JP7269203B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus.

In the process of manufacturing a substrate such as a semiconductor substrate, a process of heating the substrate is performed. Generally, the substrate is heated while the substrate is accommodated in the chamber. For example, a substrate heat treatment apparatus disclosed in Patent Document 1 includes a hot plate, a housing surrounding the hot plate, and a discharge nozzle for discharging heated air into the housing. A substrate heat treatment apparatus heats a substrate by raising the temperature of a hot plate and discharging heated air from a discharge nozzle.

JP 2008-251862 A

By the way, a chamber for housing a substrate is generally made of aluminum, stainless steel (SUS), or the like. Therefore, the conventional chamber tends to dissipate heat, resulting in non-uniform temperature distribution in the chamber. There is a possibility that uneven heating may occur on the substrate. Therefore, there is a demand for a technique for reducing heat radiation from the chamber.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technique for reducing heat dissipation in a chamber.

In order to solve the above problems, a first aspect is a substrate processing apparatus comprising a chamber, a substrate supporting section that supports a substrate in the chamber, and a heating section that heats the substrate supported by the substrate supporting section. and, at least part of the surface of the chamber is made of fiber reinforced resin , and the chamber includes a core layer containing a heat insulating material and a layer covering the core layer, the fiber containing fiber reinforced resin and a reinforced resin layer .
A second aspect is a substrate processing apparatus comprising: a chamber; a substrate supporting section that supports a substrate in the chamber; a heating section that heats the substrate supported by the substrate supporting section; At least a portion of the surface of the chamber is made of a fiber reinforced resin, and the chamber has a first surface made of a first fiber reinforced resin and a second fiber reinforced resin different from the first fiber reinforced resin. and a second surface made of resin.
A third aspect is a substrate processing apparatus comprising: a chamber; a substrate support for supporting a substrate in the chamber; a heating unit for heating the substrate supported by the substrate support; At least a part of the surface of is composed of a plurality of laminated layers of fiber reinforced resin.
A fourth aspect is the substrate processing apparatus according to the third aspect, wherein at least part of the surface of the chamber is composed of different types of laminated fiber reinforced resins.

A fifth aspect is the substrate processing apparatus according to any one of the second aspect to the fourth aspect , wherein the chamber includes a core layer containing a heat insulating material and a layer covering the core layer, the fiber reinforced resin and a fiber reinforced resin layer containing

A sixth aspect is the substrate processing apparatus according to the first aspect or the fifth aspect, wherein the chamber includes a ceiling facing a main surface of the substrate supported by the substrate support, and supported by the substrate support. and a sidewall portion surrounding the side of the substrate that has been shaped.

A seventh aspect is the substrate processing apparatus according to the sixth aspect, wherein the surface of the ceiling portion is made of fiber-reinforced resin.

An eighth aspect is the substrate processing apparatus according to the sixth aspect or the seventh aspect, wherein the surface of the side wall portion is made of fiber reinforced resin.

A ninth aspect is the substrate processing apparatus according to any one of the sixth aspect to the eighth aspect, wherein the heating section is positioned within the ceiling section or the side wall section and forms a flow path through which high-temperature gas can pass. and an injection unit connected to the gas flow path and injecting high-temperature gas passing through the flow path into the chamber.

A tenth aspect is the substrate processing apparatus according to the ninth aspect, wherein the gas flow path portion is positioned within the core layer and covered with a fiber-reinforced resin layer.

An eleventh aspect is the substrate processing apparatus according to any one of the first to tenth aspects, wherein the heating section is positioned within the chamber and has a hot plate that heats the substrate.

According to the substrate processing apparatuses of the first to eleventh aspects, by using a fiber-reinforced resin for at least part of the surface, it is possible to reduce the weight of the chamber while suppressing a decrease in the strength of the chamber. Therefore, heat radiation from the chamber can be reduced by replacing materials with high heat radiation such as aluminum and stainless steel with fiber reinforced resin.

According to the substrate processing apparatus of the first aspect, since the chamber has a heat insulating material, heat radiation from the chamber is reduced. In addition, since the heat insulating material is covered with the fiber-reinforced resin, it is possible to suppress scattering of dust and the like from the heat insulating material.

