JP7248000B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7248000B2
JP7248000B2 JP2020185134A JP2020185134A JP7248000B2 JP 7248000 B2 JP7248000 B2 JP 7248000B2 JP 2020185134 A JP2020185134 A JP 2020185134A JP 2020185134 A JP2020185134 A JP 2020185134A JP 7248000 B2 JP7248000 B2 JP 7248000B2
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Prior art keywords
group
resin composition
insulating layer
mass
printed wiring
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JP2020185134A
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English (en)
Japanese (ja)
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JP2021011587A (ja
JP2021011587A5 (https=
Inventor
賢司 川合
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Priority to JP2020185134A priority Critical patent/JP7248000B2/ja
Publication of JP2021011587A publication Critical patent/JP2021011587A/ja
Publication of JP2021011587A5 publication Critical patent/JP2021011587A5/ja
Priority to JP2023035365A priority patent/JP7613494B2/ja
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
JP2020185134A 2020-11-05 2020-11-05 樹脂組成物 Active JP7248000B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020185134A JP7248000B2 (ja) 2020-11-05 2020-11-05 樹脂組成物
JP2023035365A JP7613494B2 (ja) 2020-11-05 2023-03-08 樹脂組成物

Applications Claiming Priority (1)

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JP2020185134A JP7248000B2 (ja) 2020-11-05 2020-11-05 樹脂組成物

Related Parent Applications (1)

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JP2020123028A Division JP6791428B2 (ja) 2020-07-17 2020-07-17 樹脂組成物

Related Child Applications (1)

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JP2023035365A Division JP7613494B2 (ja) 2020-11-05 2023-03-08 樹脂組成物

Publications (3)

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JP2021011587A JP2021011587A (ja) 2021-02-04
JP2021011587A5 JP2021011587A5 (https=) 2021-06-10
JP7248000B2 true JP7248000B2 (ja) 2023-03-29

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Family Applications (2)

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JP2020185134A Active JP7248000B2 (ja) 2020-11-05 2020-11-05 樹脂組成物
JP2023035365A Active JP7613494B2 (ja) 2020-11-05 2023-03-08 樹脂組成物

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JP2023035365A Active JP7613494B2 (ja) 2020-11-05 2023-03-08 樹脂組成物

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023135613A (ja) * 2022-03-15 2023-09-28 味の素株式会社 樹脂組成物
JP2024102755A (ja) * 2023-01-19 2024-07-31 味の素株式会社 樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114286A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
JP2016131243A (ja) 2015-01-13 2016-07-21 日立化成株式会社 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板
JP2018090728A (ja) 2016-12-06 2018-06-14 三菱瓦斯化学株式会社 電子材料用樹脂組成物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010053334A (ja) * 2008-07-31 2010-03-11 Sekisui Chem Co Ltd エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP5408046B2 (ja) * 2010-06-10 2014-02-05 味の素株式会社 樹脂組成物
TWI633011B (zh) * 2012-10-15 2018-08-21 Ajinomoto Co., Inc. Resin composition
JP2013234328A (ja) * 2013-06-18 2013-11-21 Ajinomoto Co Inc エポキシ樹脂組成物
JP2016074849A (ja) * 2014-10-08 2016-05-12 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP6756108B2 (ja) * 2015-01-13 2020-09-16 日立化成株式会社 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、金属張積層板及び多層印刷配線板
JP6550872B2 (ja) * 2015-04-03 2019-07-31 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP6922157B2 (ja) * 2015-04-17 2021-08-18 昭和電工マテリアルズ株式会社 樹脂組成物、積層板及び多層プリント配線板
US20180237668A1 (en) * 2015-08-08 2018-08-23 Designer Molecules, Inc. Anionic curable compositions
JP6708947B2 (ja) * 2016-01-14 2020-06-10 日立化成株式会社 ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法
JP6616201B2 (ja) * 2016-01-27 2019-12-04 京セラ株式会社 半導体接着用樹脂組成物及び半導体装置
JP6789030B2 (ja) * 2016-08-09 2020-11-25 京セラ株式会社 封止用樹脂組成物及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114286A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
JP2016131243A (ja) 2015-01-13 2016-07-21 日立化成株式会社 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板
JP2018090728A (ja) 2016-12-06 2018-06-14 三菱瓦斯化学株式会社 電子材料用樹脂組成物

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JP2021011587A (ja) 2021-02-04
JP7613494B2 (ja) 2025-01-15
JP2023067987A (ja) 2023-05-16

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