JP7160051B2 - Inspection device and inspection method - Google Patents

Description

TECHNICAL FIELD The present invention relates to an inspection apparatus and an inspection method, and more particularly, to an inspection apparatus and an inspection method that perform continuity inspection by sandwiching a thin substrate to be inspected between inspection jigs from both sides.

2. Description of the Related Art Conventionally, there has been known an inspection apparatus for inspecting the continuity of a wiring pattern by bringing a probe of an inspection jig into contact with a wiring pattern formed on a printed circuit board, which is a substrate to be inspected. In these inspection apparatuses, a substrate to be inspected is placed between an upper inspection jig and a lower inspection jig, and the substrate to be inspected is sandwiched between the respective inspection jigs, thereby making probes contact the substrate to be inspected. are in contact with each other (see Patent Document 1, for example).

In the inspection apparatus as described above, when setting the amount of displacement (distance) when each inspection jig is brought close to the substrate to be inspected, data relating to the height position of the substrate to be inspected is input to the inspection apparatus, and the data and the , the amount of displacement of each inspection jig is set based on preset height position data of each inspection jig. The inspection apparatus controls the amount of displacement of each inspection jig by feeding back the reaction force received when each inspection jig comes into contact with the substrate to be inspected.

JP-A-2000-55971

In the inspection apparatus configured as described above, the fixing height of the substrate to be inspected and the size of the inspection jig are different for each type of the substrate to be inspected. For this reason, there is a possibility that variations in inspection accuracy may occur when inspecting different types of substrates to be inspected.

The present invention has been made in view of the above circumstances, and an object of the present invention is to ensure high inspection accuracy even when the type of substrate to be inspected is changed for inspection. It is to provide an inspection device and an inspection method.

In order to solve the above problems, the present invention provides an inspection apparatus and an inspection method configured below.

An inspection apparatus according to an example of the present invention includes a first jig that approaches a substrate to be inspected, which is a thin plate-like inspection object having a first surface and a second surface, from the first surface side; An inspection device that performs a continuity test by being sandwiched between a second jig that is adjacent from two sides, wherein the first A distance measuring sensor, a second distance measuring sensor fixed toward the first jig side integrally with the second jig, and a distance to the first surface measured by the first distance measuring sensor the second jig and the first surface based on the first substrate distance, which is the distance, and the second jig distance, which is the distance to the second jig measured by the first ranging sensor; a second distance calculating unit that calculates a second distance that is the distance of the second substrate distance that is the distance to the second surface measured by the second ranging sensor; and the second substrate distance that is measured by the second ranging sensor a first distance calculation unit for calculating a first distance, which is the distance between the first jig and the second surface, based on the first jig distance, which is the distance to the first jig, and and a displacement amount setting unit that sets displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance.

Further, an inspection method according to an example of the present invention includes a first jig that approaches a substrate to be inspected, which is a thin plate-shaped inspection object having a first surface and a second surface, from the first surface side; An inspection method performed by an inspection device that conducts a continuity test by sandwiching it between a second jig approaching from the second surface side, wherein the inspection device is integrated with the first jig and the second jig a first distance measuring sensor fixed toward the jig side; and a second distance measuring sensor integrally with the second jig and fixed toward the first jig side; a first substrate distance, which is the distance to the first surface measured by the first distance measuring sensor; and a second jig distance, which is the distance to the second jig measured by the first distance measuring sensor; a second distance calculating step of calculating a second distance, which is the distance between the second jig and the first surface, based on the distance to the second surface measured by the second distance measuring sensor; Based on the second substrate distance and the first jig distance, which is the distance to the first jig measured by the second distance measuring sensor, the distance between the first jig and the second surface a first distance calculating step of calculating a certain first distance; and setting displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance. and a displacement amount setting step.

FIG. 4 is a schematic diagram showing a state in which a distance to a substrate to be inspected is measured in an inspection apparatus according to one embodiment; FIG. 2 is a plan view showing a substrate to be inspected; Schematic which shows the state which is measuring the distance to the jig|tool which opposes in an inspection apparatus. Schematic diagram showing a state in which the inspection device is measuring the distance to the support surface of the workpiece. Schematic diagram showing the distance from the jig to the substrate to be inspected in the inspection apparatus. Schematic which shows the displacement amount of a jig|tool in an inspection apparatus. Schematic which shows the inspection apparatus in the state which reversed the jig|tool.

