JP7222243B2 - Base material preheating method and base material preheating apparatus - Google Patents

Description

The present invention relates to a substrate preheating method and a substrate preheating apparatus.

A resin sealing molding machine that manufactures various semiconductor packages consists of a press unit that performs mold molding, a base material supply unit that supplies base materials, a resin material supply unit that supplies resin materials, and an interface that supplies base materials to the press unit. It is equipped with a loader unit and an unloader unit that takes out resin-sealed moldings from the press unit.

In order to improve the efficiency of the work performed by the resin encapsulation molding apparatus, it is important to smoothly receive and deliver base materials such as lead frames between these units. In recent years, the base material has become larger and thinner, so the amount of deformation due to the weight when holding it and the amount of deformation due to heat in the process of resin sealing are large, and countermeasures are urgently needed.

Further, in the operation using the resin encapsulation molding apparatus, there is a step of preheating the substrate with a preheater before conveying the substrate to which chips and wires are bonded to the press unit. The preheating of the base material is performed to suppress the deformation stress generated in the base material due to the heat when the base material is placed on the high-temperature mold in the press unit.

In this preheating of the base material, the base material in the preheater should be kept in order to smoothly transfer and transfer the base material from the preheater to the press unit, and not to damage the bonded chips or wires. It is necessary to suppress the deformation of

Here, a heater for heating a lead frame described in Patent Literature 1 has been proposed as a device for preheating a base material and suppressing deformation of the base material due to heat.

The heating heater described in Patent Document 1 includes an insertion pin for insertion into a pilot hole of a lead frame and a plurality of contact pins for contacting side ends of the lead frame, and is positioned. Form a group of pins.

Also, a group of positioning pins is provided so as to protrude from the upper surface of the heater base. The movement and rotation of the lead frame are restricted by the insertion pin and the contact pin, and the thermal expansion of the lead frame is not restricted by the insertion pin and the contact pin.

Japanese Patent Application Laid-Open No. 2001-237254

The above conventional heater for heating suppresses deformation of the base material by eliminating or reducing the stress caused by interference with the positioning pin group when the lead frame expands due to heat. However, the conventional heater for heating has the following problems.

In other words, most of the base materials are thin (sheet-like) and have many holes, etc., to which chips and wires are bonded. It is hard to think that it will stretch in the direction of expansion while remaining as it is.

In reality, not only the deformation extending in the direction of expansion as described above, but rather the entire base material is wavy and undulating, and the ends are warped. There is a possibility that so-called three-dimensional deformation, which is not assumed in 1, may occur, and conventional heaters cannot stop such deformation. Therefore, the conventional heater for heating cannot be a sufficient countermeasure in terms of suppressing the deformation of the base material by preheating.

The present invention has been devised in view of the above points, and provides a substrate preheating method and a substrate preheating apparatus capable of suppressing deformation of the substrate due to preheating in the preheater. It is intended to

(1) In order to achieve the above object, the method of preheating a base material of the present invention prevents deformation due to heat in a preheater for preheating a sheet-like base material on which electronic components are mounted before resin encapsulation. A method for preheating a substrate to be restrained, comprising a step of holding and conveying the substrate by a substrate carrier and placing the substrate at a predetermined position of the preheater; After releasing the holding, or in conjunction with releasing the holding, the shutter is placed at least in the intermediate part in the linear direction along the two opposite sides of the fixed base material. and moving the substrate of the heater to a position where it contacts a surface opposite to the surface on which it is placed, or to a position separated from the opposite surface by a required gap, where deformation of the substrate is stopped.

According to this preheating method for the base material, first, the base material is held and transported by the base material carrier, and can be fixed at a predetermined position of the preheater, thereby determining the position for preheating the base material. .

Next, after releasing the holding of the substrate when the substrate is placed, or in accordance with releasing the holding, the shutter is moved at least in linear directions along two sides of the placed substrate that are opposite to each other. is moved to a position in which it contacts the surface of the substrate opposite the surface of the preheater on which the substrate rests. As a result, the shutter can be stably stopped at an intermediate portion in the linear direction along two opposite sides of the substrate so that the substrate does not deform.

Also, the shutter is moved to a position where the deformation of the substrate is stopped, separated from the surface of the preheater opposite to the surface in contact with the substrate on which the substrate is placed, with a required gap. As a result, the shutter is stably positioned at the intermediate portion in the linear direction along two opposite sides of the base material so as to prevent further deformation while allowing a certain amount of deformation of the base material. can stop.

In addition, the term "intermediate part" in the present invention does not mean the middle or the middle in the strict sense, but is used to mean the middle (including the middle or the middle) and not the end. ing.

(2) In order to achieve the above objects, the method for preheating a base material of the present invention prevents deformation due to heat in a preheater for preheating a sheet-like base material on which electronic components are mounted before resin encapsulation. A method for preheating a substrate to be restrained, comprising a step of holding and conveying the substrate by a substrate carrier and placing the substrate at a predetermined position of the preheater; After releasing the holding, or in conjunction with releasing the holding, the shutter is placed on the base of the preheater at the portion along the entire length of the two opposite sides of the stationary base. to a position in contact with the surface opposite to the surface on which the substrate is to be placed, or to a position separated from the opposite surface by a required gap, where the deformation of the base material is stopped.

