TWI445973B - Electrical connecting apparatus and testing system using the same - Google Patents

Electrical connecting apparatus and testing system using the same Download PDF

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TWI445973B
TWI445973B TW101109058A TW101109058A TWI445973B TW I445973 B TWI445973 B TW I445973B TW 101109058 A TW101109058 A TW 101109058A TW 101109058 A TW101109058 A TW 101109058A TW I445973 B TWI445973 B TW I445973B
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wiring
probe
inspected
electrode
sheet
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TW101109058A
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TW201250261A (en
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Satoshi Narita
Hisao Narita
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Nihon Micronics Kk
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Description

電氣連接裝置及使用其之測試裝置Electrical connection device and test device using same

本發明係關於於半導體積體電路、液晶顯示用基板等平板狀之被檢查體之電氣檢查使用之電氣連接裝置與使用該電氣連接裝置之測試裝置。The present invention relates to an electrical connection device for electrical inspection of a flat object to be inspected such as a semiconductor integrated circuit or a liquid crystal display substrate, and a test device using the electrical connection device.

積體電路係集合形成於例如平坦之矽基板之半導體晶圓後,該半導體晶圓切割為各晶片。此種半導體積體電路係在其製造過程中之半導體晶圓之狀態下做為被檢查體而接受電氣檢查。此外,於平坦之面具有電極之薄膜電晶體基板(TFT基板)、液晶顯示面板等液晶顯示用基板亦於製造過程中接受同樣之電氣檢查。The integrated circuit is formed by, for example, forming a semiconductor wafer of a flat germanium substrate, and the semiconductor wafer is diced into individual wafers. Such a semiconductor integrated circuit is subjected to electrical inspection as a test object in a state of a semiconductor wafer in the manufacturing process. Further, a liquid crystal display substrate such as a thin film transistor substrate (TFT substrate) having an electrode on a flat surface or a liquid crystal display panel receives the same electrical inspection during the manufacturing process.

用於此種被檢查體之電氣檢查之檢查裝置亦即測試裝置具備生成電氣檢查用之電氣信號或處理應答信號之測試器,連接於該測試器且對被檢查體接觸而將測試器與被檢查體電氣連接之電氣連接裝置。此電氣連接裝置具有設有對被檢查體之設有電極之平面對向之對向面區域之支持體、從該支持體之前述對向面區域突出之探針。The testing device for the electrical inspection of the object to be inspected, that is, the testing device, is provided with a tester for generating an electrical signal for electrical inspection or a processing response signal, connected to the tester and contacting the object to be inspected to test the device Check the electrical connections of the electrical connections. The electrical connecting device has a support for providing a facing surface facing the plane of the electrode to be inspected, and a probe protruding from the opposing surface region of the support.

為了電氣檢查而前述電氣連接裝置往前述被檢查體移動而前述探針對電極接觸時,藉由前述探針之前端將對應之前述電極之表面部分削取,電極表面之氧化膜除去。藉此探針係確實接觸對應之電極,前述電氣連接裝置與前述被檢查體確實連接。然而,以探針之前端削取之電極之表 面部分會因靜電等而集中成為異物,可能對前述支持體之前述對向面區域附著。In order to perform electrical inspection, when the electrical connection device moves toward the object to be inspected and the probe is in contact with the electrode, the surface portion of the corresponding electrode is removed by the front end of the probe, and the oxide film on the surface of the electrode is removed. Thereby, the probe system is surely in contact with the corresponding electrode, and the electrical connection device is surely connected to the object to be inspected. However, the surface of the electrode taken at the front end of the probe The surface portion is concentrated into foreign matter due to static electricity or the like, and may adhere to the opposing surface region of the support.

前述探針係以微小之尺寸形成,故於前述探針接觸被檢查體之電極之狀態係前述支持體之設有探針之前述對向面區域與被檢查體之設有電極之前述平面接近。Since the probe is formed in a minute size, the probe is in contact with the electrode of the test object, and the opposite surface region of the support provided with the probe is close to the plane of the electrode on which the test object is provided. .

因此,若如比接近之狀態之前述對向面區域與被檢查體之平面之間隔大之前述之異物對前述電氣連接裝置之前述對向面區域附著,前述電氣連接裝置往被檢查體移動時,該異物會對被檢查體撞擊。因此,被檢查體之積體電路會於其電極有撞擊痕形成,或其配線斷路,受損傷而成為製品不良。特別是若在有異物附著之狀態重複電氣檢查會有極大之數量之製品不良產生。Therefore, when the foreign matter having the larger distance between the opposing surface region and the plane of the object to be inspected is in contact with the opposing surface region of the electrical connecting device, the electrical connecting device moves toward the object to be inspected. The foreign matter will hit the object to be inspected. Therefore, the integrated circuit of the object to be inspected is formed with an impact mark on the electrode, or the wiring thereof is broken, and the product is damaged and becomes a product defect. In particular, if the electrical inspection is repeated in the state in which foreign matter is attached, a great number of products are defective.

專利文獻1之電氣連接裝置係為了防止此種異物導致之製品不良產生而於支持體之對向面區域具備凹處。亦即,即使異物對支持體之對向面區域附著,只要附著之部分為凹處之內側,異物會集中於凹處之中,不會對被檢查體撞擊。然而,為了確實防止異物造成之損傷,有形成充分深之凹處以使不論何種大小之異物都不會從凹處突出。此外,若考慮做為凹處之機能,不能將凹處於對向面區域之全域形成,於凹所沒有形成之對向面區域係有異物附著,因該異物而被檢查體損傷。亦即,提供即使異物附著亦完全不會使被檢查體損傷之電氣連接裝置為困難。The electrical connection device of Patent Document 1 has a recess in the opposing surface region of the support in order to prevent the occurrence of defective products due to such foreign matter. That is, even if the foreign matter adheres to the opposing surface region of the support, as long as the adhered portion is the inner side of the concave portion, the foreign matter concentrates in the concave portion and does not hit the object to be inspected. However, in order to surely prevent damage caused by foreign matter, there is a recess formed deep enough so that foreign matter of any size does not protrude from the recess. Further, in consideration of the function as a recess, the recess cannot be formed in the entire region of the opposing surface region, and foreign matter adheres to the opposing surface region where the recess is not formed, and the specimen is damaged by the foreign matter. That is, it is difficult to provide an electrical connecting device that does not damage the object to be inspected at all even if foreign matter adheres.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

專利文獻1:日本專利4372785號公報Patent Document 1: Japanese Patent No. 4372785

因此,本發明與提供即使有異物附著亦不會使被檢查體損傷之電氣連接裝置之思想在根本上相異,係基於防止在於對向面區域有異物附著之狀態下之電氣檢查之想法。Therefore, the present invention and the idea of providing an electrical connecting device that does not damage the object to be inspected even if foreign matter adheres are fundamentally different, and are based on the idea of preventing electrical inspection in a state where foreign matter adheres to the facing region.

亦即,本發明之目的係在於偵測於對向於電氣連接裝置之支持體之被檢查體之對向面區域有異物附著,防止在有異物附著之狀態下重複電氣檢查。That is, the object of the present invention is to prevent foreign matter from adhering to the opposing surface region of the object to be inspected to the support of the electrical connection device, and to prevent repeated electrical inspection in the presence of foreign matter.

本發明之電氣連接裝置係一種電氣連接裝置,用於具有設有電極之平面之被檢查體之電氣檢查,其特徵在於包含:對前述被檢查體之前述平面隔著間隔且具備對向於該平面配置之對向面區域之支持體、具有應接觸於前述電極之針頭部且該針頭部從前述對向面區域突出為可接觸前述電極之複數探針、遍佈於前述對向面區域之至少1個之配線且具有互相接近而並行延伸且從前述對向面區域露出之複數近接部分之配線、用來將前述配線對可偵測在前述近接部分之短路或前述配線之斷線之電氣量測裝置電氣連接之電氣連接於各配線之偵測用電極。An electrical connection device according to the present invention is an electrical connection device for electrical inspection of an object to be inspected having a plane on which an electrode is provided, and includes: an interval between the plane of the object to be inspected and an opposite direction a support body in a facing area of the planar arrangement, having a needle head to be in contact with the electrode, and the needle head protruding from the opposing surface area to contact the plurality of probes of the electrode, and extending over at least the opposing surface area a wiring having a plurality of wirings which are adjacent to each other and extend in parallel and exposed from the opposite surface area, and an electrical quantity for detecting a short circuit of the wiring portion or a disconnection of the wiring The electrical connection of the measuring device is electrically connected to the detecting electrodes of the respective wirings.

前述對向面區域係分為複數區域且於各區域獨立設有1個或複數前述配線之複數區域。The opposing surface area is divided into a plurality of areas, and a plurality of areas of the plurality of wirings are independently provided in each area.

