JP7287977B2 - パッドコンディショナカット速度監視 - Google Patents
パッドコンディショナカット速度監視 Download PDFInfo
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- JP7287977B2 JP7287977B2 JP2020547192A JP2020547192A JP7287977B2 JP 7287977 B2 JP7287977 B2 JP 7287977B2 JP 2020547192 A JP2020547192 A JP 2020547192A JP 2020547192 A JP2020547192 A JP 2020547192A JP 7287977 B2 JP7287977 B2 JP 7287977B2
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- pad
- polishing
- conditioner
- polishing pad
- signal
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- 238000012544 monitoring process Methods 0.000 title claims description 31
- 238000005498 polishing Methods 0.000 claims description 146
- 239000000758 substrate Substances 0.000 claims description 34
- 238000011065 in-situ storage Methods 0.000 claims description 11
- 230000005674 electromagnetic induction Effects 0.000 claims description 9
- 230000003750 conditioning effect Effects 0.000 description 24
- 238000005520 cutting process Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 238000004590 computer program Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000010408 sweeping Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
- G01B7/107—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring objects while moving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9006—Details, e.g. in the structure or functioning of sensors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
ここで、Sは信号強度であり、Thは研磨パッドの厚さであり、AおよびBは、既知の研磨パッドの厚さのデータに関数をフィッティングさせるように調整された定数である。
しかしながら、他の関数、例えば、2次以上の多項式関数、またはポリラインが、使用されてもよい。こうして、信号値SNのシーケンスは、厚さ値ThNのシーケンスに変換することができる。
Claims (5)
- 研磨パッドを支持するための表面を有するプラテンと、
前記研磨パッドの研磨面に対して基板を保持するためのキャリアヘッドと、
前記研磨面に対してコンディショナディスクを保持するためのパッドコンディショナと、
インシトゥ研磨パッド厚さ監視システムと、
複数のコンディショナディスク製品の各々のコンディショナディスク製品をそれぞれの摩耗速度閾値に関連付けるデータを記憶し、特定のコンディショナディスク製品を特定するデータ入力を受け取り、前記データ入力に基づいて前記記憶されたデータにおいて前記複数のコンディショナディスク製品から前記特定のコンディショナディスク製品を選択し、前記記憶されたデータに基づいて前記特定のコンディショナディスク製品に対応する特定の摩耗速度閾値を決定し、前記監視システムから信号を受信し、前記信号からパッド摩耗速度の測定量を生成し、前記パッド摩耗速度が前記特定の摩耗速度閾値を下回った場合に警告を生成するように構成されたコントローラと、
を備える、化学機械研磨のための装置。 - 前記インシトゥ研磨パッド厚さ監視システムが、電磁誘導監視システムを備える、請求項1に記載の装置。
- 前記電磁誘導監視システムが、前記プラテン内に電流を誘導するための磁場を生成するように前記パッドコンディショナ上に保持された磁気コアを有するセンサを備える、請求項2に記載の装置。
- 前記パッドコンディショナが、前記プラテンの上方で延在するアームを備え、前記磁気コアが、前記パッドコンディショナの前記アーム上に支持される、請求項3に記載の装置。
- 前記コントローラが、前記信号に予測フィルタを適用して、フィルタリングされた信号を生成するように構成されている、請求項1に記載の装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023085968A JP2023116523A (ja) | 2018-03-14 | 2023-05-25 | パッドコンディショナカット速度監視 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862643134P | 2018-03-14 | 2018-03-14 | |
US62/643,134 | 2018-03-14 | ||
PCT/US2019/021041 WO2019177840A1 (en) | 2018-03-14 | 2019-03-06 | Pad conditioner cut rate monitoring |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023085968A Division JP2023116523A (ja) | 2018-03-14 | 2023-05-25 | パッドコンディショナカット速度監視 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021517074A JP2021517074A (ja) | 2021-07-15 |
JP7287977B2 true JP7287977B2 (ja) | 2023-06-06 |
Family
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JP2020547192A Active JP7287977B2 (ja) | 2018-03-14 | 2019-03-06 | パッドコンディショナカット速度監視 |
JP2023085968A Pending JP2023116523A (ja) | 2018-03-14 | 2023-05-25 | パッドコンディショナカット速度監視 |
