JP7189057B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP7189057B2 JP7189057B2 JP2019058669A JP2019058669A JP7189057B2 JP 7189057 B2 JP7189057 B2 JP 7189057B2 JP 2019058669 A JP2019058669 A JP 2019058669A JP 2019058669 A JP2019058669 A JP 2019058669A JP 7189057 B2 JP7189057 B2 JP 7189057B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- tan
- polishing pad
- polishing layer
- prepolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019058669A JP7189057B2 (ja) | 2019-03-26 | 2019-03-26 | 研磨パッド |
TW109108177A TWI833924B (zh) | 2019-03-26 | 2020-03-12 | 研磨墊、研磨光學材料或半導體材料之表面之方法、及減少研磨光學材料或半導體材料之表面時之刮痕之方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019058669A JP7189057B2 (ja) | 2019-03-26 | 2019-03-26 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020157415A JP2020157415A (ja) | 2020-10-01 |
JP7189057B2 true JP7189057B2 (ja) | 2022-12-13 |
Family
ID=72641014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019058669A Active JP7189057B2 (ja) | 2019-03-26 | 2019-03-26 | 研磨パッド |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7189057B2 (zh) |
TW (1) | TWI833924B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022153961A1 (ja) * | 2021-01-14 | 2022-07-21 | 富士紡ホールディングス株式会社 | 研磨パッド、研磨パッドの製造方法、及び光学材料又は半導体材料の表面を研磨する方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018127562A (ja) | 2017-02-09 | 2018-08-16 | ニッタ・ハース株式会社 | 高分子体、研磨パッド、および、高分子体の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI222390B (en) * | 2001-11-13 | 2004-10-21 | Toyo Boseki | Polishing pad and its production method |
-
2019
- 2019-03-26 JP JP2019058669A patent/JP7189057B2/ja active Active
-
2020
- 2020-03-12 TW TW109108177A patent/TWI833924B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018127562A (ja) | 2017-02-09 | 2018-08-16 | ニッタ・ハース株式会社 | 高分子体、研磨パッド、および、高分子体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI833924B (zh) | 2024-03-01 |
TW202103849A (zh) | 2021-02-01 |
JP2020157415A (ja) | 2020-10-01 |
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