<Inspection device 1>
An overall configuration of an inspection apparatus 1 according to an embodiment of the present invention will be described below with reference to FIG. An inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting a wiring pattern formed on a substrate to be inspected (hereinafter simply referred to as "substrate") 100, which is a thin plate-like object to be inspected. The substrate 100 has an upper surface 101 that is a first surface and a lower surface 102 that is a second surface, and wiring patterns are formed on each of the upper surface 101 and the lower surface 102 . In FIG. 1, the horizontal direction of the inspection apparatus 1 is shown as the X-axis direction, the depth direction of the paper surface is the Y-axis direction, and the vertical direction of the paper surface is the Z-axis direction.

The substrate 100 may be, for example, a flexible substrate, a rigid substrate such as glass epoxy, an electrode plate for a liquid crystal display or a plasma display, a package substrate for a semiconductor package, or a film carrier. The substrate 100 in this embodiment is formed as a combined substrate, which is an aggregate of a plurality of unit substrates that will be separated in the future. In the present embodiment, as shown in FIG. 2, the regions forming the respective unit substrates in the substrate 100 are described as "first unit region Rf and second unit region Rr". A plurality of pairs of first unit regions Rf and second unit regions Rr are formed on the substrate 100 . In addition, the second unit region Rr is arranged point-symmetrically with respect to the adjacent and corresponding first unit region Rf by 180 degrees in plan view (around the Z-axis). It is also possible to use a board other than the assembled board as the object to be inspected by the inspection apparatus 1 .

In the substrate 100, the same wiring pattern is formed in each of the first and second unit regions Rf and Rr. In each of the first and second unit regions Rf and Rr, inspection points for inspecting the continuity, disconnection, short circuit, etc. of the wiring pattern are set. , lands, electrodes, etc. are appropriately set.

The inspection apparatus 1 shown in FIG. 1 includes an inspection apparatus main body 2, and a first jig 31 and a second jig 32, which are inspection jigs. The first jig 31 and the second jig 32 are provided at positions facing each other. That is, the inspection device main body 2 corresponds to a portion obtained by removing the first and second jigs 31 and 32 from the inspection device 1 . At the tip of each of the first and second jigs 31 and 32, inspection surfaces 31P and 32P having probes (not shown) and formed in a rectangular shape in a plan view are provided. In this embodiment, the first jig 31 is configured to approach the upper surface 101 of the substrate 100 from above, and the second jig 32 is configured to approach the lower surface 102 of the substrate 100 from below.

The inspection apparatus main body 2 mainly includes inspection units 4U and 4D, inspection jig drive mechanisms 5U and 5D, a substrate fixing device 6, inspection unit drive mechanisms 7U and 7D, a control unit 9, and a housing 8 that accommodates these units. prepared for. The board fixing device 6 is configured to fix the board 100 to be inspected at a predetermined position. The substrate fixing device 6 includes a work support portion 61 supported by the housing 8 and a clamp portion 62 rotatable with respect to the work support portion 61 . As shown in FIG. 1, the substrate fixing device 6 clamps the work support portion 61 and the clamp portion while the substrate 100 is placed on the work support surface 6c (see FIG. 3) formed on the upper surface of the work support portion 61. The substrate 100 is fixed by sandwiching the substrate 100 with 62 . In this embodiment, the substrate 100 is formed in a rectangular shape in plan view, and the substrate fixing device 6 fixes the substrate 100 by clamping the four clamped portions 100c (see FIG. 2) of the substrate 100. As shown in FIG. ing.

The control unit 9 includes, for example, a power supply circuit that supplies a current or voltage for inspection to the probe, a detection circuit that detects the voltage or current signal detected by the probe, a microcomputer, and the like. By executing the program, the operation of each part of the inspection apparatus 1 is controlled, and the substrate 100 is inspected. The control unit 9 supplies, for example, a voltage or current to each inspection point via a probe, detects a voltage signal or a current signal detected from each inspection point by the probe, and detects these detection values and the resistance calculated from the detection values. The continuity test of the substrate 100 is performed by comparing the values and the like with reference values stored in advance. The control unit 9 includes an initial setting unit 90, a first distance calculation unit 91, a second distance calculation unit 92, and a displacement amount setting unit 93, as shown in FIG. Each unit constituting the control unit 9 executes calculation corresponding to each step performed in the inspection method described later.

