JP7213050B2 - 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 - Google Patents
電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 Download PDFInfo
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- JP7213050B2 JP7213050B2 JP2018185567A JP2018185567A JP7213050B2 JP 7213050 B2 JP7213050 B2 JP 7213050B2 JP 2018185567 A JP2018185567 A JP 2018185567A JP 2018185567 A JP2018185567 A JP 2018185567A JP 7213050 B2 JP7213050 B2 JP 7213050B2
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- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
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- VTEYUPDBOLSXCD-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-2-methylcyclohexane Chemical compound CC1CCCCC1(OOC(C)(C)C)OOC(C)(C)C VTEYUPDBOLSXCD-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- JCTXKRPTIMZBJT-UHFFFAOYSA-N 2,2,4-trimethylpentane-1,3-diol Chemical compound CC(C)C(O)C(C)(C)CO JCTXKRPTIMZBJT-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
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- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
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- UUORTJUPDJJXST-UHFFFAOYSA-N n-(2-hydroxyethyl)prop-2-enamide Chemical compound OCCNC(=O)C=C UUORTJUPDJJXST-UHFFFAOYSA-N 0.000 description 1
- JPNTUZVTAHVHFB-UHFFFAOYSA-N n-ethyl-n-hydroxyprop-2-enamide Chemical compound CCN(O)C(=O)C=C JPNTUZVTAHVHFB-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Adjustable Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018185567A JP7213050B2 (ja) | 2018-09-28 | 2018-09-28 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
| TW108134172A TWI752350B (zh) | 2018-09-28 | 2019-09-23 | 電極形成用樹脂組合物與晶片型電子零件及其製造方法 |
| CN201910905828.4A CN110970149B (zh) | 2018-09-28 | 2019-09-24 | 电极形成用树脂组合物以及芯片型电子部件及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018185567A JP7213050B2 (ja) | 2018-09-28 | 2018-09-28 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020055912A JP2020055912A (ja) | 2020-04-09 |
| JP7213050B2 true JP7213050B2 (ja) | 2023-01-26 |
Family
ID=70028518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018185567A Active JP7213050B2 (ja) | 2018-09-28 | 2018-09-28 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7213050B2 (zh) |
| CN (1) | CN110970149B (zh) |
| TW (1) | TWI752350B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7352327B1 (ja) | 2023-06-07 | 2023-09-28 | 大西 徳生 | 共振電流制御形直流電源 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009074066A (ja) | 2007-08-29 | 2009-04-09 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置 |
| JP2012140558A (ja) | 2011-01-05 | 2012-07-26 | Sekisui Chem Co Ltd | 無機微粒子分散ペースト組成物 |
| JP2015162392A (ja) | 2014-02-27 | 2015-09-07 | 京セラケミカル株式会社 | 導電性ペースト、電気・電子部品及びその製造方法 |
| WO2015151136A1 (ja) | 2014-04-04 | 2015-10-08 | 京セラケミカル株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
| JP2016065146A (ja) | 2014-09-25 | 2016-04-28 | 京セラケミカル株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
| JP2017002181A (ja) | 2015-06-10 | 2017-01-05 | 京セラ株式会社 | 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置 |
| WO2018181697A1 (ja) | 2017-03-29 | 2018-10-04 | 京セラ株式会社 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6034194A (en) * | 1994-09-02 | 2000-03-07 | Quantum Materials/Dexter Corporation | Bismaleimide-divinyl adhesive compositions and uses therefor |
| JP2005293851A (ja) * | 2004-03-10 | 2005-10-20 | Toyobo Co Ltd | 導電性ペースト |
| US20070088134A1 (en) * | 2005-10-13 | 2007-04-19 | Ajinomoto Co. Inc | Thermosetting resin composition containing modified polyimide resin |
| JP5216682B2 (ja) * | 2009-04-27 | 2013-06-19 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| GB201206885D0 (en) * | 2012-04-19 | 2012-06-06 | Cytec Tech Corp | Composite materials |
| WO2015045450A1 (ja) * | 2013-09-30 | 2015-04-02 | 株式会社クラレ | 樹脂組成物、これを硬化させた硬化物及びこの樹脂組成物を含有する光学用粘着剤 |
| TWI678390B (zh) * | 2017-01-20 | 2019-12-01 | 台燿科技股份有限公司 | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
-
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-
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009074066A (ja) | 2007-08-29 | 2009-04-09 | Hitachi Chem Co Ltd | 接着剤組成物、フィルム状接着剤、回路接続用接着剤、接続体及び半導体装置 |
| JP2012140558A (ja) | 2011-01-05 | 2012-07-26 | Sekisui Chem Co Ltd | 無機微粒子分散ペースト組成物 |
| JP2015162392A (ja) | 2014-02-27 | 2015-09-07 | 京セラケミカル株式会社 | 導電性ペースト、電気・電子部品及びその製造方法 |
| WO2015151136A1 (ja) | 2014-04-04 | 2015-10-08 | 京セラケミカル株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
| JP2016065146A (ja) | 2014-09-25 | 2016-04-28 | 京セラケミカル株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
| JP2017002181A (ja) | 2015-06-10 | 2017-01-05 | 京セラ株式会社 | 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置 |
| WO2018181697A1 (ja) | 2017-03-29 | 2018-10-04 | 京セラ株式会社 | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7352327B1 (ja) | 2023-06-07 | 2023-09-28 | 大西 徳生 | 共振電流制御形直流電源 |
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| JP2020055912A (ja) | 2020-04-09 |
| CN110970149A (zh) | 2020-04-07 |
| CN110970149B (zh) | 2021-09-28 |
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