According to the substrate processing apparatus of the sixth aspect, it is possible to surround the side surfaces of the substrate with the side walls while covering the main surface of the substrate with the ceiling.

According to the substrate processing apparatus of the seventh aspect, heat radiation from the ceiling can be reduced by using fiber-reinforced resin instead of aluminum or stainless steel for the ceiling. Thereby, uneven heating of the main surface of the substrate can be reduced.

According to the substrate processing apparatus of the eighth aspect, by using fiber-reinforced resin instead of aluminum or stainless steel for the side wall, heat radiation from the side wall can be reduced. Thereby, uneven heating of the substrate can be reduced.

According to the substrate processing apparatus of the ninth aspect, the substrate can be heated by injecting the hot gas into the chamber from the injection part. The chamber can be miniaturized because the gas passage portion is arranged in the ceiling portion or the side wall portion.

According to the substrate processing apparatus of the tenth aspect, since the gas channel portion is positioned inside the core layer containing the heat insulating material, the temperature drop of the high-temperature gas in the gas channel portion is suppressed.

According to the substrate processing apparatus of the second aspect, the first surface and the second surface of the chamber can have different characteristics.

According to the substrate processing apparatus of the fourth aspect, the surface of the chamber can have different types of properties.

According to the substrate processing apparatus of the eleventh aspect, it is possible to suppress the heat of the hot plate from diffusing out of the chamber.

1 is a perspective view showing a substrate processing apparatus according to an embodiment; FIG. 1 is a cross-sectional view of a substrate processing apparatus according to an embodiment; FIG. FIG. 4 shows a hot gas supply; FIG. 4 is a cross-sectional view showing part of the chamber; FIG. 4 is a cross-sectional view showing a ceiling part in which a gas channel part is incorporated;

Embodiments of the present invention will be described below with reference to the accompanying drawings. It should be noted that the constituent elements described in this embodiment are merely examples, and are not intended to limit the scope of the present invention only to them. In the drawings, for ease of understanding, the dimensions and numbers of each part may be exaggerated or simplified as necessary.

<1. embodiment>
FIG. 1 is a perspective view showing a substrate processing apparatus 1 according to an embodiment. FIG. 2 is a cross-sectional view of the substrate processing apparatus 1 according to the embodiment. In the following description, the vertically upward direction is simply referred to as "up", and the vertically downward direction is simply referred to as "down". The inside of chamber 2 is simply called "inside" and the outside of chamber 2 is simply called "outside". However, the directions described below are for explaining the positional relationship of each element, and do not limit the positional relationship of each element.

The substrate processing apparatus 1 is a heat processing apparatus that heats a substrate 9 . The substrate 9 to be processed is, for example, various substrates to be processed for electronic devices. Specifically, semiconductor wafers, glass substrates for liquid crystal displays or plasma displays, glass or ceramic substrates for magnetic disks or optical disks, Examples include glass substrates for organic EL, glass or silicon substrates for solar cells, flexible substrates, and printed substrates.

A substrate processing apparatus 1 has a chamber 2 , a plurality of support pins 3 , a hot plate 4 and a hot gas supply section 5 . Each component of the substrate processing apparatus 1 will be described below.

<Chamber>
The chamber 2 is a housing that accommodates the substrate 9 . The chamber 2 forms a processing space for processing the accommodated substrate 9 . The chamber 2 has, for example, a rectangular parallelepiped shape. The chamber 2 has a ceiling portion 21 , side wall portions 22 and a bottom portion 23 . The ceiling part 21 is a partition wall that partitions the upper side of the accommodation space. The bottom portion 23 is a partition wall that partitions the lower side of the accommodation space. The side wall portion 22 is a partition wall that partitions the accommodation space between the ceiling portion 21 and the bottom portion 23 . When the substrate 9 is supported by the upper ends of the support pins 3 to be described later, the inner surface of the ceiling portion 21 faces the upper surface, which is the main surface (largest surface) of the substrate 9 . Moreover, the inner surface of the side wall portion 22 faces the side surface of the substrate 9 . Side wall portion 22 surrounds the side surface of substrate 9 .

