JP7162134B2 - 画像処理プログラム、画像処理装置および画像処理方法 - Google Patents

画像処理プログラム、画像処理装置および画像処理方法 Download PDF

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JP7162134B2
JP7162134B2 JP2021525501A JP2021525501A JP7162134B2 JP 7162134 B2 JP7162134 B2 JP 7162134B2 JP 2021525501 A JP2021525501 A JP 2021525501A JP 2021525501 A JP2021525501 A JP 2021525501A JP 7162134 B2 JP7162134 B2 JP 7162134B2
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image processing
sample
image
calculating
statistic
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JPWO2020250373A5 (https=
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将記 大内
伸一 篠田
康隆 豊田
竜 弓場
博之 新藤
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Hitachi High Tech Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T9/00—Image coding
    • G06T9/005—Statistical coding, e.g. Huffman, run length coding
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/46—Descriptors for shape, contour or point-related descriptors, e.g. scale invariant feature transform [SIFT] or bags of words [BoW]; Salient regional features
    • G06V10/469—Contour-based spatial representations, e.g. vector-coding
    • G06V10/476—Contour-based spatial representations, e.g. vector-coding using statistical shape modelling, e.g. point distribution models
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Software Systems (AREA)
  • Probability & Statistics with Applications (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Evolutionary Biology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Artificial Intelligence (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Processing Or Creating Images (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Closed-Circuit Television Systems (AREA)
JP2021525501A 2019-06-13 2019-06-13 画像処理プログラム、画像処理装置および画像処理方法 Active JP7162134B2 (ja)

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US (2) US12394038B2 (https=)
JP (2) JP7162134B2 (https=)
KR (2) KR20250069987A (https=)
CN (1) CN113994368A (https=)
TW (3) TWI813871B (https=)
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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3078085A1 (en) * 2020-04-09 2021-10-09 Techinsights Inc. System and method for image segmentation from sparse particle impingement data
US11854184B2 (en) * 2021-01-14 2023-12-26 Applied Materials Israel Ltd. Determination of defects and/or edge roughness in a specimen based on a reference image
WO2023127081A1 (ja) * 2021-12-28 2023-07-06 株式会社日立ハイテク 画像検査装置、画像処理方法
JP7728711B2 (ja) * 2022-01-14 2025-08-25 株式会社日立ハイテク プロセッサシステム、半導体検査システム、およびプログラム
JP7829415B2 (ja) 2022-06-13 2026-03-13 株式会社日立ハイテク 欠陥検査装置
CN115454560A (zh) * 2022-10-18 2022-12-09 上海鼎捷移动科技有限公司 界面布局系统以及界面布局方法
JP2024128511A (ja) * 2023-03-10 2024-09-24 キヤノン株式会社 画像処理装置、画像処理システム、画像処理方法、およびプログラム
CN121773325A (zh) * 2023-08-23 2026-03-31 东京毅力科创株式会社 基片检查装置、基片检查方法和存储介质
TWI905565B (zh) * 2023-10-31 2025-11-21 英屬維爾京群島商威爾德嘉德有限公司 影像處理系統、影像處理方法、裝置及相關設備
CN121169823B (zh) * 2025-08-27 2026-04-03 东莞理工学院 一种基于小样本微调和可控扩散模型的工业缺陷样本生成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151655A (ja) 2008-12-25 2010-07-08 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20170148226A1 (en) 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164661A (ja) * 1998-11-30 2000-06-16 Hitachi Ltd 回路パターンの検査装置
JP4920268B2 (ja) * 2006-02-23 2012-04-18 株式会社日立ハイテクノロジーズ 半導体プロセスモニタ方法およびそのシステム
KR101342203B1 (ko) * 2010-01-05 2013-12-16 가부시키가이샤 히다치 하이테크놀로지즈 Ｓｅｍ을 이용한 결함 검사 방법 및 장치
JP5622398B2 (ja) 2010-01-05 2014-11-12 株式会社日立ハイテクノロジーズ Ｓｅｍを用いた欠陥検査方法及び装置
JP5198546B2 (ja) * 2010-12-03 2013-05-15 株式会社日立ハイテクノロジーズ 回路パターン検査方法、及び回路パターン検査システム
JP2013098267A (ja) * 2011-10-31 2013-05-20 Hitachi High-Technologies Corp 半導体パターン検査装置
JP6018803B2 (ja) 2012-05-31 2016-11-02 株式会社日立ハイテクノロジーズ 計測方法、画像処理装置、及び荷電粒子線装置
JP2016057068A (ja) * 2014-09-05 2016-04-21 株式会社ブイ・テクノロジー パターン欠陥検査装置及びパターン欠陥検査方法
US10181185B2 (en) 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
KR102376200B1 (ko) 2016-05-12 2022-03-18 에이에스엠엘 네델란즈 비.브이. 기계 학습에 의한 결함 또는 핫스폿의 식별
KR102194154B1 (ko) 2016-09-01 2020-12-22 주식회사 히타치하이테크 패턴 계측 장치
JP6759034B2 (ja) * 2016-09-29 2020-09-23 株式会社日立ハイテク パターン評価装置及びコンピュータープログラム
CN107123114A (zh) * 2017-04-21 2017-09-01 佛山市南海区广工大数控装备协同创新研究院 一种基于机器学习的布匹缺陷检测方法及装置
CN107169956B (zh) * 2017-04-28 2020-02-14 西安工程大学 基于卷积神经网络的色织物疵点检测方法
CN107607554A (zh) * 2017-09-26 2018-01-19 天津工业大学 一种基于全卷积神经网络的镀锌冲压件的瑕疵检测与分类方法
US10809635B2 (en) 2017-11-20 2020-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Defect inspection method and defect inspection system
CN108734690B (zh) * 2018-03-02 2021-12-14 苏州汉特士视觉科技有限公司 一种视觉缺陷检测设备及其检测方法
US10713769B2 (en) * 2018-06-05 2020-07-14 Kla-Tencor Corp. Active learning for defect classifier training
CN109872313A (zh) * 2019-02-15 2019-06-11 苏州晓创光电科技有限公司 一种基于深度卷积自编码器的产品表面缺陷检测方法
CN109871895B (zh) * 2019-02-22 2021-03-16 北京百度网讯科技有限公司 电路板的缺陷检测方法和装置
US20210397198A1 (en) * 2020-06-18 2021-12-23 Ford Global Technologies, Llc Enhanced vehicle operation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010151655A (ja) 2008-12-25 2010-07-08 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20170148226A1 (en) 2015-11-19 2017-05-25 Kla-Tencor Corporation Generating simulated images from design information

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JP7427744B2 (ja) 2024-02-05
US20220318975A1 (en) 2022-10-06
JP2023002652A (ja) 2023-01-10
JPWO2020250373A1 (https=) 2020-12-17
TW202333106A (zh) 2023-08-16
KR20220002572A (ko) 2022-01-06
TW202046246A (zh) 2020-12-16
US12394038B2 (en) 2025-08-19
TWI861845B (zh) 2024-11-11
KR20250069987A (ko) 2025-05-20
WO2020250373A1 (ja) 2020-12-17
TWI883705B (zh) 2025-05-11
KR102808073B1 (ko) 2025-05-16
US20240404043A1 (en) 2024-12-05
TW202418220A (zh) 2024-05-01
TWI813871B (zh) 2023-09-01
CN113994368A (zh) 2022-01-28

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