另外,前述電氣連接裝置可另包含可對前述被檢查體隔著間隔平行於前述平面配置且將前述支持體保持於對前述被檢查體對向之面之配線基板, 該配線基板可具備前述偵測用電極、電氣連接於前述探針之測試器電極、分別連接於前述偵測用電極與前述測試器電極之第1與第2之配線路, 前述支持體可具有位於前述配線與前述第1之配線路之間將前述配線與前述偵測用電極電氣連接之第3之配線路、位於前述探針與前述第2之配線路之間將前述探針與前述測試器電極電氣連接之第4之配線路。In addition, the electrical connection device may further include a wiring board that is disposed so as to be parallel to the plane with respect to the object to be inspected, and to hold the support body on a surface facing the object to be inspected. The wiring board may include the detecting electrode, a tester electrode electrically connected to the probe, and first and second matching lines respectively connected to the detecting electrode and the tester electrode. The support body may have a third matching line between the wiring and the first wiring, and electrically connecting the wiring to the detecting electrode, and between the probe and the second matching line. The fourth matching circuit in which the probe is electrically connected to the aforementioned tester electrode.

前述電氣連接裝置可另包含位於前述配線基板與前述支持體之間且安裝於前述配線基板與前述支持體之保持塊,前述支持體可具有一方之面安裝於前述保持塊之第1之片狀構件、一方之面貼於前述第1之片狀構件之另一方之面且另一方之面具備前述對向面區域之第2之片狀構件,前述第3之配線路與第4之配線路可係在前述前述第1之片狀構件與第2之片狀構件之間沿著兩片狀構件延伸。The electrical connection device may further include a holding block between the wiring board and the support and attached to the wiring board and the support, and the support may have one surface mounted on the first sheet of the holding block. a member in which one of the members is attached to the other surface of the first sheet-like member, and the other surface includes the second sheet-like member of the opposing surface region, and the third matching line and the fourth matching line The first sheet member and the second sheet member may extend along the two sheet members.

前述探針可具有將前述第2之片狀構件於其厚度方向貫通之基部且連接於前述第4之配線路並從該第4之配線路往前述被檢查體延伸之基部、從該基部之延長端往前述第2之片狀構件之前述對向 面區域隔著間隔往該對向面區域平行延伸之臂部,前述針頭部可係從前述臂部之延長端往前述被檢查體延伸。The probe may have a base portion that penetrates the base portion of the second sheet-like member in the thickness direction thereof, and is connected to the fourth distribution line, and extends from the fourth distribution line to the base portion of the inspection object, and the base portion Extending the end to the aforementioned opposite direction of the second sheet member The arm portion extends in an arm portion extending in parallel with the opposing surface region, and the needle head may extend from the extended end of the arm portion toward the object to be inspected.

前述電氣連接裝置可另包含可對前述被檢查體隔著間隔平行配置且保持前述支持體之配線基板,該配線基板可係於對前述被檢查體對向之一方之面具備前述複數探針抵接之複數探針島部,前述支持體可具備相互隔著間隔對向之第1之板狀構件與第2之板狀構件、以與該第1之板狀構件與第2之板狀構件共同形成具有中空部之箱之方式設於該第1之板狀構件與第2之板狀構件之間之框狀構件,前述第1之板狀構件可係於前述配線基板之設有前述探針島部之部分保持為與前述配線基板平行,前述第2之板狀構件可係於與對前述第1之板狀構件對向之面相反之面具有前述對向面區域,前述探針可係使其一端抵接前述探針島部,從前述探針島部往前述被檢查體直線狀延伸,通過前述第1之板狀構件、前述中空部、前述第2之板狀構件貫通前述箱,從前述對向面區域突出。The electrical connection device may further include a wiring substrate in which the support body is disposed in parallel with each other and spaced apart from each other, and the wiring substrate may be provided with the plurality of probes on a surface facing the object to be inspected In the plurality of probe island portions, the support body may include a first plate-shaped member and a second plate-shaped member that face each other with a gap therebetween, and the first plate-shaped member and the second plate-shaped member a frame-shaped member provided between the first plate-shaped member and the second plate-shaped member in a manner of forming a box having a hollow portion, wherein the first plate-shaped member may be provided in the wiring substrate The portion of the island portion is kept in parallel with the wiring board, and the second plate member may have the opposite surface region on a surface opposite to a surface facing the first plate member, and the probe may be One end of the probe island portion is abutted, and the probe island portion extends linearly from the probe island portion, and the first plate member, the hollow portion, and the second plate member penetrate the case. , protruding from the aforementioned opposite surface area.

前述電氣連接裝置可另包含配置於前述被檢查體之外方且安裝有前述支持體之探針裝置之本體,前述支持體可係形成為從前述本體往前述被檢查體延伸之片狀,於其一方之面具有前述對向面區域,於其延長端設有前述探針。The electrical connection device may further include a body of the probe device disposed outside the object to be inspected and having the support, and the support may be formed in a sheet shape extending from the body to the object to be inspected. One of the faces has the aforementioned opposing surface area, and the probe is provided at the extended end.

本發明之測試裝置係一種測試裝置,包含前述電氣連接裝置、電氣連接於前述偵測用電極之前述電氣量測裝置。The test device of the present invention is a test device comprising the electrical connection device and the electrical measuring device electrically connected to the detecting electrode.

根據本發明之前述電氣連接裝置,遍佈於對前述被檢查體之前述平面對向之對向面區域之配線具有互相接近而並行延伸且從前述對向面區域露出之複數近接部分,且電氣連接於對可偵測在前述近接部分之短路或前述配線之斷線之電氣量測裝置電氣連接之電氣連接於各配線之偵測用電極。若因於前述配線之前述近接部分有導電性之異物附著而前述近接部分短路或對前述配線附著之異物使前述配線斷線,前述配線之抵抗值會變化。前述電氣量測裝置檢出或量測此變化,偵測於對向面區域有異物附著。According to the electric connecting device of the present invention, the wiring of the opposing surface region facing the plane of the object to be inspected has a plurality of closely-connected portions which are adjacent to each other and extend in parallel from the opposing surface region, and are electrically connected. The electrical connection between the electrical measuring devices that can detect the short circuit of the proximal portion or the disconnection of the wiring is electrically connected to the detecting electrodes of the respective wirings. When the foreign matter adhering to the proximal portion of the wiring is adhered, and the short-circuited portion or the foreign matter adhering to the wiring is broken, the resistance value of the wiring changes. The electrical measuring device detects or measures the change, and detects foreign matter adhesion in the opposite surface area.

於有異物附著之場合係只要為了除去異物而清掃支持體之對向面區域再進行電氣檢查即可。因此,根據本發明之電氣連接裝置,不會在有異物附著之狀態下重複電氣檢查,可防止異物對被檢查體給予損傷而被檢查體成為製品不良。When foreign matter adheres, it is only necessary to clean the opposing surface area of the support in order to remove foreign matter. Therefore, according to the electrical connecting device of the present invention, the electrical inspection is not repeated in the state in which foreign matter adheres, and it is possible to prevent foreign matter from being damaged to the object to be inspected, and the object to be inspected is defective in the product.

[第1實施例][First Embodiment]

參照圖1,本發明之第1實施例之測試裝置10係用於使用電氣連接裝置16將如半導體晶圓之平板狀之被檢查體12之全域以一次或分為複數檢查區域對各檢查區域試驗之電氣檢查。測試裝置10包含將被檢查體12可卸除地保持 之夾頭14、對該夾頭14隔間隔配置之電氣連接裝置16、電氣連接於該電氣連接裝置16之測試器(不圖示)與電氣量測裝置60(參照圖4)。Referring to Fig. 1, a test apparatus 10 according to a first embodiment of the present invention is for using an electrical connection device 16 to divide a whole of a flat object 12 such as a semiconductor wafer into a plurality of inspection areas for each inspection area. Electrical inspection of the test. The test device 10 includes the detachable holding of the object 12 to be inspected The chuck 14 has an electrical connection device 16 that is disposed at intervals between the chucks 14, a tester (not shown) that is electrically connected to the electrical connector device 16, and an electrical measuring device 60 (see FIG. 4).

於為被檢查體12之半導體晶圓係組裝有如電子電路之積體電路(不圖示),該積體電路之為輸入端子或輸出端子之複數電極12a設於被檢查體12之平面12b。An integrated circuit (not shown) such as an electronic circuit is incorporated in the semiconductor wafer of the object 12 to be inspected, and the plurality of electrodes 12a which are input terminals or output terminals of the integrated circuit are provided on the plane 12b of the object 12 to be inspected.

夾頭14係具備於既知之檢查載台者,且具有在電極12a朝向上方之狀態下將被檢查體12可解除地保持之上面14A。往夾頭14之被檢查體12之保持係可使為例如以真空吸著來進行。The chuck 14 is provided on a known inspection stage, and has an upper surface 14A that releasably holds the inspection object 12 with the electrode 12a facing upward. The holding of the test object 12 to the collet 14 can be performed, for example, by vacuum suction.

