JP7165203B2 - UV package element - Google Patents

Description

The present invention relates to ultraviolet packaging devices, and more particularly to ultraviolet LED light source packaging devices.

A light emitting diode (LED) is a solid state semiconductor light emitting device. With the development of LED technology, the wavelength range of LED modules gradually develops toward near-ultraviolet and further toward far-ultraviolet. As a new green light source, ultraviolet LEDs are known to have many advantages such as high luminous efficiency, long life, energy saving, and environmental protection. Its application fields, such as medicine, food and drink, and plant growth, are becoming more and more extensive. However, the current ultraviolet (UV) LED package structure, especially the deep ultraviolet (DUV) LED package structure, generally uses a completely inorganic package, and the light of such a package structure is emitted from the LED chip into the atmosphere, and then further , through an optical element made of quartz glass or the like. Since the entire optical path passes through a light-dense medium and a light-sparse medium several times and the boundary surface has a planar structure, there is a large total reflection phenomenon, which greatly affects the luminous efficiency.

In order to overcome the drawbacks of the prior art, for example, as disclosed in CN108134007, the prior art allows the light emitted from the chip to pass through a filling medium whose refractive index is higher than that of the atmosphere, and then The light passes through the optical element and is emitted to the outside, and this configuration can improve the effect of total reflection and increase the light extraction efficiency.

On the other hand, amorphous fluororesin packaging materials are known, and their refractive index is generally 1.3 to 1.6. Some deep UV LED packaging materials. However, in the package structure disclosed in Chinese Patent Application Publication No. 108134007, as shown in FIGS. 1(a) and 1(b), the material filled in the package structure is liquid. , there is a problem that even if bubbles are generated, they cannot be removed. The presence of air bubbles in the sealed package structure affects the light extraction efficiency, and the above structure also has the problem that the optical element is deformed during the reflow soldering process.

To solve the above technical problems, the present invention includes a base frame, an optical element and an LED chip, a recess is formed in the middle of the base frame, and the LED chip is fixed at the bottom of the recess. In the ultraviolet package element described above, a package colloid is filled in the recessed portion below the optical element, and a through-hole structure above the optical element or formed between the edge of the optical element and the inner wall of the recess Provided is an ultraviolet package element characterized by filling through the gap until the upper surface of a portion of the optical element is covered.

Preferably, the package colloid is a fluorine-containing resin. The fluorine-containing resin has excellent heat resistance and ultraviolet resistance, and more preferably, the non-fluorine-containing resin is an amorphous fluorine-containing resin in order to increase the light transmittance to ultraviolet rays.

Preferably, the ultraviolet LED chip has a peak emission wavelength of 290 nm or less.

Preferably, a plurality of spaced-apart stepped portions having the same height or a continuously formed annular stepped portion are formed along the inner wall of the recess, and the edge of the optical element is formed on the stepped portion. It is provided to be located in

Preferably, the optical element is provided so as to be positioned on the stepped portion, and one or more adhesive layers are formed between the stepped portion and the optical element. The adhesion strength of the adhesive layer is higher than that of the fluorine-containing resin.

Preferably, some of the edges of the optical element are provided on the stepped portion, and some of the edges are not provided on the stepped portion but are provided on the stepped portion. The fluorine-containing resin is filled through the gap formed between the edge of the non-exposed portion and the inner wall of the recess until it covers the upper surface of the portion of the optical element.

Preferably, the stepped portion is higher than the light exit surface of the chip and lower than the top of the inner surface of the recess.

Preferably, there are four stepped portions spaced apart from each other.

Preferably, said holes are plural.

Preferably, said hole is located above said recess and said hole is provided close to the edge of said optical element. The size of said pore structure is greater than or equal to 20 μm, preferably between 100 μm and 1 mm. Said size is the maximum diameter of the pore. Preferably, said gap is greater than or equal to 20 μm in size. Preferably, it is between 100 μm and 1 mm. Said size is the maximum level distance from the face of the sidewall of the recess to the edge of the optical element. The inner walls of said holes have a roughness, preferably at least ≧0.2 μm.

Preferably, the edge of the optical element is provided on the top edge of the base frame, and an adhesive layer is formed between the optical element and the top edge of the base frame.

Preferably, the outer surface of said optical element is an arc-shaped lens.