The ceiling part 21 has, for example, a rectangular shape when viewed from above. The side wall portion 22 has, for example, a rectangular annular shape when viewed from above. A lower end of the ceiling portion 21 is connected to an upper end of the side wall portion 22 . Note that the ceiling portion 21 may be placed above the side wall portion 22 . In this case, the ceiling part 21 or the side wall part 22 may be in contact via packing. The packing can eliminate the gap between the ceiling portion 21 and the side wall portion 22 .

The side wall portion 22 has an opening portion 221 and a door portion 223 . The opening 221 constitutes a loading port that communicates the inside and the outside of the chamber 2 . The substrate 9 is taken in and out of the chamber 2 through the opening 221 . The door portion 223 is movable between a closed position that closes the inlet and an open position that opens the inlet. As shown in FIG. 2, the arm 100 of the transport mechanism loads the substrate 9 to be processed into the chamber 2 . Also, the arm 100 unloads the substrate 9 that has undergone the heat treatment from the chamber 2 .

<Support pin>
The substrate processing apparatus 1 has a plurality of support pins 3 and a pin drive section 31 . The support pin 3 has a bar shape extending in the vertical direction. The support pin 3 penetrates the bottom portion 23 and the hot plate 4 in the vertical direction. The pin drive unit 31 moves the support pins 3 integrally along the vertical direction. A plurality of support pins 3 horizontally support the substrate 9 within the chamber 2 . The plurality of support pins 3 are examples of substrate supports that support the substrate 9 within the chamber 2 .

<Hot plate>
The hot plate 4 is installed on the bottom 23 side inside the chamber 2 . Chamber 2 surrounds hot plate 4 . The hot plate 4 has a heater (heat source) inside. Hot plate 4 is an example of a heating unit.

The bottom 23 of the chamber 2 and the hot plate 4 have a plurality of through-holes passing through them in the thickness direction. Each support pin 3 is inserted through a through-hole of the bottom portion 23 and the hot plate 4 .

<High temperature gas supply part>
FIG. 3 is a diagram showing the hot gas supply unit 5. As shown in FIG. The high-temperature gas supply unit 5 is a device that supplies high-temperature gas into the chamber 2 . The high-temperature gas supply unit 5 has a plurality of gas passage units 51 , a plurality of injection units 53 , a heater 55 and an air supply unit 57 .

The gas channel portion 51 constitutes a channel through which high-temperature gas can pass. The gas channel portion 51 is incorporated in the ceiling portion 21 . The gas flow path portion 51 is positioned inside the ceiling portion 21 . The injection section 53 is connected to the gas flow path section 51 . The injection part 53 forms an injection port for injecting the high-temperature gas flowing through the flow path of the gas flow path part 51 into the chamber 2 . The injection port corresponds to a vent for supplying air into the chamber 2 . The injection part 53 is a tubular member that forms an opening on the inner surface of the ceiling part 21 . The injection part 53 is positioned on the ceiling part 21 .

The high-temperature gas supply section 5 includes a plurality of sets (five sets in this example) of the gas flow path section 51 and the injection section 53 . However, the high-temperature gas supply unit 5 may include only one set of the gas flow path unit 51 and the injection unit 53 .

An upstream end portion of each gas flow path portion 51 is exposed to the outside of the ceiling portion 21 and connected to a heater 55 . The heater 55 is, for example, an in-line heater. The injection section 53 is connected to the heater 55 via the gas flow path section 51 . The air supply unit 57 supplies gas to the heater 55 . The air supply unit 57 has, for example, a fan. The heater 55 heats the gas supplied from the air supply section 57 . The gas heated by the heater 55 passes through each gas flow path portion 51 and is jetted from each injection portion 53 into the chamber 2 . As a result, the temperature inside the chamber 2 rises, so that the substrate 9 housed inside the chamber 2 is heated. The hot gas supply section 5 is an example of a heating section.

