JP7201384B2 - アイレットの製造方法 - Google Patents

アイレットの製造方法 Download PDF

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Publication number
JP7201384B2
JP7201384B2 JP2018196754A JP2018196754A JP7201384B2 JP 7201384 B2 JP7201384 B2 JP 7201384B2 JP 2018196754 A JP2018196754 A JP 2018196754A JP 2018196754 A JP2018196754 A JP 2018196754A JP 7201384 B2 JP7201384 B2 JP 7201384B2
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JP
Japan
Prior art keywords
eyelet
outer peripheral
plate
hole
processed product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018196754A
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English (en)
Japanese (ja)
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JP2020062669A5 (https=
JP2020062669A (ja
Inventor
真登 大内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2018196754A priority Critical patent/JP7201384B2/ja
Priority to EP19201398.5A priority patent/EP3640974B1/en
Publication of JP2020062669A publication Critical patent/JP2020062669A/ja
Publication of JP2020062669A5 publication Critical patent/JP2020062669A5/ja
Application granted granted Critical
Publication of JP7201384B2 publication Critical patent/JP7201384B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K23/00—Making other articles
    • B21K23/04—Making other articles flanged articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/02—Die forging; Trimming by making use of special dies ; Punching during forging
    • B21J5/027—Trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/16—Shoulder or burr prevention, e.g. fine-blanking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Punching Or Piercing (AREA)
  • Forging (AREA)
  • Semiconductor Lasers (AREA)
JP2018196754A 2018-10-18 2018-10-18 アイレットの製造方法 Active JP7201384B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018196754A JP7201384B2 (ja) 2018-10-18 2018-10-18 アイレットの製造方法
EP19201398.5A EP3640974B1 (en) 2018-10-18 2019-10-04 Method of manufacturing eyelet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018196754A JP7201384B2 (ja) 2018-10-18 2018-10-18 アイレットの製造方法

Publications (3)

Publication Number Publication Date
JP2020062669A JP2020062669A (ja) 2020-04-23
JP2020062669A5 JP2020062669A5 (https=) 2021-11-04
JP7201384B2 true JP7201384B2 (ja) 2023-01-10

Family

ID=68137958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018196754A Active JP7201384B2 (ja) 2018-10-18 2018-10-18 アイレットの製造方法

Country Status (2)

Country Link
EP (1) EP3640974B1 (https=)
JP (1) JP7201384B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113263098A (zh) * 2021-05-25 2021-08-17 成都宏明双新科技股份有限公司 一种厚材不锈钢冲裁工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004255454A (ja) 2003-02-27 2004-09-16 Todo Kogyo Kk 精密加工プレス用金型及びそれを用いた加工方法
WO2015113746A1 (de) 2014-01-30 2015-08-06 Electrovac Hacht & Huber Gmbh Verfahren zur herstellung eines anzündersockels
JP6293350B1 (ja) 2017-12-01 2018-03-14 新光電気工業株式会社 アイレットの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477537A (en) * 1982-09-23 1984-10-16 Blase Tool And Manufacturing Co., Inc. Method for producing burr-free blanks and the blanks produced thereby
JP2000102826A (ja) * 1998-09-25 2000-04-11 Toshiba Corp プレス加工法、プレス部品およびプレス部品を用いたブラウン管

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004255454A (ja) 2003-02-27 2004-09-16 Todo Kogyo Kk 精密加工プレス用金型及びそれを用いた加工方法
WO2015113746A1 (de) 2014-01-30 2015-08-06 Electrovac Hacht & Huber Gmbh Verfahren zur herstellung eines anzündersockels
JP6293350B1 (ja) 2017-12-01 2018-03-14 新光電気工業株式会社 アイレットの製造方法

Also Published As

Publication number Publication date
EP3640974B1 (en) 2021-02-17
EP3640974A1 (en) 2020-04-22
JP2020062669A (ja) 2020-04-23

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