JP7198403B1 - 活性エネルギー線硬化型インキ組成物および印刷物 - Google Patents
活性エネルギー線硬化型インキ組成物および印刷物 Download PDFInfo
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- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Inorganic materials [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
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- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001592 prop-2-enyl (2E,4E)-hexa-2,4-dienoate Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Epoxy Resins (AREA)
Abstract
Description
(1)インキ組成物全量中、(B)アリル樹脂を3~25重量%含有する。
(2)インキ組成物全量中、(C)エポキシ化合物と(D)オキセタン化合物の合計が30~65重量%である。
(3)(C)エポキシ化合物/(D)オキセタン化合物で表される重量比率が、1~5の範囲である。
式(D4-1):
式(D4-2):
式(D4-3):
を示す)
式(D4-4):
各種樹脂を含有したインキ組成物については、インキ組成物を作製するに先立ち、ワニスを作製した。ワニスは、各種樹脂とエポキシ化合物とを100℃で混合し、樹脂比率を60重量%比率で溶解させて作製した。尚、樹脂を含有し、且つエポキシ化合物を含有していない比較例7および13に関しては、エポキシ化合物の代わりにオキセタン化合物で樹脂を溶解させてワニスを作製した。
表1、2に記載される配合にて、3本ロールミルを用いて最大粒径が7.5μm以下になるように分散して、実施例1~15、比較例1~14のインキ組成物を作製した。
表中の材料を下記に示す。
・有機顔料:フタロシアニン系顔料(トーヨーカラー(株)製「LIONOL BLUE FG-7351」)
・体質顔料:非晶質シリカ(日本アエロジル(株)製「AEROSIL R976S」)
・アリル樹脂:((株)大阪ソーダ製「ダイソーダップK(ジアリルフタレート系樹脂)」、「ダイソーダップA(ジアリルフタレート系樹脂)」、「RADPAR AD-032」)
・ポリエステル樹脂:(東洋紡(株)製「バイロンGK-680」)
・石油樹脂:(東ソー(株)製「ペトロタック90」、「ペトコール130」)
・アクリル樹脂:(根上工業(株)製「ハイパールGM-3011」)
・エポキシ化合物:脂環式エポキシ化合物(Dalian Trico Chemical Co.,Ltd製「CER4221」)、(3,4-エポキシシクロヘキシル)メチル-3,4-エポキシシクロヘキサンカルボキシレート
・オキセタン化合物:2官能オキセタン化合物(東亞合成(株)製「アロンオキセタンOXT-221」)、式(D4-2)においてR3がエチル基である化合物
・光カチオン重合開始剤:オニウム塩系開始剤(サンアプロ(株)製「CPI-100P」)
・増感剤:アントラセン系増感剤(川崎化成工業(株)製「アントラキュアーUVS-1101」)
実施例1~15、および比較例1~14のインキ組成物について、バーコーターにて膜厚10μmとなるように、 ガラス板(アセトンで洗浄した市販の硬質ガラス板)もしくはアルミ板に印刷した。次いで、集光型メタルハライドランプ(アイグラフィックス(株)製、120W/cm)照射装置を用いて、印刷物との距離11cm、コンベア速度10m/分で紫外線を印刷物に照射して硬化させ、テストパネルを得た。
ガラス板もしくはアルミ板上に印刷したテストパネルについて、セロハンテープ剥離試験(碁盤目テープ法)にて以下基準で評価を実施した。試験は紫外線照射1時間後のテストパネルを使用して実施した。実用面から「△」以上が望まれる。
〇:全く剥離していない。
△:僅かに剥離している。(剥離面積が試験面積の10%未満)
×:剥離している。(剥離面積が試験面積の10%以上)
ガラス板上に印刷したテストパネルについて、紫外線照射直後から指で触ってタック(粘着性)を感じなくなるまでの時間(秒数)を測定した。尚、湿度40%と80%の2種の条件下で紫外線を照射した。実用面から「△」以上が望まれる。
〇 :1秒未満。
〇△:1秒以上、5秒未満
△ :5秒以上、10秒未満
× :10秒以上
ガラス板上に印刷したテストパネルについて、表面をエタノールを含浸させた綿棒で軽く100回こすり(100往復させる)、皮膜表面の劣化及び綿棒への色移りについて以下基準で評価を実施した。試験は紫外線照射1時間後のテストパネルを使用して実施した。尚、湿度40%と80%の2種の条件下で紫外線を照射した。実用面から「△」以上が望まれる。
〇 :皮膜表面の劣化なし、綿棒への色移りなし
〇△:皮膜表面の劣化なし、綿棒へ僅かに色移りあり
△ :皮膜表面の劣化なし、綿棒へ色移りあり
× :皮膜表面の劣化あり、綿棒へ色移りあり
(1)表1(実施例1~15)