Each injection part 53 may be evenly distributed on the inner surface of the ceiling part 21 . As a result, uneven heating of the substrate 9 is suppressed because the high-temperature gas is prevented from becoming biased in the chamber 2 .

As shown in FIG. 2 , the chamber 2 may have an exhaust port 225 that communicates with the outside of the chamber 2 . Gas in the chamber 2 may be discharged to the outside through the exhaust port 225 . Also, the exhaust port 225 may communicate with the air supply portion 57 . In this case, the gas discharged from the chamber 2 through the exhaust port 225 can be returned to the chamber 2 again.

When the substrate 9 is heat-treated in the substrate processing apparatus 1, first, the opening 221 is opened by moving the door 223 to the open position. With the opening 221 open, the substrate 9 , which is horizontally supported by the arm 100 of the transport mechanism, is inserted into the chamber 2 and placed above the hot plate 4 . The pin drive section 31 lifts the substrate 9 from the arm 100 by raising each support pin 3 . Arm 100 then retreats outside chamber 2 . When the arm 100 is retracted, the pin drive section 31 lowers the support pins 3 to place the substrate 9 at a heating position close to the hot plate 4 . The hot plate 4 is heated while the substrate 9 is placed at the heating position. Then, the substrate 9 is heated by the radiant heat of the hot plate 4 . Also, the high-temperature gas supply unit 5 supplies high-temperature gas into the chamber 2 . The substrate 9 is heated by this high temperature gas.

FIG. 4 is a cross-sectional view showing part of the chamber 2. As shown in FIG. The chamber 2 has a core layer 25 , a first fiber reinforced resin layer 26 and a second fiber reinforced resin layer 27 .

Core layer 25 includes, for example, a heat insulating material. The heat insulating material is, for example, a fiber heat insulating material, a foamed heat insulating material, an aerogel, a fumed silica, or a vacuum heat insulating material. Fiber-based heat insulating materials are, for example, glass wool, rock wool, cellulose fibers, carbonized cork, wool heat insulating materials, wood fibers, and the like. Foamed heat insulating materials are, for example, urethane foam, phenol foam, polystyrene foam, bead polystyrene (EPS), foamed rubber (FEF), and extruded polystyrene (XPS). Aerogels are, for example, sia aerogels, carbon aerogels, alumina aerogels.

The first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27 are made of fiber reinforced resin (FRP: Fiber Reinforced Plastics). A fiber-reinforced resin is a reinforced resin in which fibers are combined with a resin to improve strength. A fiber-reinforced resin can be produced by impregnating a sheet-like fiber cloth with a resin. The resin is a thermosetting resin or a thermoplastic resin. Thermosetting resins are, for example, epoxies, vinyl esters, phenols, unsaturated polyesters, polyimides, bismaleimides. Thermoplastic resins are, for example, polyolefins, polyamides, polycarbonates, polyphenylene sulfides, polyetheretherketones. Fibers are, for example, glass fibres, carbon fibres, basalt fibres, boron fibres, aramid fibres, polyethylene fibres, polyparaphenylenebenzobisoxazole fibres.

By using a fiber-reinforced resin for the surface of the chamber 2, it is possible to reduce the weight of the chamber 2 while suppressing a decrease in the strength of the chamber 2. By replacing materials with relatively high heat dissipation such as aluminum and stainless steel with fiber reinforced resin, the heat dissipation of the chamber 2 can be reduced.

The first fiber reinforced resin layer 26 is positioned inside the core layer 25 . The second fiber reinforced resin layer 27 is positioned outside the core layer 25 . That is, the ceiling portion 21 , the side wall portion 22 and the bottom portion 23 of the chamber 2 have a first fiber reinforced resin layer 26 , a core layer 25 and a second fiber reinforced resin layer 27 in order from inside to outside of the chamber 2 . Thus, the chamber 2 is made of a heat insulating material (core layer 25) whose surface is covered with fiber reinforced resin (first fiber reinforced resin layer 26 and second fiber reinforced resin layer 27).

