CN102044597B - Light-emitting diode - Google Patents
Light-emitting diode Download PDFInfo
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- CN102044597B CN102044597B CN 200910180906 CN200910180906A CN102044597B CN 102044597 B CN102044597 B CN 102044597B CN 200910180906 CN200910180906 CN 200910180906 CN 200910180906 A CN200910180906 A CN 200910180906A CN 102044597 B CN102044597 B CN 102044597B
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- rubber base
- lens
- light
- emitting diode
- cannelure
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Abstract
The invention provides a light-emitting diode, which comprises a rubber base, a copper substrate, a wafer and a lens, wherein a slot is arranged on the middle part of the rubber base in the longitudinal direction; the bottom of the rubber base is provided with a cavity; the cavity is communicated with the slot; an annular groove around the slot is arranged on the top of the rubber base; the copper substrate is arranged in the cavity; the lens is arranged in the annular groove; the wafer is arranged on the side surface of the lens of the copper substrate; and at least one notch is arranged on the outer side wall of the annular groove along the longitudinal direction. Because of the notch arranged on the outer side wall of the annular groove on the rubber base in the light-emitting diode provided by the invention, the gas in the cavity can be discharged to the outside through the notch when the space formed by the lens and the rubber base is filled with silica gel, so as to avoid forming air bubble in the cavity of the lens and efficiently avoid the influence of the air bubble on light quality when the LED illuminates.
Description
Technical field
The present invention relates to photoelectric field, especially, relate to a kind of light-emitting diode.
Background technology
Along with the development of science and technology, light-emitting diode (Light Emitting Diode, LED) technology is applied in daily life more and more widely, as LED light fixture and LED display etc.LED is a kind of solid-state semiconductor device, and it can directly be converted into light to electricity.The heart of LED is a semi-conductive wafer that is got up by epoxy resin sealing, and this semiconductor wafer is comprised of two parts, and a part is P type semiconductor, occupies an leading position in its hole, the inside, and the other end is N type semiconductor, is mainly wherein electronics.When these two kinds of semiconductors couple together, just form one " P-N knot " between them.When electric current acted on this wafer by wire, electronics will be pushed to the P district, and hole-recombination in electronics, then will send energy with the form of photon in the P district.And the light wavelength color of light namely is to be determined by the material that forms the P-N knot.
As shown in Figure 1, LED generally includes rubber base 101, copper pedestal 102, wafer 103, lens 104 and silica gel.Bottom at rubber base 101 offers cavity volume, offers cannelure on the top of rubber base 101, offers installing hole on the sidewall of the relative both sides of cannelure.Copper pedestal 102 is assemblied in the cavity volume inside of rubber base 101 bottoms, wafer 103 is assemblied in copper pedestal 102 upper surfaces, it is inner that lens 104 are assemblied in the cannelure on rubber base 101 tops, and cover at copper pedestal 102 and wafer 103 tops, and silica gel is filled in space between lens 104 and rubber base 101.A lug is extended respectively at the two ends of lens 104 root edges, offers a through hole on each lug, and the installing hole that this lug lays respectively on rubber base 101 is inner.When perfusion silica gel, silica gel can pour into from one of them through hole of lens 104, and the gas between lens 104 and rubber base 101 can be discharged by another through hole of lens 104, yet, only have a through hole on above-mentioned LED for exhaust, the gas between lens 104 and rubber base 101 is difficult to all discharge, and easily forms bubble in the space between lens 104 and rubber base 101, affect the filling of silica gel, and then affect the light quality effect of LED.
In a word, need the urgent technical problem that solves of those skilled in the art to be exactly: how a kind of LED to be provided, can effectively to solve the problem that affects light quality when LED is luminous because of the existence of bubble.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of LED, can effectively solve the problem that affects light quality when LED is luminous because of the existence of bubble.