The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6, and is assembled with the first jig 31. As shown in FIG. The inspection section 4D is positioned below the substrate 100 fixed to the substrate fixing device 6, and is assembled with the second jig 32. As shown in FIG. The inspection unit driving mechanism 7U is a moving mechanism that moves the inspection unit 4U in the X-axis direction and the Y-axis direction. The inspection unit driving mechanism 7D is a moving mechanism that moves the inspection unit 4D in the X-axis direction and the Y-axis direction. The inspection unit driving mechanisms 7U and 7D are capable of moving the inspection units 4U and 4D to arbitrary positions on the XY plane according to control signals from the control unit 9. FIG. Hereinafter, the inspection unit driving mechanisms 7U and 7D are collectively referred to as the inspection unit driving mechanism 7. As shown in FIG.

Since the inspection unit 4U and the inspection unit 4D have the same configuration except that they are vertically inverted, the inspection units 4U and 4D are hereinafter collectively referred to as the inspection unit 4, and the inspection jig drive mechanisms 5U and 5D. are collectively referred to as the inspection jig driving mechanism 5, and the first and second jigs 31 and 32 are collectively referred to as the inspection jig 3. Hereinafter, the configuration of each part of the inspection units 4U and 4D will be collectively referred to. to explain.

The inspection jig drive mechanism 5 includes an X jig drive unit 5X that moves the inspection jig 3 in the X-axis direction with respect to the inspection apparatus main body 2, and is connected to the X jig drive unit 5X to move the inspection jig 3 in a Y direction. A Y jig drive unit 5Y for moving in the axial direction, a θ jig drive unit 5θ that is connected to the Y jig drive unit 5Y and rotates the inspection jig 3 around the Z axis, and a θ jig drive unit 5θ. It is configured with a Z jig drive section 5Z that is connected to move the inspection jig 3 in the Z-axis direction.

As a result, the inspection jig drive mechanism 5 positions the inspection jig 3 relative to the substrate 100 or moves the inspection jig 3 in the vertical direction (Z-axis direction) according to the control signal from the control unit 9 . ) so that the probe attached to the inspection jig 3 can be brought into contact with or separated from the inspection point on the wiring pattern formed on the substrate 100 .

In the inspection apparatus 1 configured as described above, by driving the inspection jig drive mechanism 5, the first jig 31 is brought close to the upper surface 101 of the substrate 100 from above, and the second jig 32 is moved to the substrate 100. The lower surface 102 is approached from below. Then, the substrate 100 is sandwiched between the first jig 31 and the second jig 32, the inspection surface 31P of the first jig 31 is brought into contact with the upper surface 101, and the inspection surface 32P of the second jig 32 is brought into contact with the lower surface 102. Continuity test is carried out while they are in contact with each other. In this embodiment, the continuity test by the first and second jigs 31 and 32 is performed for each unit area of the substrate 100 . In addition, in the inspection apparatus 1 according to the present embodiment, the inspection is performed by bringing the first jig 31 and the second jig 32 into contact with the substrate 100. , it is also possible to adopt a configuration in which inspection is performed in a non-contact manner.

In the substrate 100 according to the present embodiment, the corresponding unit regions Rf and Rr are arranged point-symmetrically by being inverted 180 degrees (around the Z-axis) in plan view. When inspecting such a substrate 100 with the inspection apparatus 1, as shown in FIGS. 1 to 6, the unit region Rf is inspected (first inspection) in a normal posture using the first and second jigs 31 and 32. After that, as shown in FIG. 7, the first and second jigs 31 and 32 are rotated by 180 degrees in plan view to inspect the unit region Rr (second inspection).

As shown in FIG. 1, the first distance measuring sensor 11 is fixed to the first jig 31 facing downward, which is the side of the second jig 32 . Further, the second distance measuring sensor 12 is fixed to the second jig 32 so as to face upward on the side of the first jig 31 . In this embodiment, an optical sensor such as an infrared sensor is adopted as the first ranging sensor 11 and the second ranging sensor 12 .

In the inspection apparatus 1 according to this embodiment, as shown in FIG. are placed in That is, the first jig 31 and the first distance measuring sensor 11 and the second jig 32 and the second distance measuring sensor 12 have a positional relationship in which they are mutually inverted by 180 degrees (around the Y-axis) when viewed from the front. is provided as follows.

<Inspection method (first embodiment)>
Next, a first example of an inspection method using the inspection apparatus 1 according to this embodiment will be described. In the inspection apparatus 1, when changing the type of the board 100, first and second The amount of displacement of the jigs 31 and 32 is set. A method for setting the displacement amounts of the first and second jigs 31 and 32 will be described below.