夾頭14與電氣連接裝置16係以雖不圖示但以往習知之驅動機構於往X方向與Y方向延伸之XY面內、對XY面垂直之Z方向之3方向三次元地相對移動,且繞Z軸線角度地相對旋轉。The chuck 14 and the electrical connection device 16 are relatively three-dimensionally moved in three directions in the XY plane extending in the X direction and the Y direction and three directions in the Z direction perpendicular to the XY plane, although not shown. Rotate relative to each other angularly about the Z axis.

本發明之電氣連接裝置16與保持於夾頭14之被檢查體12係於試驗時於相靠近之方向(亦即圖1中之上下方向)相對移動,使後述之探針26接觸被檢查體12之電極12a。電氣連接裝置16係電氣連接於測試裝置10之前述測試器,以在該測試器與被檢查體12之間傳達電氣信號之方式發揮機能。為了試驗之電氣信號(電壓、電流)係包含從前述測試器往被檢查體12供給之試驗信號、對該試驗信號應答之從前述測試器往被檢查體12供給之應答信號。The electrical connecting device 16 of the present invention moves relative to the object 12 to be held by the chuck 14 in a direction close to the test (that is, in the up-down direction in FIG. 1), so that the probe 26 to be described later contacts the object to be inspected. 12 electrode 12a. The electrical connection device 16 is electrically connected to the aforementioned tester of the test device 10 to function as an electrical signal between the tester and the test object 12. The electrical signal (voltage, current) to be tested includes a test signal supplied from the tester to the test object 12, and a response signal supplied from the tester to the test object 12 in response to the test signal.

電氣連接裝置16係包含配線基板20、支持於配線基板20之一方之面20A之保持塊22、安裝於配線基板20與保 持塊22之配線片24、設於配線片24且對被檢查體12之電極12a接觸之複數接觸子亦即複數探針26、設於配線片24之一方之面24A之配線28(參照圖2)。配線片24係做為支持探針26之支持體發揮機能。The electrical connection device 16 includes a wiring substrate 20, a holding block 22 supported on one surface 20A of the wiring substrate 20, and is mounted on the wiring substrate 20 and protected. The wiring piece 24 of the holding block 22, the plurality of contacts 26 provided on the wiring sheet 24 and contacting the electrode 12a of the object 12 to be inspected, that is, the plurality of probes 26 and the wiring 28 provided on one surface 24A of the wiring sheet 24 (refer to the figure) 2). The wiring sheet 24 functions as a support for supporting the probe 26.

配線基板20係如以往習知,為例如於使玻璃纖維分散之環氧樹脂板形成配線路之印刷配線基板(PWB:Printed wiring Board)。一般配線基板20係形成為圓形。The wiring board 20 is a printed wiring board (PWB: Printed Wiring Board) in which an epoxy resin sheet in which glass fibers are dispersed is formed, for example, as is conventionally known. The wiring board 20 is generally formed in a circular shape.

配線基板20係於其內部具備複數配線路30、32(亦即第1與第2配線路)、設於配線基板20之另一方之面20B且對應於各配線路30、32而分別連接於配線路30、32之一端之偵測用電極34與測試器電極36。偵測用電極34與測試器電極36係分別電氣連接於之後說明之電氣量測裝置60、測試裝置10之前述測試器,且沿配線基板20之緣部排列。配線基板20係於被檢查體12隔間隔平行配置,保持於測試裝置10之不圖示之支架。The wiring board 20 is provided with a plurality of distribution lines 30 and 32 (that is, first and second distribution lines), and is provided on the other surface 20B of the wiring board 20, and is connected to each of the distribution lines 30 and 32, respectively. The detecting electrode 34 and the tester electrode 36 at one end of the line 30, 32 are provided. The detecting electrode 34 and the tester electrode 36 are electrically connected to the above-described testers of the electrical measuring device 60 and the testing device 10 described later, respectively, and are arranged along the edge of the wiring substrate 20. The wiring board 20 is placed in parallel with the inspection object 12 at intervals, and is held by a holder (not shown) of the test apparatus 10.

保持塊22係位於配線基板20與配線片24之間,配置於配線基板20之一方之面20A之中央,安裝於配線基板20。例如,保持塊22可以將配線基板20於厚度方向貫通並對保持塊22螺合之螺絲構件對配線基板20結合。The holding block 22 is disposed between the wiring board 20 and the wiring sheet 24, and is disposed at the center of one of the faces 20A of the wiring board 20, and is attached to the wiring board 20. For example, the holding block 22 can couple the wiring board 20 in the thickness direction and screw the screw member to which the holding block 22 is screwed to the wiring board 20.

配線片24係具有安裝於保持塊22之接觸領域24a、對接觸領域24a連續且往配線基板20之外方延伸之一對之伸出區域24b、對各伸出區域24b連續且更往外方延伸且結合於配線基板20之一方之面20A之連接區域24c。The wiring sheet 24 has a contact region 24a attached to the holding block 22, a pair of extending regions 24b extending continuously to the contact region 24a and extending outside the wiring substrate 20, and extending continuously and outwardly toward the respective protruding regions 24b. Further, it is bonded to the connection region 24c of the one surface 20A of the wiring substrate 20.

接觸領域24a係以另一方之面24B支持於保持塊22, 設有從一方之面24A往下方突出之探針26。各探針26係可對被檢查體12之電極12a接觸。接觸領域24a之一方之面24A係對被檢查體12之平面12b對向之對向面區域。The contact area 24a is supported by the holding block 22 by the other side 24B. A probe 26 that protrudes downward from the one side 24A is provided. Each of the probes 26 is in contact with the electrode 12a of the test object 12. The surface 24A of one of the contact areas 24a is opposed to the plane 12b of the object 12 to be inspected.

配線片24係如於圖2顯示,具備第1及第2之片狀構件40與42、配線路44亦即第4之配線路。兩片狀構件係相互貼合,配線路44係在兩片狀構件之間沿該兩片狀構件延伸。配線路44係以接觸領域24a連接於探針26,通過伸出區域24b往連接區域24c延伸,以連接區域24c連接於配線路32之另一端。As shown in FIG. 2, the wiring sheet 24 includes the first and second sheet members 40 and 42 and the fourth line of the distribution line 44. The two sheet members are attached to each other, and the distribution line 44 extends between the two sheet members along the two sheet members. The distribution line 44 is connected to the probe 26 by the contact area 24a, the extension area 24b to the connection area 24c, and the connection area 24c to the other end of the distribution line 32.

探針26係如於圖2明確顯示,於配線片24之接觸區域24a具備將第2之片狀構件42於其厚度方向貫通之基部26a、與基部26a一體形成之針頭部26b。基部26a係連接於配線路44,從該配線路44往被檢查體12延伸。針頭部26b係從基部26a之延長端經過第2之片狀構件42由該第2之片狀構件42之下面突出。因此,探針26係透過配線片24之配線路44與配線基板20之配線路32電氣連接於測試器電極36。As shown in FIG. 2, the probe 26 is provided with a base portion 26a that penetrates the second sheet-like member 42 in the thickness direction and a needle portion 26b that is integrally formed with the base portion 26a in the contact region 24a of the wiring sheet 24. The base portion 26a is connected to the distribution line 44, and extends from the distribution line 44 to the inspection object 12. The needle head portion 26b protrudes from the lower end of the base portion 26a through the second sheet member 42 from the lower surface of the second sheet member 42. Therefore, the probe 26 is electrically connected to the tester electrode 36 through the wiring line 44 of the wiring sheet 24 and the wiring line 32 of the wiring substrate 20.

探針26與配線片24係以以往習知之方法使用光微影技術、蝕刻技術、電鍍技術等以與PWB同樣之製造方法以連續之步驟製造。因此,基部26a與配線路44係在該製造步驟之中使用電鍍技術一體形成。The probe 26 and the wiring sheet 24 are manufactured in a continuous process using a photolithography technique, an etching technique, a plating technique, or the like in the same manner as the PWB by a conventionally known method. Therefore, the base portion 26a and the wiring line 44 are integrally formed using the plating technique in this manufacturing step.

於試驗時係電氣連接裝置16與被檢查體12於相靠近之方向相對移動,對被檢查體12之電極12a有對應於該電極之探針26之針頭部26b接觸。藉此,測試裝置10之前 述測試器係透過電氣連接裝置16之測試器電極36、配線路32、配線路44、探針26在與被檢查體12之間進行為了電氣檢查之電氣信號之授受。在此接觸係如以往習知削取電極12a之一部分而有電極12a之切削屑產生。During the test, the electrical connecting device 16 and the object 12 are relatively moved in the direction in which they are in contact with each other, and the electrode 12a of the subject 12 is in contact with the needle head 26b of the probe 26 corresponding to the electrode. Thereby, before the test device 10 The tester transmits and receives an electrical signal for electrical inspection between the test object electrode 36, the distribution line 32, the distribution line 44, and the probe 26 of the electrical connection device 16 and the test object 12. Here, the contact system is conventionally obtained by cutting a portion of the electrode 12a and chipping of the electrode 12a is generated.

