JP7181081B2 - 基板処理装置および基板搬送方法 - Google Patents

基板処理装置および基板搬送方法 Download PDF

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JP7181081B2
JP7181081B2 JP2018248736A JP2018248736A JP7181081B2 JP 7181081 B2 JP7181081 B2 JP 7181081B2 JP 2018248736 A JP2018248736 A JP 2018248736A JP 2018248736 A JP2018248736 A JP 2018248736A JP 7181081 B2 JP7181081 B2 JP 7181081B2
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block
processing
substrate
indexer
carrier
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JP2020109785A5 (https=
JP2020109785A (ja
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丈二 ▲桑▼原
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2018248736A priority Critical patent/JP7181081B2/ja
Priority to CN201911285908.0A priority patent/CN111383957B/zh
Priority to KR1020190168696A priority patent/KR102296014B1/ko
Priority to US16/724,429 priority patent/US11443968B2/en
Priority to TW108147765A priority patent/TWI732401B/zh
Publication of JP2020109785A publication Critical patent/JP2020109785A/ja
Publication of JP2020109785A5 publication Critical patent/JP2020109785A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Robotics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2018248736A 2018-12-28 2018-12-28 基板処理装置および基板搬送方法 Active JP7181081B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018248736A JP7181081B2 (ja) 2018-12-28 2018-12-28 基板処理装置および基板搬送方法
CN201911285908.0A CN111383957B (zh) 2018-12-28 2019-12-13 衬底处理装置及衬底搬送方法
KR1020190168696A KR102296014B1 (ko) 2018-12-28 2019-12-17 기판 처리 장치 및 기판 반송 방법
US16/724,429 US11443968B2 (en) 2018-12-28 2019-12-23 Substrate treating apparatus and substrate transporting method
TW108147765A TWI732401B (zh) 2018-12-28 2019-12-26 基板處理裝置及基板搬送方法

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Application Number Priority Date Filing Date Title
JP2018248736A JP7181081B2 (ja) 2018-12-28 2018-12-28 基板処理装置および基板搬送方法

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JP2020109785A JP2020109785A (ja) 2020-07-16
JP2020109785A5 JP2020109785A5 (https=) 2021-10-21
JP7181081B2 true JP7181081B2 (ja) 2022-11-30

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US (1) US11443968B2 (https=)
JP (1) JP7181081B2 (https=)
KR (1) KR102296014B1 (https=)
CN (1) CN111383957B (https=)
TW (1) TWI732401B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7221048B2 (ja) * 2018-12-28 2023-02-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7190900B2 (ja) * 2018-12-28 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP7114456B2 (ja) * 2018-12-28 2022-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP7387316B2 (ja) * 2019-07-19 2023-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板搬送方法
JP7571498B2 (ja) * 2020-11-25 2024-10-23 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7659421B2 (ja) * 2021-03-23 2025-04-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システムおよび基板処理方法
KR102870702B1 (ko) * 2023-11-16 2025-10-15 세메스 주식회사 보관 및 운반 모듈, 및 이를 포함하는 기판 처리 장치
JP2026056426A (ja) * 2024-09-19 2026-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置と基板処理方法
JP2026056425A (ja) * 2024-09-19 2026-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置と基板処理方法

Citations (8)

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Publication number Priority date Publication date Assignee Title
JP2003100587A (ja) 2001-09-21 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理システム
JP2010219434A (ja) 2009-03-18 2010-09-30 Sokudo Co Ltd 基板処理装置
JP2011187796A (ja) 2010-03-10 2011-09-22 Sokudo Co Ltd 基板処理装置、ストッカー装置および基板収納容器の搬送方法
US20160351430A1 (en) 2015-05-29 2016-12-01 Semes Co., Ltd. Apparatus for processing substrate
JP2017102254A (ja) 2015-12-01 2017-06-08 東京エレクトロン株式会社 基板処理装置
JP2020109787A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP2020109788A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP2020109784A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法

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KR20020063664A (ko) * 2001-01-30 2002-08-05 삼성전자 주식회사 반도체 소자 제조용 설비의 멀티챔버 시스템
US6832863B2 (en) * 2002-06-11 2004-12-21 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus and method
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
KR101019212B1 (ko) * 2008-08-21 2011-03-04 세메스 주식회사 기판 처리 설비 및 방법
AU2014202290B9 (en) * 2009-03-03 2016-02-11 Lg Electronics Inc Apparatus for transmitting and receiving a signal and method of transmitting and receiving a signal
JP5758509B2 (ja) * 2014-01-17 2015-08-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP5925869B2 (ja) * 2014-12-10 2016-05-25 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
KR102225957B1 (ko) * 2018-09-12 2021-03-11 세메스 주식회사 기판 처리 장치
CN110943018B (zh) * 2018-09-21 2024-12-27 株式会社斯库林集团 衬底处理装置及衬底处理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100587A (ja) 2001-09-21 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理システム
JP2010219434A (ja) 2009-03-18 2010-09-30 Sokudo Co Ltd 基板処理装置
JP2011187796A (ja) 2010-03-10 2011-09-22 Sokudo Co Ltd 基板処理装置、ストッカー装置および基板収納容器の搬送方法
US20160351430A1 (en) 2015-05-29 2016-12-01 Semes Co., Ltd. Apparatus for processing substrate
JP2017102254A (ja) 2015-12-01 2017-06-08 東京エレクトロン株式会社 基板処理装置
JP2020109787A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法
JP2020109788A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
JP2020109784A (ja) 2018-12-28 2020-07-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板搬送方法

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Publication number Publication date
US20200211880A1 (en) 2020-07-02
TW202036768A (zh) 2020-10-01
US11443968B2 (en) 2022-09-13
JP2020109785A (ja) 2020-07-16
KR102296014B1 (ko) 2021-08-31
CN111383957A (zh) 2020-07-07
CN111383957B (zh) 2024-12-31
TWI732401B (zh) 2021-07-01
KR20200083236A (ko) 2020-07-08

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