JPH08114648A - Substrate inspection apparatus and probe contact position adjusting method thereof - Google Patents

Abstract

PURPOSE: To accurately bring a probe into contact with a pad in an in-circuit test by providing a mechanism measuring the positional shift between the tooling hole of a substrate to be inspected and the pad and moving and correcting the probe contact position of upper and lower fixtures on the basis of the correction quantity corresponding to the measured value. CONSTITUTION: A substrate support pin T provided on a lower fixture adjusting plate 23 is fitted in the tooling hole of a substrate PB to be inspected and the substrate PB to be inspected is fixed and supported on the lower fixture adjusting plate 23. Thereafter, the probe position of a lower fixture 21 is corrected with respect to the lower fixture adjusting plate 23 by operating three upper fixture adjusting parts (micrometers) 26... according to measured correction quantity and, continuously, the same correction of a probe position is performed to an upper fixture adjusting plate 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection device for inspecting a board by applying a probe provided on a fixture to a board (printed circuit board) to be inspected, and more particularly to a function for correcting a probe contact position of a fixture. The present invention relates to a substrate inspection device.

[0002]

2. Description of the Related Art Conventionally, in an in-circuit tester for inspecting a substrate (printed circuit board) to be inspected by a probe provided in the fixture, the fixture is a fixed type. At this time, the inspection probe set up on the fixture is set up based on the design data of the board.
Further, a plurality of tooling holes are provided for positioning on a mounting board (printed circuit board) which is a board to be inspected.

As described above, since the fixture is a fixed type in the related art, when the positional relationship between the tooling hole of the substrate to be inspected and the pad is deviated from the design data, the inspection probe does not contact the pad accurately. There were cases. At this time, an inspection error such as a false error due to a contact error (a good product substrate is determined to be a defective product) occurs.

[0004]

As described above, in the conventional in-circuit tester, if the fixture is of a fixed type with respect to the board to be inspected, a false error due to a contact mistake due to a tooling hole and a pad shift due to a board processing error. There is a problem such as (a non-defective substrate is determined to be defective).

The present invention has been made in view of the above circumstances,
Provided are a board inspection device and a probe contact position adjusting method for the same, which can accurately contact the pad of the board to be inspected with the inspection probe of the fixture in mounting board inspection, and can always perform correct board inspection. The purpose is to do.

[0006]

The present invention has means for measuring the displacement of the mounting board, and means for moving and adjusting the probe contact position of the fixture based on the value measured here to fix it. Thus, a substrate inspection apparatus and a probe contact position adjusting method of the apparatus capable of accurately contacting the inspection probe set on the fixture with the pad of the mounting substrate are realized.

That is, the board inspecting apparatus of the present invention is a board inspecting apparatus for inspecting a board by applying a probe provided on the fixture to a board to be inspected, and a position where the fixture can move in a plane direction. It is characterized in that an adjusting mechanism is provided.

Further, the substrate inspection apparatus of the present invention has a substrate supporting mechanism for supporting the substrate to be inspected, a fixture for applying a probe to the substrate to be inspected supported by the substrate supporting mechanism, and the fixture in the plane direction. And a position adjusting mechanism for moving the position, and adjusting the contact position between the pad and the probe by moving the fixture in the surface direction.

Further, the substrate inspection apparatus of the present invention has a substrate supporting mechanism for supporting the substrate to be inspected so as to be movable in the plane direction, and a fixture for applying a probe to the substrate to be inspected supported by the substrate supporting mechanism. The position of contact between the pad and the probe is adjusted by moving the substrate to be inspected.

Further, the board inspection apparatus of the present invention is a board inspection apparatus in which an upper fixture and a lower fixture are opposed to each other with a board to be inspected therebetween, and the board to be inspected is provided on the lower fixture. A lower fixture adjustment mechanism for supporting the upper part of the lower fixture so as to be movable in the surface direction, and an upper fixture adjustment mechanism provided on the lower part adjustment mechanism for moving the upper fixture in the surface direction. The mechanism moves the inspected substrate to adjust the probe contact position of the lower fixture, and the upper fixture adjustment mechanism moves the upper fixture in the surface direction to adjust the probe contact position of the upper fixture. Characterize.