連接於電氣量測裝置60之配線28係設於接觸區域24a之一方之面24A亦即對向面區域,從該對向面區域露出。配線28係不對探針26電氣連接,亦即使為電氣絕緣之相異電路。配線28係透過設於配線片24之伸出區域24b之配線路(不圖示)亦即第3之配線路以連接區域24c電氣連接於配線路30之另一端。藉此,配線28係電氣連接於偵測用電極34。配線28係可遍佈於接觸區域24a之全面或遍佈於接觸區域24a之一部分。The wiring 28 connected to the electrical measuring device 60 is provided on the surface 24A which is one of the contact regions 24a, that is, the opposing surface region, and is exposed from the opposing surface region. The wiring 28 is not electrically connected to the probe 26, and is even a circuit that is electrically insulated. The wiring 28 is electrically connected to the other end of the distribution line 30 via the connection line 24c through a distribution line (not shown) provided in the extension region 24b of the wiring sheet 24, that is, the third distribution line. Thereby, the wiring 28 is electrically connected to the detecting electrode 34. The wiring 28 can be distributed throughout the contact area 24a or over a portion of the contact area 24a.

參照圖3,前述對向面區域係區分為複數區域,在圖示之例係具有區域50、52。於區域50係分別獨立設有一對之配線28a、28b,於區域52係獨立設有配線28c。Referring to Fig. 3, the opposing surface area is divided into a plurality of areas, and in the illustrated example, areas 50, 52 are provided. A pair of wirings 28a and 28b are separately provided in the region 50, and a wiring 28c is provided independently in the region 52.

設於區域50之一對之配線28a與28b係具備分別互相接近且平行延伸之近接部分(例如近接部分28A)、一條之配線(例如配線28b)折返而互相接近且平行延伸之近接部分(例如近接部分28B)。此外,區域52之配線28c係具備一條之配線折返而互相接近且平行延伸之近接部分(例如近接部分28C)。The wirings 28a and 28b provided in one of the regions 50 are provided with a proximal portion (for example, the proximal portion 28A) which is adjacent to each other and extends in parallel, and a wiring (for example, the wiring 28b) which is folded back to each other and which is adjacent to each other and extends in parallel (for example, Proximity portion 28B). Further, the wiring 28c of the region 52 is provided with a proximal portion (for example, the proximal portion 28C) in which one of the wirings is folded back and is adjacent to each other and extends in parallel.

配線28a、28b、28c之各一端與各另一端係透過偵測用電極34電氣連接於可偵測配線之抵抗值亦即配線間之短路或配線之斷線之電氣量測裝置60,或使為可連接。Each of the ends 28a, 28b, and 28c is electrically connected to the other end through the detecting electrode 34, and is electrically connected to the electrical measuring device 60 of the resistance of the detectable wiring, that is, the short circuit of the wiring or the disconnection of the wiring, or It is connectable.

配線28a、配線28b係在沒有異物附著之狀態下為相互電氣絕緣。電氣量測裝置60係電氣連接於配線28a、配線28b之各自之一端,檢出配線28a、配線28b為電氣絕緣。若於配線28a、配線28b之間(例如近接部分28A)有異物附著,從配線28a到配線28b之閉電路會透過前述異物形成。因此,電氣量測裝置60係檢出配線28a、配線28b之導通,偵測於配線28a、配線28b之間有異物附著。The wiring 28a and the wiring 28b are electrically insulated from each other in a state where no foreign matter adheres. The electrical measuring device 60 is electrically connected to one end of each of the wiring 28a and the wiring 28b, and the detecting wiring 28a and the wiring 28b are electrically insulated. When foreign matter adheres between the wiring 28a and the wiring 28b (for example, the proximity portion 28A), the closed circuit from the wiring 28a to the wiring 28b is formed by the foreign matter. Therefore, the electrical measuring device 60 detects the conduction of the wiring 28a and the wiring 28b, and detects that foreign matter adheres between the wiring 28a and the wiring 28b.

配線28b係連續之一條之配線,故從配線28b之一端至另一端之電路係串聯電路。因此,電氣量測裝置60係電氣連接於配線28b之一端與另一端,在沒有異物附著之狀態下係量測配線28b之從前述一端至前述另一端之前述串聯電路之電阻。若於配線28b折返而近接之近接部分(例如近接部分28B)有使該近接部分短路之異物附著,透過異物之新閉電路形成,配線28b之從前述一端至前述另一端成為並聯電路。藉此,配線28b之從前述一端至前述另一端之前述串聯電路之電阻變化(減少),故電氣量測裝置60可偵測於配線28b之近接部分有異物附著。在圖示之例係形成有以大約90度之角度折彎之配線圖案。Since the wiring 28b is one continuous wiring, the circuit from one end of the wiring 28b to the other end is a series circuit. Therefore, the electrical measuring device 60 is electrically connected to one end and the other end of the wiring 28b, and measures the resistance of the series circuit of the wiring 28b from the one end to the other end in a state where no foreign matter adheres. When the wiring 28b is folded back and the immediately adjacent portion (for example, the proximal portion 28B) has a foreign matter that short-circuits the proximal portion, a new closed circuit that transmits foreign matter is formed, and the wiring 28b is connected in parallel from the one end to the other end. Thereby, the resistance of the series circuit of the wiring 28b from the one end to the other end is changed (reduced), so that the electrical measuring device 60 can detect that foreign matter adheres to the adjacent portion of the wiring 28b. In the illustrated example, a wiring pattern bent at an angle of about 90 degrees is formed.

配線28c係與配線28b同樣地連續之一條之配線。因此,與上述之於配線28b之近接部分有異物附著之場合同樣地,電氣量測裝置60可偵測於配線28c之近接部分(例如近接部分28C)有異物附著。The wiring 28c is one continuous wiring in the same manner as the wiring 28b. Therefore, similarly to the case where the foreign matter adheres to the vicinity of the wiring 28b, the electrical measuring device 60 can detect that foreign matter adheres to the proximal portion of the wiring 28c (for example, the proximal portion 28C).

此外,可能於各配線(28a、28b、28c)有異物附著且附著之異物使配線28斷線。於此種場合亦各配線28a、28b、 28c之從前述一端至前述另一端之前述串聯電路之電阻成為無限,故電氣量測裝置60可偵測於各配線28a、28b、28c有異物附著。Further, it is possible that the wires 28 are disconnected by foreign matter adhering to and adhering to the respective wires (28a, 28b, and 28c). In this case, the wirings 28a, 28b, The resistance of the series circuit of the 28c from the one end to the other end is infinite, so that the electrical measuring device 60 can detect that foreign matter adheres to each of the wires 28a, 28b, and 28c.

圖4係顯示電氣量測裝置60與配線28之電氣等效電路。比圖之假想線(一點鍊線)右側係顯示電氣量測裝置60之等效電路,左側係顯示配線28之等效電路。電氣量測裝置60係包含2個之端子62、64、電源66、電流計68、保護抵抗70。4 is an electrical equivalent circuit showing the electrical measuring device 60 and the wiring 28. The equivalent circuit of the electrical measuring device 60 is shown on the right side of the imaginary line (a little chain line) of the figure, and the equivalent circuit of the wiring 28 is shown on the left side. The electrical measuring device 60 includes two terminals 62 and 64, a power source 66, an ammeter 68, and a protection against 70.

電源66、電流計68、保護抵抗70係在端子62、64之間串聯連接。根據以電流計68量測之電流之變化,電氣量測裝置60係可檢出連接於該電氣量測裝置60之前述電路之抵抗值之變化。端子62、64係透過偵測用電極34電氣連接於配線28。A power source 66, an ammeter 68, and a protection against 70 are connected in series between the terminals 62, 64. The electrical measuring device 60 detects the change in the resistance value of the aforementioned circuit connected to the electrical measuring device 60 based on the change in the current measured by the ammeter 68. The terminals 62 and 64 are electrically connected to the wiring 28 through the detecting electrode 34.