Preferably, the bottom surface of the lens is flat, and a straight line connecting the center of the spherical surface and the center of the light exit surface of the LED chip is perpendicular to the light exit surface of the LED chip.

Preferably, the edge of said lens has a plateau. Preferably, at least a part of the upper or lower surface of the flat base or the side of the edge is roughened and has a roughness of at least ≧0.2 μm.

Preferably, the fluorine-containing resin is an amorphous fluorine-containing resin and has a crystallinity of 10% or less. Preferably, the imaginary part of the complex refractive index of the fluororesin is smaller than 0.001@300 nm.

Preferably, the fluorine-containing resin is a copolymer of perfluorooxygen heterocycle and perfluoroolefin.

Preferably, the structural unit of the fluorine-containing resin contains a five-membered ring, and the ring contains one or two oxygens. The fluorine-containing resin has a structure of the following formula 1,

Here, the ratio value of n/(n+m)% is 40-60%.

Preferably, the emission wavelength of said LED is between 275 nm and 285 nm. The main body of the base frame is made of aluminum nitride insulating material.

According to the ultraviolet chip package structure according to the present invention, the following beneficial effects can be achieved compared with the prior art.

1. After filling the liquid fluorine-containing resin into the package, the air contained or gas generated during the curing process can be effectively discharged through the pore structure or gap. There may be one or more such pore structures or gaps, one of which has a size of 20 μm or more. With such a structure, the gap between the chip and the optical element is completely filled with the fluorine-containing resin, leaving no air, and the light extraction efficiency can be improved.

2. Due to the hole structure of the optical element or the gap formed between the optical element and the inner wall of the recess, the filling height of the fluorine-containing resin is higher than the edge of the bottom surface of the optical element and partially covers the outer surface. come true. The rigid fluorine-containing resin forms a fixing action between the edge of the optical element and the fluorine resin, and can enhance the effect of fixing the optical element to the surface of the base frame. This can eliminate the adhesion problem between the optical element and the base frame, improve the reliability of the element, reduce total internal reflection, and increase light extraction. This structural design is effectively used in the package structure of ultraviolet light, especially in the deep ultraviolet (DUV) light emitting region, and the adhesive weakens with long-term use or aging under ultraviolet irradiation, and the optical element is easy to fall off. can also solve the problem.

3. Providing stepped portions spaced apart or continuous along the sidewalls in the recess of the base frame, the height of the steps being higher than the height of the chip and lower than the height of the base frame, and the edge of the optical element being provided on the steps; It is More preferably, an adhesive layer is provided between the steps and the optical element to provide support for the optical element.

Other features and advantages of the invention will be set forth in the description that follows, and in part will be obvious from the specification, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

The drawings are provided for a further understanding of the invention, and constitute a part of the specification, and may be used in conjunction with the embodiments of the invention to interpret the invention, but are not limiting of the invention. not something to do. Also, the numerical values in the drawings are only schematic and are not drawn to scale.
1 is a diagram showing a conventional ultraviolet package structure according to the background art; FIG. 1 is a diagram showing a conventional ultraviolet package structure according to the background art; FIG. 1 is a diagram showing an ultraviolet package structure according to Example 1; FIG. 4 is a top view showing a state in which a chip and an optical element are mounted on a base frame in Example 1. FIG. 4 is a top view showing a state in which a chip and an optical element are mounted on a base frame in Example 1. FIG. FIG. 4 is a diagram showing a structure in which a chip is mounted in a base frame in Example 1; 4 is a diagram showing a structure in which a chip and an optical element are mounted in a base frame in Example 1. FIG. FIG. 10 is a diagram showing an improved ultraviolet package structure according to Example 2; FIG. 10 is a diagram showing an ultraviolet package structure according to Example 3; FIG. 10 is a diagram showing an ultraviolet package structure according to Example 4; 4 is a curve graph showing the light transmittance and wavelength distribution of the fluorine-containing resin used in the ultraviolet package structure according to Example 1. FIG.

Hereinafter, the details of the ultraviolet LED package structure according to the present invention will be described with reference to the drawings. Before describing the present invention, it should be understood that the specific examples may vary and are not limited to the specific examples below. It is also to be understood that the scope of the present invention is limited only by the appended claims and that the examples used are illustrated for purposes of illustration and not limitation. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of skill in the art.