Further, the board inspection apparatus of the present invention measures the center of the tooling hole of the board to be inspected and the recognition marks at a plurality of points by using image processing, and calculates the error from the design value, and the board measuring mechanism. And a position correction mechanism for performing an in-circuit test by correcting probe contact positions of the upper and lower fixtures with a correction amount according to a value measured and calculated by the measurement mechanism.

Further, according to the present invention, in a probe contact position adjusting method for a substrate inspection apparatus, the position of the pad and the probe is adjusted by moving the fixture in the surface direction, and the position of the fixture is corrected. It is characterized by fixing the position.

Further, according to the present invention, in a probe contact position adjusting method for a board inspecting apparatus, the center of a tooling hole of a board to be inspected and recognition marks at a plurality of points are measured by using image processing, and an error from a design value is detected. The in-circuit test is performed by calculating and correcting the probe contact positions of the upper and lower fixtures by the correction amount according to the calculated value.

[0014]

Function: The center of the tooling hole of the board to be inspected and two recognition marks are measured using image processing, and the error from the design value is calculated. From this measured value, the surface direction (X, Y, θ)
Is calculated, and the probe position correction mechanism of the fixture is operated according to the correction amount to correct the probe contact positions of the upper and lower fixtures.

That is, in the mounting board inspection (in-circuit test), first, the board measuring mechanism measures the center of the boarding hole and two recognition marks using image processing, and the error from the design value is measured. To calculate. The calculated error is converted into a correction amount in the surface direction (X, Y, θ) and displayed on the display screen. The in-circuit test is performed by adjusting the correction amount given here with the micrometer of the position correction mechanism to correct and fix the probe contact positions of the upper and lower fixtures.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. A board inspection apparatus according to an embodiment of the present invention includes a board measuring mechanism that measures the center of a tooling hole of a board to be inspected and recognition marks at a plurality of points using image processing and calculates an error from a design value. It is composed of a position correction mechanism that corrects the probe contact positions of the upper and lower fixtures by a correction amount according to the value measured and calculated by the substrate measuring mechanism to perform an in-circuit test.

FIG. 1 is a diagram showing a configuration of a substrate measuring device which is a main component of the substrate measuring mechanism, and FIG. 2 is a block diagram showing a system configuration of the substrate measuring mechanism. In the figure, reference numeral 10 is a board measuring device for measuring an error with respect to a design value of a board (PB) to be inspected.

Reference numeral 11 denotes a board fixing table for fixing the board to be inspected (PB) at a fixed position, and along the guide rails 19 and 19 according to the operation amount of the handle 18, a predetermined surface direction (Y).
It is provided so that it can be moved and adjusted.

Reference numeral 12 is a reference pin provided on the board fixing table 11, which is inserted into the tooling hole (h) of the board to be inspected when the board to be inspected (PB) is mounted to position the board. , The center of this pin is the origin of measurement.

Denoted by 13 are clamps for preventing the warp of the substrate to be inspected (PB), and are clamps for fixing and supporting the substrate to be inspected (PB) on the substrate fixing table 11 in a state where the warp is eliminated. Prevent warping.

Reference numeral 14 denotes two recognition marks (m) provided on the center of the tooling hole (h) and the board under test (PB).
Is a camera for measuring the reference pin 12, and two recognition marks (m) provided on the substrate (PB) to be inspected are projected, and the image data thereof is input to the personal computer 31.

Reference numeral 15 denotes an X-axis linear scale that obtains data on the relative position between the substrate to be inspected (PB) fixed to the substrate fixing table 11 and the camera 14. Here, the center of one predetermined reference pin 12 is set. With the position set to “0”, the X-direction movement amount (X coordinate) of the camera 14 is detected and input to the linear counter 32 and the personal computer 31.

Reference numeral 16 is a handle for moving and adjusting the camera 14 in a certain plane direction, that is, in the X direction in this case. The camera 14 is guided by the moving shaft 16a in accordance with the operation amount of the handle 16 and moves in the X direction. Adjusted. The amount of movement (X coordinate) of the camera 14 in the X direction is detected by the X-axis linear scale 15, and the personal computer 3
Input to 1.