In the inspection apparatus 1 , when changing the type of the substrate 100 , the first jig 31 and the second jig 32 are also changed according to the type of the substrate 100 . At this time, as shown in FIG. 3, the second jig distance Dj2, which is the distance to the inspection surface 32P of the second jig 32, is measured in advance by the first distance measuring sensor 11. FIG. Moreover, the first jig distance Dj1, which is the distance from the first jig 31 to the inspection surface 31P, is measured in advance by the second distance measuring sensor 12 . In this embodiment, when measuring the first jig distance Dj1 and the second jig distance Dj2, the average value of the distances to the four corners of the inspection surfaces 31P and 32P is calculated. This improves the measurement accuracy of the first jig distance Dj1 and the second jig distance Dj2 in the inspection apparatus 1 .

In the inspection apparatus 1 according to this embodiment, as shown in FIG. The jigs 31 and 32 are provided so as to have a positional relationship in which they are mutually inverted by 180 degrees when viewed in a direction orthogonal to a straight line connecting the jig 31 and the second jig 32 . Therefore, the first jig distance Dj1 and the second jig distance Dj2 can be measured simultaneously by the first distance measurement sensor 11 and the second distance measurement sensor 12, thereby improving the inspection efficiency of the inspection apparatus 1. becomes possible.

Further, as shown in FIG. 4, by measuring the distance to the work support surface 6c of the work support portion 61 with the first distance measurement sensor 11, the distance between the first distance measurement sensor 11 and the lower surface 102 of the substrate 100 is A certain clamping distance Dc is calculated in advance. In this embodiment, the calculation of the clamping distance Dc is performed for each of the first and second unit regions Rf and Rr based on the positional relationship of the heights of the four work support surfaces 6c. Specifically, the heights of two points located at the X coordinate of the unit area on a straight line connecting two work support surfaces 6c, 6c adjacent in the X direction are calculated. After that, the clamp distance Dc in the unit area is calculated by calculating the height of the point located at the Y coordinate of the unit area on the straight line connecting the two points.

As in the present embodiment, when the substrate 100 to be inspected is to be inspected for the second inspection in which the first and second jigs 31 and 32 are reversed, the normal orientation is used for the first inspection. The first jig distance Dj1 and the second jig distance Dj2, which are the distances to the first and second jigs 31 and 32, are measured, and for the second inspection, the first and second jigs 31 and The first jig distance Dj1 and the second jig distance Dj2 are also measured in a state where 32 is rotated 180 degrees in plan view. This makes it possible to improve the inspection accuracy when the inspection is performed by reversing the first and second jigs 31 and 32 in the inspection apparatus 1 .

Furthermore, when starting the continuity test of the substrate 100 in the inspection apparatus 1, the first distance measuring sensor 11 measures the first substrate distance Db1, which is the distance to the upper surface 101 of the substrate 100, as shown in FIG. Also, the second distance measuring sensor 12 measures a second substrate distance Db2, which is the distance to the bottom surface 102 of the substrate 100 . When measuring the first substrate distance Db1 and the second substrate distance Db2, each of the first and second unit regions Rf and Rr on the substrate 100 is measured.

Then, the second distance calculator 92 calculates the second distance D2, which is the distance between the inspection surface 32P of the second jig 32 and the upper surface 101, based on the first substrate distance Db1 and the second jig distance Dj2. is calculated (second distance calculation step). Specifically, the second distance D2, which is the distance between the inspection surface 32P of the second jig 32 and the upper surface 101, is calculated from the difference between the first substrate distance Db1 and the second jig distance Dj2. (See Figure 5).

Further, the first distance calculator 91 calculates the first distance D1, which is the distance between the inspection surface 31P of the first jig 31 and the lower surface 102, based on the second substrate distance Db2 and the first jig distance Dj1. is calculated (first distance calculation step). Specifically, the first distance D1, which is the distance between the inspection surface 31P of the first jig 31 and the lower surface 102, is calculated from the difference between the second substrate distance Db2 and the first jig distance Dj1. (See Figure 5).