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JP2023085968A Pending JP2023116523A (ja) | 2018-03-14 | 2023-05-25 | パッドコンディショナカット速度監視 |
Country Status (6)
Country | Link |
---|---|
US (2) | US11577362B2 (ja) |
JP (2) | JP7287977B2 (ja) |
KR (1) | KR20200122399A (ja) |
CN (2) | CN111263683B (ja) |
TW (1) | TWI839348B (ja) |
WO (1) | WO2019177840A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220116324A (ko) * | 2020-06-29 | 2022-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기계적 연마를 위한 스팀 생성의 제어 |
CN115103738A (zh) * | 2020-06-29 | 2022-09-23 | 应用材料公司 | Cmp中的温度和浆体流动速率控制 |
CN115151376B (zh) * | 2020-07-08 | 2024-05-24 | 应用材料公司 | 多齿磁控保持环 |
US11794305B2 (en) | 2020-09-28 | 2023-10-24 | Applied Materials, Inc. | Platen surface modification and high-performance pad conditioning to improve CMP performance |
WO2022256175A1 (en) * | 2021-06-01 | 2022-12-08 | Applied Materials, Inc. | Methods of modeling and controlling pad wear |
CN114734372A (zh) * | 2022-03-28 | 2022-07-12 | 北京烁科精微电子装备有限公司 | 一种晶圆研磨方法 |
Citations (4)
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JP2007266547A (ja) | 2006-03-30 | 2007-10-11 | Kawasaki Microelectronics Kk | Cmp装置及びcmp装置の研磨パッドコンディショニング処理方法 |
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JP2012056029A (ja) | 2010-09-09 | 2012-03-22 | Ebara Corp | 研磨装置 |
JP2015519740A (ja) | 2012-04-26 | 2015-07-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 |
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-
2019
- 2019-03-06 KR KR1020207029478A patent/KR20200122399A/ko active IP Right Grant
- 2019-03-06 JP JP2020547192A patent/JP7287977B2/ja active Active
- 2019-03-06 CN CN201980005305.2A patent/CN111263683B/zh active Active
- 2019-03-06 WO PCT/US2019/021041 patent/WO2019177840A1/en active Application Filing
- 2019-03-06 US US16/294,604 patent/US11577362B2/en active Active
- 2019-03-06 CN CN202311178955.1A patent/CN117140341A/zh active Pending
- 2019-03-08 TW TW108107782A patent/TWI839348B/zh active
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2023
- 2023-02-09 US US18/167,015 patent/US20230182264A1/en active Pending
- 2023-05-25 JP JP2023085968A patent/JP2023116523A/ja active Pending
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JP2007266547A (ja) | 2006-03-30 | 2007-10-11 | Kawasaki Microelectronics Kk | Cmp装置及びcmp装置の研磨パッドコンディショニング処理方法 |
JP2011519747A (ja) | 2008-05-08 | 2011-07-14 | アプライド マテリアルズ インコーポレイテッド | Cmpパッド厚みおよびプロファイル監視システム |
JP2012056029A (ja) | 2010-09-09 | 2012-03-22 | Ebara Corp | 研磨装置 |
JP2015519740A (ja) | 2012-04-26 | 2015-07-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 研磨のインシトゥ監視時にデータをフィルタリングするための線形予測 |
Also Published As
Publication number | Publication date |
---|---|
US20190283208A1 (en) | 2019-09-19 |
CN117140341A (zh) | 2023-12-01 |
US11577362B2 (en) | 2023-02-14 |
TWI839348B (zh) | 2024-04-21 |
TW202413004A (zh) | 2024-04-01 |
TW201945123A (zh) | 2019-12-01 |
US20230182264A1 (en) | 2023-06-15 |
CN111263683B (zh) | 2024-03-15 |
JP2023116523A (ja) | 2023-08-22 |
JP2021517074A (ja) | 2021-07-15 |
CN111263683A (zh) | 2020-06-09 |
KR20200122399A (ko) | 2020-10-27 |
WO2019177840A1 (en) | 2019-09-19 |
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