JP7189057B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP7189057B2
JP7189057B2 JP2019058669A JP2019058669A JP7189057B2 JP 7189057 B2 JP7189057 B2 JP 7189057B2 JP 2019058669 A JP2019058669 A JP 2019058669A JP 2019058669 A JP2019058669 A JP 2019058669A JP 7189057 B2 JP7189057 B2 JP 7189057B2
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Japan
Prior art keywords
polishing
tan
polishing pad
polishing layer
prepolymer
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JP2019058669A
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Japanese (ja)
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JP2020157415A (ja
Inventor
立馬 松岡
浩 栗原
さつき 鳴島
大和 ▲高▼見沢
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Fujibo Holdins Inc
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Fujibo Holdins Inc
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Priority to JP2019058669A priority Critical patent/JP7189057B2/ja
Priority to TW109108177A priority patent/TWI833924B/zh
Publication of JP2020157415A publication Critical patent/JP2020157415A/ja
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Publication of JP7189057B2 publication Critical patent/JP7189057B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2019058669A 2019-03-26 2019-03-26 研磨パッド Active JP7189057B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019058669A JP7189057B2 (ja) 2019-03-26 2019-03-26 研磨パッド
TW109108177A TWI833924B (zh) 2019-03-26 2020-03-12 研磨墊、研磨光學材料或半導體材料之表面之方法、及減少研磨光學材料或半導體材料之表面時之刮痕之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019058669A JP7189057B2 (ja) 2019-03-26 2019-03-26 研磨パッド

Publications (2)

Publication Number Publication Date
JP2020157415A JP2020157415A (ja) 2020-10-01
JP7189057B2 true JP7189057B2 (ja) 2022-12-13

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ID=72641014

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JP2019058669A Active JP7189057B2 (ja) 2019-03-26 2019-03-26 研磨パッド

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JP (1) JP7189057B2 (zh)
TW (1) TWI833924B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022153961A1 (ja) * 2021-01-14 2022-07-21 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018127562A (ja) 2017-02-09 2018-08-16 ニッタ・ハース株式会社 高分子体、研磨パッド、および、高分子体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI222390B (en) * 2001-11-13 2004-10-21 Toyo Boseki Polishing pad and its production method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018127562A (ja) 2017-02-09 2018-08-16 ニッタ・ハース株式会社 高分子体、研磨パッド、および、高分子体の製造方法

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Publication number Publication date
TWI833924B (zh) 2024-03-01
TW202103849A (zh) 2021-02-01
JP2020157415A (ja) 2020-10-01

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