download PDF

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Publication number
JP7290650B2
JP7290650B2 JP2020541446A JP2020541446A JP7290650B2 JP 7290650 B2 JP7290650 B2 JP 7290650B2 JP 2020541446 A JP2020541446 A JP 2020541446A JP 2020541446 A JP2020541446 A JP 2020541446A JP 7290650 B2 JP7290650 B2 JP 7290650B2
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Japan
Prior art keywords
jig
fin
fins
pin
power module
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JP2020541446A
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English (en)
Japanese (ja)
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JP2021513217A (ja
Inventor
シャオグアン リャン
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ZF Friedrichshafen AG
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ZF Friedrichshafen AG
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Publication of JP2021513217A publication Critical patent/JP2021513217A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2020541446A 2018-01-29 2019-01-10 ピンフィン型パワーモジュールを製造する方法および治具 Active JP7290650B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018201263.6A DE102018201263B3 (de) 2018-01-29 2018-01-29 Ein verfahren und eine vorrichtung zum herstellen eines pin-fin-leistungsmoduls
DE102018201263.6 2018-01-29
PCT/EP2019/050488 WO2019145154A1 (en) 2018-01-29 2019-01-10 A method and a jig for manufacturing a pin-fin type power module

Publications (2)

Publication Number Publication Date
JP2021513217A JP2021513217A (ja) 2021-05-20
JP7290650B2 true JP7290650B2 (ja) 2023-06-13

Family

ID=65036765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020541446A Active JP7290650B2 (ja) 2018-01-29 2019-01-10 ピンフィン型パワーモジュールを製造する方法および治具

Country Status (5)

Country Link
EP (1) EP3747046A1 (zh)
JP (1) JP7290650B2 (zh)
CN (1) CN111527598A (zh)
DE (1) DE102018201263B3 (zh)
WO (1) WO2019145154A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020208862A1 (de) * 2020-07-15 2022-01-20 Zf Friedrichshafen Ag Formwerkzeug zum verkapseln eines pin-fin-artigen leistungsmoduls und verfahren zum herstellen eines leistungsmoduls
EP4205942A4 (en) * 2020-09-16 2023-10-25 Huawei Technologies Co., Ltd. INJECTION MOLD AND INJECTION MOLDING PROCESS

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238644A (ja) 2010-05-06 2011-11-24 Denso Corp パワー半導体モジュールの製造方法
JP2012164763A (ja) 2011-02-04 2012-08-30 Toyota Motor Corp ヒートシンク付き半導体パッケージの製造方法及び当該ヒートシンク
JP2012243941A (ja) 2011-05-19 2012-12-10 Toyota Motor Corp 冶具、半導体モジュールの製造方法及び半導体モジュール
JP2014067771A (ja) 2012-09-25 2014-04-17 Mitsubishi Electric Corp 半導体装置封止用金型及び半導体装置
JP2014175336A (ja) 2013-03-06 2014-09-22 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置ならびに半導体装置の製造装置
JP2015185835A (ja) 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP2016139709A (ja) 2015-01-28 2016-08-04 日立オートモティブシステムズ株式会社 電子装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2965699B1 (fr) 2010-10-05 2013-03-29 Commissariat Energie Atomique Dispositif pour la dissipation thermique destine a au moins un composant electronique et procede correspondant
DE112012005791B4 (de) 2012-01-31 2022-05-12 Mitsubishi Electric Corporation Halbleiterbauteil und Verfahren zu dessen Herstellung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238644A (ja) 2010-05-06 2011-11-24 Denso Corp パワー半導体モジュールの製造方法
JP2012164763A (ja) 2011-02-04 2012-08-30 Toyota Motor Corp ヒートシンク付き半導体パッケージの製造方法及び当該ヒートシンク
JP2012243941A (ja) 2011-05-19 2012-12-10 Toyota Motor Corp 冶具、半導体モジュールの製造方法及び半導体モジュール
JP2014067771A (ja) 2012-09-25 2014-04-17 Mitsubishi Electric Corp 半導体装置封止用金型及び半導体装置
JP2014175336A (ja) 2013-03-06 2014-09-22 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置ならびに半導体装置の製造装置
JP2015185835A (ja) 2014-03-26 2015-10-22 株式会社デンソー 半導体装置及びその製造方法
JP2016139709A (ja) 2015-01-28 2016-08-04 日立オートモティブシステムズ株式会社 電子装置

Also Published As

Publication number Publication date
EP3747046A1 (en) 2020-12-09
JP2021513217A (ja) 2021-05-20
WO2019145154A1 (en) 2019-08-01
CN111527598A (zh) 2020-08-11
DE102018201263B3 (de) 2019-05-16

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