JP7209767B2 - 静電チャック、及び基板処理装置 - Google Patents
静電チャック、及び基板処理装置 Download PDFInfo
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- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
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- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
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- H01J2237/334—Etching
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Description
10 基板支持アセンブリー
11 静電チャック
12 フォーカスリング
13 下部カバー
14 絶縁部材
15 連結体
100 工程チャンバー
200 チャック本体
300 チャックベース
400 熱伝達層
410 熱伝達空間
420 インナーシール
430 アウターシール
510 インサート
550 シール保護部材
600 シャワーヘッド
700 工程ガス供給ユニット
910 チャック押圧ユニット
950 チャック昇降ユニット
Claims (20)
- 基板を静電気力でチャッキングする上側のチャック本体と、
前記チャック本体の温度を調節するための下側のチャックベースと、
前記チャック本体と前記チャックベースとの間に配置され、熱伝達流体を用いる熱伝達層と、
前記チャック本体を前記チャックベースに対して上下方向に移動させるチャック昇降ユニットとを含む、静電チャック。 - 前記熱伝達層は前記チャック本体と前記チャックベースとの間に前記熱伝達流体を収容する熱伝達空間を提供するように構成されることを特徴とする、請求項1に記載の静電チャック。
- 前記熱伝達層は、前記チャック本体と前記チャックベースとの間の外側領域に介在された環形のアウターシール(outer seal)を含むことにより、前記チャック本体と前記チャックベースとの間にギャップを形成するとともに前記チャック本体、前記チャックベース及び前記アウターシールによって限定された前記熱伝達空間を提供することを特徴とする、請求項2に記載の静電チャック。
- 前記アウターシールは、前記熱伝達空間と連通して前記熱伝達流体が導入される中空を有することを特徴とする、請求項3に記載の静電チャック。
- 前記アウターシールは耐熱性素材を含むことを特徴とする、請求項3に記載の静電チャック。
- 前記アウターシールをカバーするシール保護部材をさらに含むことを特徴とする、請求項3に記載の静電チャック。
- 前記熱伝達空間に熱伝達流体供給ラインが連結されることを特徴とする、請求項2に記載の静電チャック。
- 前記熱伝達空間に熱伝達流体回収ラインが連結されることを特徴とする、請求項7に記載の静電チャック。
- 前記チャック本体は前記チャックベース上に前記熱伝達層と物理的に接触するように載せられることを特徴とする、請求項1に記載の静電チャック。
- 前記チャック本体の下部には下方に延びたインサートが提供され、前記チャックベースには前記インサートが挿入される位置決め空間が備えられ、前記熱伝達層は前記インサートが通過する貫通空間を有することを特徴とする、請求項9に記載の静電チャック。
- 前記熱伝達層は、前記チャック本体と前記チャックベースとの間で前記貫通空間の周囲から相対的に近い内側領域及び相対的に遠い外側領域にそれぞれ介在された環形のインナーシール(inner seal)及び環形のアウターシール(outer seal)を含むことにより、前記チャック本体と前記チャックベースとの間にギャップを形成するとともに前記チャック本体、前記チャックベース、前記インナーシール及び前記アウターシールによって限定されて前記熱伝達流体を収容する熱伝達空間を提供することを特徴とする、請求項10に記載の静電チャック。
- 前記インサートは電源ラインが導入される空洞を有することを特徴とする、請求項10に記載の静電チャック。
- 前記熱伝達層は前記チャックベースの上部に提供されることを特徴とする、請求項9に記載の静電チャック。
- 前記位置決め空間は前記チャックベースを上下方向に貫通する孔として提供され、前記インサートは前記位置決め空間を通過する長さを有するように提供され、前記チャック昇降ユニットは前記インサートの下部に連結されることを特徴とする、請求項10に記載の静電チャック。
- 前記チャック昇降ユニットは前記チャック本体を上側に移動させて前記チャック本体を前記チャックベースから離隔させて分離することを特徴とする、請求項1に記載の静電チャック。
- 前記チャック昇降ユニットは前記チャック本体を下側に移動させて前記チャック本体を前記熱伝達層に密着させることを特徴とする、請求項1に記載の静電チャック。
- 前記チャックベースはヒーティングエレメント及びクーリングエレメントの少なくとも一つ以上を含むことを特徴とする、請求項1に記載の静電チャック。
- 前記熱伝達流体は不活性気体であることを特徴とする、請求項1に記載の静電チャック。
- 基板処理空間を提供する工程チャンバーと、前記基板処理空間に配置された静電チャックとを含み、
前記静電チャックは、
基板を静電気力でチャッキングする上側のチャック本体と、
前記チャック本体の温度を調節するための下側のチャックベースと、
前記チャック本体と前記チャックベースとの間に配置され、熱伝達流体を用いる熱伝達層と、
前記チャック本体を前記チャックベースに対して上下方向に移動させるチャック昇降ユニットとを含む、基板処理装置。 - 基板処理空間を提供する工程チャンバーと、前記基板処理空間に配置された基板支持アセンブリーと、前記基板処理空間にプラズマを発生させるためのプラズマ発生器とを含み、
前記基板支持アセンブリーは、
基板を静電気力でチャッキングする上側のチャック本体、高周波電力が印加され、前記チャック本体の温度を調節するための下側のチャックベース、前記チャック本体と前記チャックベースとの間に配置され、熱伝達流体を収容する熱伝達空間を提供するように構成された熱伝達層、及び前記チャック本体を前記チャックベースに対して上下方向に移動させるチャック昇降ユニットを含む静電チャックと、
前記チャック本体の周囲に配置され、前記基板を取り囲むように提供されるフォーカスリングと、
前記熱伝達空間及び前記基板と前記チャック本体との間にそれぞれ熱伝達流体を供給し、前記熱伝達空間に供給された前記熱伝達流体の圧力を制御する第1圧力制御器、及び前記基板と前記チャック本体との間に供給された前記熱伝達流体の圧力を制御する第2圧力制御器を有する熱伝達流体供給ユニットとを含み、
前記チャックベースは前記基板を冷却するための冷却流体が流れる冷却流路を含む、基板処理装置。
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Application Number | Priority Date | Filing Date | Title |
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KR10-2020-0058285 | 2020-05-15 | ||
KR1020200058285A KR102615216B1 (ko) | 2020-05-15 | 2020-05-15 | 정전 척, 기판 처리 장치 및 기판 처리 방법 |
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JP2021180308A JP2021180308A (ja) | 2021-11-18 |
JP7209767B2 true JP7209767B2 (ja) | 2023-01-20 |
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US (1) | US20210358726A1 (ja) |
JP (1) | JP7209767B2 (ja) |
KR (1) | KR102615216B1 (ja) |
CN (1) | CN113675127A (ja) |
TW (1) | TWI792312B (ja) |
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JP2022165477A (ja) * | 2021-04-20 | 2022-11-01 | 日新イオン機器株式会社 | ウエハ支持装置 |
CN114220758A (zh) * | 2021-11-29 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 晶圆承载装置及工艺腔室 |
CN114959600B (zh) * | 2022-05-31 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 工艺腔室及半导体工艺设备 |
WO2024100876A1 (ja) | 2022-11-11 | 2024-05-16 | 日本碍子株式会社 | ウエハ載置台 |
US11705437B1 (en) * | 2023-01-19 | 2023-07-18 | Zhejiang Lab | Interconnection structure of system on wafer and PCB base on TSV process and method for manufacturing the same |
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