Example 1
As shown in FIG. 2 , this embodiment provides an ultraviolet LED package comprising a base frame 1 , an optical element 6 and an LED chip 4 . This base frame 1 has a dent in the middle, and an LED chip 4 is fixed to the bottom of this dent. A fluorine-containing resin 5 is filled in the recess of the base frame 1 . The optical element 6 is fitted in the recess and positioned above the LED chip 4 . There is a gap between the edge of the optical element 6 and the inner wall of the recess, and the gap is filled with the fluorine-containing resin 5 . Air bubbles are eliminated by the gap between the edge of the optical element 6 and the inner wall of the recess, and the fluorine-containing resin 5 covers up to the upper surface of a part of the optical element through the gap to obtain a fixing action. be able to.

Specifically, the base frame 1 is preferably a single piece of ceramic material or a composite structure with a ceramic bottom and metal sides. Insulating materials including, for example, ceramic materials can be selected to ensure high heat dissipation. Ceramic materials include co-fired low temperature co-fired ceramics (LTCC) or high temperature co-fired ceramics (HTCC). The body material of the base frame 10 may be AIN and may consist of a metal nitride with a thermal conductivity of 140 W/(m·K) or higher. The base frame 1 has a recessed portion in its center, and an ultraviolet LED chip structure is mounted on the bottom of the recessed portion. One or a plurality of ultraviolet LED chips 4 are provided. Positive and negative electrodes are provided at the bottom of the recess. The positive and negative electrodes of the LED chip are connected to the positive and negative electrodes at the bottom of the recess by wire bonding or chip bonding method. The positive and negative electrodes are realized as electrically connected positive and negative electrodes by extending to the outside. The LED chip 4 may be a face-up chip, a flip chip or a vertical chip. The LED chip 4 is an ultraviolet chip. Such LED chips are placed on a support frame, and their wavelength is between 200 and 380 nm, specifically long wavelength (abbreviated UVA, wavelength 315 to 380 nm), medium wavelength (UVB, wavelength 280 to 315 nm), or short wavelength (UVC, wavelength 200-280 nm). The emission wavelength can be selected according to practical application requirements, such as surface sterilization and surface curing. The number of UV LED chips 4 can be selected according to factors such as output requirements. UV LED chips 4 with different wavelengths can be selected in the same UV LED package structure according to different applications. You may combine the ultraviolet LED chip 4 and the chip|tip of other wavelengths.

The optical element 6 has a lens structure with an arc-shaped outer surface and a flat bottom surface, and is made of, for example, quartz glass. Such a lens fits within the recess to form a gap with the inner wall of the recess.

The fluororesin 5 fills up to cover the LED chip 4, the bottom surface and at least part of the side surfaces in the recess, and covers at least part of the arc shape of the edge and at least the outer surface of the lens. Preferably, the top surface of such an arc-shaped lens is arc-shaped forming a portion of a spherical shape. As for the position of the spherical center of the arc shape, it is best that the straight line connecting the center point of the light emitting surface of the chip is perpendicular to the light emitting surface of the chip. This ensures that the light emerging from the optical element is uniform at all angles. The larger the size of the arc-shaped lens with respect to the size of the chip, the better. As a result, the position of the tip is closer to the position of the center of the sphere, and the light emitted by the tip reaches the fluororesin and the arc-shaped lens, the light exit interface between the arc-shaped lens and the air in this order, and Ensure that the light can be emitted at a small angle and reduce the reflectance.

Such a fluorine-containing resin has a refractive index higher than that of air, which is between 1.3 and 1.6. The fluorine-containing resin has a refractive index between the refractive index of the LED chip epitaxial structure and the refractive index of the glass, so it can effectively reduce the total reflection caused by the interfaces of different materials, and directly increase the light extraction efficiency. can be done.

Such a fluororesin is a stable UV radiation resistant and high light transmittance resin, and such a stable UV radiation resistant and high light transmittance fluororesin is more preferably an amorphous fluororesin. More preferably, such fluororesins are monomers or copolymers, specifically for example perfluoroalkyl vinyl ether copolymers, perfluoroalkyl vinyl ether copolymers, fluorinated ethylene propylene (Fluorinated ethylene propylene), a copolymer of ethylene and tetrafluoroethylene. Structural units constituting the monomer or copolymer have fluorine-containing alicyclic structural units. The fluorine-containing alicyclic structural unit is further useful for amorphization and has high transparency.