According to this preheating method for the base material, first, the base material is held and transported by the base material carrier, and can be fixed at a predetermined position of the preheater, thereby determining the position for preheating the base material. .

Next, after releasing the holding of the base material when the base material is fixed, or in accordance with the release of the holding, the shutter is moved along the entire two sides of the fixed base material at positions opposite to each other. , is brought into contact with the surface of the substrate opposite the surface that contacts the surface of the preheater on which the substrate rests. As a result, the shutter can be stably stopped at portions along the entire length of the two sides of the substrate that are opposite to each other so that the substrate does not deform.

Also, the shutter is moved to a position where the deformation of the substrate is stopped, separated from the surface of the preheater opposite to the surface in contact with the substrate on which the substrate is placed, with a required gap. As a result, the shutter is stably positioned at the intermediate portion in the linear direction along two opposite sides of the base material so as to prevent further deformation while allowing a certain amount of deformation of the base material. can stop.

(3) In the substrate preheating method of the present invention, the shutter is brought into contact with the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or vice versa. When moving to the position where the deformation of the base material is stopped, separated from the surface by a required gap, it may be moved from a position away from the opposite surface to a direction approaching the opposite surface while facing the opposite surface.

In this case, the shutter stops deformation of the substrate until it contacts the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or is separated from the opposite surface by a required gap. When moving to a position, it can be moved from a position distant from the opposite surface to a direction approaching the opposite surface while facing the opposite surface.

According to this, when the base material is fixed, the shutter moves in the direction of approaching the surface to be deformed while facing it, so that the deformation of the base material can be easily stopped by the movement of the shutter. In addition, since the shutter can be prevented from hitting the already deformed edge (thickness portion) of the base material, damage to the shutter or damage to the base material can be prevented.

The motion of the shutter at this time may be linear motion or curvilinear motion. Also, the movement of the shutter may be a combination of those movements.

(4) In the substrate preheating method of the present invention, the shutter is moved to a position where the shutter is in contact with the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or vice versa. The preheater may be configured to rotate about an axis parallel to the surface on which the base of the preheater is placed when the base is moved to a position separated from the surface by a required gap to stop the deformation of the base.

In this case, the shutter stops deformation of the substrate until it contacts the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or is separated from the opposite surface by a required gap. When moving to the position, by rotating around an axis parallel to the surface on which the base material of the pre-heater is fixed, even if there are multiple shutters, each axis can be used as a common axis. Each shutter can be driven with a relatively simple structure.

(5) In the method of preheating a base material of the present invention, when the base material is placed at a predetermined position of the preheater, the clamper of the base material carrier for holding down the base material is attached to the base material as described above. The base material of the preheater may be moved to a position in contact with the surface opposite to the surface on which the base material is to be placed to temporarily fix the deformation of the base material.

In this case, when the substrate is placed at a predetermined position on the preheater, the clamper of the substrate carrier that presses the substrate is placed on the opposite side of the substrate from the surface that contacts the surface of the preheater on which the substrate is placed. By temporarily fixing the deformation of the base material by moving it to a position in contact with the surface, the clamper can contact the base material and stop the deformation faster than the shutter stops the deformation of the base material. Deformation at the initial stage of heating can be minimized.

(6) In order to achieve the above object, the substrate preheating apparatus of the present invention prevents deformation due to heat in a preheater for preheating a sheet-like substrate on which electronic components are mounted before resin sealing. An apparatus for preheating a substrate to be restrained, comprising: a substrate placement unit for placing and heating the substrate in place; and along two opposite sides of the substrate in the stationary state, at least In the intermediate part in the linear direction, the deformation of the base material is stopped at a position in contact with the surface of the base material opposite to the surface in contact with the base material fixing part, or at a required gap from the opposite surface. a pre-heater having a shutter movable between a position and a substrate-fixing release position; and a substrate-holding unit movable along a working path including the pre-heater and detachably holding the substrate; and a substrate carrier having a shutter drive for moving the shutter.

According to this base material preheating apparatus, first, the base material carrier holds the base material by the base material holding portion, conveys the base material along the work path including the preheater, and transfers the base material to the base material stationary portion of the preheater. be stationary. This determines the position for preheating the substrate.

Next, after releasing the holding of the substrate when the substrate is placed, or in accordance with releasing the holding, the shutter is moved at least in linear directions along two sides of the placed substrate that are opposite to each other. is moved to a position in which it contacts the surface of the substrate opposite the surface of the preheater on which the substrate rests. As a result, the shutter can be stably stopped at an intermediate portion in the linear direction along two opposite sides of the substrate so that the substrate does not deform.

Also, the shutter is moved to a position where the deformation of the substrate is stopped, separated from the surface of the preheater opposite to the surface in contact with the substrate on which the substrate is placed, with a required gap. As a result, the shutter is stably positioned at the intermediate portion in the linear direction along two opposite sides of the base material so as to prevent further deformation while allowing a certain amount of deformation of the base material. can stop.