Reference numeral 17 denotes a Y-axis linear scale for detecting the Y-direction movement amount (Y coordinate) of the inspected substrate (PB) fixedly supported on the substrate fixing table 11, and one predetermined reference pin 12 is provided. With the central position set to “0”, the Y-direction movement amount (Y coordinate) of the inspected substrate (PB) fixedly supported by the substrate fixing table 11 is detected and input to the linear counter 32 and the personal computer 31.

Reference numeral 18 denotes a handle for moving and adjusting the board fixing table 11 in the Y direction, and the board fixing table 11 is guided by the guide rail 1 in accordance with the operation amount of the handle 18.
It is moved and adjusted in the Y direction along 9 and 19.

Further, in FIG. 2, reference numeral 31 obtains a correction amount in the substrate surface direction (X, Y, θ) from the measurement value (error data) measured by the substrate measuring device 10 shown in FIG. The correction amount is displayed and output to the display device (DISP) 33 to inform the board inspector of the correction amount.
C), which is the camera 1 of the board measuring device 10 shown in FIG.
By measuring the center of the tooling hole of the board to be inspected (PB) and the two recognition marks by image processing of the image data input from 4 and calculating the error with the design value, the calculated error is calculated in the surface direction ( (X, Y, θ), and displayed on the display screen of the display device (DISP) 33.

32 is fixed to the substrate fixing table 11 with the center position of one predetermined reference pin 12 set to "0" according to the detection data of the X-axis linear scale 15 and the detection data of the Y-axis linear scale 17. This is a linear counter that outputs the amount of movement (X / Y coordinates) of the supported inspected substrate (PB) in the X / Y directions, and this data is input to the personal computer 31.

FIG. 3 shows the structure of a position correction mechanism for correcting the probe contact positions of the upper and lower fixtures with an amount of correction in accordance with a value measured and calculated by the substrate measuring mechanism having the structure shown in FIGS. FIG.

In the figure, reference numeral 20 denotes an upper fixture having a plurality of inspection probes provided on the lower surface portion, and here, guide pins (P) are provided at two positions on the left and right of the lower surface portion. Two
Reference numeral 1 denotes a lower fixture having a plurality of inspection probes provided on the upper surface thereof, which is fixedly arranged on a base 27 here.

Reference numeral 22 is an upper fixture adjusting plate for correcting the surface direction probe position of the upper fixture 20. The upper lock pin 24a, ... And the upper fixture adjusting section 25 ,. Correct the probe position. That is, the upper fixture 2
The upper fixture 20 is supported by the upper fixture adjusting plate 22 by inserting the guide pin (P) of 0 into the linear bush (B) of the upper fixture adjusting plate 22. Therefore, when the upper fixture adjusting plate 22 is moved in the surface direction by the adjusting operation of the upper lock pins 24a, ... And the upper fixture adjusting portions 25, .., the upper fixture 20 moves accordingly and the upper fixture 20 moves. The probe position can be corrected in the X, Y, and θ directions of 20.

Reference numeral 23 is a lower fixture adjusting plate for correcting the surface direction probe position of the lower fixture 21, and by adjusting the lower lock pins 24b, ... And the lower fixture adjusting portions 26 ,. Correct the probe position. That is, the lower fixture adjusting plate 23 is provided with a board supporting pin (T) fitted in a tooling hole (h) of the board to be inspected (PB), and the board to be inspected by the board supporting pin (T). (P
B) is fixedly supported in place. Therefore, by operating the lower lock pins 24b, ... And the lower fixture adjusting sections 26, ... To move the lower fixture adjusting plate 23, the substrate to be inspected (PB) fixedly supported by the substrate supporting pins (T). ) Moves in the surface direction on the lower fixture 21, and it becomes possible to correct the probe position of the lower fixture 21 in the X, Y, and θ directions.

Reference numeral 24a denotes an upper fixture adjusting plate 2
Upper lock pin for adjusting and fixing the position of 2 in the plane direction, 2
Reference numeral 4b is a lower lock pin for adjusting and fixing the surface direction position of the lower fixture adjusting plate 23.

Reference numeral 25 is an upper fixture adjusting section using a micrometer for adjusting the probe contact position of the upper fixture 20, and the upper fixture adjustment is made in accordance with the correction amount given by the substrate measuring mechanism shown in FIGS. Position the plate 22. By adjusting the position of the upper fixture adjusting plate 22, the contact position between the probe of the upper fixture 20 supported by the plate 22 and the pad of the substrate under test (PB) fixedly supported by the lower fixture adjusting plate 23. Is corrected, and the upper fixture adjustment plate 22 is fixed to the corrected position by the upper lock pin 24a.