Such a fluorine-containing resin monomer or copolymer has a fluorine-containing alicyclic structural unit, preferably based on a unit of a cyclic fluorine-containing monomer or a unit formed by cyclopolymerization of a diene-type fluorine-containing monomer. there is Specifically, the unit of the cyclic fluorine-containing monomer has a monomer with a polymerizable double bond between the carbon atoms that constitute the fluorine-containing alicyclic ring, or the carbon atoms that constitute the fluorine-containing alicyclic ring. It may have a polymerizable double bond monomer between carbon atoms outside the fluorine-containing aliphatic ring. The fluorine-containing alicyclic ring may have an etheric oxygen atom (--O--) in its skeleton. At this time, the number of etheric oxygen atoms in the fluorine-containing alicyclic ring is preferably one or two. Copolymers of the above cyclic fluorine-containing monomers and other monomers may also be used. The ratio of the cyclic fluorine-containing monomer is preferably 20 mol% or more, more preferably 40 mol% or more, and may be 100 mol% with respect to the total of all repeating units constituting the copolymer. . Specific examples of other monomers include diene fluorine-containing monomers, tetrafluoroethylene, trifluorochloroethylene, perfluoro(methyl vinyl ether), perfluoro(ethyl vinyl ether), perfluoro(propyl vinyl ether), etc., which will be described later. be. Such a diene fluorine-containing monomer has two polymerizable double bonds and a fluorine atom monomer. The polymerizable double bond is preferably a vinyl group, an allyl group, an acryloyl group, a methylacryloyl group, or the like. As the diene fluorine-containing monomer, the following compounds are preferred.

CF2=CF-Q-CF=CF2 (2)
In the formula, Q is a perfluoroalkylidene group having 1 to 3 carbon atoms having an etheric oxygen atom and partially substituted with halogen atoms other than fluorine atoms.

The amorphous fluororesin may be a polymer consisting only of a diene fluorine-containing monomer, or a copolymer containing the diene fluorine-containing monomer and other monomers. The ratio of the diene fluorine-containing monomer is 50 mol % or more, more preferably 80 mol % or more, most preferably 100 mol %, based on the total of all repeating units constituting the copolymer. The type I amorphous fluororesin preferably has an average molecular weight of 3,000 to 1,000,000, more preferably 10,000 to 300,000, still more preferably 100,000 to 250,000. In addition, as the cyclization polymerization method of the monomer, there are a homopolymerization method and a copolymerization method. In this example, the following amorphous fluorine-containing resin is used.

Its crystallinity is 10% or less, and the imaginary part of the complex refractive index of the fluorine-containing resin is smaller than 0.001@300 nm. This makes it possible to ensure that it has a higher light transmittance under irradiation with ultraviolet light, especially far ultraviolet light sources, in particular a light transmittance of 90% at 200 nm or more. In particular, when irradiated with a light source of 275 to 285 nm, the light transmittance is 95% or more, and more preferably, the value of n/n+m is 40 to 60%. Polymers of this kind exhibit high-temperature stability, good hydrophobicity, chemical resistance, and have the advantages of high solubility in fluorinated solvents and low solution viscosities. For example, when the value of n/n+m is 60%, the refractive index is 1.327 and the glass transition temperature is 125°C. FIG. 9 shows the light transmittance test of the fluorine-containing resin between 200 nm and 800 nm. From there, it can be seen that it has a clearly high UV transmittance, and in particular, a light transmittance of 90% or more can be obtained in the wavelength range of 200 nm or more, and a typical UV light transmittance of 280 nm is 95% or more. has been shown to reach

A plurality of steps 3 separated from each other and having the same height are provided near the side wall at the bottom of the recess. The stepped portion 3 is made of the same or different material as the base frame. The edge of the optical element 6 is arranged on the stepped portion 3 . The height of the step portion 3 is higher than the height of the chip and lower than the height of the side wall. The height of the stepped portion 3 can be adjusted by controlling the distance between the chip and the optical element, and can be controlled to radiate light at an angle as close to vertical as possible. When such recesses are rectangular, the number of steps spaced apart from one another is preferably four and the heights of each are the same, i. has a staircase. Such an optical element has a gap instead of forming a completely enclosed space inside the recess by covering the steps. That is, a gap is formed between the edge of the optical element and the inner wall of the recess. The sidewalls of such steps are made of the same material as the base frame, eg aluminum nitride, but may also be made of a material having a higher reflectivity than aluminum nitride, eg metal.