(7) In order to achieve the above object, the substrate preheating apparatus of the present invention prevents deformation due to heat in a preheater for preheating a sheet-shaped substrate on which electronic components are mounted before resin sealing. A device for preheating a substrate to be restrained, comprising a substrate placement part for placing and heating the substrate in a predetermined position, and a portion along the entire length of two opposite sides of the substrate in the stationary state. In the above, a position where the base material is in contact with the surface opposite to the surface in contact with the base material fixing portion, or a position where the base material is stopped from being deformed and the base material is released from the opposite surface with a required gap. a pre-heater having a shutter movable between positions, a substrate holder movable along a work path including the pre-heater and detachably holding the substrate, and the shutter being moved. a substrate carrier having a shutter drive.

According to this base material preheating apparatus, first, the base material carrier holds the base material by the base material holding portion, conveys the base material along the work path including the preheater, and transfers the base material to the base material stationary portion of the preheater. be stationary. This determines the position for preheating the substrate.

Next, after releasing the holding of the base material when the base material is fixed, or in accordance with the release of the holding, the shutter is moved along the entire two sides of the fixed base material at positions opposite to each other. , is brought into contact with the surface of the substrate opposite the surface that contacts the surface of the preheater on which the substrate rests. As a result, the shutter can be stably stopped at portions along the entire length of the two sides of the substrate that are opposite to each other so that the substrate does not deform.

Also, the shutter is moved to a position where the deformation of the substrate is stopped, separated from the surface of the preheater opposite to the surface in contact with the substrate on which the substrate is placed, with a required gap. As a result, the shutter is stably positioned at the intermediate portion in the linear direction along two opposite sides of the base material so as to prevent further deformation while allowing a certain amount of deformation of the base material. can stop.

(8) In the substrate preheating apparatus of the present invention, the substrate holding portion may have holding claws, and the shutter may be configured such that a portion corresponding to the moving path of the holding claws is cut out. .

In this case, the substrate holding portion has the holding claws, and the shutter has a portion corresponding to the moving path of the holding claws. Smooth delivery is possible without interference with the shutter. In addition, since the size, number, and arrangement of shutters can be determined relatively freely, the degree of freedom in design increases.

(9) In the substrate preheating apparatus of the present invention, the shutter is in contact with the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or the opposite side. The preheater may rotate about an axis parallel to the surface of the preheater on which the base material is fixed when moving the base material to a position separated from the surface by a required gap to stop the deformation of the base material.

In this case, the shutter stops deformation of the substrate until it contacts the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or is separated from the opposite surface by a required gap. When moving to the position, it is configured to rotate around an axis parallel to the surface on which the base material of the pre-heater is fixed. The shutter can be driven with a relatively simple structure.

(10) In the substrate preheating apparatus of the present invention, the substrate carrier moves to a position where the substrate carrier is in contact with the surface of the substrate opposite to the surface of the preheater on which the substrate is placed. Alternatively, a clamper may be provided for temporarily fixing deformation of the base material.

In this case, the base material carrier has a clamper that moves to a position where the base material contacts the surface of the base material opposite to the surface of the preheater on which the base material is placed, thereby temporarily fixing the deformation of the base material. As a result, when the substrate is transferred, the clamper can contact the substrate and stop the deformation earlier than the shutter stops the deformation of the substrate, so the deformation of the substrate at the initial stage of heating can be minimized. can be kept.

INDUSTRIAL APPLICABILITY The present invention can provide a substrate preheating method and a substrate preheating apparatus capable of suppressing deformation of a substrate due to preheating in a preheater.

FIG. 2 is a schematic front view showing the structures of an inloader and a preheater that constitute the substrate preheating apparatus according to the present invention. FIG. 2 is a schematic plan view showing the structure of the preheater shown in FIG. 1; FIG. 4 is a schematic front view explanatory diagram showing a state in which an in-loader holding a substrate is positioned above the preheater. FIG. 4 is a schematic front view explanatory diagram showing a state in which an in-loader holding a substrate is lowered and the lead frame is placed on the substrate fixing portion of the preheater. FIG. 10 is a schematic front view explanatory diagram showing a state in which the holding claws of the in-loader are opened to release the holding of the lead frame, and the rotating shutter and the direct-acting shutter of the preheater are closed; FIG. 10 is a front view schematic explanatory diagram showing a state in which the in-loader is lifted with the lead frame left in the substrate fixing portion and positioned above the preheater. After preheating is finished, the in-loader is lowered and is a schematic explanatory front view showing a state in which it is positioned at a predetermined position of the preheater. FIG. 4 is a schematic front view explanatory diagram showing a state in which holding claws of an in-loader are closed to hold a lead frame, and a rotary shutter and a direct-acting shutter of a preheater are open; FIG. 4 is a schematic front view explanatory diagram showing a state in which an in-loader holding a lead frame is lifted and positioned above the preheater. FIG. 4 is a schematic plan view explanatory view showing another example of a preheater in the apparatus for preheating a base material according to the present invention.