<First fiber reinforced resin layer>
The first fiber reinforced resin layer 26 has a first inner layer 261 and a first surface layer 263 . The first inner layer 261 is located inside the core layer 25 . A first inner layer 261 covers the inner surface of the core layer 25 . The first surface layer 263 is located inside the first inner layer 261 . A first surface layer 263 covers the inner surface of the first inner layer 261 . The first surface layer 263 is the inner surface of the chamber 2 . That is, the first surface layer 263 constitutes the surface of the core layer 25 (heat insulating material) exposed to the processing space formed by the chamber 2 . The first inner layer 261 and the first surface layer 263 are made of fiber-reinforced resins of different types. That is, the inner surface of the chamber 2 is composed of multiple types of fiber reinforced resins laminated in the thickness direction.

<Second fiber reinforced resin layer>
The second fiber reinforced resin layer 27 has a second inner layer 271 and a second surface layer 273 . The second inner layer 271 is located outside the core layer 25 . A second inner layer 271 covers the outer surface of the core layer 25 . The second surface layer 273 is located outside the second inner layer 271 . A second surface layer 273 covers the outer surface of the second inner layer 271 . The second surface layer 273 is the outer surface of the chamber 2 . The second inner layer 271 and the second surface layer 273 are made of different types of fiber reinforced resin. That is, the outer surface of the chamber 2 is composed of multiple types of fiber reinforced resins laminated in the thickness direction.

During heat treatment, the first fiber reinforced resin layer 26 is exposed to a higher temperature than the second fiber reinforced resin layer 27 . Therefore, the first fiber reinforced resin layer 26 may be made of a fiber reinforced resin having a lower coefficient of thermal expansion than the fiber reinforced resin of the second fiber reinforced resin layer 27 . By forming the first fiber reinforced resin layer 26 exposed to high temperatures with a fiber reinforced resin having a low coefficient of thermal expansion, deformation of the chamber 2 due to heat treatment is suppressed.

The resins used in each of the first inner layer 261 and the first surface layer 263 may be different. The first surface layer 263 may contain a resin having a higher chemical resistance grade than the resin contained in the first inner layer 261 (chemical resistant resin). Chemical resistant resins are, for example, phenols, unsaturated polyesters, polyphenylene sulfides. The first inner layer 261 may contain a resin (flame-retardant resin) having a higher flame resistance grade than the resin of the first surface layer 263 . A flame-retardant resin is, for example, phenol. Also, the first inner layer 261 may contain a resin (heat resistant resin) having a higher heat resistance grade than the resin of the first surface layer 263 . Heat-resistant resins are, for example, polyimide, bismaleimide, polyamide, polyphenylene sulfide, and polyetheretherketone. By configuring the surface of the chamber 2 with a plurality of types of fiber reinforced resins including resins with different resistances, the surface of the chamber 2 can be given different types of resistance (characteristics).

The first surface layer 263 may have a higher cosmetic grade than the fiber reinforced resin of the first inner layer 261 . The second surface layer 273 may be composed of a fiber reinforced resin having a higher cosmetic grade than the fiber reinforced resin of the second inner layer 271 . By increasing the cosmetic grade of the first surface layer 263 and the second surface layer 273, dust generation from the chamber 2 can be suppressed.

The first surface layer 263 is, for example, fiber-reinforced resin in which chemical-resistant resin is reinforced with basalt fiber. The first inner layer 261 is, for example, fiber-reinforced resin in which flame-retardant resin is reinforced with glass fiber. The second surface layer 273 is, for example, fiber-reinforced resin in which chemical-resistant resin is reinforced with glass fiber. The second inner layer 271 is, for example, fiber-reinforced resin in which flame-retardant resin is reinforced with carbon fiber.

The first surface layer 263 may be thinner than the first inner layer 261 . Also, the second surface layer 273 may be thinner than the second inner layer 271 . By thinning the first surface layer 263 or the second surface layer 273, the material cost of the chamber 2 can be suppressed.