Reference numeral 26 is a lower fixture adjusting section using a micrometer for adjusting the probe contact position of the lower fixture 21, and according to the correction amount given by the substrate measuring mechanism shown in FIGS. Position the plate 23. By adjusting the position of the lower fixture adjustment plate 23, the contact position between the probe of the lower fixture 21 supported by the plate 23 and the pad of the substrate under test (PB) fixedly supported by the lower fixture adjustment plate 23. Is corrected and the lower fixture adjustment plate 23 is fixed to the corrected position by the lower lock pin 24b.

The operation of the embodiment of the present invention will be described with reference to the drawings. First, a measuring method by the substrate measuring mechanism will be described with reference to FIGS. 1 and 2. When measuring the error of the inspected board (PB) with respect to the design value, the inspected board (PB) is first set on the board fixing table 11 of the board measuring device 10.

That is, the board inspector uses the board fixing table 1
With all the clamps 13, ... on 1 being released, the tooling holes (h) of the board (PB) to be inspected are fitted into the reference pins 12 provided on the board fixing table 11,
After the board to be inspected (PB) is aligned with the fixed position on the board fixing table 11, all the clamps 13, ... Are locked to prevent the board to be inspected (PB) from being warped. Lock in position.

The board to be inspected (PB) mounted on the board fixing table 11 is captured by the camera 14 and displayed on the display screen of the display device (DISP) 33. Next, the board inspector operates the handles 16 and 18 while observing the display screen of the display device (DISP) 33 to move the gazing point of the camera 14 to the center of the tooling hole (h) on the reference pin 12. Align the reference position.

The X / Y coordinate display value of the linear counter 32 is cleared to zero. After that, the board inspector
ISP) 33 while viewing the display screen of the handle 16,
18 is moved to move the gazing point of the camera 14 onto the recognition marks (m) at two places, thereby moving the movement amount (X.
The (Y coordinate) is read by the X-axis linear scale 15 and the Y-axis linear scale 17, and displayed on the linear counter 32.

The measurement data of the substrate measuring instrument 10 displayed on the linear counter 32 is personal computer (P
C) Input to 31. Personal computer (P
C) 31 obtains a correction amount in the substrate surface direction (X, Y, θ) from the measurement data (error data) of the substrate measuring device 10 according to a predetermined program process, and displays the correction amount on the display device (DISP) 33. The display is output to inform the board inspector of the correction amount.

The above measurement work is performed on both sides of the substrate to be inspected (PB). The probe contact position of the in-circuit tester is corrected according to the correction amount measured by this measurement work.

To correct the probe contact position, first, the substrate to be inspected (PB), which is the object of the measurement, is set in the position correction mechanism. That is, the tooling hole (h) of the substrate (PB) to be inspected, which has been subjected to the error measurement, is fitted to the substrate support pin (T) provided on the lower fixture adjusting plate 23, and the lower fixture adjusting plate 23 is inserted.
By mounting the board to be inspected (PB) on the board, the board to be inspected (PB) is fixedly supported at a fixed position on the lower fixture adjustment plate 23.

After that, the lower fixture adjusting plate 2
3 is adjusted by the lower fixture adjusting units 26, ... According to the measured correction amount, and the probe position of the lower fixture 21 is corrected.

The probe position of the lower fixture 21 is corrected by operating the three lower fixture adjusting units (micrometers) 26, ... With the measured correction amount as an instruction value.

After this micrometer operation, the lower lock pin 24b is locked to fix the position of the lower fixture adjusting plate 23. The above-described correction work is similarly performed on the upper fixture adjustment plate 22.

In this way, by correcting the deviation between the inspection probe and the pad due to the processing error of the substrate (PB) to be inspected, accurate probing can be performed and the false error caused by the contact mistake can be surely prevented.

As a result, the inspected substrate (P
Even if an error occurs between B) and the design value, the inspection probe of the upper and lower fixtures can be accurately brought into contact with the pad of the inspected substrate (PB), and the correct substrate inspection can be always performed.