1 and 2, the outline of the structure of the substrate preheating apparatus according to the present invention will be described.
In the following description, regarding the expression of "front and rear (vertical)" when describing the location and direction, the lower side along the paper surface in FIG. do. In addition, regarding the expression of "up and down", the upper side along the paper surface in FIG. , the left side along the paper surface is referred to as "left", and the right side is referred to as "right". As for the expression of "inside and outside", in FIGS. 1 and 2, the side closer to the midpoint in the horizontal direction is referred to as "inner", and the side farther from the midpoint is referred to as "outer".

A substrate preheating apparatus A includes an inloader 1 as a substrate carrier and a preheater 2 for preheating a lead frame 5 as a substrate. In the following description, the structure for positioning with respect to the pre-heater 2 when the in-loader 1 is lowered will be omitted for the sake of convenience, except for the guide pin 205 which will be described later.

The in-loader 1 delivers the lead frame 5 mounted with the electronic component to the base material fixing parts 20, 20a described later of the preheater 2, and further receives the lead frame 5 preheated by the base material fixing parts 20, 20a, It is transferred to a press unit (not shown) that performs resin sealing.

[Inloader 1]
The in-loader 1 can be transferred as described above by a transfer drive (not shown), and the lead frame 5 can be transferred.

The inloader 1 has a rectangular frame (not shown) elongated in the front-rear direction. The frame is provided with substrate holding portions 11 and 11a arranged side by side in the lateral direction of the frame. The substrate holding portions 11 and 11a are respectively provided with drive bars 111 and 112 which move forward and backward in conjunction with each other in opposite directions in the lateral direction of the frame by a drive portion such as an actuator (not shown) (Fig. 1).

On the outer surface of each drive bar 111 on the outside of the base material holding parts 11 and 11a, the base material holding parts 11, 11a, 11b, 11b, 11c, 11d, 11d, and 11d are mounted at two locations on each side at predetermined intervals in the longitudinal direction via an L-shaped arm 113. Outer holding claws 114 are provided to constitute 11a.

In addition, on the outer surfaces of the driving bars 112 inside the substrate holding portions 11 and 11a, two L-shaped arms 115 are provided on each of the surfaces at predetermined intervals in the longitudinal direction to support the substrate holding portions. Inner holding claws 116 are provided which constitute 11, 11a.

The outer holding claws 114 and the inner holding claws 116 are arranged at positions facing each other so that one lead frame 5 can be held at two positions on the left and right sides, a total of four positions. Each of the inner holding claws 114 and each of the outer holding claws 116 has a bilaterally symmetrical shape in which the claw portions (reference numerals omitted) at the tips thereof are hooked inward (see FIG. 1 and FIGS. 3 to 9 to be described later). reference).

Further, L-shaped frames 12 are fixed to both ends in the longitudinal direction of each driving bar 112 inside the substrate holding portions 11 and 11a. A driving pin 120 is provided so as to hang down from the lower tip of each frame 12 .

Thus, the drive pins 120 provided at a total of four locations are inserted into pin holes 232, 242 (see FIG. 2) provided in the linear motion shutters 23, 24, 23a, 24a, which will be described later.

In this state, the driving bars 111 and 112 move in the left-right direction, so that the outer holding claws 114 and the inner holding claws 116 move in the expansion/contraction direction. The driving bars 112 corresponding to the base material fixing parts 20 and 20a move in opposite directions at the same timing.

At the same time, each drive pin 120 moves together with each drive bar 112, so that the direct-acting shutters 23, 24, 23a, 24a slide left and right to open and close rotary shutters 21, 22, which will be described later.

The driving bar 112 of the inloader 1, the driving section for driving the driving bar 112, the frame 12, and the driving pin 120 constitute a shutter driving section for driving the rotating shutters 21 and 22 to open and close. Configure.

[Preheater 2]
The preheater 2 includes rectangular and plate-like base material setting portions 20 and 20a for setting the lead frame 5 and performing preheating. The substrate fixing portions 20, 20a are arranged horizontally at two locations on a substantially rectangular base member 200 (see FIG. 2) at the same height with a predetermined interval therebetween. The upper surfaces (reference numerals omitted) of the substrate fixing portions 20, 20a are formed to have approximately the same size as the lead frame 5 to be fixed.

In the base member 200, guide pins 205 are erected vertically at two locations on the left and right sides of the base material setting portions 20 and 20a with a required longitudinal interval therebetween (FIGS. 2, 3 to 3). See FIG. 9, etc.). Each guide pin fits into a fitting hole (not shown) provided in the frame of the in-loader 1 to position the in-loader 1 in the vertical and horizontal directions.

Rotating shutters 21 and 22 are provided along the edges in the longitudinal direction on both sides in the short direction of each of the substrate fixing portions 20 and 20a. The rotating shutter 21 is provided outside each of the base material fixing portions 20 and 20a, and the rotating shutter 22 is provided inside each of the base material fixing portions 20 and 20a (see FIGS. 1 and 2).

The structure of the rotating shutters 21 and 22 will be described. The rotating shutters 21 and 22 are formed in a substantially symmetrical shape so as to face each other with the substrate fixing portions 20 and 20a interposed therebetween. The rotary shutters 21 and 22 have rotary shafts 201 (see enlarged views of FIGS. 4 and 5) along substantially the entire longitudinal length of the substrate stationary portions 20 and 20a.