An adhesive layer may be formed between the optical element 6 and the step portion 3 in order to increase the strength. The adhesiveness of the adhesive layer is preferably higher than that of the fluorine-containing resin. Here, the adhesive layer may consist of one or more layers of material, preferably consists of one layer of material, the adhesive strength is greater than or equal to 2 MPa, the thickness preferably does not exceed 5 μm, and the adhesive strength is It is preferably higher than that of the fluorine-containing resin.

More preferably, in order to increase the adhesive force between the optical element 6 and the fluorine resin, the edge of such an arc-shaped lens has a flat base, as shown in the schematic diagram of the package structure seen from the side of the outer surface in FIG. A part of the flat plate portion of the lens is placed on the stepped portion 3, thereby increasing the bonding area. A portion of the flat base portion of the lens is not placed on the stepped portion 3 and is in a state of being suspended in the air between the stepped portions 3, and a gap exists between this portion of the flat base portion and the side wall of the recess. The gap is filled with a fluorine-containing resin, and the fluorine-containing resin is filled until it covers the flat base portion and at least a part of the outer surface of the lens, thereby removing the fluorine-containing resin below the lens. Air bubbles can be vented to the atmosphere through the gap and can form a fixed structure. It should be noted that the portion within the dashed line in FIG. 3 is the gap formed between the flat plate portion of the lens and the side wall of the recess. The maximum value of the level distance between the edge of the lens plateau and all surfaces of the sidewalls of the recess is at least 20 μm.

More preferably, at least a portion of the top surface or bottom surface or the side of the edge of the flat base is roughened and has a roughness of at least ≧0.2 μm. By performing surface roughening treatment at least between the flat base portion and the stepped portion, it is possible to increase the adhesiveness of the bonding area or the position where the flat base portion and the fluorine-containing resin are connected, thereby enhancing the fixing effect.

More preferably, the edge of the plateau of such a lens conforms entirely to the arc shape of the lens, as shown in FIG. The edges of the flatbed conform to the shape of the recess, for example the square shape shown in FIG.

In order to obtain the package structure of this embodiment, as shown in FIG. In addition, it is preferable that the ultraviolet LED chip is a flip chip.

Then, as shown in FIG. 6, a lens with an arc-shaped top surface and a flat bottom surface is mounted over the stepped portion 3 of the side wall of the recess, and an adhesive layer is used to separate the stepped portion 3 and the lens. Glue between The adhesive layer is made of a conventional adhesive resin, and the adhesiveness of the adhesive layer is higher than that of the fluorine-containing resin. A portion of the edge of the lens is not placed over the stepped portion and is completely slanted by forming a gap 7 (gap 7 is indicated by the dashed circle in FIG. 5) between the lens and the side wall of the recess. is formed with a non-sealing lower recessed portion.

Then, a coating solution prepared by dissolving the above amorphous fluororesin in a fluorine-containing solvent, preferably an aprotic fluorine-containing solvent, is injected into the recess of the base frame through the gap between the lens and the recess. , the LED chip 4 under the lens, the metal positive and negative electrodes 2 at the bottom, the recessed space and the edge of the lens, and also cover the outer surface of a part of the arc shape of the lens. The solvent is volatilized while gradually heating the coating liquid. When volatilizing the solvent, gently heat it from a low temperature range below the boiling point of the solvent (for example, around room temperature) to a high temperature range above the boiling point of the solvent (for example, around 200°C) in order to prevent air bubbles from remaining in the resin as much as possible. Evaporate the solvent.

If the molecular weight of the fluorine-containing solvent used is too large, it not only increases the viscosity of the coating solution, but also decreases the solubility of the type I amorphous fluororesin. In order to increase the solubility of the type I amorphous fluororesin, the fluorine content of the solvent is preferably 60 to 80% by weight.