In the above-mentioned embodiment, the inspected substrate (PB) having pads on both sides is taken as an example. However, even in the inspected substrate (PB) having pads on one side, the probe position is the same as above. Can be corrected. In this case, the substrate to be inspected (P
B) either the board inspection using the lower fixture adjustment plate 23 for adjusting the probe position by moving the probe or the board inspection using the upper fixture adjustment plate 22 for adjusting the probe position by moving the probe itself. It is possible even if there is.

In the above-mentioned embodiment, the substrate to be inspected (P
B) The probe position adjustment with respect to one surface (upper surface) is performed by moving the probe itself of the upper fixture 20, and the probe position adjustment with respect to the other surface (lower surface) of the inspected substrate (PB) is performed. However, the present invention is not limited to this. For example, the probe itself of the fixture may be moved with respect to both surfaces of the inspected substrate (PB).

[0049]

As described in detail above, according to the present invention, the deviation between the inspection probe and the pad due to the processing error of the substrate to be inspected is corrected, and the accurate probing can be always performed, and the false error caused by the contact mistake can be eliminated. It can be surely prevented.

That is, according to the present invention, in the board inspecting apparatus for inspecting the board by inspecting the board to be inspected with the probe provided in the fixture, the position adjusting mechanism capable of moving the position of the fixture in the surface direction. With the configuration including, even if an error occurs between the created inspected substrate and the design value, the inspection probe of the upper and lower fixtures can be accurately brought into contact with the pad of the inspected substrate, The correct board inspection can always be performed.

Further, according to the board inspection apparatus of the present invention, the board supporting mechanism for supporting the board to be inspected, the fixture for applying the probe to the board to be inspected supported by the board supporting mechanism, and the surface of the fixture. Between the created inspected substrate and the design value by having a position adjustment mechanism that moves the position in the direction and adjusting the contact position between the pad and the probe by moving the fixture in the surface direction. Even if an error occurs, the inspection probe of the upper and lower fixtures can be accurately brought into contact with the pad of the substrate to be inspected, and the correct substrate inspection can be always performed.

Further, according to the substrate inspection apparatus of the present invention, a substrate supporting mechanism for supporting the substrate to be inspected so as to be movable in the plane direction, and a fixture for applying a probe to the substrate to be inspected supported by the substrate supporting mechanism. By adjusting the contact position between the pad and the probe by moving the board to be inspected, even if an error occurs between the created board to be inspected and the design value, the vertical fixture The inspection probe of can be accurately brought into contact with the pad of the substrate to be inspected, and correct substrate inspection can always be performed.

Further, according to the substrate inspection apparatus of the present invention, in the substrate inspection apparatus in which the upper fixture and the lower fixture are arranged so as to face each other with the substrate to be inspected, the substrate inspection device is provided on the lower fixture. A lower fixture adjusting mechanism that supports the inspection board so as to be movable in the planar direction; and an upper fixture adjusting mechanism that is provided on the lower adjusting mechanism and moves the upper fixture in the planar direction.
Adjust the probe contact position of the lower fixture by moving the board to be inspected with the lower fixture adjustment mechanism,
Due to the configuration that the upper fixture adjustment mechanism moves the upper fixture in the surface direction to adjust the probe contact position of the upper fixture, an error occurs between the created inspected substrate and the design value. Also, the inspection probes of the upper and lower fixtures can be accurately brought into contact with the pads on each surface of the substrate to be inspected, and correct substrate inspection can always be performed.

Further, according to the board inspection apparatus of the present invention, a board measuring mechanism for measuring the center of the tooling hole of the board to be inspected and the recognition marks at a plurality of positions by using image processing and calculating an error from the design value, A position correction mechanism for performing an in-circuit test by correcting the probe contact position of the upper and lower fixtures with the correction amount according to the value measured and calculated by this substrate measuring mechanism is used. Even if an error occurs between the substrate and the design value, the inspection probe of the upper and lower fixtures can be accurately brought into contact with the pads on each surface of the substrate to be inspected, and the correct substrate inspection can be always performed.

Further, according to the present invention, in adjusting the probe contact position of the board inspection apparatus, the position of the pad and the probe is adjusted by moving the fixture in the surface direction, and the position of the fixture is corrected. By using the probe contact position adjustment method that fixes the directional position, even if an error occurs between the created inspected board and the design value, the inspection probe of the upper and lower fixtures can be accurately measured on each surface of the inspected board. The pads can be contacted and the correct board inspection can always be performed.