A rotating body 202 (see enlarged views of FIGS. 4 and 5) is fixed to the rotating shaft 201 . The structure for rotating the rotating shutters 21 and 22 with the common rotating shaft 201 can be made with a relatively simple structure.

The rotating body 202 is formed in a substantially L-shape when viewed from the front. At upper ends of the rotating body 202 corresponding to both ends in the longitudinal direction of the base material stationary parts 20 and 20a, there are elongated vertically when closed. A long hole 203 (see enlarged views of FIGS. 4 and 5) is formed. Engagement pins 204 (see enlarged views of FIGS. 4 and 5) are formed on the direct-acting shutters 23, 24, 23a, and 24a.

That is, at both ends in the longitudinal direction of the direct-acting shutters 23 and 23a, the rotary shutter 21 corresponding to one of the substrate stationary portions 20 and the rotary shutter 22 corresponding to the other substrate stationary portion 20a are provided. An engagement pin 204 is provided that engages the hole 203 (see FIG. 1).

At both ends in the longitudinal direction of the direct-acting shutters 24, 24a, a rotating shutter 22 corresponding to one substrate fixing portion 20 and a rotating shutter 21 corresponding to the other substrate fixing portion 20a are provided. An engagement pin 204 is provided that engages the hole 203 . By sliding the direct-acting shutters 23, 24, 23a, 24a in the left-right direction, the rotating bodies 202 of the paired rotating shutters 21, 22 rotate in the same direction to open and close.

Under the long hole 203 on the top of the rotating body 202, a plurality of stoppers 202a for stopping the deformation of the lead frame 5 are provided downward in the longitudinal direction (see the enlarged left diagrams of FIGS. 4 and 5). . When the stop portion 202a is rotated and closed, it may come into contact with the upper surface of the lead frame 5 (the surface opposite to the stationary surface), or may be arranged with a gap from the upper surface. good. In this embodiment, it is the latter.

Seven stop portions 202a are provided in the longitudinal direction of both the rotating shutters 21 and 22, and the respective lengths are different. As the rotating body 202 rotates, each stopping portion 202a moves toward the surface of the lead frame 5 while finally facing it.

The rotating body 202 of the rotating shutters 21 and 22 is provided with a notch 206 (the notch through which the guide pin 205 is passed in FIG. 2) through which the outer holding claw 114 and the inner holding claw 116 pass. The claws 114 and the inner holding claws 116 do not interfere with the rotating body 202, so that the lead frame 5 can be smoothly received and transferred. In addition, since the size, number, and arrangement of the rotary shutters 21 and 22 can be determined relatively freely, the degree of freedom in design is increased.

The in-loader 1 includes a clamper 3 for holding down and temporarily fixing the lead frame 5 when the lead frame 5 is fixed on the substrate fixing portions 20 and 20 a of the preheater 2 . The arrangement and length of the stop portion 202a correspond to the shape of the clamper 3 (see FIGS. 2 and 3).

In other words, each stop portion 202a is provided so as to fit into a notch portion 31 (see the enlarged view of FIG. 2) in which the pressing portion 30 for pressing the lead frame 5 is lacking in the clamper 3 (see FIG. 2). ). The shape of the clamper 3 is symmetrical with respect to the substrate holding portions 11 and 11a.

Here, the direct-acting shutters 23, 24, 23a, 24a driven by the inner drive bars 112 corresponding to the base material setting portions 20, 20a of the inloader 1 will be described. The direct-acting shutters 23, 24, 23a, and 24a are arranged at both ends in the longitudinal direction of the substrate fixing portions 20 and 20a. The direct-acting shutters 23, 24 and the direct-acting shutters 23a, 24a have a point-symmetric structure (see FIG. 2).

The direct-acting shutters 23, 24, 23a, and 24a function as a relay section for the driving force from the shutter driving section for operating the rotating shutters 21 and 22 as described above, and also function as follows. It has the function of stopping the deformation of the four corners of the lead frame 5 .

The direct-acting shutters 23 and 24 are arranged on the rear side in FIG. The direct-acting shutters 23a and 24a are arranged on the front side in FIG. 23a and 24a are denoted by the same reference numerals as those of the direct-acting shutters 23 and 24, and the description thereof is omitted.
The direct-acting shutters 23 and 24 are provided so as to move laterally within a required range along guides (not shown).

First, one direct-acting shutter 23 has a front end bent forward in a crank shape so as to avoid the adjacent right-hand direct-acting shutter 24, and has a fixed position at the tip when closed. A shutter plate 230 having a stop portion 230a covering the corner of the lead frame 5 with a gap is provided.

At the base end of the linear shutter 23, a shutter plate 231 is provided which has a stopper 231a which covers a corner of the lead frame 5 which is fixed with a gap when closed. A pin hole 232 is formed at a position displaced from the intermediate portion of the direct-acting shutter 23 as described above.

Next, the other direct-acting shutter 24 passes under the direct-acting shutter 23 so that the tip part avoids the adjacent left-side direct-acting shutter 23. A shutter plate 240 having a stop portion 240a covering the corner of the stationary lead frame 5 with a gap is provided.