圖4(A)係顯示於圖3中之配線28a與配線28b之各自之一端連接有端子62、64之狀態。在沒有異物72附著之狀態下配線28a與配線28b係不形成閉電路,故於電流計68係沒有電流流動。在於配線28a與配線28b之間有異物72附著之狀態下配線28a與配線28b係形成閉電路,故於電流計68係有電流流動。因此,在異物72之附著前後配線28a與配線28b間之抵抗值會變化,故電氣量測裝置60偵測異物之附著。Fig. 4(A) shows a state in which the terminals 62, 64 are connected to one end of each of the wiring 28a and the wiring 28b in Fig. 3. In the state in which the foreign matter 72 is not attached, the wiring 28a and the wiring 28b do not form a closed circuit, so that no current flows in the ammeter 68. In a state in which the foreign matter 72 is adhered between the wiring 28a and the wiring 28b, the wiring 28a and the wiring 28b form a closed circuit, so that current flows in the ammeter 68. Therefore, the resistance value between the wiring 28a and the wiring 28b changes before and after the foreign matter 72 is attached, and the electrical measuring device 60 detects the adhesion of the foreign matter.

圖4(B)係顯示於圖3中之配線28b(或配線28c)之一端與另一端分別連接有端子62、64之狀態。在沒有異物72附著之狀態下配線28b係在前述一端與前述另一端之間 形成串聯電路,因此於電流計68係有既定之定電流流動。在於配線28b之近接部分有異物72附著之狀態下,除了既存之串聯電路外形成經過異物72之閉電路,在配線28b之前述一端與前述另一端之間形成並聯電路。配線28b之前述一端與前述另一端之間之等效電路變化,故於電流計68流動之電流亦變化。因此,在異物72之附著前後配線28b之前述一端與前述另一端之間之之抵抗值會變化,故電氣量測裝置60偵測異物之附著。Fig. 4(B) shows a state in which the terminals 62, 64 are connected to one end and the other end of the wiring 28b (or the wiring 28c) in Fig. 3, respectively. The wiring 28b is between the aforementioned one end and the other end in a state where no foreign matter 72 is attached. A series circuit is formed, so that the galvanometer 68 has a predetermined constant current flow. In a state in which the foreign matter 72 is adhered to the proximal portion of the wiring 28b, a closed circuit through which the foreign matter 72 is formed is formed in addition to the existing series circuit, and a parallel circuit is formed between the one end of the wiring 28b and the other end. The equivalent circuit between the one end of the wiring 28b and the other end is changed, so that the current flowing in the ammeter 68 also changes. Therefore, the resistance value between the one end of the wiring 28b and the other end before and after the attachment of the foreign matter 72 changes, and the electrical measuring device 60 detects the adhesion of the foreign matter.

圖4(C)係顯示於圖3中之配線28a(或配線28b、配線28c)之一端與另一端分別連接有端子62、64之狀態。在沒有異物72附著之狀態下配線28b係在前述一端與前述另一端之間形成閉電路,因此於電流計68係有既定之定電流流動。在於配線28b之近接部分有異物72附著且異物72使配線28a斷線之狀態下,在配線28b之前述一端與前述另一端之間形成開電路。因此,於電流計68變成沒有電流流動。因此,在往前述近接部分之異物72之附著前後配線28b之前述一端與前述另一端之間之之抵抗值會變化,故電氣量測裝置60根據此抵抗值之變化偵測異物之附著。Fig. 4(C) shows a state in which the terminals 62 and 64 are connected to one end and the other end of the wiring 28a (or the wiring 28b and the wiring 28c) in Fig. 3, respectively. In the state where the foreign matter 72 is not attached, the wiring 28b forms a closed circuit between the one end and the other end. Therefore, the galvanometer 68 flows with a predetermined constant current. In a state in which the foreign matter 72 adheres to the proximal portion of the wiring 28b and the foreign matter 72 breaks the wiring 28a, an open circuit is formed between the one end of the wiring 28b and the other end. Therefore, no current flows in the galvanometer 68. Therefore, the resistance value between the one end and the other end of the wiring 28b before and after the attachment to the foreign matter 72 in the proximal portion changes, and the electrical measuring device 60 detects the adhesion of the foreign matter based on the change in the resistance value.

電氣量測裝置60不限於上述之實施例,只要能偵測或量測配線28之抵抗值之變化,可使為其他構成。例如,可使為與能進行抵抗值之測定之一般之複數測試器同樣之構成。電氣量測裝置60係組入測試裝置10之前述測試器亦可。The electrical measuring device 60 is not limited to the above-described embodiment, and may be configured as long as it can detect or measure the change in the resistance value of the wiring 28. For example, it can be configured in the same manner as a general multi-tester capable of performing measurement of resistance values. The electrical measuring device 60 may be incorporated into the aforementioned test device of the testing device 10.

如前述,藉由將接觸區域24a之對向面區域區分為複數 區域50或區域52並於區域50獨立設配線28a、28b、於區域52設配線28c且給予區域與設於該區域之配線之對應關係來特定抵抗值變化之配線,可特定有異物附著之區域。藉此,可特定為了將異物除去而清掃之區域,故電氣連接裝置16之清掃作業變容易。As described above, the opposite surface area of the contact area 24a is divided into plural numbers In the region 50 or the region 52, the wirings 28a and 28b are provided independently in the region 50, and the wiring 28c is provided in the region 52, and the wiring of the region and the wiring provided in the region is given to specify the wiring having the resistance value change, and the region to which the foreign matter adheres can be specified. . Thereby, the area where the foreign matter is removed and removed can be specified, so that the cleaning operation of the electrical connection device 16 becomes easy.

不將對向面區域分為區域而使一條之配線28遍佈於對向面區域之全域亦可。如此,只要檢出一條之配線28之抵抗值即可,故檢出作業變容易。此外,使平行之複數配線遍佈於對向面區域之全域亦可。The wiring area 28 may be distributed over the entire area of the facing area without dividing the opposing surface area into areas. Thus, as long as the resistance value of one of the wires 28 is detected, the detection operation becomes easy. Further, it is also possible to spread the parallel plurality of wirings over the entire area of the facing area.

於本實施例中,偵測用電極34係與測試器電極36同樣地設於配線基板20。但偵測用電極34係設於配線片24亦可。但若偵測用電極34設於測試器電極36之附近,可於將測試器電極36對測試裝置10之前述測試器連接之作業並行進行將偵測用電極34對電氣量測裝置60連接之作業。藉此,可簡易進行此等連接作業。In the present embodiment, the detecting electrode 34 is provided on the wiring board 20 in the same manner as the tester electrode 36. However, the detecting electrode 34 may be provided on the wiring sheet 24. However, if the detecting electrode 34 is disposed in the vicinity of the tester electrode 36, the detecting electrode 34 can be connected to the electrical measuring device 60 in parallel with the operation of connecting the tester electrode 36 to the tester of the testing device 10. operation. This makes it easy to perform these connection tasks.

將偵測用電極34與配線28電氣連接之前述第3之配線路係於配線片24與配線路44(第4之配線路)相同之層亦即設於第1之片狀構件40與第2之片狀構件42之間亦可。只要如此,可將配線路44與前述第3之配線路於配線片24之製造同時製作,故沒有另外設製作前述第3之配線路之步驟之必要,配線片24之製造變容易。The third matching line that electrically connects the detecting electrode 34 and the wiring 28 is the same layer as the wiring sheet 24 and the wiring line 44 (the fourth wiring), that is, the first sheet member 40 and the first The sheet members 42 of 2 may also be between. In this case, the distribution line 44 and the third distribution line can be simultaneously produced in the manufacture of the wiring sheet 24. Therefore, it is not necessary to separately provide the step of fabricating the third distribution line, and the wiring sheet 24 can be easily manufactured.

如前述,探針26與配線片24係以連續之步驟製造,但可將配線28於探針26與配線片24之製造步驟使用電鍍技術在前述連續之步驟之中製造。As described above, the probe 26 and the wiring sheet 24 are manufactured in a continuous step, but the wiring 28 can be manufactured in the above-described successive steps using the plating technique in the manufacturing steps of the probe 26 and the wiring sheet 24.

參照圖5與圖6,本發明之電氣連接裝置116係僅探針126與於圖2顯示之探針26相異,其他之構成係與電氣連接裝置16同樣之構成。Referring to Fig. 5 and Fig. 6, in the electrical connecting device 116 of the present invention, only the probe 126 is different from the probe 26 shown in Fig. 2, and the other configurations are the same as those of the electrical connecting device 16.

探針126係以往習知之懸臂型之探針,於配線片24之接觸區域24a包含將第2之片狀構件42於其厚度方向貫通之基部126a、一體形成於基部126a之臂部126c、一體形成於臂部126c之針頭部126b。基部126a係連接於配線路44,從該配線路44往被檢查體12延伸。臂部126c係從基部126a之延長端往接觸區域24a隔著間隔平行延伸。針頭部126b係從臂部126c之延長端往被檢查體12延伸。The probe 126 is a conventional cantilever type probe, and the contact portion 24a of the wiring sheet 24 includes a base portion 126a that penetrates the second sheet member 42 in the thickness direction thereof, and an arm portion 126c that is integrally formed on the base portion 126a. The needle head 126b is formed on the arm portion 126c. The base portion 126a is connected to the distribution line 44, and extends from the distribution line 44 to the inspection object 12. The arm portion 126c extends in parallel from the extended end of the base portion 126a to the contact region 24a at intervals. The needle head portion 126b extends from the extended end of the arm portion 126c toward the subject 12 to be inspected.