Furthermore, based on the first distance D1 and the second distance D2, the displacement amount setting unit 93 sets a first displacement amount M1 and a second displacement amount M1, which are displacement amounts of the first jig 31 and the second jig 32 with respect to the substrate 100. A quantity M2 (see FIG. 6) is set (displacement quantity setting step). Specifically, the substrate thickness Tb is calculated for each of the first and second unit regions Rf and Rr from the difference between the first substrate distance Db1 and the clamp distance Dc. Then, the first displacement amount M1, which is the displacement amount of the first jig 31 with respect to the substrate 100, is calculated from the difference between the first distance D1 and the substrate thickness Tb. Also, the second displacement amount M2, which is the displacement amount of the second jig 32 with respect to the substrate 100, is calculated from the difference between the second distance D2 and the substrate thickness Tb. It is also possible to calculate the second displacement amount M2 from the difference between the second jig distance Dj2 and the clamp distance Dc. Further, as the substrate thickness Tb, it is possible to employ a design value of the thickness of the substrate 100 instead of the value calculated from the first substrate distance Db1 and the clamp distance Dc.

In the inspection apparatus 1 according to the present embodiment, when changing the type of the substrate 100, the first displacement amount M1 and A second displacement amount M2 is set. Therefore, even if the fixed height of the board 100 or the size of the inspection jig changes, the first jig 31 and the second jig 31 and the first jig 31 and the second jig 32 can be adjusted according to the actual distance between the first jig 31 and the second jig 32 and the substrate 100 . The second jig 32 can be displaced. That is, according to the inspection apparatus 1 according to the present embodiment, it is possible to ensure high inspection accuracy even when the substrate 100 is changed for inspection.

<Inspection method (second embodiment)>
Next, a second example of the inspection method using the inspection apparatus 1 according to this embodiment will be described. In the inspection method of this embodiment, the parts different from the inspection method of the first embodiment will be mainly described.

In this embodiment, before setting the displacement amounts of the first and second jigs 31 and 32, the initial setting unit 90 sets the height position data of the substrate 100 and the first and second jigs 31 and 32. and the height position data of (initial setting step). .

Specifically, a preset gauge is installed at the same height position as the second jig 32 in the inspection section 4D. Then, with the substrate 100 fixed to the substrate fixing device 6, the inspection unit 4D is displaced in the positive Z direction, and the displacement amount of the inspection unit 4D until the upper surface of the preset gauge comes into contact with the lower surface 102 is measured, This amount of displacement is set as the initial amount of displacement Md2. When setting the initial displacement amount Md2, the initial displacement amount Md2 is not the amount of displacement up to the lower surface 102, but the amount of displacement up to the lower surface of the work supporting portion 61 plus the thickness of the work supporting portion 61. is also possible.

Further, a reference jig is installed at the same height position as the first jig 31 in the inspection section 4U. Then, in a state in which the inspection unit 4D is displaced so that the upper surface of the preset gauge installed in the inspection unit 4D is at the same height as the lower surface 102, the inspection unit 4U is displaced in the negative Z direction to The displacement amount of the inspection part 4U is measured until the lower surface comes into contact with the upper surface of the preset gauge. Further, a value obtained by subtracting the thickness (design value) of the substrate 100 from this displacement amount is set as the initial displacement amount Md1.

It should be noted that a method different from the above can be employed for setting the initial displacement amounts Md1 and Md2. For example, the inspection unit 4U and the inspection unit 4D were each provided with a reference jig so as to be at the same height position as the first jig 31 and the second jig 32, and the distance from the substrate 100 was measured with a block gauge. It is also possible to set the value to the initial displacement amounts Md1 and Md2. It is also possible to set a reference jig in the same manner and use the values obtained by measuring the distance to the substrate 100 with a distance gauge between two points as the initial displacement amounts Md1 and Md2.

Next, as in the above embodiment, the second distance calculator 92 calculates the inspection surface 32P of the second jig 32 and the upper surface 101 based on the first substrate distance Db1 and the second jig distance Dj2. (second distance calculating step). Further, the first distance calculator 91 calculates the first distance D1, which is the distance between the inspection surface 31P of the first jig 31 and the lower surface 102, based on the second substrate distance Db2 and the first jig distance Dj1. is calculated (first distance calculation step).

In this embodiment, the displacement amount setting unit 93 sets the first jig 31 and the A first displacement amount M1 and a second displacement amount M2, which are displacement amounts of the second jig 32 with respect to the substrate 100, are set (displacement amount setting step). Specifically, the initial displacement amount Md1 is compared with the difference between the first distance D1 and the substrate thickness Tb, and the first displacement amount of the first jig 31 with respect to the substrate 100 is determined according to the difference amount. The amount of displacement M1 is set. Also, the initial displacement amount Md2 is compared with the difference between the second distance D2 and the substrate thickness Tb, and the second displacement amount M2, which is the displacement amount of the second jig 32 with respect to the substrate 100, is determined according to the difference amount. is set.

