JP7166256B2 - ロボットの診断方法 - Google Patents

ロボットの診断方法 Download PDF

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Publication number
JP7166256B2
JP7166256B2 JP2019533985A JP2019533985A JP7166256B2 JP 7166256 B2 JP7166256 B2 JP 7166256B2 JP 2019533985 A JP2019533985 A JP 2019533985A JP 2019533985 A JP2019533985 A JP 2019533985A JP 7166256 B2 JP7166256 B2 JP 7166256B2
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JP
Japan
Prior art keywords
robot
end effector
work
turntable
center position
Prior art date
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Active
Application number
JP2019533985A
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English (en)
Japanese (ja)
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JPWO2019026508A1 (ja
Inventor
哲也 吉田
ミン ゼン，
一 中原
アントニオ ジョン ロザノ，
智一 在田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Kawasaki Robotics USA Inc
Original Assignee
Kawasaki Jukogyo KK
Kawasaki Robotics USA Inc
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Publication of JPWO2019026508A1 publication Critical patent/JPWO2019026508A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2019533985A 2017-08-04 2018-07-02 ロボットの診断方法 Active JP7166256B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/669,665 2017-08-04
US15/669,665 US10403539B2 (en) 2017-08-04 2017-08-04 Robot diagnosing method
PCT/JP2018/025039 WO2019026508A1 (ja) 2017-08-04 2018-07-02 ロボットの診断方法

Publications (2)

Publication Number Publication Date
JPWO2019026508A1 JPWO2019026508A1 (ja) 2020-06-25
JP7166256B2 true JP7166256B2 (ja) 2022-11-07

Family

ID=65229955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019533985A Active JP7166256B2 (ja) 2017-08-04 2018-07-02 ロボットの診断方法

Country Status (6)

Country Link
US (1) US10403539B2 (zh)
JP (1) JP7166256B2 (zh)
KR (1) KR102341754B1 (zh)
CN (1) CN111052337B (zh)
TW (1) TWI684503B (zh)
WO (1) WO2019026508A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11295975B2 (en) * 2019-09-13 2022-04-05 Brooks Automation Us, Llc Method and apparatus for substrate alignment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110004A (ja) 2001-09-28 2003-04-11 Assist Japan Kk ウェハ搬送における位置補正方法
JP2007281249A (ja) 2006-04-07 2007-10-25 Yaskawa Electric Corp 搬送用ロボットおよび搬送用ロボットの位置補正方法
JP2013162029A (ja) 2012-02-07 2013-08-19 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2017092246A (ja) 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理システム、および基板搬送方法

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
JPH0656864B2 (ja) * 1987-10-21 1994-07-27 富士電機株式会社 半導体ウエハの搬送位置決め方式
EP0793261B1 (en) * 1996-02-28 2005-01-05 Ebara Corporation Robotic transport apparatus having a guard against water
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
JP2002270672A (ja) * 2001-03-09 2002-09-20 Olympus Optical Co Ltd アライメント方法及び基板検査装置
US6711972B1 (en) * 2002-10-09 2004-03-30 Visteon Global Technologies, Inc. Articulated support for manually-operated tool
JP2006048244A (ja) * 2004-08-02 2006-02-16 Fanuc Ltd 加工プログラム作成装置
WO2007046430A1 (ja) * 2005-10-19 2007-04-26 Nikon Corporation 物体の搬出入方法及び搬出入装置、露光方法及び露光装置、並びにデバイス製造方法
JP2009049251A (ja) 2007-08-22 2009-03-05 Yaskawa Electric Corp ウエハ搬送装置
JP2009194046A (ja) * 2008-02-13 2009-08-27 Hitachi High-Tech Control Systems Corp 基板搬送装置および基板の偏心補正方法
JP5246550B2 (ja) * 2009-03-03 2013-07-24 川崎重工業株式会社 ロボット及びその制御方法
JP5689704B2 (ja) * 2010-08-08 2015-03-25 日本電産サンキョー株式会社 モータ制御装置およびモータ制御方法
US9004838B2 (en) * 2011-04-07 2015-04-14 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
US9505133B2 (en) * 2013-12-13 2016-11-29 Canon Kabushiki Kaisha Robot apparatus, robot controlling method, program and recording medium
JP6595206B2 (ja) * 2015-04-30 2019-10-23 ライフロボティクス株式会社 多関節アーム機構の動作制御装置及びロボット装置
US9824908B2 (en) * 2015-05-05 2017-11-21 Kawasaki Jukogyo Kabushiki Kaisha Conveying system, conveying robot and teaching method of the same
WO2016199224A1 (ja) * 2015-06-09 2016-12-15 株式会社安川電機 基板搬送方法及び基板搬送装置
KR102587203B1 (ko) * 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10509052B2 (en) * 2017-02-06 2019-12-17 Lam Research Corporation Smart vibration wafer with optional integration with semiconductor processing tool
US10290523B2 (en) * 2017-03-17 2019-05-14 Asm Ip Holding B.V. Wafer processing apparatus, recording medium and wafer conveying method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110004A (ja) 2001-09-28 2003-04-11 Assist Japan Kk ウェハ搬送における位置補正方法
JP2007281249A (ja) 2006-04-07 2007-10-25 Yaskawa Electric Corp 搬送用ロボットおよび搬送用ロボットの位置補正方法
JP2013162029A (ja) 2012-02-07 2013-08-19 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP2017092246A (ja) 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理システム、および基板搬送方法

Also Published As

Publication number Publication date
JPWO2019026508A1 (ja) 2020-06-25
TWI684503B (zh) 2020-02-11
CN111052337A (zh) 2020-04-21
US20190043750A1 (en) 2019-02-07
KR20200032737A (ko) 2020-03-26
TW201910078A (zh) 2019-03-16
CN111052337B (zh) 2023-08-22
US10403539B2 (en) 2019-09-03
KR102341754B1 (ko) 2021-12-21
WO2019026508A1 (ja) 2019-02-07

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