JP7166335B2 - 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 - Google Patents

粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP7166335B2
JP7166335B2 JP2020510808A JP2020510808A JP7166335B2 JP 7166335 B2 JP7166335 B2 JP 7166335B2 JP 2020510808 A JP2020510808 A JP 2020510808A JP 2020510808 A JP2020510808 A JP 2020510808A JP 7166335 B2 JP7166335 B2 JP 7166335B2
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Japan
Prior art keywords
copper foil
roughened
carrier
copper
less
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JP2020510808A
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Japanese (ja)
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JPWO2019188712A1 (ja
Inventor
翼 加藤
光由 松田
浩人 飯田
哲聡 ▲高▼梨
和広 吉川
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2020510808A 2018-03-27 2019-03-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 Active JP7166335B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018060635 2018-03-27
JP2018060635 2018-03-27
PCT/JP2019/011864 WO2019188712A1 (ja) 2018-03-27 2019-03-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2019188712A1 JPWO2019188712A1 (ja) 2021-04-22
JP7166335B2 true JP7166335B2 (ja) 2022-11-07

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ID=68060016

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JP2020510808A Active JP7166335B2 (ja) 2018-03-27 2019-03-20 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP7166335B2 (zh)
KR (1) KR102647658B1 (zh)
CN (1) CN111886367B (zh)
TW (1) TWI745668B (zh)
WO (1) WO2019188712A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7259093B2 (ja) * 2020-02-04 2023-04-17 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
JP7051988B1 (ja) * 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板
KR20230169770A (ko) * 2022-06-09 2023-12-18 와이엠티 주식회사 금속층, 이를 포함하는 캐리어 부착 금속박 및 이를 포함하는 인쇄회로기판
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196576A1 (ja) 2013-06-04 2014-12-11 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
WO2016158775A1 (ja) 2015-03-31 2016-10-06 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2016174998A1 (ja) 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
WO2017138338A1 (ja) 2016-02-10 2017-08-17 古河電気工業株式会社 表面処理銅箔及びこれを用いて製造される銅張積層板
WO2018211951A1 (ja) 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010093009A1 (ja) * 2009-02-13 2010-08-19 古河電気工業株式会社 金属箔およびその製造方法，絶縁基板，配線基板
WO2013065730A2 (ja) * 2011-11-04 2013-05-10 Jx日鉱日石金属株式会社 印刷回路用銅箔
JP5919303B2 (ja) * 2012-01-18 2016-05-18 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
JP2017193778A (ja) * 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196576A1 (ja) 2013-06-04 2014-12-11 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器、樹脂層、キャリア付銅箔の製造方法、及びプリント配線板の製造方法
WO2016158775A1 (ja) 2015-03-31 2016-10-06 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2016174998A1 (ja) 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
WO2017138338A1 (ja) 2016-02-10 2017-08-17 古河電気工業株式会社 表面処理銅箔及びこれを用いて製造される銅張積層板
WO2018211951A1 (ja) 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
CN111886367B (zh) 2023-05-16
KR102647658B1 (ko) 2024-03-15
WO2019188712A1 (ja) 2019-10-03
TWI745668B (zh) 2021-11-11
TW201942370A (zh) 2019-11-01
KR20200135303A (ko) 2020-12-02
CN111886367A (zh) 2020-11-03
JPWO2019188712A1 (ja) 2021-04-22

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