A shutter plate 241 is provided at the base end of the direct-acting shutter 24. The shutter plate 241 has a stop portion 241a that covers the corner of the stationary lead frame 5 with a gap when closed. A pin hole 242 is formed at a position shifted from the intermediate portion of the direct-acting shutter 24 .

The stopper portions 230a and 231a and the stopper portions 240a and 241a are different from the rotating shutters 21 and 22 in which each stopper portion 202a rotates and moves toward the surface of the lead frame 5 while facing the surface thereof. Different, moving in a straight line at the same height.

Therefore, even if it is fixed and not yet deformed, it is difficult to contact the surface of the lead frame 5 and stop it.

Then, as described above, by providing the direct-acting shutters 23a, 24a having a symmetrical structure with the direct-acting shutters 23, 24 across the base material fixing portions 20, 20a in the longitudinal direction, each drive bar 112 of the inloader 1 , so that the rotating shutters 21 and 22 driven by the drive bars 112 can operate smoothly.

(Action)
1, 2, and 3 to 9, the operation of the base material preheating device A and the preheating method using the preheating device A will be described. 3 to 9, the left figure of the preheater 2 shows the movement of the direct-acting shutter 23 and the rotary shutters 21 and 22, and the right figure shows the state of the outer holding claw 114 of the lowered in-loader. , and the lower diagram on the left side is an explanatory diagram showing the movement of the direct-acting shutters 23 and 24. As shown in FIG. Although the lower left figure is shown separately for convenience, it is actually at the same height as the preheater 2 in the upper figure.

[1] Refer to FIGS. 2 and 3. FIG.
An inloader 1 conveys a lead frame 5 with chips and wires bonded to a predetermined position above the preheater 2 . At this time, the outer holding claws 114 and the inner holding claws 116 of the base material holding portions 11, 11a on both sides are closed, each holding the lead frame 5, and lifting the clamper 3 slightly (for example, 0.2 mm) from the fixed position. . Further, the rotary shutters 21 and 22, the linear shutters 23 and 24, and the linear shutters 23a and 24a of the preheater 2 are open.

[2] Refer to FIGS. 2 and 4. FIG.
When the in-loader 1 descends, the guide pins 205 are fitted into the fitting holes to determine the vertical and horizontal positions of the in-loader 1, as well as the vertical position (height). At the same time, the drive pins 120 of the frame 12 fixed to each drive bar 112 are inserted into the pin holes 232, 242 of the linear shutters 23, 24, 23a, 24a.

At this time, the outer holding claws 114 and the inner holding claws 116 are closed, but the lead frame 5 can be fixed to the base material without any trouble by entering the notched relief portions (reference numerals omitted) of the base material setting portions 20 and 20a. It can be placed on the portions 20 and 20a, and is slightly separated downward from the lead frame 5 to release the hold of the lead frame 5 (see the enlarged right view of FIG. 4).

The clamper 3 provided in the in-loader 1 presses predetermined portions of the edges of the four sides of the lead frame 5 placed on the stationary portions 20, 20a with the pressing portion 30, and rotates the shutters 21, 22, and Until the direct-acting shutters 23, 24, 23a, 24a are actuated, they are temporarily fixed so as not to move. The clamper 3 can stop the deformation of the lead frame 5 by coming into contact with the shutters earlier than the deformation of the lead frame 5 can be stopped.

In addition, since the clamper 3 can suppress the range where the rotary shutters 21, 22 and the linear shutters 23, 24, 23a, 24a cannot be stopped, the deformation of the lead frame 5 as a whole is further suppressed. .

Further, since the rotary shutters 21 and 22 are open, the lead frame 5 can be lowered without any trouble (see the left enlarged view of FIG. 4). In this manner, the lead frame 5 is placed on the substrate placement portions 20, 20a. Note that the base material fixing portions 20 and 20a have already been heated to a predetermined temperature for preheating.

[3] Refer to FIGS. 2 and 5. FIG.
The drive bars 111 and 112 move in opposite directions as indicated by the arrows in FIG. 5, and the drive bars 112 also move in opposite directions (inward). As a result, the outer holding claws 114 and the inner holding claws 116 are opened so that they do not hang on the lead frame 5 during the upward movement (see the enlarged right view of FIG. 5).

Further, the drive pins 120 that move together with the drive bars 112 move the direct-acting shutters 23 and 24 inward, and the shutter plates 231 and 240 move inward, so that the corners of one lead frame 5 are closed with a gap. As a result, the shutter plates 230 and 241 move inward to cover the corners of the other lead frame 5 with a gap, allowing deformation of the lead frame 5 to some extent (for example, three-dimensional deformation), while allowing further deformation. It is possible to stably prevent deformation due to thermal expansion of the lead frame 5 so as not to cause deformation.

At the same time, the inwardly moving linear shutter 23 rotates the rotating body 202 of each rotating shutter 21 inward, and the inwardly moving linear shutter 24 rotates each rotating shutter 22 inward. .

As a result, the rotating shutters 21 and 22 are rotated in the closing direction, and the stop portions 202a of the respective rotating bodies 202 cover the intermediate portions in the linear direction along the two opposite sides of the lead frame 5 with a gap ( 5), while allowing a certain amount of deformation of the lead frame 5, the lead frame 5 is wavy or warped due to thermal expansion or the like so as not to cause further deformation. Deformation can be stably stopped.