In order to address the above problem, the embodiment of the present invention provides a kind of light-emitting diode, and described light-emitting diode comprises rubber base, copper pedestal, wafer and lens; The middle part of described rubber base is vertically arranged with groove, and the bottom of described rubber base is provided with cavity volume, and described cavity volume is communicated with groove, and the top of described rubber base is provided with cannelure around described groove; Described copper pedestal is installed in described cavity volume, and described lens are installed in described cannelure, and described wafer is placed on the lens side surface of described copper pedestal; The lateral wall of described cannelure is vertically arranged with at least one breach.
Preferably, the position corresponding with described breach, the bottom of described cannelure is provided with mesopore.
Preferably, in the space between described lens and rubber base be silica gel filler.
Preferably, the cross section of described groove is circular.
Preferably, the cross section of described groove is hexagon.
Preferably, the cross section of described breach is arc.
Preferably, be provided with a plurality of metal accepting grooves for accommodating sheet metal in described cannelure, be provided with installing hole in the rubber base between described cavity volume and metal accepting groove.
Preferably, described lens are the semicircle spheroid, inner become a cavity, and a lug is extended respectively at the root edge two ends of described lens, is provided with through hole on each described lug.
Preferably, described rubber base is cylindrical.
Compared with prior art, the present invention has the following advantages:
Light-emitting diode of the present invention is jagged in the arranged outside of the cannelure of rubber base, when perfusion silica gel in the space that is surrounded by lens and rubber base, gas in the space can be discharged to the external world by breach, thereby avoided producing bubble in the cavity of lens, effectively avoided thus LED to affect light quality because of bubble when luminous.
Description of drawings
Fig. 1 is the structural representation of a kind of LED of prior art;
Fig. 2 is the structural representation of the vertical section of a kind of LED embodiment of the present invention;
Fig. 3 is the perspective view of the rubber base part of LED embodiment shown in Figure 2.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
With reference to Fig. 2, show the vertical section structural representation of a kind of LED embodiment of the present invention, specifically can comprise: rubber base 201, copper pedestal 202, wafer 203, lens 204 and silica gel 205.
For the ease of being well understood to the LED of the present embodiment, the below first does to introduce to the rubber base 201 of this LED embodiment.With reference to Fig. 3, show the perspective view of the rubber base 201 of this LED embodiment.201 one-tenth of the rubber bases of the present embodiment are cylindrical, and its middle part is vertically arranged with the groove 2011 that connects rubber base 201, and the groove 2011 of the present embodiment is cylindrical on the longitudinal direction of rubber base 201, its cross section is circular, certainly, also can be hexagon or other shape, to adapt to copper pedestal 202.With respect to other shape, cylindrical being easier to processing, the convenient production in enormous quantities in enormous quantities.The bottom of rubber base 201 is provided with cavity volume 2012, is used for accommodating copper pedestal 202, and cavity volume 2012 can rationally arrange according to the shape of copper pedestal 202, and to be fit to copper pedestal 202 as standard, cavity volume 2012 and groove 2011 are communicated with.The top of rubber base 201 is provided with cannelure 2013 around groove 2011, and described cannelure 2013 is used for mounted lens 204, is provided with a plurality of metal accepting grooves 2014 for accommodating sheet metal in cannelure 2013.Be provided with at least one breach 2015 on the lateral wall of cannelure 2013, the breach number that arranges in the present embodiment is four, and those skilled in the art also can arrange suitable breach number according to actual needs, and the present invention need not restrict this.Described breach 2015 vertically arranges along cannelure 2013 lateral walls, the cross section camber, and certainly, breach 2015 also can be other shape, and as triangle, the present invention need not restrict this.The bottom of cannelure 2013, the position corresponding with described breach 2015 also is provided with mesopore 2016.The setting of mesopore 2016, the gas when having increased lens 204 perfusion silica gel 205 is discharged approach, has further reduced the impact of bubble on the luminous light quality of LED.In addition, the both sides between cannelure 2013 and cavity volume 2012 are respectively arranged with for the installing hole 2017 (as shown in fig. 1) that the connector (not shown) is installed, and, for the gap slot 2018 of the lug 2041 on mounted lens 204.
