JP7226684B2 - 基板収納容器 - Google Patents
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- JP7226684B2 JP7226684B2 JP2018563230A JP2018563230A JP7226684B2 JP 7226684 B2 JP7226684 B2 JP 7226684B2 JP 2018563230 A JP2018563230 A JP 2018563230A JP 2018563230 A JP2018563230 A JP 2018563230A JP 7226684 B2 JP7226684 B2 JP 7226684B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
Description
(2)上記(1)の態様において、前記第1吹出孔の少なくとも1つは、前記容器本体に収納された最下段の前記基板よりも下方に位置してもよい。
(3)上記(1)又は(2)の態様において、前記気体置換ユニットは、前記ハウジング部材の内側に通気性を有するフィルタ部材を含んでもよい。
(4)上記(1)から(3)までのいずれか1つの態様において、前記気体置換ユニットの上部又は中央部の少なくとも一方が、前記容器本体の背面壁に形成された貫通孔を用いて位置決め固定されてもよい。
(5)上記(1)から(4)までのいずれか1つの態様において、前記気体は、窒素ガス又はドライエアであってもよい。
(6)本発明に係る別の1つの態様は、前面に開口部を有し、複数枚の基板を収納可能な容器本体と、前記開口部を閉鎖する蓋体と、前記容器本体の外部から内部空間に気体を供給する給気弁と、前記給気弁から供給された前記気体を前記容器本体の内部空間に吹出す気体置換ユニットと、を備え、前記容器本体の底面の後方に前記給気弁を取付けた基板収納容器用の気体置換ユニットであって、前記給気弁から供給された前記気体を貯留するハウジング部材と、前記ハウジング部材の開口を覆うカバー部材と、を含み、前記ハウジング部材は、貯留された前記気体を前記容器本体の正面方向に吹出す複数の第1吹出孔を上下方向に有し、最上段の前記第1吹出孔の開口面積は、2段目の前記第1吹出孔の開口面積よりも大きいものである。
図1に示される基板収納容器1は、正面Fに開口部を有し、複数枚の基板Wを収納する容器本体2と、この容器本体2の開口部を閉鎖する蓋体4と、を備えている。基板収納容器1に収納される基板Wとしては、直径が300mmや450mmの半導体ウエハ、マスクガラスなどが挙げられる。
図12において、給気弁50から高圧で導入された気体Gは、フィルタ部材51を通過し、オフセットプレート押さえ90とオフセットプレート95との隙間を流れ、後方Bのオフセットプレート押さえ90と気体置換ユニット3Rの下部の接続具311との接続部に向かう。
最上段の第1吹出孔31aの開口面積が、第1吹出孔31bの開口面積よりも大きく、最上段の第3吹出孔33aの開口面積が、第3吹出孔33bの開口面積よりも大きい気体置換ユニット3R,3L(図7参照)を、基板収納容器1に取付けて、気体Gを90L/min(1個当たり)の風量でパージし、基板収納容器1内の湿度の推移を、収納された基板Wの段ごと(#1から#25)に、正面側の頂点付近(F位置)、右側の頂点付近(R位置)について測定した。なお、基板収納容器1は、蓋体4が取外された状態で、ダウンフローが0.4m/sの環境に設置した。このとき、容器本体2の内部と外部との差圧は、1.7Paであった。
比較例では、図7に示した気体置換ユニット3R,3Lを、最上段の第1吹出孔31aの開口面積が、第1吹出孔31bの開口面積と同じ大きさで、最上段の第3吹出孔33aの開口面積が、第3吹出孔33bの開口面積と同じ大きさにしたものを用いた。
実施形態の気体置換ユニット3R,3Lにおいて、第1吹出孔群31a-z、第3吹出孔群33a-z及び第2吹出孔32a-fの開口面積や数量や配置も実施形態に限らず、底面2fの上面に沿って吹き込むダウンフローエアなどの外部からエアに対向できるように、下方の吹出風量を増やすように構成してもよい。
2 容器本体、2a 正面開口枠、2b 背面壁、2c 右側壁、2d 左側壁、2e 天面、2f 底面
21 支持片、21b 補助支持片
22 位置規制部
23 グリップ
25 トップフランジ
26 ボトムプレート
27 貫通孔
28 ストッパ
29 取付孔
3R,3L 気体置換ユニット
31 ハウジング部材、31A,31B 面部、311 接続具、312 回止め突起、313 位置決め突起
32 カバー部材
31a・・・31z 第1吹出孔
32a・・・32f 第2吹出孔
33a・・・33z 第3吹出孔
34,35 フィルタ部材
4 蓋体
50 給気弁、50a グロメット、51 フィルタ部材、52 逆止弁、53 コイルバネ、54 バルブハウジング
60 排気弁
8 位置決め固定部材
81,82,83 フランジ
84A,84B Oリング
85 Cリング
86 スリット
87 端部
88 切欠き
9 オフセット部材
90 オフセットプレート押さえ
91 Oリング
92 凹部
93 パッキン
94 Oリング
95 オフセットプレート
F 正面
B 後方
G 気体
W 基板
NL 法線
Claims (3)
- 正面に開口部を有し、複数枚の基板を収納可能な容器本体と、
前記開口部を閉鎖する蓋体と、
前記容器本体の外部から内部空間に気体を供給する給気弁と、
前記給気弁から供給された前記気体を前記容器本体の内部空間に吹出す気体置換ユニットと、を備え、
前記容器本体の底面の後方に前記給気弁を取付けた基板収納容器であって、
前記気体置換ユニットは、
前記給気弁から供給された前記気体を貯留するハウジング部材と、
前記ハウジング部材の開口を覆うカバー部材と、を含み、
前記ハウジング部材は、貯留された前記気体を前記容器本体の正面方向に吹出す複数の第1吹出孔を上下方向に有し、
前記第1吹出孔は、前記容器本体の正面方向を向くように前記ハウジング部材に形成され、
最上段の前記第1吹出孔の開口面積は、最上段から2段目の前記第1吹出孔の開口面積よりも大きく、
最下段の前記第1吹出孔の開口面積は、最下段から2段目の前記第1吹出孔の開口面積よりも小さく、
最下段から2段目の前記第1吹出孔の開口面積は、最下段から3段目の前記第1吹出孔の開口面積よりも大きい
ことを特徴とする基板収納容器。 - 前記気体置換ユニットは、前記ハウジング部材の内側に通気性を有するフィルタ部材を含む