於被檢查體12之電氣檢查時,探針126對被檢查體12之電極12a接觸,針頭部126b往接觸區域24a推上。藉此,臂部126c係以與基部126a境界為支點以既定之力彎曲。At the time of electrical inspection of the subject 12, the probe 126 is in contact with the electrode 12a of the subject 12, and the needle head 126b is pushed up toward the contact area 24a. Thereby, the arm portion 126c is bent with a predetermined force with the boundary of the base portion 126a as a fulcrum.

根據電氣連接裝置116,配線28亦設於對應於前述對向面區域之臂部126c之部分,故可偵測於該部分附著之異物。偵測之異物係藉由清掃前述對向面區域而除去。因此,於臂部126c彎曲時,可防止因於前述對向面區域附著之異物夾於臂部126c與前述對向面區域之間而臂部126c折損。藉由將配線28之前述近接部分設計為比前述對向面區域與臂部126c之間隔小,可更確實偵測將臂部126c折損之尺寸之異物。According to the electrical connecting device 116, the wiring 28 is also provided at a portion corresponding to the arm portion 126c of the opposing surface region, so that foreign matter adhering to the portion can be detected. The detected foreign matter is removed by cleaning the aforementioned opposing surface area. Therefore, when the arm portion 126c is bent, it is possible to prevent the foreign matter adhering to the opposing surface region from being caught between the arm portion 126c and the opposing surface region, and the arm portion 126c is broken. By designing the abutting portion of the wiring 28 to be smaller than the interval between the opposing face region and the arm portion 126c, it is possible to more reliably detect foreign matter having a size that is broken by the arm portion 126c.

參照圖7與圖8,本發明之電氣連接裝置216係包含與圖1之測試裝置10同樣之配線基板20、安裝於配線基板20之連接基板222、安裝於連接基板222之探針基板224、 結合於探針基板224之複數探針226、設於探針基板224之配線28。7 and 8 , the electrical connection device 216 of the present invention includes a wiring substrate 20 similar to the testing device 10 of FIG. 1 , a connection substrate 222 mounted on the wiring substrate 20 , and a probe substrate 224 mounted on the connection substrate 222 . The plurality of probes 226 coupled to the probe substrate 224 and the wiring 28 provided on the probe substrate 224.

配線基板20、連接基板222、探針基板224係相互重疊結合,分別具備複數配線路,探針226與配線28係透過此等配線路電氣連接於偵測用電極34與測試器電極36。The wiring board 20, the connection board 222, and the probe board 224 are overlapped with each other, and each has a plurality of lines, and the probe 226 and the wiring 28 are electrically connected to the detecting electrode 34 and the tester electrode 36 through the wiring.

探針基板224係以對被檢查體12對向之一方之面224A之至少一部分做為對向面區域之支持探針226之支持體。探針226係設於探針基板224之對向面區域,從對向面區域往被檢查體12突出。The probe substrate 224 is a support for the support probe 226 which is at least a part of the face 224A facing the test object 12 as a facing area. The probe 226 is provided on the opposing surface area of the probe substrate 224, and protrudes from the opposing surface area to the subject 12 .

探針基板224係做為以往習知之印刷配線基板製作,具備陶瓷、加入玻璃纖維之環氧樹脂等硬直之基材、設於該基材之內部或外面之複數配線路244、對配線路244電氣連接之探針島部228。The probe substrate 224 is produced as a conventional printed wiring board, and includes a rigid substrate such as ceramics, epoxy resin added with glass fibers, a plurality of wiring lines 244 provided inside or outside the substrate, and a matching wiring 244. Electrically connected probe island portion 228.

探針226係以往習知之懸臂型之探針,包含相互一體形成之基部226a、臂部226c、針頭部226b。基部226a係以其一端連接於探針島部228,從探針島部228往下方延伸。臂部226c係從基部226a之延長端往對向面區域隔著間隔與該對向面區域平行延伸。針頭部226b係從臂部226c之延長端往下延伸。The probe 226 is a conventional cantilever type probe, and includes a base portion 226a, an arm portion 226c, and a needle head portion 226b which are integrally formed with each other. The base portion 226a is connected to the probe island portion 228 at one end thereof and extends downward from the probe island portion 228. The arm portion 226c extends in parallel with the opposing surface region from the extended end of the base portion 226a to the opposing surface region. The needle head 226b extends downward from the extended end of the arm portion 226c.

本實施例中之探針226係與於圖5與圖6顯示之電氣連接裝置116之探針126同樣為懸臂型之探針,故有因於對向面區域224A附著之異物72而折損之虞。然而,根據電氣連接裝置216,於對向面區域224A設有配線28,故可偵測此種異物。藉由於此異物之偵測時將該異物除去,防 止探針226之折損。The probe 226 in this embodiment is a cantilever-type probe similarly to the probe 126 of the electrical connection device 116 shown in FIGS. 5 and 6, and is thus damaged by the foreign matter 72 attached to the facing area 224A. Hey. However, according to the electrical connection device 216, the wiring 28 is provided in the opposing surface region 224A, so that such foreign matter can be detected. By removing the foreign matter during the detection of the foreign matter, the prevention The breakage of the probe 226 is stopped.

探針島部228與配線28係形成於對向面區域224A亦即探針基板224之同一面。因此,於製作探針基板224之步驟中可將探針島部228與配線28同時形成,故不以製作探針基板224之步驟外另外製作配線28之步驟為必要。若將探針島部228與配線28以同一步驟製作,探針島部228與配線28之厚度成為大致同一尺寸。The probe island portion 228 and the wiring 28 are formed on the same surface of the opposite surface region 224A, that is, the probe substrate 224. Therefore, since the probe island portion 228 and the wiring 28 can be simultaneously formed in the step of fabricating the probe substrate 224, it is necessary to separately produce the wiring 28 in addition to the step of fabricating the probe substrate 224. When the probe island portion 228 and the wiring 28 are formed in the same step, the thickness of the probe island portion 228 and the wiring 28 are substantially the same size.

參照圖9與圖10,本發明之電氣連接裝置316係包含與配線基板20、安裝於配線基板20之探針組裝體322、設於探針組裝體322之配線28。探針組裝體322係具備複數探針326、安裝並支持複數探針326之支持機構324。亦即,支持機構324係做為支持探針326之支持體發揮機能。Referring to Fig. 9 and Fig. 10, the electrical connecting device 316 of the present invention includes a wiring board 20, a probe assembly 322 attached to the wiring board 20, and a wiring 28 provided in the probe assembly 322. The probe assembly 322 is provided with a plurality of probes 326 and a support mechanism 324 that mounts and supports the plurality of probes 326. That is, the support mechanism 324 functions as a support for the support probe 326.

支持機構324係包含第1之板狀構件330、框狀構件332、第2之板狀構件334。第1之板狀構件330與第2之板狀構件334係相互隔著間隔對向配置。框狀構件332係配置於第1之板狀構件330與第2之板狀構件334之間。第1之板狀構件330、框狀構件332、第2之板狀構件334係重疊結合為形成具有中空部336之箱。The support mechanism 324 includes a first plate member 330, a frame member 332, and a second plate member 334. The first plate-shaped member 330 and the second plate-shaped member 334 are disposed to face each other with a space therebetween. The frame member 332 is disposed between the first plate member 330 and the second plate member 334. The first plate-shaped member 330, the frame-shaped member 332, and the second plate-shaped member 334 are superposed and joined to form a case having the hollow portion 336.

複數探針326係分別直線狀延伸,通過第1之板狀構件330、中空部336、第2之板狀構件334,以貫通前述箱之狀態安裝於支持機構324。如上述組裝探針組裝體322。The plurality of probes 326 extend linearly, and are attached to the support mechanism 324 through the first plate member 330, the hollow portion 336, and the second plate member 334 so as to penetrate the case. The probe assembly 322 is assembled as described above.

配線基板20係於對被檢查體12對向之面設有複數探針島部(不圖示),探針組裝體322係以探針326之一端地接前述探針島部之方式安裝於前述配線基板20。例如, 探針組裝體322係可以貫通支持機構324並對配線基板20螺合之螺絲構件對配線基板20支持。The wiring board 20 is provided with a plurality of probe island portions (not shown) facing the object to be inspected 12, and the probe assembly 322 is attached to the probe island portion at one end of the probe 326. The wiring board 20 described above. E.g, The probe assembly 322 can support the wiring board 20 by a screw member that penetrates the support mechanism 324 and screws the wiring board 20 .