The outlet that the present invention discharges because a plurality of supplied gas are set on the cannelure 2013 of rubber base 201, therefore can effectively avoid producing the phenomenon of bubble when perfusion silica gel 205 in the cavity of lens 204, and then reach LED can not affect because of bubble the effect of light quality when luminous.
Above a kind of LED provided by the present invention is described in detail, has used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1. a light-emitting diode, is characterized in that, comprises rubber base, copper pedestal, wafer and lens; The middle part of described rubber base is vertically arranged with groove, and the bottom of described rubber base is provided with cavity volume, and described cavity volume is communicated with groove, and the top of described rubber base is provided with cannelure around described groove; Described copper pedestal is installed in described cavity volume, and described lens are installed in described cannelure, and described wafer is placed on the lens side surface of described copper pedestal; The lateral wall of described cannelure is vertically arranged with at least one breach, and the position corresponding with described breach, the bottom of wherein said cannelure is provided with mesopore.
2. light-emitting diode according to claim 1, is characterized in that, is silica gel filler in the space between described lens and rubber base.
3. light-emitting diode according to claim 1, is characterized in that, the cross section of described groove is circular.
4. light-emitting diode according to claim 1, is characterized in that, the cross section of described groove is hexagon.
5. light-emitting diode according to claim 1, is characterized in that, the cross section of described breach is arc.
6. light-emitting diode according to claim 1, is characterized in that, is provided with a plurality of metal accepting grooves for accommodating sheet metal in described cannelure, is provided with installing hole in the rubber base between described cavity volume and metal accepting groove.
7. light-emitting diode according to claim 1, is characterized in that, described lens are the semicircle spheroid, inner becomes a cavity, and a lug is extended respectively at the root edge two ends of described lens, is provided with through hole on each described lug.
8. light-emitting diode according to claim 1, is characterized in that, described rubber base is cylindrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910180906 CN102044597B (en) | 2009-10-21 | 2009-10-21 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910180906 CN102044597B (en) | 2009-10-21 | 2009-10-21 | Light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102044597A CN102044597A (en) | 2011-05-04 |
| CN102044597B true CN102044597B (en) | 2013-05-22 |
Family
ID=43910578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910180906 Expired - Fee Related CN102044597B (en) | 2009-10-21 | 2009-10-21 | Light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102044597B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7165203B2 (en) * | 2018-11-19 | 2022-11-02 | 泉州三安半導体科技有限公司 | UV package element |
| CN111384220A (en) * | 2018-12-27 | 2020-07-07 | 南昌欧菲生物识别技术有限公司 | Light emitter, depth camera and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200961829Y (en) * | 2006-09-01 | 2007-10-17 | 一诠精密工业股份有限公司 | Surface adhered LED support structure with metal reflecting component |
| CN101382267A (en) * | 2007-09-03 | 2009-03-11 | 复盛股份有限公司 | Support structure of light-emitting diode and method for making same |
| CN201780989U (en) * | 2009-10-21 | 2011-03-30 | 陆亮 | Light-emitting diode |
-
2009
- 2009-10-21 CN CN 200910180906 patent/CN102044597B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200961829Y (en) * | 2006-09-01 | 2007-10-17 | 一诠精密工业股份有限公司 | Surface adhered LED support structure with metal reflecting component |
| CN101382267A (en) * | 2007-09-03 | 2009-03-11 | 复盛股份有限公司 | Support structure of light-emitting diode and method for making same |
| CN201780989U (en) * | 2009-10-21 | 2011-03-30 | 陆亮 | Light-emitting diode |
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| Publication number | Publication date |
|---|---|
| CN102044597A (en) | 2011-05-04 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20141021 |
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