・(A)顔料、(B)アリル樹脂、(C)エポキシ化合物、(D)オキセタン化合物、(E)光カチオン重合開始剤を含有している。
・インキ組成物全量中、(B)アリル樹脂を3~25重量%含有している。
・インキ組成物全量中、(C)エポキシ化合物と(D)オキセタン化合物の合計が30~65重量%である。
・(C)エポキシ化合物/(D)オキセタン化合物で表される重量比率が、1~5の範囲である。
(2)表2(比較例1~5)
・実施例の組成物との相違点として、(B)アリル樹脂を含有していない。(比較例1~4はその他の樹脂を含有している。)
(3)表2(比較例6)
・実施例の組成物との相違点として、(B)アリル樹脂、(D)オキセタン化合物を含有していない。
(4)表2(比較例7)
・実施例の組成物との相違点として、(B)アリル樹脂、(C)エポキシ化合物を含有していない。
(5)表2(比較例8)
・実施例の組成物との相違点として、(B)アリル樹脂の含有量が3~25重量%の範囲を超えている。
(6)表2(比較例9)
・実施例の組成物との相違点として、(D)オキセタン化合物を含有していない。
(7)表2(比較例10~12)
・実施例の組成物との相違点として、(C)エポキシ化合物/(D)オキセタン化合物で表される重量比率が、1~5の範囲でない。
(8)表2(比較例13)
・実施例の組成物との相違点として、(C)エポキシ化合物を含有していない。
(9)表2(比較例14)
・実施例の組成物との相違点として、C)エポキシ化合物と(D)オキセタン化合物の合計が30重量%未満である。
Claims (4)
- (A)顔料
(B)アリル樹脂
(C)エポキシ化合物
(D)オキセタン化合物
(E)光カチオン重合開始剤
を含有し、下記(1)~(3)を特徴とする活性エネルギー線硬化型インキ組成物。
(1)インキ組成物全量中、(B)アリル樹脂を3~25重量%含有する。
(2)インキ組成物全量中、(C)エポキシ化合物と(D)オキセタン化合物とを合計で30~65重量%含有する。
(3)(C)エポキシ化合物/(D)オキセタン化合物で表される重量比率が、1~5の範囲である。 - 活性エネルギー線硬化型インキ組成物が、増感剤(F)を含有し、増感剤(F)がアントラセン化合物である請求項1に記載の活性エネルギー線硬化型インキ組成物。
- 前記オキセタン化合物(D)が、分子中にオキセタン環を2個含有する化合物である請求項1または2に記載の活性エネルギー線硬化型インキ組成物。
- 請求項1または2に記載の活性エネルギー線硬化型インキ組成物を、基材に印刷してなる印刷物。
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JP2000507281A (ja) | 1996-03-08 | 2000-06-13 | レヴロン コンシューマー プロダクツ コーポレイション | ビスフェノールaエポキシ樹脂を用いたガラスの装飾方法及び関連する組成物並びに物品 |
WO2007049488A1 (ja) | 2005-10-24 | 2007-05-03 | Matsui Chemical Co., Ltd. | セラミックス被覆用組成物 |
JP2007211200A (ja) | 2006-02-13 | 2007-08-23 | Fuji Seal International Inc | プラスチックフィルム塗工用活性エネルギー線硬化性樹脂組成物およびその用途 |
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JP2873482B2 (ja) * | 1989-02-09 | 1999-03-24 | 関西ペイント株式会社 | 光架橋性樹脂組成物 |
JP2007051244A (ja) * | 2005-08-19 | 2007-03-01 | Konica Minolta Medical & Graphic Inc | 活性エネルギー線硬化組成物、インクジェット用インク組成物及び画像形成方法 |
JP7289192B2 (ja) * | 2018-08-03 | 2023-06-09 | Dicグラフィックス株式会社 | 活性エネルギー線硬化型オフセットインキ組成物、これを用いたオフセット印刷インキ、及び印刷物 |
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JP2000507281A (ja) | 1996-03-08 | 2000-06-13 | レヴロン コンシューマー プロダクツ コーポレイション | ビスフェノールaエポキシ樹脂を用いたガラスの装飾方法及び関連する組成物並びに物品 |
WO2007049488A1 (ja) | 2005-10-24 | 2007-05-03 | Matsui Chemical Co., Ltd. | セラミックス被覆用組成物 |
JP2007211200A (ja) | 2006-02-13 | 2007-08-23 | Fuji Seal International Inc | プラスチックフィルム塗工用活性エネルギー線硬化性樹脂組成物およびその用途 |
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