第2之板狀構件334之一方之面334A係以探針組裝體322安裝於配線基板20之狀態對被檢查體12對向。因此,第2之板狀構件334之一方之面334A之至少一部分係成為對被檢查體12之平面12b對向之對向面區域。One of the faces 334A of the second plate-shaped member 334 is opposed to the test object 12 in a state where the probe assembly 322 is attached to the wiring board 20. Therefore, at least a part of the surface 334A of one of the second plate-shaped members 334 is a region facing the plane 12b of the test object 12.

配線28係設於第2之板狀構件334之一方之面334A。在圖示之例雖係第2之板狀構件334於板狀之本體直接形成配線而製作,但以將形成有配線28之撓性配線基板等對板狀之本體貼附來製作亦可。The wiring 28 is provided on one of the faces 334A of the second plate member 334. In the example shown in the figure, the second plate-shaped member 334 is formed by directly forming a wiring in a plate-like body. However, a flexible wiring board on which the wiring 28 is formed may be attached to a plate-shaped body.

[第2實施例][Second Embodiment]

參照圖11與圖12,本發明之第2實施例之測試裝置410係用於如TFT基板、液晶顯示用面板等液晶顯示用基板之發光檢查之電氣檢查。Referring to Fig. 11 and Fig. 12, a test apparatus 410 according to a second embodiment of the present invention is used for electrical inspection of illuminating inspection of a liquid crystal display substrate such as a TFT substrate or a liquid crystal display panel.

測試裝置410包含以液晶顯示用基板做為平板狀之被檢查體412並保持被檢查體412之夾頭(不圖示)、對保持於該夾頭之被檢查體412之緣部隔間隔配置之電氣連接裝置416、電氣連接於該電氣連接裝置416之測試器(不圖示)。此外,測試裝置410係可進一步包含前述之電氣量測裝置60。The test apparatus 410 includes a specimen 412 in which the substrate for liquid crystal display is formed into a flat shape, and holds a chuck (not shown) of the specimen 412, and is disposed at intervals along the edge of the specimen 412 held by the chuck. The electrical connection device 416 is electrically connected to the tester (not shown) of the electrical connection device 416. Additionally, test device 410 can further include the aforementioned electrical measurement device 60.

被檢查體412係具有矩形之形狀,於對應於其矩形之至少1個之邊之緣部形成有多數之電極412a。各電極412a係具有往與形成有該電極412a之緣部之長度方向(亦即圖11之紙背方向)正交之方向(亦即圖11之左右方向)延伸 之帶狀之形狀,於緣部之長度方向以既定之間隔形成。The object to be inspected 412 has a rectangular shape, and a plurality of electrodes 412a are formed on the edge portion corresponding to at least one of the sides of the rectangle. Each of the electrodes 412a has a direction orthogonal to the longitudinal direction of the edge portion on which the electrode 412a is formed (that is, the paper back direction of FIG. 11) (that is, the left-right direction of FIG. 11). The strip shape is formed at a predetermined interval in the longitudinal direction of the edge portion.

電氣連接裝置416係以往習知之探針裝置,於被檢查體412之周圍從被檢查體412隔著間隔配置。前述探針裝置係其本體422配置於被檢查體412之外方,包含從本體422往被檢查體412延伸之配線片424、設於配線片424之複數接觸子亦即複數探針426、設於配線片424之配線28、支持配線片424之彈性構件430、電氣連接於配線28之偵測用電極(不圖示)。The electrical connection device 416 is a conventional probe device and is disposed at intervals around the subject 412 from the subject 412. In the probe device, the main body 422 is disposed outside the test object 412, and includes a wiring piece 424 extending from the main body 422 to the test object 412, and a plurality of contacts 426 disposed on the wiring piece 424. The wiring 28 of the wiring sheet 424, the elastic member 430 supporting the wiring sheet 424, and the detecting electrode (not shown) electrically connected to the wiring 28 are provided.

探針426係對應於被檢查體412之電極412a設於配線片424,探針426之節距係對應於電極412a之節距。電氣連接裝置416與被檢查體412係以探針426對電極412a接觸之方式相對移動。在電氣連接裝置416與被檢查體412之接觸係如以往習知削取電極412a之一部分而有電極412a之切削屑產生。The probe 426 is provided on the wiring sheet 424 corresponding to the electrode 412a of the object to be inspected 412, and the pitch of the probe 426 corresponds to the pitch of the electrode 412a. The electrical connection device 416 and the object to be inspected 412 relatively move in such a manner that the probe 426 is in contact with the electrode 412a. The contact between the electrical connection device 416 and the object to be inspected 412 is conventionally known to be a part of the electrode 412a, and the chips of the electrode 412a are generated.

配線片424係包含第3之板狀構件432、設於第3之板狀構件432之配線434、以覆蓋配線434之方式將一方之面434A貼附於第3之板狀構件432之第4之板狀構件436。配線28係設於第4之板狀構件436之另一方之面434B。The wiring sheet 424 includes the third plate member 432, the wiring 434 provided in the third plate member 432, and the fourth surface 434A attached to the fourth plate member 432 so as to cover the wiring 434. The plate member 436. The wiring 28 is provided on the other surface 434B of the fourth plate-shaped member 436.

配線片424係在其延長端配線434往被檢查體412(圖之下方)露出。探針426係形成於配線434之露出部分,配線片424係做為支持探針426之支持體發揮作用。探針426係透過配線434電氣連接於測試裝置410之前述測試器。The wiring sheet 424 is exposed to the inspection body 412 (below the figure) at the extension end wiring 434. The probe 426 is formed on the exposed portion of the wiring 434, and the wiring sheet 424 functions as a support for the support probe 426. Probe 426 is electrically coupled to the aforementioned tester of test device 410 via wiring 434.

配線片424之延長端中之第3之板狀構件432之一方 之面432A與位於探針426之附近之第4之板狀構件436之另一方之面434B之一部分係做為配線片424之對被檢查體412對向之對向面區域424A發揮作用。根據電氣連接裝置416,可檢出於對向面區域附著之異物。One of the third plate members 432 of the extended ends of the wiring sheets 424 One of the faces 434A of the fourth surface of the fourth plate-shaped member 436 located adjacent to the probe 426 is formed as a pair of facing faces 424A facing the object to be inspected 412. According to the electrical connection device 416, the foreign matter attached to the opposing surface area can be detected.

[產業上之可利用性][Industrial availability]

本發明不限於上述實施例,只要不脫離記載於申請專利範圍之主旨,各種變更皆可。The present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit and scope of the invention.

16、116、216、316、416‧‧‧電氣連接裝置16, 116, 216, 316, 416‧‧‧ electrical connection devices

12、412‧‧‧被檢查體12. 412‧‧‧Inspected body

12a、412a‧‧‧被檢查體之電極12a, 412a‧‧‧ electrodes of the inspected body

24‧‧‧配線片24‧‧‧Wiring

24A、224A、324A、424A‧‧‧對向面區域24A, 224A, 324A, 424A‧‧‧ opposite areas

26、226、326、426‧‧‧探針26, 226, 326, 426‧‧ probe

26a、226a、326a、426a‧‧‧基部Bases 26a, 226a, 326a, 426a‧‧

26b、226b、326b、426b‧‧‧針頭部26b, 226b, 326b, 426b‧‧‧ needle head

28‧‧‧配線28‧‧‧Wiring

34‧‧‧偵測用電極34‧‧‧Detection electrode

224‧‧‧探針基板224‧‧‧Probe substrate

324‧‧‧支持機構324‧‧‧Support institutions

424‧‧‧配線片424‧‧‧Wiring sheet

圖1係顯示本發明之測試裝置之第1之實施例之側面圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view showing a first embodiment of the test apparatus of the present invention.

圖2係將圖1中之配線片之一部分擴大顯示之剖面圖。Fig. 2 is a cross-sectional view showing a portion of the wiring sheet of Fig. 1 enlarged.

圖3係將圖1中之配線片之一部分擴大顯示之仰視圖。Fig. 3 is a bottom plan view showing an enlarged portion of one of the wiring sheets of Fig. 1.

圖4係顯示配線與電氣量測器之電氣等效電路之電路圖,圖4(A)係顯示因異物之附著而配線間短路之狀態,圖4(B)係顯示因異物之附著而於配線間有並聯電路形成之狀態,圖4(C)係顯示因異物而配線斷線之狀態。4 is a circuit diagram showing an electrical equivalent circuit of a wiring and an electrical measuring device, and FIG. 4(A) shows a state in which a short circuit is caused by a foreign matter, and FIG. 4(B) shows a wiring due to adhesion of a foreign matter. There is a state in which a parallel circuit is formed, and FIG. 4(C) shows a state in which the wiring is broken due to foreign matter.

圖5係顯示本發明之電氣連接裝置之第2之實施例之側面圖。Fig. 5 is a side view showing a second embodiment of the electrical connecting device of the present invention.