In addition, since the stop portion 202a of the rotating body 202 moves toward the deformed surface of the lead frame 5 while facing the deformed surface, when it comes into contact with the deformed surface, the stopper portion 202a moves from the deformed surface. The deformation of the lead frame 5 can be easily stopped by the movement of the stop portion 202a.

In addition, it is possible to prevent the stopper 202a from contacting the already deformed edge of the lead frame 5, thereby preventing damage to the rotating shutters 21 and 22 or lead damage due to contact of the stopper 202a with a hard portion such as the edge. Damage to the frame 5 can be suppressed.

According to this, the lead frame 5 is prevented from deforming at the four corners by the direct-acting shutters 23, 24, 23a, and 24a, and linearly moving along two opposite sides by the rotating shutters 21 and 22. Since the deformation of the intermediate portion in the direction is stopped, even if the lead frame 5 tries to be deformed by preheating, the deformation can be stopped.

[4] Refer to FIGS. 2 and 6. FIG.
The inloader 1 rises to a predetermined height. Since the outer holding claws 114 and the inner holding claws 116 are open and the holding of the lead frame 5 is released, the inloader 1 can be lifted without any trouble.

The lead frame 5 remains on the substrate fixing portions 20, 20a in a state where deformation is stopped by the rotating shutters 21, 22 and the linear shutters 23, 24, 23a, 24a. When the lead frame 5 is slightly deformed by heating, the deformed portions come into contact with the stop portions 202a, 230a, 231a, 240a, and 241a, and the lead frame 5 is substantially fixed by the pressure. In this state, preheating of the lead frame 5 is performed for a predetermined time.

[5] Refer to FIGS. 2 and 7. FIG.
When the preheating of the lead frame 5 is completed, the in-loader 1 descends to the predetermined position shown in [2] above. Further, the drive pins 120 of the frame 12 fixed to each drive bar 112 are inserted into the pin holes 232, 242 of the linear shutters 23, 24, 23a, 24a.

The outer retaining claw 114 and the inner retaining claw 116 are continuously open (see the enlarged right view of FIG. 5). The rotary shutters 21 and 22 are continuously closed (see the left enlarged view of FIG. 5), and the lead frame 5 is substantially fixed on the substrate fixing portions 20 and 20a.

[6] Refer to FIGS. 2 and 8. FIG.
The drive bars 111 and 112 move in opposite directions to each other as indicated by the arrows in FIG. 8, and the drive bars 112 also move in opposite directions (outward). As a result, the outer holding claws 114 and the inner holding claws 116 are closed so as to hang on the lower surface of the lead frame 5 (see the enlarged right view of FIG. 4).

Further, the drive pin 120, which moves together with each drive bar 112, moves the direct-acting shutters 23, 24 outward, and the shutter plates 231, 240 move outward to disengage from the corners of one lead frame 5, Each of the shutter plates 230 and 241 moves outward to come off the corner of the lead frame 5 on the other side.

At the same time, the linear motion shutter 23 moving outward rotates the rotating body 202 of each rotating shutter 21 outward, and the linear motion shutter 24 also moving outward rotates each rotating shutter 22 outward. . As a result, the rotating shutters 21 and 22 are opened, and the stop portions 202a of the respective rotating bodies 202 are disengaged from the intermediate portions in the linear direction along the two opposite sides of the lead frame 5 (the left side of the enlarged view of FIG. 4). ).

As a result, the lead frame 5 can be held by the outer holding claws 114 and the inner holding claws 116, and the substantial fixing by the rotary shutters 21, 22 and the linear shutters 23, 24, 23a, 24a is released.

[7] Refer to FIGS. 2 and 9. FIG.
The inloader 1 rises to a predetermined height while holding the lead frame 5 with the outer holding claws 114 and the inner holding claws 116 . Since the lead frame 5 is substantially unfixed by the rotating shutters 21 and 22, the inloader 1 can be lifted without any trouble. After that, the in-loader 1 conveys the lead frame 5 to the press unit of the next process, and the preheating device A for the base material repeats the above steps [1] to [7].

Another example of the preheater will be described with reference to FIG.
In the following explanation, the parts equivalent to those of the pre-heater 2 are denoted by the same reference numerals, redundant explanation of the structure and action is omitted, and only the different structure and action are explained.

The preheater 2a has a configuration in which the pressing portions 30 along the two opposite longitudinal sides of the lead frame 5 on which the clamper 3a is fixed and the stopping portions 202a of the rotating shutters 21 and 22 are arranged in parallel. The pressing portion 30 and the stop portion 202a may be arranged in parallel while being in contact with each other, or may be arranged in parallel with a gap without contact.

According to this, if there is no problem in receiving and delivering the lead frame 5, the pressing portions 30 along the two longitudinal sides of the lead frame 5 and the stop portions 202a of the rotating shutters 21 and 22 can be further attached to the lead frame. 5, the deformation of the lead frame 5 can be stably and more reliably stopped.

Further, in this case, deformation of the four corners of the lead frame 5 can be prevented, so that the direct-acting shutters 23, 24, 23a, 24a can be omitted.