Examples of the aprotic fluorine-containing solvent include polyfluoroaromatic compounds, polyfluorotrialkylamines, polyfluoroparaffins, polyfluorocyclic ethers, hydrofluoroethers (HFE), and the like. These aprotic fluorine-containing solvents may be used alone or in combination.

After evaporating the solvent by high-temperature curing and cooling to room temperature, the obtained fluorine-containing resin is in a rigid state, fills the space below the optical element, and is partially applied to the upper surface of the optical element through the gap. Fill to cover. It has the effect of fixing the rigid fluororesin and the edge of the optical element. Also, the flat plate formed at the edge of the optical element is beneficial due to its rigidity due to the locking action.

Example 2
As a modification of the first embodiment, as shown in FIG. 7, a continuous ring-shaped step portion 3 is provided near the side wall of the bottom of the recess. The height of such annular stepped portion 3 is the same, the edge of part of the optical element 6 is placed on the stepped portion 3, the height of the stepped portion 3 is greater than the height of the chip and less than the height of the side wall of the recess. low. To effectively control the distance between the chip and the optical element by arranging the height of the steps, thereby effectively controlling the light emission angle to be almost vertical as much as possible. can be done. An adhesive layer is formed between the optical element and the step portion, and the material of the adhesive layer may be the same as or different from the fluorine-containing resin material, or the adhesion of the adhesive layer may be higher than that of the fluorine-containing resin. high. This adhesive layer may consist of one or more layers of material. A portion of the edge of the optical element is not placed on the stepped portion, and the interior of the recess below the optical element is a space that is not completely sealed. A gap 7 is formed between the upper edge and the inner wall of the recess. The fluorine-containing resin is filled in the recess under the optical element and covers up to the arc-shaped side wall of the top surface of the optical element, or at least covers the flat plate portion of the edge if the edge has a flat plate portion. .

Example 3
This embodiment provides an ultraviolet package device different from the above embodiments. As shown in FIG. 8, this UV package device comprises a base frame 1, an optical element 6, and an LED chip 4. As shown in FIG. A recess is provided in the center of the base frame 1, and the LED chip 4 is fixed to the bottom of this recess. The edge of the optical element 6 is placed over the steps in the recess of the base frame. Such an optical element preferably has a platform at its edge, the platform being arranged on the stepped part. An adhesive layer is provided between the flat base portion and the stepped portion, and the adhesive strength of the adhesive layer is preferably higher than that of the fluorine-containing resin. The fluorine-containing resin 5 fills the recesses of the base frame. Such an optical element has holes 8 . Such a fluorine-containing resin fills the pores and covers the outer surface around the pores. By overflowing the fluororesin from the pores, it is possible to achieve a fixing function between the optical element and the fluororesin. This can help fix the optical element. The height of such steps is higher than the light extraction surface of the chip and lower than the height of the top of the base frame.

The hole 8 is located above the recess, and the fluorine-containing resin fills between the optical element and the chip.

There are at least two holes 8, uniformly or non-uniformly distributed over the optical element. Such holes may be relatively distributed on both sides above the chip. The location of such holes may be arranged away from the middle of the optical element and closer to the edge of the optical element. The holes 8 are circular, elliptical or polygonal. The size of the pore 8 structure is greater than 20 μm, preferably between 100 μm and 1 mm. The optical element 6 is an arc-shaped lens. It is possible to increase the bonding area by performing a surface roughening treatment on the portion where the flat base portion and the stepped portion of the optical element are in contact with each other. The inside of such holes may be roughened and have a roughness of at least ≧0.2 μm. This can enhance the fixing effect between the optical element and the fluorine-containing resin.

Example 4
As an alternative to Example 3, the inner wall of such a recess is not arranged with a stepped portion of the edge of the optical element, and the optical element 6 is arranged above the edge of the base frame, as shown in FIG. . An adhesive layer is formed between the edges of the optical element and the base frame, and the adhesive layer may be one layer or multiple layers.