ことを特徴とする請求項1に記載の基板収納容器。 - 前記気体は、窒素ガス又はドライエアである
ことを特徴とする請求項1又は2に記載の基板収納容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017006998 | 2017-01-18 | ||
JP2017006998 | 2017-01-18 | ||
PCT/JP2017/045724 WO2018135222A1 (ja) | 2017-01-18 | 2017-12-20 | 基板収納容器及び気体置換ユニット |
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JPWO2018135222A1 JPWO2018135222A1 (ja) | 2019-11-07 |
JP7226684B2 true JP7226684B2 (ja) | 2023-02-21 |
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US (1) | US11488850B2 (ja) |
JP (1) | JP7226684B2 (ja) |
KR (1) | KR102465301B1 (ja) |
TW (1) | TWI761416B (ja) |
WO (1) | WO2018135222A1 (ja) |
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US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
JP2024521323A (ja) * | 2021-05-27 | 2024-05-31 | インテグリス・インコーポレーテッド | 直径が拡大されたパージポートを有する半導体基板搬送容器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004146676A (ja) | 2002-10-25 | 2004-05-20 | Shin Etsu Polymer Co Ltd | 収納容器 |
JP2011514014A (ja) | 2008-03-13 | 2011-04-28 | インテグリス インコーポレーテッド | 管状制御要素を有するウエハーコンテナ |
JP2015176976A (ja) | 2014-03-14 | 2015-10-05 | ミライアル株式会社 | 基板収納容器 |
JP2016004949A (ja) | 2014-06-18 | 2016-01-12 | 信越ポリマー株式会社 | 基板収納容器 |
JP2016225352A (ja) | 2015-05-27 | 2016-12-28 | 信越ポリマー株式会社 | 基板収納容器 |
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KR100505061B1 (ko) * | 2003-02-12 | 2005-08-01 | 삼성전자주식회사 | 기판 이송 모듈 |
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WO2016002005A1 (ja) * | 2014-07-01 | 2016-01-07 | ミライアル株式会社 | 基板収納容器 |
KR102373746B1 (ko) * | 2016-09-06 | 2022-03-15 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 및 기체 치환 유닛 |
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- 2017-12-20 WO PCT/JP2017/045724 patent/WO2018135222A1/ja active Application Filing
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- 2017-12-20 US US16/471,177 patent/US11488850B2/en active Active
- 2017-12-20 JP JP2018563230A patent/JP7226684B2/ja active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004146676A (ja) | 2002-10-25 | 2004-05-20 | Shin Etsu Polymer Co Ltd | 収納容器 |
JP2011514014A (ja) | 2008-03-13 | 2011-04-28 | インテグリス インコーポレーテッド | 管状制御要素を有するウエハーコンテナ |
JP2015176976A (ja) | 2014-03-14 | 2015-10-05 | ミライアル株式会社 | 基板収納容器 |
JP2016004949A (ja) | 2014-06-18 | 2016-01-12 | 信越ポリマー株式会社 | 基板収納容器 |
JP2016225352A (ja) | 2015-05-27 | 2016-12-28 | 信越ポリマー株式会社 | 基板収納容器 |
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Publication number | Publication date |
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KR102465301B1 (ko) | 2022-11-11 |
KR20190102188A (ko) | 2019-09-03 |
TW201829266A (zh) | 2018-08-16 |
JPWO2018135222A1 (ja) | 2019-11-07 |
TWI761416B (zh) | 2022-04-21 |
US20190393062A1 (en) | 2019-12-26 |
US11488850B2 (en) | 2022-11-01 |
WO2018135222A1 (ja) | 2018-07-26 |
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