In the inspection method according to the present embodiment, when changing the type of the substrate 100, the initial displacement amounts Md1 and Md2 set for bringing the first jig 31 and the second jig 32 closer to the substrate 100 are Adjustments can be made based on the actual distances between the first jig 31 and the second jig 32 and the substrate 100 . That is, according to the inspection method according to the present embodiment, it is possible to ensure high inspection accuracy even when the substrate 100 is changed for inspection.

As described above, the inspection apparatus according to an example of the present invention moves the substrate to be inspected, which is a thin plate-shaped inspection object having a first surface and a second surface, to the first jig that approaches from the first surface side. and a second jig approaching from the second surface side to perform a continuity test, wherein the inspection device is fixed toward the second jig side integrally with the first jig a first distance measuring sensor; a second distance measuring sensor fixed integrally with the second jig toward the first jig; The second jig and the a second distance calculator that calculates a second distance that is the distance from the first surface; a second substrate distance that is the distance to the second surface measured by the second distance measuring sensor; calculating a first distance, which is the distance between the first jig and the second surface, based on a first jig distance, which is the distance to the first jig measured by a distance sensor; a distance calculation unit; and a displacement amount setting unit that sets displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance. It is.

According to this configuration, it is possible to set the amount of displacement when each inspection jig approaches the substrate to be inspected based on the actual distance between the inspection jig and the substrate to be inspected, thereby ensuring high inspection accuracy. becomes possible.

Further, based on the height position data of the substrate to be inspected and the height position data of the first jig and the second jig, the An initial setting unit for setting an initial displacement amount with respect to the inspection substrate, wherein the displacement amount setting unit sets the first jig and the first jig based on the initial displacement amount and the first distance and the second distance. A displacement amount of the second jig with respect to the substrate to be inspected is set.

According to this configuration, the initial amount of displacement set for bringing each inspection jig closer to the substrate to be inspected can be adjusted based on the actual distance between the inspection jig and the substrate to be inspected. Accuracy can be ensured.

The second distance calculation unit calculates the second distance from the difference between the first substrate distance and the second jig distance, and the first distance calculation unit calculates the second substrate distance and the It is preferable to calculate the first distance from the difference from the first jig distance.

According to this configuration, it is possible to set the amount of displacement when each inspection jig approaches the substrate to be inspected based on the actual distance between the inspection jig and the substrate to be inspected, thereby ensuring high inspection accuracy. becomes possible.

Further, each of the first jig and the second jig has an inspection surface formed in a rectangular shape in a plan view, and the second distance calculation unit is the first distance sensor. The second jig distance is calculated by an average value of the measured distances to the four corners of the inspection surface of the second jig. It is preferable to calculate the first jig distance by the average value of the distances to the four corners of the inspection surface of the jig.

According to this configuration, it is possible to improve the measurement accuracy of the first jig distance and the second jig distance.

A plurality of pairs of first unit regions and second unit regions are formed on the substrate to be inspected, and the second unit regions are inverted 180 degrees in plan view with respect to the corresponding first unit regions. a first inspection for conducting a conduction inspection of the first unit area by sandwiching the first jig and the second jig in a normal posture, the first jig and the second and a second inspection in which the second unit area is sandwiched in a posture inverted 180 degrees in a plan view, and the second distance calculation unit includes the first During the inspection, the second distance is calculated based on the second jig distance obtained by measuring the distance to the second jig in the normal posture, and during the second inspection, The second distance is calculated based on the second jig distance obtained by measuring the distance to the second jig in the reversed posture, and the first distance calculation unit calculates the second distance during the first inspection. calculates the first distance based on the first jig distance obtained by measuring the distance to the first jig in the normal posture, and in the second inspection, the inverted posture Preferably, the first distance is calculated based on the first jig distance obtained by measuring the distance to the first jig.

According to this configuration, it is possible to improve the inspection accuracy when performing inspection by reversing the jig in the inspection apparatus.

Further, the first jig and the first distance measuring sensor, and the second jig and the second distance measuring sensor are arranged in a direction orthogonal to a straight line connecting the first jig and the second jig. It is preferable that the first jig distance and the second jig distance are measured simultaneously by the first distance measurement sensor and the second distance measurement sensor provided at positions that are 180 degrees reversed from each other in terms of vision. .

According to this configuration, it is possible to improve the inspection efficiency of the inspection apparatus.

