JP7183377B1 - ポリイミド系樹脂 - Google Patents

ポリイミド系樹脂 Download PDF

Info

Publication number
JP7183377B1
JP7183377B1 JP2021192532A JP2021192532A JP7183377B1 JP 7183377 B1 JP7183377 B1 JP 7183377B1 JP 2021192532 A JP2021192532 A JP 2021192532A JP 2021192532 A JP2021192532 A JP 2021192532A JP 7183377 B1 JP7183377 B1 JP 7183377B1
Authority
JP
Japan
Prior art keywords
structural unit
formula
derived
group
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021192532A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023079092A (ja
Inventor
洋行 塚田
勇輔 小沼
敦弘 高田
裕太 高岡
皓史 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=84321887&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7183377(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2021192532A priority Critical patent/JP7183377B1/ja
Priority to JP2022186762A priority patent/JP7890910B2/ja
Priority to KR1020220159470A priority patent/KR20230078554A/ko
Priority to CN202211483429.1A priority patent/CN116178711A/zh
Priority to TW111144995A priority patent/TW202337958A/zh
Application granted granted Critical
Publication of JP7183377B1 publication Critical patent/JP7183377B1/ja
Publication of JP2023079092A publication Critical patent/JP2023079092A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2021192532A 2021-11-26 2021-11-26 ポリイミド系樹脂 Active JP7183377B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021192532A JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂
JP2022186762A JP7890910B2 (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂
KR1020220159470A KR20230078554A (ko) 2021-11-26 2022-11-24 폴리이미드계 수지
CN202211483429.1A CN116178711A (zh) 2021-11-26 2022-11-24 聚酰亚胺系树脂
TW111144995A TW202337958A (zh) 2021-11-26 2022-11-24 聚醯亞胺系樹脂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021192532A JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022186762A Division JP7890910B2 (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Publications (2)

Publication Number Publication Date
JP7183377B1 true JP7183377B1 (ja) 2022-12-05
JP2023079092A JP2023079092A (ja) 2023-06-07

Family

ID=84321887

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021192532A Active JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂
JP2022186762A Active JP7890910B2 (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022186762A Active JP7890910B2 (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Country Status (4)

Country Link
JP (2) JP7183377B1 (enExample)
KR (1) KR20230078554A (enExample)
CN (1) CN116178711A (enExample)
TW (1) TW202337958A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024092599A (ja) * 2022-12-26 2024-07-08 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層板及び回路基板
KR20260074678A (ko) 2023-09-29 2026-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지 조성물, 도액, 수지 필름, 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기
KR20260074665A (ko) 2023-09-29 2026-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 공중합체, 수지 기재, 수지 조성물, 도액, 폴리이미드, 수지 필름, 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기 및 제조 방법
JP7908171B2 (ja) 2022-12-26 2026-08-19 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層板及び回路基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146025A (ja) 2003-11-11 2005-06-09 Kaneka Corp 接着フィルム及びそれから得られるフレキシブル金属張積層板
JP2014208793A (ja) 2013-03-29 2014-11-06 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
CN106543720A (zh) 2016-10-27 2017-03-29 武汉依麦德新材料科技有限责任公司 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法
CN112375221A (zh) 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法
CN112409621A (zh) 2020-11-27 2021-02-26 桂林电器科学研究院有限公司 高强度低介电性聚酰亚胺多层膜及其制备方法
CN112940316A (zh) 2021-02-19 2021-06-11 北京八亿时空液晶科技股份有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021161285A (ja) 2020-03-31 2021-10-11 株式会社大阪ソーダ ポリイミド系接着剤
JP7714391B2 (ja) * 2021-06-30 2025-07-29 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146025A (ja) 2003-11-11 2005-06-09 Kaneka Corp 接着フィルム及びそれから得られるフレキシブル金属張積層板
JP2014208793A (ja) 2013-03-29 2014-11-06 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
CN106543720A (zh) 2016-10-27 2017-03-29 武汉依麦德新材料科技有限责任公司 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法
CN112375221A (zh) 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法
CN112409621A (zh) 2020-11-27 2021-02-26 桂林电器科学研究院有限公司 高强度低介电性聚酰亚胺多层膜及其制备方法
CN112940316A (zh) 2021-02-19 2021-06-11 北京八亿时空液晶科技股份有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024092599A (ja) * 2022-12-26 2024-07-08 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層板及び回路基板
JP7908171B2 (ja) 2022-12-26 2026-08-19 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、樹脂フィルム、金属張積層板及び回路基板
KR20260074678A (ko) 2023-09-29 2026-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 수지 조성물, 도액, 수지 필름, 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기
KR20260074665A (ko) 2023-09-29 2026-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 공중합체, 수지 기재, 수지 조성물, 도액, 폴리이미드, 수지 필름, 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기 및 제조 방법

Also Published As

Publication number Publication date
CN116178711A (zh) 2023-05-30
TW202337958A (zh) 2023-10-01
JP2023079092A (ja) 2023-06-07
KR20230078554A (ko) 2023-06-02
JP2023079194A (ja) 2023-06-07
JP7890910B2 (ja) 2026-07-15

Similar Documents

Publication Publication Date Title
JPWO2018061727A1 (ja) ポリイミドフィルム、銅張積層板及び回路基板
JP7336614B1 (ja) 積層フィルム
TW202319444A (zh) 聚醯胺酸、聚醯亞胺、聚醯亞胺膜、金屬包覆積層板及電路基板
JP2024144018A (ja) 積層フィルム
JP2023079194A (ja) ポリイミド系樹脂
JP2023079202A (ja) ポリイミド系樹脂前駆体
JP2022154637A (ja) ポリイミド、金属張積層板及び回路基板
CN118063769A (zh) 聚酰亚胺系树脂
JP4768606B2 (ja) 配線基板用積層体
JP2024142262A (ja) 積層フィルム
JP2023079201A (ja) ポリイミド系フィルム
JP7519509B1 (ja) ポリイミド系フィルム
JP2023079203A (ja) ポリイミド系フィルム
JP2024101973A (ja) ポリイミド系樹脂
JP2024101974A (ja) ポリイミド系樹脂
JP2024122828A (ja) ポリイミド系フィルム
TW202440735A (zh) 聚醯亞胺系樹脂
KR20240133651A (ko) 폴리이미드계 필름
KR20240133652A (ko) 폴리이미드계 필름
TW202440736A (zh) 聚醯亞胺系樹脂
CN118359808A (zh) 聚酰亚胺系树脂
CN118359809A (zh) 聚酰亚胺系树脂
JP2024142260A (ja) 積層フィルム
JP2024122829A (ja) ポリイミド系フィルム
JP2024142264A (ja) 積層フィルム

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211209

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20211209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220222

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220422

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220726

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220926

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221025

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221122

R150 Certificate of patent or registration of utility model

Ref document number: 7183377

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R157 Certificate of patent or utility model (correction)

Free format text: JAPANESE INTERMEDIATE CODE: R157