JP7256787B2 - 粘着シート - Google Patents

粘着シート Download PDF

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Publication number
JP7256787B2
JP7256787B2 JP2020505036A JP2020505036A JP7256787B2 JP 7256787 B2 JP7256787 B2 JP 7256787B2 JP 2020505036 A JP2020505036 A JP 2020505036A JP 2020505036 A JP2020505036 A JP 2020505036A JP 7256787 B2 JP7256787 B2 JP 7256787B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
pressure
sensitive adhesive
adhesive layer
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020505036A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019172219A1 (ja
Inventor
洋一 稲男
直也 岡本
忠知 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of JPWO2019172219A1 publication Critical patent/JPWO2019172219A1/ja
Application granted granted Critical
Publication of JP7256787B2 publication Critical patent/JP7256787B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Materials For Medical Uses (AREA)
JP2020505036A 2018-03-07 2019-03-05 粘着シート Active JP7256787B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018040795 2018-03-07
JP2018040795 2018-03-07
PCT/JP2019/008512 WO2019172219A1 (ja) 2018-03-07 2019-03-05 粘着シート

Publications (2)

Publication Number Publication Date
JPWO2019172219A1 JPWO2019172219A1 (ja) 2021-03-11
JP7256787B2 true JP7256787B2 (ja) 2023-04-12

Family

ID=67846183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020505036A Active JP7256787B2 (ja) 2018-03-07 2019-03-05 粘着シート

Country Status (3)

Country Link
JP (1) JP7256787B2 (zh)
TW (1) TWI814786B (zh)
WO (1) WO2019172219A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021065072A1 (ja) * 2019-10-04 2021-04-08 リンテック株式会社 粘着シート
JP7188658B1 (ja) * 2021-09-27 2022-12-13 昭和電工マテリアルズ株式会社 半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245389A (ja) 2006-03-14 2007-09-27 Nitto Denko Corp 半導体用粘着シート
WO2012124389A1 (ja) 2011-03-17 2012-09-20 リンテック株式会社 エネルギー線硬化型粘着剤および粘着シート
WO2018003312A1 (ja) 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007245389A (ja) 2006-03-14 2007-09-27 Nitto Denko Corp 半導体用粘着シート
WO2012124389A1 (ja) 2011-03-17 2012-09-20 リンテック株式会社 エネルギー線硬化型粘着剤および粘着シート
WO2018003312A1 (ja) 2016-06-30 2018-01-04 リンテック株式会社 半導体加工用シート

Also Published As

Publication number Publication date
TW201939681A (zh) 2019-10-01
TWI814786B (zh) 2023-09-11
JPWO2019172219A1 (ja) 2021-03-11
WO2019172219A1 (ja) 2019-09-12

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