Further, an inspection method according to an example of the present invention includes a first jig that approaches a substrate to be inspected, which is a thin plate-shaped inspection object having a first surface and a second surface, from the first surface side; An inspection method performed by an inspection device that conducts a continuity test by sandwiching it between a second jig approaching from the second surface side, wherein the inspection device is integrated with the first jig and the second jig a first distance measuring sensor fixed toward the jig side; and a second distance measuring sensor integrally with the second jig and fixed toward the first jig side; a first substrate distance, which is the distance to the first surface measured by the first distance measuring sensor; and a second jig distance, which is the distance to the second jig measured by the first distance measuring sensor; a second distance calculating step of calculating a second distance, which is the distance between the second jig and the first surface, based on the distance to the second surface measured by the second distance measuring sensor; Based on the second substrate distance and the first jig distance, which is the distance to the first jig measured by the second distance measuring sensor, the distance between the first jig and the second surface a first distance calculating step of calculating a certain first distance; and setting displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance. and a displacement amount setting step.

According to this configuration, it is possible to set the amount of displacement when each inspection jig approaches the substrate to be inspected based on the actual distance between the inspection jig and the substrate to be inspected, thereby ensuring high inspection accuracy. becomes possible.

Further, based on the height position data of the substrate to be inspected and the height position data of the first jig and the second jig, the An initial setting step of setting an initial displacement amount with respect to the inspection substrate, wherein the displacement amount setting step sets the first jig and the first jig based on the initial displacement amount and the first distance and the second distance. A displacement amount of the second jig with respect to the substrate to be inspected is set.

According to this configuration, the initial amount of displacement set when each inspection jig is brought close to the substrate to be inspected can be adjusted based on the actual distance between the inspection jig and the substrate to be inspected. Accuracy can be ensured.

Further, in the second distance calculating step, the second distance is calculated from the difference between the first substrate distance and the second jig distance, and in the first distance calculating step, the second substrate distance and the It is preferable to calculate the first distance from the difference from the first jig distance.

According to this configuration, it is possible to set the amount of displacement when each inspection jig approaches the substrate to be inspected based on the actual distance between the inspection jig and the substrate to be inspected, thereby ensuring high inspection accuracy. becomes possible.

According to such an inspection apparatus and inspection method, it is possible to set the amount of displacement when each inspection jig is brought close to the substrate to be inspected based on the actual distance between the inspection jig and the substrate to be inspected. It becomes possible to ensure high inspection accuracy.

This application is based on Japanese Patent Application No. 2017-253918 filed on December 28, 2017, the content of which is included in the present application. It should be noted that the specific embodiments or examples described in the section of the mode for carrying out the invention only clarify the technical content of the present invention, and the present invention is limited to such specific examples. It should not be interpreted narrowly by limiting to

1 inspection device 2 inspection device main body
3 inspection jig 4 inspection unit
4U Inspection Department 4D Inspection Department
5 Inspection jig drive mechanism 5U Inspection jig drive mechanism
5D inspection jig driving mechanism 5X X jig driving section
5Y Y jig driving section 5θ θ jig driving section
5ZZ Z jig driving section 6 Substrate fixing device
6c Work support surface 7 Inspection unit drive mechanism
7U Inspection unit drive mechanism 7D Inspection unit drive mechanism
8 housing 9 control unit
11 first ranging sensor 12 second ranging sensor
31 first jig 31P inspection surface
32 second jig 32P inspection surface
61 work support part 62 clamp part
90 initial setting unit 91 first distance calculation unit
92 Second distance calculator 93 Displacement amount setting unit
100 substrate to be inspected (substrate) 100c portion to be clamped
101 upper surface (first surface) 102 lower surface (second surface)
D1 first distance D2 second distance
Dj1 First jig distance Dj2 Second jig distance
Db1 First substrate distance Db2 Second substrate distance
Dc Clamp distance Db2 Second substrate distance
Rf first unit area Rr second unit area
Tb Substrate thickness M1 First displacement amount
M2 Second displacement amount

Claims (9)