The core layer 25 is covered with a first fiber reinforced resin layer 26 and a second fiber reinforced resin layer 27 . That is, the heat insulating material is covered with a fiber-reinforced layer. Thereby, it is possible to suppress the heat insulating material from generating dust. Therefore, contamination of the substrate processing apparatus 1 by dust from the heat insulating material is suppressed. The entire outer surface of the core layer 25 may be covered with a layer of fiber reinforced resin. That is, of the core layer 25, not only the main surfaces on both sides but also the side surfaces excluding the main surfaces on both sides may be covered with the fiber-reinforced resin layer. In this case, dust generation from the heat insulating material included in the core layer 25 can be suppressed compared to the case where a portion of the surface of the core layer 25 is covered with a fiber-reinforced resin layer.

By having the heat insulating material in the chamber 2 , it is possible to suppress the heat of the hot plate 4 and the heat of the gas supplied by the high-temperature gas supply unit 5 from diffusing to the outside of the chamber 2 .

FIG. 5 is a cross-sectional view showing the ceiling portion 21 in which the gas channel portion 51 is incorporated. The gas channel portion 51 may be arranged in the core layer 25 . That is, the gas flow path portion 51 may be arranged between the first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27 . Each gas flow path portion 51 may be arranged, for example, in a plurality of accommodation grooves 251 previously provided on the inner surface of the core layer 25 (see FIGS. 4 and 5). The plurality of accommodation grooves 251 are concave portions that are provided in advance on one main surface of the core layer 25 (a heat radiating material in this example). One main surface is, for example, the surface covered with the first fiber reinforced resin layer 26 .

When the gas channel portion 51 is accommodated in the accommodation groove 251 , for example, in a state in which the gas channel portion 51 and the injection portion 53 are installed in the accommodation groove 251 , a second One inner layer 261 may be formed. The first inner layer 261 is formed, for example, by molding. Specifically, the core layer 25 and the fiber cloth for forming the first inner layer 261 are placed in an overlapping fashion in a mold (not shown). Then, the resin impregnates the fiber cloth by pouring the resin for forming the first inner layer 261 into the mold. After that, the first internal layer 261 is formed on one main surface of the core layer 25 by curing the resin. When forming the first inner layer 261 , the resin may enter the accommodation groove 251 of the core layer 25 . In this case, as shown in FIG. 5 , the gap between the inner surface of the accommodation groove 251 and the outer surface of the gas passage portion 51 is filled with resin, thereby fixing the gas passage portion 51 within the accommodation groove 251 . After the first inner layer 261 is formed, the first surface layer 263 is formed. The second fiber reinforced resin layer 27 can also be formed on the other main surface of the core layer 25 in the same manner as the first fiber reinforced resin layer 26 .

Since the gas flow path part 51 is incorporated in the core layer 25 containing the heat insulating material, the temperature drop of the high-temperature gas in the gas flow path part 51 is suppressed.

<2. Variation>
Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

The pin driving section 31 may place the substrate 9 on the hot plate 4 by moving the upper end of each support pin 3 below the upper surface of the hot plate 4 . The substrate 9 may be heated while being supported by the hot plate 4 . In this case, the hot plate 4 functions as a substrate support.

The substrate supporting portion may be a support that holds the peripheral portion of the substrate 9 .

The gas flow path portion 51 is incorporated in the ceiling portion 21 , but may be incorporated in the side wall portion 22 .

The first fiber reinforced resin layer 26 is composed of two layers (the first inner layer 261 and the first surface layer 263), but may be composed of a single layer or three or more layers. good. The same applies to the second fiber reinforced resin layer 27 as well.

The first fiber reinforced resin layer 26 and the second fiber reinforced resin layer 27 may be made of the same fiber reinforced resin.

One surface of the chamber 2 may be composed of different types of fiber-reinforced resin. For example, in one first inner layer 261, a part and other parts may be made of fiber-reinforced resins of different types.

The substrate processing apparatus 1 may be configured to heat-process a plurality of substrates 9 at the same time. The substrate processing apparatus 1 may include a substrate supporting section capable of simultaneously supporting a plurality of substrates 9 inside the chamber 2 .