The above is only a preferred embodiment of the present invention, and improvements and modifications can be made by persons skilled in the art without departing from the scope of the present invention, and these improvements and modifications are also within the scope of protection of the present invention. It should be understood that there is

1 base frame 2 positive and negative electrodes 3 stepped portion 4 LED chip 5 fluorine-containing resin 6 optical element 7 gap 8 hole

Claims (17)

comprising a base frame, an optical element and an LED chip, wherein a recess is formed in the middle of the base frame, the LED chip is fixed at the bottom of the recess, and the LED chip is included in the recessed portion below the optical element. Filling the fluororesin and filling the fluororesin until the upper surface of a part of the optical element is covered through the hole structure on the optical element,
An ultraviolet package element, wherein the diameter of said pore structure is at least 20 μm and at most 1 mm , and the inner side of said pore structure is roughened and has an arithmetic mean roughness of at least ≧0.2 μm. 2. An ultraviolet package device according to claim 1, wherein said LED chip has an emission peak wavelength of 290 nm or less. 2. The method according to claim 1, wherein a plurality of stepped portions of the same height or an annular shape are formed along the inner wall of the recess, and the edges of the optical element are provided on the stepped portions. Ultraviolet package element. 4. The ultraviolet package element according to claim 3, wherein the optical element is provided on the step portion, and one or more adhesive layers are formed between the step portion and the optical element. 5. An ultraviolet package element according to claim 4, wherein the adhesive strength of said adhesive layer is higher than that of said fluorine-containing resin. Some edges of the optical element are provided on the stepped portion, some edges are not provided on the stepped portion, and some edges are not provided on the stepped portion. 5. The fluorine-containing resin fills up to cover the upper surface of a part of the optical element through a gap formed between and the inner wall of the recess. UV package element. 4. The ultraviolet package element according to claim 3, wherein the stepped portion is higher than the light exit surface of the LED chip and lower than the top of the inner surface of the recess. 2. The ultraviolet package device of claim 1, wherein the hole structure is plural. 2. The ultraviolet packaging element of claim 1, wherein the hole structure is located above the recess, and the hole structure is close to the edge of the optical element. The ultraviolet package of claim 1, wherein the edge of the optical element is provided on the top edge of the base frame to form an adhesive layer between the optical element and the top edge of the base frame. element. comprising a base frame, an optical element and an LED chip, wherein a recess is formed in the middle of the base frame, the LED chip is fixed at the bottom of the recess, and the LED chip is included in the recessed portion below the optical element. The fluororesin is filled and filled with the fluororesin until the upper surface of a part of the optical element is covered through a gap formed between the edge of the optical element and the inner wall of the recess,
The LED chip has an emission peak wavelength of 290 nm or less,
A plurality of stepped portions of the same height or an annular shape are formed in the recess along the inner wall, and the edge of the optical element is provided on the stepped portion, and the optical element has an arc-shaped outer surface. is a lens of
the top surface of the arc-shaped lens is arc-shaped forming a portion of a spherical shape;
a straight line connecting the position of the spherical center of the arc shape and the center point of the light exit surface of the LED chip is perpendicular to the light exit surface of the LED chip;
An edge of the lens has a flat base portion, a flat base portion of the edge of the optical element is provided on the stepped portion, and a flat base portion of the edge of the portion is provided on the stepped portion. not
The fluorine-containing resin is filled up to cover the upper surface of a portion of the optical element through a gap formed between a portion of the edge not provided on the stepped portion and the inner wall of the recess. and
An ultraviolet package element, wherein at least a part of the upper surface or the lower surface of the flat base or the sides of the edge is roughened to have an arithmetic mean roughness of at least ≧0.2 μm. 12. The ultraviolet package device as claimed in claim 11, wherein there are four steps separated from each other. 2. The ultraviolet package element according to claim 1, wherein said fluorine-containing resin is an amorphous fluorine-containing resin having a degree of crystallinity of 10% or less. 2. An ultraviolet package element according to claim 1, wherein said fluorine-containing resin is a copolymer of perfluorooxygen heterocycle and perfluoroolefin. 2. An ultraviolet package element according to claim 1, wherein the imaginary part of the complex refractive index of said fluorine-containing resin is smaller than 0.001@300 nm. The fluorine-containing resin is a polymer represented by the following formula 1,

The ultraviolet package element of claim 1, wherein the ratio of n/(n+m)% is 40-60%. The ultraviolet package device of claim 1, wherein the LED chip has a radiation wavelength of 275nm to 285nm.

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