A first jig approaching from the first surface side and a second jig approaching from the second surface side a substrate to be inspected, which is a thin plate-shaped inspection object having a first surface and a second surface. and a testing device that performs a continuity test by sandwiching
a first ranging sensor fixed integrally with the first jig toward the second jig;
a second ranging sensor fixed integrally with the second jig toward the first jig;
a first substrate distance, which is the distance to the first surface measured by the first distance measuring sensor; and a second jig distance, which is the distance to the second jig measured by the first distance measuring sensor; a second distance calculation unit that calculates a second distance, which is the distance between the second jig and the first surface, based on
a second substrate distance, which is the distance to the second surface measured by the second distance measuring sensor; and a first jig distance, which is the distance to the first jig measured by the second distance measuring sensor; a first distance calculator that calculates a first distance, which is the distance between the first jig and the second surface, based on
and a displacement amount setting unit that sets displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance. The substrate to be inspected of the first jig and the second jig based on the height position data of the substrate to be inspected and the height position data of the first jig and the second jig An initial setting unit for setting an initial displacement amount for
The displacement amount setting unit sets displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the initial displacement amount, the first distance, and the second distance. The inspection device according to claim 1, wherein The second distance calculation unit calculates the second distance from a difference between the first substrate distance and the second jig distance,
3. The inspection apparatus according to claim 1, wherein said first distance calculator calculates said first distance from a difference between said second substrate distance and said first jig distance. Each tip of the first jig and the second jig is provided with an inspection surface formed in a rectangular shape in a plan view,
The second distance calculation unit calculates the second jig distance by an average value of the distances to the four corners of the inspection surface of the second jig measured by the first distance measuring sensor,
The first distance calculation unit calculates the first jig distance by an average value of distances to four corners of the inspection surface of the first jig measured by the second distance measuring sensor. 4. The inspection device according to any one of 3. A plurality of pairs of first unit regions and second unit regions are formed on the substrate to be inspected, and the second unit regions are inverted 180 degrees in plan view with respect to the corresponding first unit regions. arranged symmetrically,
A first inspection in which the first jig and the second jig sandwich the first jig and the second jig in a normal posture to inspect the continuity of the first unit region, and the first jig and the second jig in a plan view and a second inspection in which the second unit area is sandwiched in a 180-degree inverted posture and a continuity inspection is performed,
The second distance calculation unit calculates the second distance based on the second jig distance obtained by measuring the distance to the second jig in the normal posture during the first inspection. , during the second inspection, calculating the second distance based on the second jig distance obtained by measuring the distance to the second jig in the reversed posture;
The first distance calculation unit calculates the first distance based on the first jig distance obtained by measuring the distance to the first jig in the normal posture during the first inspection. , wherein, during the second inspection, the first distance is calculated based on the first jig distance obtained by measuring the distance to the first jig in the reversed posture. 5. The inspection apparatus according to any one of items 4. The first jig and the first distance measuring sensor, and the second jig and the second distance measuring sensor are arranged in a direction perpendicular to a straight line connecting the first jig and the second jig. 2. The first jig distance and the second jig distance are simultaneously measured by the first distance measurement sensor and the second distance measurement sensor provided at positions 180 degrees reversed from each other. The inspection device according to claim 5 . A first jig approaching from the first surface side and a second jig approaching from the second surface side a substrate to be inspected, which is a thin plate-shaped inspection object having a first surface and a second surface. and an inspection method performed by an inspection device that performs a continuity inspection by sandwiching
The inspection device includes: a first distance measuring sensor fixed toward the second jig integrally with the first jig; and the first jig integrally with the second jig. a second ranging sensor fixed toward the side;
a first substrate distance, which is the distance to the first surface measured by the first distance measuring sensor; and a second jig distance, which is the distance to the second jig measured by the first distance measuring sensor; a second distance calculating step of calculating a second distance, which is the distance between the second jig and the first surface, based on
a second substrate distance, which is the distance to the second surface measured by the second distance measuring sensor; and a first jig distance, which is the distance to the first jig measured by the second distance measuring sensor; a first distance calculation step of calculating a first distance, which is the distance between the first jig and the second surface, based on
and a displacement amount setting step of setting displacement amounts of the first jig and the second jig with respect to the substrate to be inspected based on the first distance and the second distance. The substrate to be inspected of the first jig and the second jig based on the height position data of the substrate to be inspected and the height position data of the first jig and the second jig An initial setting step for setting an initial displacement amount for
In the displacement amount setting step, the displacement amounts of the first jig and the second jig with respect to the substrate to be inspected are set based on the initial displacement amount, the first distance, and the second distance. The inspection method according to claim 7, wherein In the second distance calculating step, the second distance is calculated from the difference between the first substrate distance and the second jig distance,
9. The inspection method according to claim 7, wherein said first distance calculating step calculates said first distance from a difference between said second substrate distance and said first jig distance.

Images