圖6係將圖5中之配線片之一部分擴大顯示之剖面圖。Fig. 6 is a cross-sectional view showing an enlarged portion of a wiring piece in Fig. 5.

圖7係顯示本發明之電氣連接裝置之第3之實施例之側面圖。Fig. 7 is a side view showing a third embodiment of the electrical connecting device of the present invention.

圖8係將圖7中之探針基板之一部分擴大顯示之剖面圖。Fig. 8 is a cross-sectional view showing an enlarged portion of a probe substrate of Fig. 7.

圖9係顯示本發明之電氣連接裝置之第4之實施例之側面圖。Fig. 9 is a side view showing a fourth embodiment of the electrical connecting device of the present invention.

圖10係將圖9中之第2板狀構件之一部分擴大顯示之剖面圖。Fig. 10 is a cross-sectional view showing a part of the second plate member in Fig. 9 in an enlarged manner.

圖11係顯示本發明之測試裝置之第2之實施例之側面圖。Figure 11 is a side elevational view showing a second embodiment of the test apparatus of the present invention.

圖12係將圖11中之配線片之一部分擴大顯示之仰視圖。Fig. 12 is a bottom plan view showing an enlarged portion of a wiring piece in Fig. 11.

24a‧‧‧接觸領域24a‧‧‧Contact area

26‧‧‧探針26‧‧‧Probe

28A‧‧‧近接部分28A‧‧‧ Near part

28B‧‧‧近接部分28B‧‧‧ Near part

28C‧‧‧近接部分28C‧‧‧ Near part

28a‧‧‧配線28a‧‧‧Wiring

28b‧‧‧配線28b‧‧‧Wiring

28c‧‧‧配線28c‧‧‧Wiring

50‧‧‧區域50‧‧‧Area

52‧‧‧區域52‧‧‧Area

Claims (8)

一種電氣連接裝置,用於具有設有電極之平面之被檢查體之電氣檢查,其特徵在於,包含:對前述被檢查體之前述平面隔著間隔且具備對向於該平面配置之對向面區域之支持體、具有應接觸於前述電極之針頭部且該針頭部從前述對向面區域突出為可接觸前述電極之複數探針、遍佈於前述對向面區域且具有互相接近而並行延伸且從前述對向面區域露出之複數近接部分之至少1個之配線、用來將前述配線對可偵測在前述近接部分之短路或前述配線之斷線之電氣量測裝置電氣連接之電氣連接於各配線之偵測用電極。 An electrical connection device for electrical inspection of an object to be inspected having a plane on which an electrode is provided, comprising: an interval facing the plane of the object to be inspected and having an opposite surface disposed opposite to the plane a support of the region, having a needle head that is in contact with the electrode, and the needle head protrudes from the opposite surface region to contact the plurality of probes of the electrode, spread over the aforementioned opposing surface regions, and have mutually adjacent and extend in parallel Electrically connecting at least one of a plurality of proximal portions exposed from the opposing surface region to electrically connect the wiring to an electrical measuring device capable of detecting a short circuit in the proximal portion or a disconnection of the wiring Detection electrodes for each wiring. 如申請專利範圍第1項之電氣連接裝置,其中,前述對向面區域係分為分別獨立設有1個或複數前述配線之複數區域。 The electrical connection device of claim 1, wherein the opposite surface region is divided into a plurality of regions each having one or a plurality of the plurality of wires. 如申請專利範圍第1項之電氣連接裝置,其中,另包含可對前述被檢查體隔著間隔平行於前述平面配置且將前述支持體保持於與前述被檢查體對向之面之配線基板,該配線基板具備前述偵測用電極、電氣連接於前述探針之測試器電極、分別連接於前述偵測用電極與前述測試器電極之第1與第2之配線路,前述支持體具有位於前述配線與前述第1之配線路之間將前述配線與前述偵測用電極電氣連接之第3之配線 路、位於前述探針與前述第2之配線路之間將前述探針與前述測試器電極電氣連接之第4之配線路。 The electrical connection device according to the first aspect of the invention, further comprising a wiring board in which the object to be inspected is disposed in parallel with the plane and the support body is held on a surface facing the object to be inspected, The wiring board includes the detecting electrode, a tester electrode electrically connected to the probe, and first and second lines respectively connected to the detecting electrode and the tester electrode, wherein the support has the aforementioned The third wiring electrically connecting the wiring to the detecting electrode between the wiring and the first matching line A fourth line connecting the probe to the tester electrode electrically connected between the probe and the second line. 如申請專利範圍第3項之電氣連接裝置,其中,另包含位於前述配線基板與前述支持體之間且安裝於前述配線基板與前述支持體之保持塊,前述支持體具有一方之面安裝於前述保持塊之第1之片狀構件、一方之面貼於前述第1之片狀構件之另一方之面且另一方之面具備前述對向面區域之第2之片狀構件,前述第3之配線路與第4之配線路係在前述第1之片狀構件與第2之片狀構件之間沿著兩片狀構件延伸。 The electrical connection device of claim 3, further comprising a holding block between the wiring board and the support and mounted on the wiring board and the support, wherein the support has one surface mounted on the surface The first sheet-like member of the holding block, one surface of which is attached to the other surface of the first sheet-like member, and the other surface of which has the second sheet-like member of the opposing surface region, the third The distribution line and the fourth distribution line extend along the two sheet-like members between the first sheet-like member and the second sheet-like member. 如申請專利範圍第4項之電氣連接裝置,其中,前述探針具有將前述第2之片狀構件於其厚度方向貫通且連接於前述第4之配線路並從該第4之配線路往前述被檢查體延伸之基部、從該基部之延長端往前述第2之片狀構件之前述對向面區域隔著間隔往該對向面區域平行延伸之臂部,前述針頭部係從前述臂部之延長端往前述被檢查體延伸。 The electrical connection device according to claim 4, wherein the probe has a second sheet member penetrating in a thickness direction thereof and connected to the fourth wiring line, and the wiring line is formed from the fourth wiring line. a base portion extending from the base portion, and an arm portion extending parallel to the opposing surface region from the extended end of the base portion to the opposing surface region of the second sheet-like member, wherein the needle head portion is from the arm portion The extended end extends toward the aforementioned object to be inspected. 如申請專利範圍第1項之電氣連接裝置,其中,另包含可對前述被檢查體隔著間隔平行配置且保持前述支持體之配線基板,該配線基板係於與前述被檢查體對向之一方之面具備前述複數探針抵接之複數探針島部,前述支持體具備相互隔著間隔對向之第1之板狀構件 與第2之板狀構件、以與該第1之板狀構件與第2之板狀構件共同形成具有中空部之箱之方式設於該第1之板狀構件與第2之板狀構件之間之框狀構件,前述第1之板狀構件係於前述配線基板之設有前述探針島部之部分保持為與前述配線基板平行,前述第2之板狀構件係於和與前述第1之板狀構件對向之面相反之面具有前述對向面區域,前述探針係使其一端抵接前述探針島部,從前述探針島部往前述被檢查體直線狀延伸,通過前述第1之板狀構件、前述中空部、前述第2之板狀構件貫通前述箱,從前述對向面區域突出。The electrical connection device according to the first aspect of the invention, further comprising: a wiring board in which the support body is arranged in parallel with the spacer to be held in parallel with each other, and the wiring board is disposed opposite to the object to be inspected The surface of the plurality of probe islands that are in contact with the plurality of probes, and the support body includes a first plate-shaped member that faces each other with a gap therebetween The second plate-shaped member is provided in the first plate-shaped member and the second plate-shaped member so as to form a box having a hollow portion together with the first plate-shaped member and the second plate-shaped member. In the frame member, the first plate-shaped member is held in a portion of the wiring board where the probe island portion is provided so as to be parallel to the wiring substrate, and the second plate-shaped member is attached to the first plate member. The surface of the plate-shaped member facing the opposite surface has the opposing surface area, and the probe has one end abutting the probe island portion, and linearly extending from the probe island portion to the object to be inspected. The first plate-shaped member, the hollow portion, and the second plate-shaped member penetrate the case and protrude from the opposing surface region. 如申請專利範圍第1項之電氣連接裝置,其中,另包含配置於前述被檢查體之外方且安裝有前述支持體之探針裝置之本體,前述支持體係形成為從前述本體往前述被檢查體延伸之片狀,於其一方之面具有前述對向面區域,於其延長端設有前述探針。The electrical connection device of claim 1, further comprising: a body of the probe device disposed outside the object to be inspected and having the support, wherein the support system is formed to be inspected from the body to the foregoing The body extends in a sheet shape having the aforementioned facing surface region on one side thereof, and the probe is provided at the extended end thereof. 一種測試裝置,包含申請專利範圍第1項之電氣連接裝置、與電氣連接於前述偵測用電極之前述電氣量測裝置。A test apparatus includes the electrical connection device of claim 1 and the electrical measurement device electrically connected to the detection electrode.
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