Further, according to the present invention, in the adjustment of the probe contact position of the board inspection apparatus, the center of the tooling hole of the board to be inspected and the recognition marks at a plurality of points are measured by using image processing, and an error from the design value is detected. Is calculated, and the probe contact position of the upper and lower fixtures is corrected by the correction amount according to the value to perform an in-circuit test. Even if an error occurs, the inspection probe of the upper and lower fixtures can be accurately brought into contact with the pads on each surface of the substrate to be inspected, and the correct substrate inspection can be always performed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a substrate measuring device according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a system configuration of a substrate measuring mechanism in the above embodiment.

FIG. 3 is a perspective view showing a configuration of a position correction mechanism in the above embodiment.

[Explanation of symbols]

10 ... Board measuring device, 11 ... Board fixing table, 12 ... Reference pin, 13 ... Clamp, 14 ... Camera, 15 ... X-axis linear scale, 16 ... Handle, 16a ... Moving shaft, 17 ... Y-axis linear scale, 18 ... Handle, 19
... guide rail, 20 ... upper fixture, 21 ... lower fixture, 22 ... upper fixture adjustment plate,
23 ... Lower fixture adjusting plate, 24a ... Upper lock pin, 24b ... Lower lock pin, 25 ... Upper fixture adjusting part (micrometer), 26 ... Lower fixture adjusting part (micrometer), 27 ... Base, 28 ...
29 ..., 30 ..., 31 ... Personal computer (P
C), 32 ... Linear counter, 33 ... Display device (DIS
P), 4 ..., 5 ..., 6 ..., 7 ..., 8 ..., 9 ..., PB ... Inspected substrate, h ... Tooling hole, P ... Guide pin, B
… Linear bush, T… Board support pin.

Claims (7)

[Claims] 1. A board inspection device for inspecting a board by applying a probe provided on a fixture to a board to be inspected,
A substrate inspection apparatus, wherein the fixture is provided with a position adjusting mechanism capable of moving a position in a plane direction. 2. A substrate supporting mechanism for supporting a substrate to be inspected,
It has a fixture for applying a probe to a substrate to be inspected supported by the substrate support mechanism, and a position adjusting mechanism for moving the fixture in the in-plane direction. The fixture and the pad are moved in the in-plane direction. A board inspecting device, which adjusts a contact position of the substrate. 3. A substrate supporting mechanism for supporting the substrate to be inspected so as to be movable in a plane direction, and a fixture for applying a probe to the substrate to be inspected supported by the substrate supporting mechanism. A substrate inspection apparatus, wherein the contact position between the pad and the probe is adjusted by doing so. 4. A substrate inspection apparatus in which an upper fixture and a lower fixture are opposed to each other with a substrate to be inspected sandwiched therebetween, and the substrate is inspected so as to be movable in a planar direction on the lower fixture. The lower fixture adjusting mechanism and the upper fixture adjusting mechanism that is provided on the lower adjusting mechanism and moves the upper fixture in the surface direction. The lower fixture adjusting mechanism moves the substrate to be inspected. Adjust the probe contact position of the lower fixture,
A substrate inspection apparatus characterized in that the upper fixture adjustment mechanism moves the upper fixture in the surface direction to adjust the probe contact position of the upper fixture. 5. A board measuring mechanism for measuring the center of a tooling hole of a board to be inspected and recognition marks at a plurality of points by image processing and calculating an error from a design value, and a value measured and calculated by the board measuring mechanism. And a position correction mechanism for performing an in-circuit test by correcting probe contact positions of the upper and lower fixtures according to the correction amount according to. 6. A board inspection device for inspecting a board by applying a probe provided on a fixture to a board to be inspected,
A probe contact position adjusting method for a substrate inspecting device, characterized in that the position of a pad and a probe is adjusted by moving the fixture in the surface direction to fix the position of the position-corrected fixture in the surface direction. 7. A tooling hole center of a board to be inspected and recognition marks at a plurality of positions are measured by using image processing, an error from a design value is calculated, and a correction amount in a plane direction according to the value is used to adjust the vertical fixture. A method for adjusting a probe contact position of a board inspection device, which comprises performing an in-circuit test by correcting the probe contact position.