JP7263771B2 - 塗布剤、吐出物及び塗布装置 - Google Patents

塗布剤、吐出物及び塗布装置 Download PDF

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JP7263771B2
JP7263771B2 JP2018247319A JP2018247319A JP7263771B2 JP 7263771 B2 JP7263771 B2 JP 7263771B2 JP 2018247319 A JP2018247319 A JP 2018247319A JP 2018247319 A JP2018247319 A JP 2018247319A JP 7263771 B2 JP7263771 B2 JP 7263771B2
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water
insoluble
coating agent
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solvent
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JP2020105444A5 (https=
JP2020105444A (ja
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浩孝 山口
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Toppan Inc
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Toppan Inc
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  • Manufacturing Of Printed Wiring (AREA)
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JP2018247319A 2018-12-28 2018-12-28 塗布剤、吐出物及び塗布装置 Active JP7263771B2 (ja)

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JP2020105444A JP2020105444A (ja) 2020-07-09
JP2020105444A5 JP2020105444A5 (https=) 2021-12-16
JP7263771B2 true JP7263771B2 (ja) 2023-04-25

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7552143B2 (ja) * 2020-08-24 2024-09-18 Toppanホールディングス株式会社 パターン印刷方法および印刷物
JP7651976B2 (ja) * 2020-09-30 2025-03-27 Toppanホールディングス株式会社 パターン印刷物の製造方法、及び、パターン印刷物
JP7803112B2 (ja) * 2021-09-06 2026-01-21 Toppanホールディングス株式会社 発熱体および駆動装置
WO2023074652A1 (ja) * 2021-11-01 2023-05-04 東レ株式会社 組成物および塗料

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071365A (ja) 2001-08-31 2003-03-11 Sony Corp 液体塗布装置及び液体塗布方法
JP2003208825A (ja) 2001-09-27 2003-07-25 Bridgestone Corp 樹脂コーティング導電材、半導電性部材及び電子写真装置
JP2009062419A (ja) 2007-09-04 2009-03-26 Kao Corp 水系顔料分散体の製造方法
JP2013504152A (ja) 2009-09-04 2013-02-04 ビーエーエスエフ ソシエタス・ヨーロピア 電極を印刷するための組成物
JP2014096369A (ja) 2013-11-25 2014-05-22 Konica Minolta Inc 透明導電性フィルム及びその製造方法
WO2015029627A1 (ja) 2013-08-27 2015-03-05 関西ペイント株式会社 水性塗料組成物及び塗装物品
US20150171238A1 (en) 2013-12-17 2015-06-18 Industrial Technology Research Institute Conductive paste composition and method for manufacturing electrode
WO2017047523A1 (ja) 2015-09-18 2017-03-23 東レ株式会社 グラフェン分散液およびその製造方法、グラフェン-活物質複合体粒子の製造方法ならびに電極用ペーストの製造方法
JP2017069175A (ja) 2015-09-30 2017-04-06 Dowaエレクトロニクス株式会社 導電性ペースト及び導電膜
JP2018070854A (ja) 2016-11-04 2018-05-10 凸版印刷株式会社 塗布剤、吐出物、及び塗布装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936954B2 (ja) * 1976-12-03 1984-09-06 日触アロ−化学株式会社 水性焼付塗料用ビヒクル

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071365A (ja) 2001-08-31 2003-03-11 Sony Corp 液体塗布装置及び液体塗布方法
JP2003208825A (ja) 2001-09-27 2003-07-25 Bridgestone Corp 樹脂コーティング導電材、半導電性部材及び電子写真装置
JP2009062419A (ja) 2007-09-04 2009-03-26 Kao Corp 水系顔料分散体の製造方法
JP2013504152A (ja) 2009-09-04 2013-02-04 ビーエーエスエフ ソシエタス・ヨーロピア 電極を印刷するための組成物
WO2015029627A1 (ja) 2013-08-27 2015-03-05 関西ペイント株式会社 水性塗料組成物及び塗装物品
JP2014096369A (ja) 2013-11-25 2014-05-22 Konica Minolta Inc 透明導電性フィルム及びその製造方法
US20150171238A1 (en) 2013-12-17 2015-06-18 Industrial Technology Research Institute Conductive paste composition and method for manufacturing electrode
WO2017047523A1 (ja) 2015-09-18 2017-03-23 東レ株式会社 グラフェン分散液およびその製造方法、グラフェン-活物質複合体粒子の製造方法ならびに電極用ペーストの製造方法
JP2017069175A (ja) 2015-09-30 2017-04-06 Dowaエレクトロニクス株式会社 導電性ペースト及び導電膜
JP2018070854A (ja) 2016-11-04 2018-05-10 凸版印刷株式会社 塗布剤、吐出物、及び塗布装置

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