JP7234323B2 - 灌注バルーンカテーテルを構築する方法 - Google Patents
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Description
(1) 電気生理学的カテーテルの膨張式灌注電極アセンブリを構築する方法であって、
予め形成された孔を有し、より高い耐熱性を有する基板を有するフレックス回路を与えることと、
より低い耐熱性を有する可撓性メンブレンを含む膨張させられたバルーン部材を与えることと、
前記基板を接着剤により前記メンブレンに貼り付けることと、
前記基板の前記予め形成された孔を通じて熱を加えることであって、前記熱が、前記基板を溶融することなく前記メンブレンの一部及び前記接着剤を溶融するのに充分な温度を発生させ、溶融された前記メンブレンの一部及び前記接着剤が前記メンブレン及び接着剤に孔を形成する、ことと、を含む、方法。
(2) 前記基板が熱硬化性材料で構成されている、実施態様1に記載の方法。
(3) 前記基板がより高い融点を有する材料で構成され、前記メンブレンがより低い融点を有する材料で構成されている、実施態様1に記載の方法。
(4) 前記基板がより高い融点を有する材料で構成され、前記接着剤がより低い融点を有する、実施態様1に記載の方法。
(5) 前記メンブレンが熱可塑性ポリウレタンで構成されている、実施態様1に記載の方法。
(7) 前記熱を加えることが、前記予め形成された孔にはんだごてを挿入することを含む、実施態様1に記載の方法。
(8) 前記熱を加えることが、前記予め形成された孔にホットワイヤを挿入することを含む、実施態様1に記載の方法。
(9) 前記熱を加えることが、レーザーから前記予め形成された孔内にエネルギー線を照射することによって前記メンブレンの標的部分及び前記接着剤を溶融することを含む、実施態様1に記載の方法。
(10) 灌注用に構成された膨張式電極アセンブリを構築する方法であって、
予め形成された孔を有する基板を有するフレックス回路を与えることと、
第1のより低い耐熱性を有するメンブレンを含むバルーン部材を与えることと、
前記基板を接着剤によって前記メンブレンに貼り付けることであって、前記予め形成された孔の周囲の前記基板の周囲部分が前記メンブレンの周囲部分をマスクすることによって前記メンブレンの標的部分及び前記接着剤が露出し、前記基板がより高い耐熱性を有し、前記接着剤が第2のより低い耐熱性を有する、ことと、
前記基板の前記予め形成された孔を通じて前記メンブレンの前記標的部分に熱を加えることであって、前記加えられた熱が、前記メンブレンに孔を形成する際に、前記基板を溶融することなく、前記メンブレンの前記標的部分及び前記接着剤を溶融する、ことと、を含む、方法。
(12) 前記加えられた熱が、前記メンブレンの融点に等しいか又はそれよりも高い温度を前記メンブレンに発生させる、実施態様10に記載の方法。
(13) 前記加えられた熱が、前記接着剤の融点に等しいか又はそれよりも高い温度を前記接着剤に発生させる、実施態様10に記載の方法。
(14) 前記メンブレンの前記孔が、前記基板の前記予め形成された孔よりも大きい、実施態様10に記載の方法。
(15) 前記熱を加えることが、前記予め形成された孔にはんだごてを挿入することを含む、実施態様10に記載の方法。
(17) 前記熱を加えることが、レーザーから前記予め形成された孔内にエネルギー線を照射することによって前記メンブレンの標的部分及び前記接着剤を溶融することを含む、実施態様10に記載の方法。
(18) 前記基板を前記メンブレンに貼り付けることが、前記メンブレンと前記基板の前記周囲部分との間に接着剤を塗布することを含み、前記メンブレンの前記標的部分及び前記接着剤に加えられた熱が、前記メンブレン及び前記接着剤を再流動化する、実施態様10に記載の方法。
(19) 前記メンブレンが熱可塑性ポリウレタンで構成されている、実施態様10に記載の方法。
(20) 前記基板がポリイミドで構成されている、実施態様10に記載の方法。
予め形成された孔を有する基板を有するフレックス回路を与えることであって、前記基板がより高い耐熱性を有する材料で構成されている、ことと、
可撓性メンブレンを含む膨張させられたバルーン部材を与えることであって、前記メンブレンがより低い耐熱性を有する材料で構成されている、ことと、
前記基板を接着剤によって前記メンブレンに貼り付けることであって、前記予め形成された孔の周囲の前記基板の第1の周囲部分が、前記メンブレンの露出した標的部分の枠となると同時に前記露出した標的部分の周囲のメンブレンの第2の周囲部分をマスクする、ことと、
前記基板の前記予め形成された孔を通じて前記メンブレンの前記標的部分に熱を加えることであって、前記熱が、前記基板の前記第1の周囲部分を溶融することなく、前記メンブレンの前記標的部分を溶融するのに充分な温度を発生させる、ことと、を含む、方法。
(22) 前記メンブレンが熱可塑性ポリウレタンで構成され、前記基板がポリイミドで構成されている、実施態様21に記載の方法。
Claims (6)
- 電気生理学的カテーテルの膨張式灌注電極アセンブリを構築する方法であって、
電極に形成された切り抜き部を枠として使用し、レーザー切削によってシート基板に孔を形成し、前記切り抜き部を有する前記電極、及び、前記孔を有する前記シート基板からなるフレックス回路を形成することと、
前記シート基板が有する耐熱性よりも低い耐熱性を有する可撓性メンブレンを含む膨張させられたバルーン部材を与えることと、
接着剤を前記シート基板と前記可撓性メンブレンとの間で流動させて硬化させることにより、前記シート基板を前記可撓性メンブレンの上側表面に貼り付けることであって、前記シート基板が前記可撓性メンブレンの前記上側表面に貼り付けられている際に、前記シート基板の前記孔の真下に、硬化している前記接着剤が存在していることと、
前記シート基板の前記孔を通じて熱を加えることであって、前記熱が、前記シート基板を溶融することなく、前記可撓性メンブレンにおける前記シート基板の前記孔の真下の部分、及び前記接着剤における前記シート基板の前記孔の真下の部分を溶融するのに充分な温度を発生させ、前記熱が加えられることで、前記可撓性メンブレンにおける前記シート基板の前記孔の真下の前記部分及び前記接着剤における前記シート基板の前記孔の真下の前記部分が、溶融されて押しのけられ、前記可撓性メンブレン及び前記接着剤に第2の孔を形成する、ことと、を含む、方法。 - 前記シート基板が熱硬化性材料で構成されている、請求項1に記載の方法。
- 前記可撓性メンブレンが熱可塑性ポリウレタンで構成されている、請求項1に記載の方法。
- 前記シート基板がポリイミドで構成されている、請求項1に記載の方法。
- 前記シート基板の前記孔を通じて熱を加えることが、前記シート基板の前記孔にホットワイヤを挿入することを含む、請求項1に記載の方法。
- 前記シート基板の前記孔を通じて熱を加えることが、前記シート基板の前記孔にレーザーからエネルギー線を照射することを含む、請求項1に記載の方法。
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