It is not essential for the substrate processing apparatus 1 to include both the hot plate 4 and the hot gas supply section 5 as heating sections. The substrate processing apparatus 1 may include only one of the hot plate 4 and the hot gas supply section 5 . Further, the substrate processing apparatus 1 may be provided with a configuration (for example, a lamp) that heats the substrate 9 by a method different from that of the hot plate 4 and the hot gas supply unit 5 .

The substrate processing apparatus 1 may be provided in the chamber 2 with a supply unit for supplying mist of the processing liquid or vapor (fume) of the processing liquid. In this case, a tank for storing the processing liquid and a heating unit for heating the processing liquid from the tank may be provided outside the chamber 2 . Also, a channel portion through which the processing liquid from the tank passes may be incorporated in the core layer 25 as in the gas channel portion 51 .

Although the present invention has been described in detail, the above description is, in all aspects, illustrative and not intended to limit the present invention. It is understood that numerous variations not illustrated can be envisioned without departing from the scope of the invention. Each configuration described in each of the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

REFERENCE SIGNS LIST 1 substrate processing apparatus 2 chamber 3 support pin 4 hot plate 5 high temperature gas supply section 9 substrate 21 ceiling section 22 side wall section 25 core layer 26 first fiber reinforced resin layer 27 second fiber reinforced resin layer 51 gas flow path section 53 injection section 55 heater 261 first internal layer 263 first surface layer 271 second internal layer 273 second surface layer

Claims (11)

A substrate processing apparatus,
a chamber;
a substrate support that supports the substrate in the chamber;
a heating unit that heats the substrate supported by the substrate support;
with
At least part of the surface of the chamber is made of fiber reinforced resin,
The chamber is
a core layer comprising thermal insulation;
A fiber reinforced resin layer that covers the core layer and contains a fiber reinforced resin;
A substrate processing apparatus having A substrate processing apparatus,
a chamber;
a substrate support that supports the substrate in the chamber;
a heating unit that heats the substrate supported by the substrate support;
with
At least part of the surface of the chamber is made of fiber reinforced resin,
The chamber is
a first surface composed of a first fiber reinforced resin;
a second surface composed of a second fiber reinforced resin different from the first fiber reinforced resin;
A substrate processing apparatus having A substrate processing apparatus,
a chamber;
a substrate support that supports the substrate in the chamber;
a heating unit that heats the substrate supported by the substrate support;
with
A substrate processing apparatus, wherein at least part of the surface of the chamber is composed of a plurality of laminated fiber-reinforced resin layers. The substrate processing apparatus according to claim 3 ,
A substrate processing apparatus, wherein at least part of the surface of the chamber is composed of different types of laminated fiber reinforced resins. The substrate processing apparatus according to any one of claims 2 to 4 ,
The chamber is
a core layer comprising thermal insulation;
A substrate processing apparatus comprising a fiber reinforced resin layer containing a fiber reinforced resin, the layer covering the core layer. The substrate processing apparatus according to claim 1 or claim 5 ,
The chamber is
a ceiling facing the main surface of the substrate supported by the substrate support;
a sidewall portion surrounding a side surface of the substrate supported by the substrate support;
A substrate processing apparatus having The substrate processing apparatus according to claim 6 ,
The substrate processing apparatus, wherein the surface of the ceiling portion is made of fiber reinforced resin. The substrate processing apparatus according to claim 6 or 7 ,
The substrate processing apparatus, wherein the surface of the side wall portion is made of fiber reinforced resin. The substrate processing apparatus according to any one of claims 6 to 8 ,
The heating unit
a gas flow path portion positioned in the ceiling portion or the side wall portion and forming a flow path through which high-temperature gas can pass;
an injection unit that is connected to the gas flow path and that injects into the chamber a high-temperature gas that passes through the flow path;
A substrate processing apparatus having The substrate processing apparatus according to claim 9 ,
The substrate processing apparatus, wherein the gas flow path portion is positioned within the core layer and is covered with a fiber-reinforced resin layer. The substrate processing apparatus according to any one of claims 1 to 10 ,
the heating unit is a hot plate that is positioned in the chamber and heats the substrate;
A substrate processing apparatus having

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