The terms and expressions used in the specification and claims are for the purpose of description only and should not be regarded as limiting the features described and claimed herein. There is no intention to exclude some equivalent terms or expressions. Moreover, it goes without saying that various modifications are possible within the scope of the technical idea of the present invention.

A Substrate Preheating Apparatus 1 Inloaders 11, 11a Substrate Holding Sections 111, 112 Drive Bar 113 Arm 114 Outer Holding Claw 115 Arm 116 Inner Holding Claw 12 Frame 120 Drive Pin 2 Preheaters 20, 20a Substrate Stationary Section 21 , 22 rotary shutters 23, 24 direct-acting shutter 230 shutter plate 230a stop portion 231 shutter plate 231a stop portion 232 pin hole 240 shutter plate 240a stop portion 241 shutter plate 241a stop portion 242 pin holes 23a, 24a direct-acting shutter 200 base member 201 Rotating shaft 202 Rotating body 202a Stopper 203 Long hole 204 Engagement pin 205 Guide pin 206 Notch 3 Clamper 30 Pressing part 31 Notch 5 Lead frame 2a Preheater 3a Clamper

Claims (10)

A method for preheating a base material for suppressing thermal deformation of the base material in a preheater for preheating a sheet-like base material on which electronic components are mounted before the base material is resin-sealed, comprising:
a step of holding and conveying the substrate by a substrate carrier and placing it at a predetermined position of the preheater;
After releasing the holding of the base material by the base material carrier when the base material is fixed, or in accordance with releasing the holding of the base material by the base material carrier , facing the surface of the fixed base material The stop portion of a rotatable rotatable shutter having a stop portion that can be moved so as to come close to each other is placed at a predetermined portion along two opposite sides of the fixed base material . The rotating shutter is rotated and moved to a position in which the material is in contact with the surface opposite to the surface in contact with the preheater when it is fixed , or the front surface is separated from the opposite surface with a required gap. and rotating and moving the rotating shutter to a position where deformation of the base material is stopped. The rotating shutter is rotated in accordance with the linear motion of the direct-acting shutter of the preheater when releasing the holding of the base material after the base material is fixed.
The method for preheating a substrate according to claim 1 . The rotating shutter is rotated and moved to a position where the stop portion of the rotating shutter is in contact with the surface of the base material opposite to the surface of the base material that is in contact with the preheater, or When rotating and moving the rotating shutter to a position separated from the opposite surface by a required gap to stop the deformation of the base material, it faces the opposite surface from a position away from the opposite surface. 3. The method of preheating a base material according to claim 1 , wherein the base material is moved in a direction of approaching while moving. The rotatable shutter is rotated and moved to a position where the rotatable shutter is in contact with the surface of the base material opposite to the surface that is in contact when the preheater is fixed , or the opposite surface. When the rotary shutter is rotated and moved to a position where the deformation of the base material is stopped separated by a required gap, it is rotated about an axis parallel to the surface of the preheater on which the base material is placed. move to move the stop
The method for preheating a substrate according to claim 1 or 2 . When the substrate is placed at a predetermined position of the preheater, the clamper of the substrate carrier for pressing the substrate is brought into contact with the surface of the preheater on which the substrate is placed. 3. The method of preheating a substrate according to claim 1 , wherein the deformation of the substrate is temporarily fixed by moving it to a position in contact with the surface opposite to the surface. A preheating device for a base material that suppresses thermal deformation of the base material in a preheater that preheats the base material in a sheet form on which electronic components are mounted before the base material is resin-sealed ,
a base material fixing unit for fixing the base material in a predetermined position and heating the base material, and a predetermined portion along two opposite sides of the base material in the fixed state, the base material fixing part of the base material; A stopping part that moves between a position that contacts the surface opposite to the surface in contact with the part, or a position that stops the deformation of the base material and a base material stop release position that is separated from the opposite surface by a required gap. a preheater comprising a rotating shutter having
a substrate carrier that is movable along a working path including the preheater and has a substrate holding section that detachably holds the substrate and a shutter driving section that drives the rotating shutter to open and close; a substrate preheating device. 7. The apparatus for preheating a substrate according to claim 6, wherein the preheater comprises a direct-acting shutter that rotates the rotating shutter in accordance with a linear motion when releasing the holding of the stationary substrate. . The substrate holding portion has holding claws, and the rotating shutter has a cutout portion corresponding to a moving path of the holding claws.
8. The apparatus for preheating a substrate according to claim 6 or 7. The rotatable shutter reaches a position where the rotary shutter contacts the surface of the substrate opposite to the surface of the preheater on which the substrate is placed, or the substrate is separated from the opposite surface by a required gap. 8. The apparatus for preheating a substrate according to claim 6 , wherein the preheater rotates about an axis parallel to a surface of the preheater on which the substrate is placed when moving to a position where deformation of the substrate is stopped. a clamper that moves the substrate carrier to a position where the substrate carrier contacts a surface of the substrate opposite to the surface of the preheater on which the substrate is placed, thereby temporarily fixing deformation of the substrate; A preheating device for a substrate according to claim 6 or 7 .

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